CN211828684U - Two-dimensional material transfer assembly system - Google Patents
Two-dimensional material transfer assembly system Download PDFInfo
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- CN211828684U CN211828684U CN202020288262.3U CN202020288262U CN211828684U CN 211828684 U CN211828684 U CN 211828684U CN 202020288262 U CN202020288262 U CN 202020288262U CN 211828684 U CN211828684 U CN 211828684U
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Abstract
The invention provides a two-dimensional material transfer assembly system, belonging to the field of optoelectronic devices; the system comprises a base substrate, an operating system and an imaging observation system, wherein the operating system consists of an XY + theta two-dimensional plane corner sample stage and a three-dimensional (XYZ) manual operating stage, the XY + theta two-dimensional plane corner sample stage is used for placing and adjusting the substrate material and the position of the substrate material, and the three-dimensional (XYZ) manual operating stage is used for accurately controlling the alignment of a two-dimensional material sheet to be transferred and a target area of the substrate material; the imaging observation system consists of a long-focus lens with a double-shaft illumination function, a digital camera and a mechanical fixing and adjusting device thereof. The building cost is reduced, and the mechanical degree of freedom and the integration degree are improved.
Description
Technical Field
The invention belongs to the field of optoelectronic devices, and particularly relates to a two-dimensional material transfer assembly system.
Background
Two-dimensional materials represented by graphene and transition metal chalcogenide have great significance for the updating and revolution of next generation electronic and optoelectronic devices by virtue of excellent electrical, optical and mechanical properties. The development and application of high-precision two-dimensional material transfer assembly systems has facilitated a tremendous advancement in two-dimensional material research, thanks to the ideal surface of the dangling bond-free. The two-dimensional material transfer assembly system can realize the construction and preparation of devices based on two-dimensional materials on one hand, and can stack two-dimensional materials with different performances and atomic-level thicknesses on the other hand, so that the construction requirements of van der Waals heterostructures such as artificial band gap superlattices, ideal heterogeneous transport interfaces, passivated surfaces and the like are met. But so far there have been few reports of being able to provide sufficient detailed information to build a two-dimensional material transfer system. In addition, in the prior reports, the systems usually need to use expensive high-precision optical and mechanical components, the matching relationship of the parts is complex, the mechanical degree of freedom is low, and the application and popularization of the two-dimensional material transfer assembly system are limited. Therefore, the building scheme of the two-dimensional material transfer assembly system which is simple in matching relation, high in mechanical freedom degree and low in cost is significant.
The documents report that an electronic device and a van der waals heterostructure based on a two-dimensional material are successfully constructed by adopting a dry transfer technology based on a high-precision transfer assembly system. However, the two-dimensional material transfer assembly system adopts expensive precision optical and mechanical modules such as an optical microscope, a long-working-distance objective lens, a three-dimensional micro operating platform and the like, so that on one hand, the matching difficulty of each component in the system building process is increased, the freedom degree in the operation process is limited, and on the other hand, the requirement of low cost cannot be met.
Disclosure of Invention
The technical problem to be solved is as follows:
in order to avoid the defects of the prior art, the invention provides a two-dimensional material transfer assembly system, and provides a building method of a high-precision two-dimensional material transfer assembly system with simple matching relation, high mechanical freedom and low cost. The defects of complex component matching relation, low mechanical operation freedom degree and higher cost in the construction process of the conventional high-precision two-dimensional material transfer assembly system are overcome; the system mainly comprises a base substrate, a manual mechanical operation system and an imaging observation system, wherein the base substrate is composed of a ferromagnetic bread board with the bottom of 200mm multiplied by 400mm and provided with a rubber shock pad, and a stable shock absorption foundation is provided for transfer assembly; the mechanical operation system consists of an XY + theta two-dimensional plane corner sample table and a three-axis manual operation table, wherein the XY + theta two-dimensional plane corner sample table is used for placing and adjusting the substrate material and the position of the substrate material, and the three-axis manual operation table is used for accurately controlling the alignment, the attaching and the separating functions of the two-dimensional material sheet to be transferred and a target area of the substrate material; the imaging observation system mainly comprises a long-focus lens with a double-shaft illumination function, a 210 ten thousand pixel digital camera and a mechanical fixing and adjusting device thereof, and provides a visual basis for the whole transfer assembly operation process. When assembled, the manual operating system is fixed on the bottom substrate by the permanent magnet quasi-rigid adhered on the bottom, and the imaging observation system is fixed on the system substrate by the screw rigid through the mechanical supporting structure.
