CN217144786U - Novel plug liquid cooling structure of moulding plastics - Google Patents

Abstract

The utility model discloses a novel plug injection liquid cooling structure, which relates to the field of injection molds. The utility model includes an upper mold and a lower mold. A lower mold is movably provided below the upper mold. A drain pipe is arranged in the middle of one end of the lower mold, an upper circulation pipe is arranged at the top of the inner cavity of the upper mold, one end of the upper circulation pipe is connected with the liquid inlet pipe, and a lower circulation pipe is arranged at the bottom of the inner cavity of the lower mold. One end of the lower circulation pipe is connected to the drain pipe, and the surfaces of the lower circulation pipe and the upper circulation pipe are evenly spaced with several groups of circular heat collecting fins. The inner cavity of the heat-collecting fin is communicated with the inner cavity of the lower circulation pipe and the upper circulation pipe; this new model solves the problem that the existing injection mold has a slow cooling speed for the injection molded parts during the use process, so that the injection molded parts cannot be rapidly cooled and formed, resulting in The problem of low production efficiency of injection molded parts.

Description

A new type of plug injection liquid cooling structure

technical field

The utility model relates to the field of injection moulds, in particular to a novel plug injection liquid cooling structure.

Background technique

Injection mold is a tool for producing plastic products; it is also a tool for giving plastic products complete structure and precise dimensions. Injection molding is a processing method used in the mass production of parts with complex shapes. Specifically, it refers to the high pressure injection of the heated and melted plastic into the cavity of the injection molding machine, and after cooling and solidification, a molded product is obtained. Plastic molds, blow molds, casting molds, thermoforming molds, hot compression molds (compression molds), injection molds, etc. Among them, hot compression molds can be divided into overflow, semi-overflow, and non-overflow There are three types. The injection mold can be divided into two types: cold runner mold and hot runner mold according to the gating system; according to the loading and unloading method, it can be divided into mobile type and fixed type.

The existing injection mold has a slow cooling rate for the injection molded parts during use, so that the injection molded parts cannot be rapidly cooled and formed, resulting in low production efficiency of the injection molded parts. For this reason, we propose a new type of plug injection liquid cooling structure. , in order to solve the above problems.

Utility model content

In order to solve the above technical problems, a new type of plug injection liquid cooling structure is provided. This technical solution solves the problem that the existing injection mold has a slow cooling speed for the injection molded parts during use, so that the injection molded parts cannot be rapidly cooled and formed, resulting in The problem of low production efficiency of injection molded parts.

In order to achieve the above purpose, the technical scheme adopted by the present utility model is:

A new type of plug injection liquid cooling structure, including an upper mold and a lower mold, a lower mold is movably arranged below the upper mold, a liquid inlet pipe is arranged in the middle of one end of the upper mold, and a drain pipe is arranged in the middle of one end of the lower mold. , the top of the upper mold cavity is provided with an upper circulation pipe, one end of the upper circulation pipe is connected with the liquid inlet pipe, the bottom of the lower mold cavity is provided with a lower circulation pipe, and one end of the lower circulation pipe is connected with the drain pipe , the surfaces of the lower circulation pipe and the upper circulation pipe are equally spaced with several groups of circular heat collecting fins, the inner cavity of the circular heat collecting fins is a hollow structure, and the inner cavity of the circular heat collecting fins is connected to the lower circulation The tube communicates with the inner cavity of the upper circulation tube, and the other end of the upper circulation tube is connected with a telescopic connection pipe, and the telescopic connection pipe is located at the other end of the upper mold. There are semiconductor refrigeration chips.

As a preferred technical solution of the present invention, the side surfaces of the semiconductor refrigeration fins that are far away from each other are provided with heat dissipation fins, and the top surface of the cooling box is provided with a connection seat, and the connection seat is connected to the bottom of the telescopic connection pipe .

As a preferred technical solution of the present invention, a conductive column is provided on the side surface of the semiconductor refrigerating sheet and the surface of the cooling box, the conductive column penetrates through the cavity wall of the cooling box, and one end of the conductive column is connected with a release piece, One side surface of the release sheets that are far away from each other is not in contact with the inner wall of the cooling box.