The technical scheme of the invention is as follows: a two-dimensional material transfer assembly system, characterized by: the device comprises a base substrate, an operating system and an imaging observation system; the base substrate is used for supporting the whole system device;
the operating system comprises an XY two-axis manual operating platform, a manual rotating platform, an aluminum cylinder and a three-axis manual operating platform; the aluminum cylinder is fixed at the center of the upper surface of the manual rotating table; the manual rotating table is fixed on the base plate through the XY two-axis manual operating table, can rotate 360 degrees in an XY two-dimensional plane and is used for fixing and adjusting a substrate material; the three-axis manual operation table is fixed on the base plate and used for controlling the alignment of a two-dimensional material sheet to be transferred and a substrate material target area;
the imaging observation system comprises a cylindrical support rod, a base, an annular clamp, a long-focus lens, an auxiliary illuminator and a digital camera; the cylindrical supporting rod is vertically fixed on the base plate of the base through the base, the telephoto lens is fixed on the cylindrical supporting rod through the annular clamp, and the annular clamp has a coarse/fine focusing screw adjusting function; the auxiliary illuminator is arranged at the bottom of the long-focus lens and is used for connecting the LED illuminator; the digital camera is fixedly arranged at the top of the tele lens;
and adjusting the relative positions of the imaging and observing system and the operating system so that the Z-axis height of the imaging and observing system can focus and observe the two-dimensional material sheet on the PDMS surface and the substrate material surface respectively.
The further technical scheme of the invention is as follows: the base substrate is a bread board made of ferromagnetic steel with the thickness of 1 BS-2040-.
The further technical scheme of the invention is as follows: four corners of XY diaxon manual operation platform bottom surface and triaxial manual operation platform bottom surface all are provided with 4 thickness and are 2mm, and the diameter is cylindrical neodymium magnet of 10mm, realize preliminary location through the appeal of magnet and base plate.
The further technical scheme of the invention is as follows: the model of the XY two-axis manual operation table is Bangggood 60mm multiplied by 60mm 1081555, the model of the manual rotation table is MSRP01/M, and the model of the triaxial manual operation table is Bangggood 60mm multiplied by 60mm 1105874.
The further technical scheme of the invention is as follows: the aluminum cylinder is 30mm in height and 25mm in diameter.
The further technical scheme of the invention is as follows: the tele lens is a 400X biaxial illumination tele lens.
The further technical scheme of the invention is as follows: the model of the cylindrical supporting rod is RS300/M, and the base is a PB1M base; the auxiliary illuminator is a 3.5X auxiliary illuminator.
Has the beneficial effects.
The invention has the beneficial effects that: the method uses a long-focus lens with a double-shaft lighting system, an XY + theta two-dimensional plane corner, a three-shaft manual operation table and a related mechanical fixing and supporting mechanism to build a low-cost high-precision two-dimensional transfer assembly system. Compared with the two-dimensional material transfer assembly system reported previously, the transfer assembly in the invention has the following advantages: first, the construction cost is low. In the invention, the imaging observation system adopts a combination of a long-focus lens and an LED illuminator with a double-axis illumination system to replace the combination of an original optical microscope and a long working distance objective lens, and the cost of the whole two-dimensional material transfer assembly system is reduced from more than 5 ten thousand yuan to 6 thousand yuan (as shown in Table 1). Secondly, the mechanical degree of freedom is high. On one hand, the XY + theta two-dimensional plane rotating sample stage can be used for adjusting the substrate with three degrees of freedom during the transfer and assembly of a two-dimensional van der Waals heterostructure, and is superior to the XY two-degree-of-freedom adjustment in the background technology. On the other hand, the imaging observation module in the system can meet the regulation requirements of four mechanical degrees of freedom of XYZ + theta, and is superior to the regulation function that the combination of an optical microscope and a long working distance objective lens can only meet the single degree of freedom of the Z axis. And thirdly, the integration level is high. The two-dimensional material transfer assembly system integrates and fixes the imaging observation system and the manual operation system on a bread board made of ferromagnetic steel, reduces the size of the whole system from 600mm multiplied by 500mm of the background technology to 200mm multiplied by 400mm multiplied by 300mm, and improves the integration level of the transfer assembly system.
Drawings
Fig. 1 is a schematic structural diagram of a high-precision two-dimensional material transfer assembly system used in embodiments 1, 2, and 3 of the method of the present invention.
FIG. 2 is a schematic diagram of the cantilever structure prepared in the transfer process of examples 1, 2 and 3 of the method of the present invention.
FIG. 3 is a schematic optical microscope of an Au-InSe-Au field effect transistor prepared by the method of example 1 of the invention.
FIG. 4 is an optical microscope representation of a fully encapsulated h-BN/InSe/h-BN van der Waals heterostructure prepared by method example 2 of the present invention.
FIG. 5 is a schematic optical microscope of a fully encapsulated h-BN/InSe/h-BN field effect transistor prepared by method example 3 of the invention.
Description of reference numerals: 1. the device comprises a base substrate, a 2 XY two-axis manual operation table, a3 manual rotation table, a 4 aluminum cylinder, a 5 three-axis manual operation table, a 6 cylindrical support rod, a 7 annular clamp, a 8 telephoto lens, a 9 auxiliary illuminator, a 10 digital camera, a 11 substrate and a 12 glass sheet.
Detailed Description
The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
A two-dimensional material transfer assembly system is characterized in that the two-dimensional material transfer assembly system is constructed and operated by adopting the following steps:
step one, assembling the system base substrate 1. A bread board made of ferromagnetic steel with the thickness of 1 BS-2040-.
And step two, assembling the operating system. Selecting a Bangggood 60mm multiplied by 60mm 1081555 type XY two-axis manual operation table 2 and an MSRP01/M type manual rotation table 3 respectively, fixing the manual rotation table 3 at the center of the upper surface of the XY two-axis manual operation table 2 to enable the whole body to have XY two-dimensional plane regulation and 360-degree rotation functions, fixing a surface-polished aluminum cylinder 4 with the height of 30mm and the diameter of 25mm at the center of the surface of the two-dimensional plane rotation table, finally fixing 4 cylindrical neodymium magnets with the thickness of 2mm and the diameter of 10mm at four corners of the bottom of the XY + theta two-dimensional plane rotation table respectively, enabling the whole body to be accurately fixed on the base plate 1 in the step one by means of the attraction force of the magnets and the base plate, and using the neodymium magnets and the neodymium magnets for fixing and regulating a substrate material (sample table) during two-. A Bangggood 60mm 1105874 type three-axis manual operation table 5 is selected, 4 cylindrical neodymium magnets with the thickness of 2mm and the diameter of 10mm are fixed at four corners of the bottom of the manual operation table respectively, and after the manual operation table is accurately fixed on a base plate, the four cylindrical neodymium magnets are integrally used for accurately controlling the alignment, the attaching and the separating functions of a two-dimensional material sheet to be transferred and a target area of a substrate material. The assembly and the fixed connection of each part in the operation system are realized by using Nural 26 type epoxy resin adhesive.
And step three, assembling an imaging observation system. An RS300/M cylindrical support rod 6 (with a height of 300mm) is connected to a PB1M base by M6 type screws, and the PB1M base connected with the support rod is fixed on the surface of the bread board by 4M 6 type screws. Then, a ring-shaped clamp 7 (with the diameter of 50mm) with the function of adjusting the thick/thin focusing screw is installed and fixed on the cylindrical supporting rod 6, and then a 400X biaxial illumination telephoto lens is installed and fixed on the ring-shaped clamp 7, and a set screw and a biaxial illuminator need to be taken down to adapt to the ring-shaped clamp 7 during installation. After the tele lens 8 is fully secured to the ring fixture 7, a 3.5X auxiliary illuminator 9 is mounted on the bottom 8 of the tele lens for connection to the LED illuminator. Finally, a 210 ten thousand pixel digital camera 10 is mounted on top of the fixed tele lens 8.
And step four, integrally assembling, combining and adjusting. And adjusting the relative positions of the imaging observation system and the operating system to finally achieve that the two-dimensional material sheet on the PDMS surface and the substrate material surface can be respectively observed in a focusing mode by adjusting the Z-axis height of the imaging observation system, as shown in fig. 1 and fig. 2.