As a preferred technical solution of the present invention, the bottom of the cooling box is connected to the end of the lower circulation pipe away from the drain pipe.

As a preferred technical solution of the present invention, one end of the liquid inlet pipe away from the upper circulation pipe is connected with an upper check valve, and one end of the liquid discharge pipe away from the lower circulation pipe is connected with a lower stop valve.

As a preferred technical solution of the present invention, one end of the upper check valve and the lower stop valve away from the liquid inlet pipe and the liquid discharge pipe is connected with a quick plug connector.

Compared with the prior art, the beneficial effect of the utility model is that: the surfaces of the upper circulation pipe and the lower circulation pipe are provided with circular heat-collecting fins at equal distances, the inner cavity of the heat-collecting fins is a hollow structure, and the circular heat-collecting fins are The inner cavity of the sheet is communicated with the inner cavity of the lower circulation tube and the upper circulation tube, so that the cooling liquid in the inner cavity of the lower circulation tube and the upper circulation tube can enter the circular heat collecting fins. The contact area of the lower mold improves the cooling efficiency of the upper mold and the lower mold. At the same time, the cooling liquid in the upper circulation pipe flows into the cooling box through the telescopic connecting pipe. The semiconductor refrigeration chips on both sides of the cooling box can use the Peltier effect of semiconductor materials. The cold energy is released from one side surface, and the cold energy is transferred to the release sheet through the conductive column, and the release sheet does not fit with the inner wall of the cooling box, so that the release sheet is completely immersed in the cooling liquid, and the cold energy on the release sheet can be fully released to the cooling In the liquid, the cooling liquid still has a relatively low temperature in the downward circulation pipe, which can still ensure the cooling effect on the lower mold.

Description of drawings

1 is a schematic diagram of the overall structure of the new model;

Fig. 2 is the side view structure schematic diagram of the new type;

Fig. 3 is a schematic diagram of the structure of the upper circulation pipe of the new type;

Fig. 4 is a schematic diagram of the structure of the new lower circulation pipe;

Fig. 5 is a schematic diagram of the cross-sectional structure of the upper circulation pipe of the new type;

FIG. 6 is a schematic diagram of the internal structure of the new cooling box.

The symbols in the figure are:

1. Upper mold; 101. Lower mold;

2. Inlet pipe; 201, drain pipe; 202, upper circulation pipe; 203, circular heat collecting fins; 204, lower circulation pipe; 205, telescopic connecting pipe; 206, connecting seat; 207, cooling box;

3. Semiconductor refrigeration sheet; 301, conduction column; 302, release sheet; 303, heat dissipation fin;

4. Upper check valve; 401, lower stop valve; 402, quick connector.

Detailed ways

The following description is used to disclose the present invention to enable those skilled in the art to implement the present invention. The preferred embodiments described below are given by way of example only, and other obvious modifications will occur to those skilled in the art.