And step five, transferring the use and evaluation of the assembly system. Firstly, preparing a two-dimensional material sheet by using a mechanical stripping method through an SPV 224 type Nitto adhesive tape based on a high-quality single crystal, and then using a Gel-pak WF-30-x4-6mil type dimethyl siloxane (PDMS) adhesive surface to perform adhesive separation with the adhesive surface of the Nitto adhesive tape with the two-dimensional material sheet to obtain the PDMS with the two-dimensional material sheet. Using an optical microscope, observing the PDMS surface with the two-dimensional material in transmission mode, selecting and marking the target two-dimensional material sheet to be transferred. And taking one common glass sheet 12 with the specification of 25mm by 75mm, and fixing one end of the PDMS far away from the target two-dimensional material sheet on the short edge of the glass sheet 12 through a Sjo tape to form a cantilever beam structure. When fixing, it should be ensured that the back surface (non-adhesive surface) of the PDMS is in contact with the surface of the glass plate 12, and the PDMS portion with the target two-dimensional indium selenide thin sheet is in a suspended state. The target substrate and the glass sheet 12 with the target two-dimensional material sheet were cantilever-fixed on an XY + θ two-dimensional planar rotary sample stage and a three-dimensional manual stage, respectively, using a sigao double-sided adhesive tape. When the substrate is fixed, the surface contacting with the two-dimensional material sheet faces upwards, and the back surface is adhered to a sample table through a Siji double-sided adhesive tape. When the glass sheet 12 is fixed to the cantilever, the short side of the glass sheet 12 without the PDMS end is fixed to the three-dimensional manual stage 5 by a double-sided adhesive tape, and the side with the sample (adhesive side) is kept facing down. And switching on a power supply of the LED illuminator, adjusting an XYZ three-dimensional manual operation table 5 and an XY + theta two-dimensional plane rotation sample table to align the region to be bonded on the substrate and the two-dimensional material sheet to be transferred on the PDMS in the Z-axis direction, adjusting the three-dimensional manual operation table 5 to slowly move the PDMS with the target two-dimensional material sheet down to be close to the surface of the target region on the substrate until the viscous surface of the PDMS is completely bonded on the surface of the substrate finally, and accurately bonding the target two-dimensional material sheet on the target region on the substrate. And adjusting the three-dimensional manual operation table to slowly lift the cantilever beam with the PDMS so as to separate the PDMS viscous surface from the upper surface of the substrate, and finally transferring the target two-dimensional material sheet to the target position of the substrate material. Based on the built transfer assembly platform and operation, the building of various two-dimensional devices and van der Waals heterostructures thereof can be realized by selecting different substrate materials and different two-dimensional materials.
TABLE 1 component abstract of a low-cost two-dimensional material transfer assembly system
Example 1:
step one, adopting a metal hard mask and forming SiO at 285nm2The thermal evaporation of the Si surface is used for preparing 1 metal electrode with a chromium (5 nm)/gold (30nm) symmetrical structure, and the channel distance between the electrodes is 30 mu m.
And secondly, selecting an indium selenide body material with good crystallization quality and a bright surface, and sticking an indium selenide thin sheet with the thickness of about 1-3 microns on the surface of the indium selenide body material by using an SPV 224 type Nitto adhesive tape. And then carrying out bonding separation on the Nitto adhesive tape with the indium selenide thin sheet for many times until the indium selenide thin layers with the thickness of about 1-100 nanometers are densely distributed on the surface of the adhesive tape. When bonding and separating, in order to protect the flat surface of the indium selenide body material, the indium selenide surface is in full contact with the surface of the adhesive tape when bonding. The separation is carried out slowly in one direction.
And step three, attaching a piece of Gel-pak WF-30-x4-6mil type dimethyl siloxane (PDMS) with the size of 10mm x 10mm to the surface of the Nitto tape with the indium selenide sheet layer with the thickness of 1-100 nanometers, lightly pressing the back surface (non-adhesive surface) of the PDMS by using a cotton swab, and then clamping one corner of the PDMS by using a pair of tweezers to separate the PDMS to obtain the PDMS with the two-dimensional indium selenide material.
And fourthly, observing the surface of the PDMS adhered with the two-dimensional indium selenide material by using a Motic BA310 MET-T type optical microscope in a transmission mode, finding a two-dimensional indium selenide slice with the size of about 100 mu m by 25 mu m and uniform thickness, and marking the position and the shape of the two-dimensional indium selenide slice.
And fifthly, selecting one common glass sheet with the specification of 25mm by 75mm, and fixing one end of PDMS (polydimethylsiloxane) far away from the target two-dimensional indium selenide sheet on the short edge of the glass sheet through a Gaussian adhesive tape to form a cantilever beam structure. When fixing, the back surface (non-adhesive surface) of the PDMS should be ensured to contact the surface of the glass sheet, and the PDMS part with the target two-dimensional indium selenide thin sheet is in a suspended state.
Step six, respectively using Sigao double-sided adhesive tapes to enable SiO with electrodes2the/Si substrate and the glass sheet cantilever with the target two-dimensional indium selenide thin sheet are fixed on a two-dimensional plane rotating sample table and a three-dimensional manual operation table. When the substrate is fixed, the surface with the electrode pattern faces upwards, and the back surface is adhered to a sample table through a Sigao double-sided adhesive tape. When the glass sheet cantilever is fixed, the short side of the glass sheet without PDMS end is fixed on the three-dimensional manual operation table by the Siji double-sided adhesive tape, and the side with the sample (adhesive side) is downward, as shown in FIG. 3.
And seventhly, switching on a power supply of the LED double-shaft illuminator, adjusting a three-dimensional manual operating platform and an XY + theta two-dimensional plane rotating sample platform to enable the electrode pattern on the substrate and the two-dimensional indium selenide thin sheet to be transferred on the PDMS to be strictly aligned in the Z-axis direction, adjusting the three-dimensional manual operating platform to enable the PDMS with the target two-dimensional indium selenide thin sheet to slowly move down to be close to the upper surface of the substrate until the PDMS sticky surface is finally attached to the surface of the substrate, and enabling the target two-dimensional indium selenide material to be accurately overlapped between the gold. And adjusting the three-dimensional manual operating platform to slowly raise the PDMS and separate the PDMS from the substrate, and keeping the target two-dimensional indium selenide thin sheet on the gold electrode of the SiO2/Si substrate to complete the preparation of the gold-two-dimensional indium selenide-gold field effect transistor.
In this example, the two-dimensional material transfer assembly system mentioned in the present invention was used to successfully prepare a gold-two-dimensional indium selenide-gold field effect transistor, the time used is 5 minutes, and the schematic diagram of the optical microscope is shown in fig. 4.
Example 2:
step one, two-dimensional hexagonal boron nitride flakes of about 100 μm by 200 μm thickness were prepared using the mechanical lift-off method and transfer operation described in step two to step seven of example 1, and transferred to 285nm SiO with specific alignment patterns using the two-dimensional material transfer assembly system of the present invention2the/Si substrate surface is used as bottom hexagonal boron nitride.
And step two, repeating the operations from the step two to the step seven in the embodiment 1, preparing a two-dimensional indium selenide thin sheet with a side length of about 50 μm and a regular triangle shape and uniform thickness, and transferring and attaching the two-dimensional indium selenide thin sheet to the surface of the hexagonal boron nitride at the bottom by using the two-dimensional material transfer assembly system provided by the invention. During transfer, the two-dimensional indium selenide thin sheet is completely attached to the surface range of the hexagonal boron nitride at the bottom.
And step three, repeating the operation in the step one, preparing the hexagonal boron nitride sheet with uniform thickness and slightly larger size than the transferred two-dimensional indium selenide material, and accurately transferring and covering the hexagonal boron nitride sheet on the surface of the two-dimensional indium selenide material by using the two-dimensional material transfer assembly system provided by the invention.
In this embodiment, the two-dimensional material transfer assembly system mentioned in the present invention was successfully applied to 285nm SiO2Si substrate surface designationThe position constructs a hexagonal boron nitride/two-dimensional indium selenide/hexagonal boron nitride Van der Waals heterostructure, the used time is 15 minutes, and the schematic diagram of an optical microscope is shown in figure 5.
Example 3:
step one, adopting a metal hard mask and forming SiO at 285nm2The Si surface is thermally evaporated to prepare 1 metal electrode with a symmetrical structure of chromium (5 nm)/gold (30nm), and the channel distance between the electrodes is 10 mu m.