1-6, a new type of plug injection liquid cooling structure includes an upper mold 1 and a lower mold 101, a lower mold 101 is movably provided below the upper mold 1, and a liquid inlet pipe 2 is arranged in the middle of one end of the upper mold 1. A drain pipe 201 is provided in the middle of one end of the mold 101, an upper circulation pipe 202 is provided at the top of the inner cavity of the upper mold 1, one end of the upper circulation pipe 202 is connected with the liquid inlet pipe 2, and a lower circulation pipe 204 is provided at the bottom of the inner cavity of the lower mold 101. One end of the circulation pipe 204 is connected with the drain pipe 201, and the surfaces of the lower circulation pipe 204 and the upper circulation pipe 202 are equally spaced with several groups of circular heat collecting fins 203. The inner cavity of the circular heat collecting fins 203 is a hollow structure, and the The inner cavity of the heat-collecting fin 203 is communicated with the inner cavity of the lower circulation pipe 204 and the upper circulation pipe 202. The other end of the upper circulation pipe 202 is connected with a telescopic connection pipe 205, and the telescopic connection pipe 205 is located at the other end of the upper mold 1. The telescopic connection pipe A cooling box 207 is arranged at the bottom of the cooling box 205, semiconductor refrigeration fins 3 are arranged on both sides of the cooling box 207, heat dissipation fins 303 are arranged on the side surfaces of the semiconductor refrigeration fins 3 that are far away from each other, and a connecting seat 206 is arranged on the top surface of the cooling box 207. The connecting seat 206 is connected to the bottom of the telescopic connecting pipe 205, and the side surface of the semiconductor refrigeration sheet 3 and the surface of the cooling box 207 is fitted with a conducting column 301, the conducting column 301 penetrates the cavity wall of the cooling box 207, and one end of the conducting column 301 is connected with a release Sheet 302, the side surface of the release sheet 302 away from each other does not fit with the inner wall of the cooling box 207, the bottom of the cooling box 207 is connected to the end of the lower circulation pipe 204 away from the drain pipe 201, and the other end of the upper circulation pipe 202 is connected with a telescopic connection pipe 205, the bottom of the telescopic connecting pipe 205 is connected with the top of the cooling box 207 through the connecting seat 206, and the bottom of the cooling box 207 is connected with the lower circulation pipe 204, so as to realize the communication of the cooling pipe, and the circulation of the cooling liquid in the cooling pipe can connect the upper mold 1 and the lower mold. The heat in the mold 101 is taken away, so that the rapid cooling and forming of the injection molded parts can be accelerated. The surfaces of the upper circulation pipe 202 and the lower circulation pipe 204 are provided with circular heat collecting fins 203 at equal distances, and the inner cavity of the heat collecting fins 203 is It has a hollow structure, and the inner cavity of the circular heat collecting fin 203 is communicated with the inner cavity of the lower circulation pipe 204 and the upper circulation pipe 202, so that the cooling liquid in the inner cavity of the lower circulation pipe 204 and the upper circulation pipe 202 can enter the circular heat collecting fin In the sheet 203, the contact area between the cooling pipe and the upper mold 1 and the lower mold 101 can be increased through the heat collecting fins 203, and the cooling efficiency of the upper mold 1 and the lower mold 101 can be improved. The connecting pipe 205 flows into the cooling box 207, and the semiconductor refrigeration sheets 3 on both sides of the cooling box 207 can release cold energy on one surface by the Peltier effect of the semiconductor material. 302 is not in contact with the inner wall of the cooling box 207, so that the release sheet 302 is completely immersed in the cooling liquid, the cooling energy on the release sheet 3 can be completely released into the cooling liquid, and the cooling liquid still has a relatively high temperature in the downward circulation pipe 204. low temperature The cooling effect on the lower mold 101 can still be guaranteed, and the upper mold 1 and the lower mold 101 are telescopically connected through the telescopic connecting pipe 205 when the mold is opened.

Referring to FIG. 1 , one end of the liquid inlet pipe 2 away from the upper circulation pipe 202 is connected with an upper check valve 4 , and one end of the liquid discharge pipe 201 away from the lower circulation pipe 204 is connected with a lower stop valve 401 , the upper check valve 4 and the lower One end of the cut-off valve 401 away from the liquid inlet pipe 2 and the liquid discharge pipe 201 is connected with a quick plug connector 402. The upper check valve 4 can prevent the coolant in the upper circulation pipe 202 from flowing back, and at the same time, the lower cut-off valve 401 can be closed to prevent the downward circulation. The coolant in tube 204 flows out. Therefore, after the quick-plug joint 402 is separated from the external cooling liquid circulation equipment, the cooling liquid in the lower circulation pipe 204 and the upper circulation pipe 202 leaks out, and the liquid inlet pipe 2 and the liquid discharge pipe 201 can be respectively connected with the external cooling liquid through the quick-plug joint 402. connected to the liquid circulation equipment.