And step two, preparing hexagonal boron nitride flakes with uniform thickness of about 50 μm by 130 μm by using the mechanical stripping method and the transfer operation thereof described in step two to step seven of example 1, adjusting the length direction of the hexagonal boron nitride to be the same as the direction of the electrode channel by using the two-dimensional material transfer assembly system, and transferring and completely attaching the hexagonal boron nitride flakes to the electrode channel.
And step three, repeating the operations from the step two to the step seven in the embodiment 1, preparing a two-dimensional indium selenide thin sheet with the size of about 50 μm x 100 μm and uniform thickness, then using the two-dimensional material transfer assembly system provided by the invention, adjusting the length direction of the two-dimensional indium selenide to be vertical to the direction of the electrode channel, and transferring and completely overlapping the two-dimensional indium selenide thin sheet on the electrodes on the two sides of the hexagonal boron nitride at the bottom.
And step four, repeating the operation in the step one, preparing the hexagonal boron nitride sheet with uniform thickness and slightly larger size than the transferred two-dimensional indium selenide material, and accurately transferring and covering the hexagonal boron nitride sheet on the surface of the two-dimensional indium selenide material by using the two-dimensional material transfer assembly system provided by the invention.
In this embodiment, the two-dimensional material transfer assembly system provided by the invention is adopted to successfully construct the h-BN/InSe/h-BN field effect transistor fully encapsulated by hexagonal boron nitride, the time used is 15 minutes, and the schematic diagram of an optical microscope is shown in FIG. 5.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (7)
1. A two-dimensional material transfer assembly system, characterized by: the device comprises a base substrate, an operating system and an imaging observation system; the base substrate is used for supporting the whole system device;
the operating system comprises an XY two-axis manual operating platform, a manual rotating platform, an aluminum cylinder and a three-axis manual operating platform; the aluminum cylinder is fixed at the center of the upper surface of the manual rotating table; the manual rotating table is fixed on the base plate through the XY two-axis manual operating table, can rotate 360 degrees in an XY two-dimensional plane and is used for fixing and adjusting a substrate material; the three-axis manual operation table is fixed on the base plate and used for controlling the alignment of a two-dimensional material sheet to be transferred and a substrate material target area;
the imaging observation system comprises a cylindrical support rod, a base, an annular clamp, a long-focus lens, an auxiliary illuminator and a digital camera; the cylindrical supporting rod is vertically fixed on the base plate of the base through the base, the telephoto lens is fixed on the cylindrical supporting rod through the annular clamp, and the annular clamp has a coarse/fine focusing screw adjusting function; the auxiliary illuminator is arranged at the bottom of the long-focus lens and is used for connecting the LED illuminator; the digital camera is fixedly arranged at the top of the tele lens;
and adjusting the relative positions of the imaging and observing system and the operating system so that the Z-axis height of the imaging and observing system can focus and observe the two-dimensional material sheet on the PDMS surface and the substrate material surface respectively.
2. The two-dimensional material transfer assembly system of claim 1, wherein: the base substrate is a bread board made of ferromagnetic steel with the thickness of 1 BS-2040-.
3. The two-dimensional material transfer assembly system of claim 1, wherein: four corners of XY diaxon manual operation platform bottom surface and triaxial manual operation platform bottom surface all are provided with 4 thickness and are 2mm, and the diameter is cylindrical neodymium magnet of 10mm, realize preliminary location through the appeal of magnet and base plate.
4. The two-dimensional material transfer assembly system of claim 1, wherein: the model of the XY two-axis manual operation table is Bangggood 60mm multiplied by 60mm 1081555, the model of the manual rotation table is MSRP01/M, and the model of the triaxial manual operation table is Bangggood 60mm multiplied by 60mm 1105874.
5. The two-dimensional material transfer assembly system of claim 1, wherein: the aluminum cylinder is 30mm in height and 25mm in diameter.
6. The two-dimensional material transfer assembly system of claim 1, wherein: the tele lens is a 400X biaxial illumination tele lens.
7. The two-dimensional material transfer assembly system of claim 1, wherein: the model of the cylindrical supporting rod is RS300/M, and the base is a PB1M base; the auxiliary illuminator is a 3.5X auxiliary illuminator.
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