Working principle: the surfaces of the upper circulation tube 202 and the lower circulation tube 204 are provided with circular heat collecting fins 203 at equal distances. The inner cavity of the heat collecting fins 203 is a hollow structure. 204 communicates with the inner cavity of the upper circulation pipe 202, so that the cooling liquid in the inner cavity of the lower circulation pipe 204 and the upper circulation pipe 202 can enter the circular heat collecting fins 203, and through the heat collecting fins 203, the cooling pipe and the upper mold can be increased. 1 and the contact area of the lower mold 101, while the cooling liquid in the upper circulation pipe 202 flows into the cooling box 207 through the telescopic connecting pipe 205, and the semiconductor refrigeration chips 3 on both sides of the cooling box 207 can be used on one side by the Peltier effect of the semiconductor material. The cold energy is released from the surface, and the cold energy is transferred to the release sheet 302 through the conductive column, and the release sheet 302 does not adhere to the inner wall of the cooling box 207, so that the release sheet 302 is completely immersed in the cooling liquid, and the cold energy on the release sheet 3 All can be released into the cooling liquid, and the cooling liquid still has a lower temperature in the downward circulation pipe 204 .

The basic principles, main features and advantages of the present invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and descriptions describe only the principles of the present invention. There are various changes and improvements that fall within the scope of the claimed invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. A novel plug injection liquid cooling structure, comprising an upper mold (1) and a lower mold (101), and a lower mold (101) is movably provided below the upper mold (1), characterized in that: the upper mold (101). 1) A liquid inlet pipe (2) is arranged in the middle of one end, a drain pipe (201) is arranged in the middle of one end of the lower mold (101), and an upper circulation pipe (202) is arranged at the top of the inner cavity of the upper mold (1), One end of the upper circulation pipe (202) is connected with the liquid inlet pipe (2), the bottom of the inner cavity of the lower mold (101) is provided with a lower circulation pipe (204), and one end of the lower circulation pipe (204) is connected with the liquid discharge pipe (201) are connected to each other, the lower circulation pipe (204) and the upper circulation pipe (202) are evenly spaced on the surfaces of several groups of circular heat collecting fins (203), and the circular heat collecting fins (203) have inner cavities. It is a hollow structure, and the inner cavity of the circular heat collecting fin (203) is communicated with the inner cavity of the lower circulation pipe (204) and the upper circulation pipe (202), and the other end of the upper circulation pipe (202) is connected with a telescopic connecting pipe ( 205), and the telescopic connecting pipe (205) is located at the other end of the upper mold (1), the bottom of the telescopic connecting pipe (205) is provided with a cooling box (207), and the two sides of the cooling box (207) are provided with semiconductor refrigeration sheet (3). 2. A new type of plug injection liquid cooling structure according to claim 1, characterized in that radiating fins (303) are provided on the side surfaces of the semiconductor refrigeration sheets (3) that are far away from each other, and the cooling box ( 207) A connecting seat (206) is provided on the top surface, and the connecting seat (206) is connected with the bottom of the telescopic connecting pipe (205). 3. A new type of plug injection liquid cooling structure according to claim 1, characterized in that a conductive column (301) is provided on the surface of one side of the semiconductor refrigeration sheet (3) that is in contact with the surface of the cooling box (207), The conductive column (301) penetrates through the cavity wall of the cooling box (207), and one end of the conductive column (301) is connected with a release piece (302), and one side surface of the release piece (302) away from each other is connected to the cooling box (207) The inner wall does not fit. 4. The novel plug injection liquid cooling structure according to claim 1, wherein the bottom of the cooling box (207) is connected to the end of the lower circulation pipe (204) away from the drain pipe (201). 5. A new type of plug injection liquid cooling structure according to claim 1, characterized in that: one end of the liquid inlet pipe (2) away from the upper circulation pipe (202) is connected with an upper check valve (4), the A lower stop valve (401) is connected to one end of the drain pipe (201) away from the lower circulation pipe (204). 6. A new type of plug injection liquid cooling structure according to claim 5, characterized in that: the upper check valve (4) and the lower stop valve (401) are far away from the liquid inlet pipe (2) and the liquid discharge pipe (201) ) is connected with a quick plug connector (402).

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