CN211828544U

CN211828544U - Key device and key unit thereof

Info

Publication number: CN211828544U
Application number: CN202020072367.5U
Authority: CN
Inventors: 许新富; 廖恩孝; 王崧霖
Original assignee: Elan Microelectronics Corp
Current assignee: Elan Microelectronics Corp
Priority date: 2020-01-02
Filing date: 2020-01-14
Publication date: 2020-10-30
Anticipated expiration: 2030-01-14
Also published as: TWM596964U

Abstract

The utility model discloses a button device and button unit thereof, button device has base plate and button unit, be equipped with first circuit unit and the second circuit unit of mutual insulation on the base plate, the conducting layer of button unit has fixed part and the actuating part that is connected, the fixed part forms the electricity with first circuit unit and is connected, actuating part is corresponding to second circuit unit, when button unit's shell fragment is pushed down, support through the buffer layer and press the conducting layer, and make the conducting layer warp, and make the actuating part of conducting layer and second circuit unit form the electricity and be connected, then borrow by the conducting layer as and switch on the medium with the base plate, make the shell fragment not directly strike the circuit unit of base plate, reduce the produced noise of shell fragment when triggering and switching on.

Description

Key device and key unit thereof

Technical Field

The utility model relates to a button device indicates a button device on being applied to electronic device's touch pad very much.

Background

The key device is widely used in electronic devices, such as touch panels, keyboards, etc., and mainly has a conductive elastic sheet and a substrate, etc., wherein the conductive elastic sheet is deformed by pressing the conductive elastic sheet, and the deformed conductive elastic sheet and a circuit on the substrate form a passage to trigger the key effect. However, when the conductive elastic sheet is deformed and contacts the circuit on the substrate, it is inevitable to generate noise caused by impact, so in the prior art, an improved structure for reducing noise is continuously sought to provide better user experience.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a key device and a key unit thereof, which improve the key device of the prior art to reduce noise.

In order to achieve the above-mentioned novel object, the utility model discloses a technical means for provide a button device, it includes: a substrate and a key unit; the substrate is provided with a first circuit unit and a second circuit unit, and the first circuit unit and the second circuit unit are insulated from each other; the key unit is arranged on the substrate and comprises a buffer layer, an elastic sheet and a conductive layer; the buffer layer is provided with a first side surface and a second side surface; the elastic sheet is provided with a deformation area, and the periphery of the elastic sheet is connected with the second side surface of the buffer layer; the conducting layer is arranged on the first side face of the buffer layer and comprises a fixing part and an actuating part which are connected, the actuating part of the conducting layer corresponds to the deformation region of the elastic sheet, the fixing part is adjacent to the outer periphery of the actuating part, the fixing part is electrically connected with the first circuit unit of the substrate, the actuating part corresponds to the second circuit unit of the substrate, and a gap is formed between the actuating part and the second circuit unit of the substrate.

The spacer layer is made of insulating material and is arranged between the conducting layer and the substrate, and corresponds to the second area of the fixing part, so that the gap is formed between the actuating part and the second circuit unit of the substrate.

The thickness of the fixing part of the conducting layer is larger than that of the actuating part, so that the gap is formed between the actuating part and the second circuit unit of the substrate.

The thickness of the partial area of the second circuit unit is larger than that of the first circuit unit, and the partial area of the second circuit unit corresponds to the position of the fixing part of the conductive layer, so that the gap is formed between the actuating part and the second circuit unit of the substrate.

The periphery of the buffer layer is provided with an extension wall, the extension wall is wrapped on the periphery of the fixing part of the conducting layer, and the periphery of the extension wall is abutted against the first circuit unit of the substrate.

The first circuit unit is arranged around the periphery of the second circuit unit.

Wherein, it further includes a protective layer, and this protective layer covers the surface of this shell fragment.

Wherein, the upper surface of the protective layer is provided with a pressing flange which is aligned with the deformation area of the elastic sheet.

Wherein, the conductive layer is a conductive cloth woven by a conductive material.

The conductive layer is connected with the first circuit unit through a conductive adhesive.

On the other hand, the utility model provides a key unit, it includes: a buffer layer, a spring plate and a conductive layer; the buffer layer is provided with a first side surface and a second side surface; the elastic sheet is arranged on the second side surface of the buffer layer and is provided with a deformation area; the conducting layer is arranged on the first side face of the buffer layer and is provided with an actuating part and a fixing part, the actuating part of the conducting layer corresponds to the deformation region of the elastic sheet, the fixing part is adjacent to the outer periphery of the actuating part, and the thickness of the actuating part is smaller than or equal to that of the fixing part.

The buffer layer is arranged on the first side surface of the buffer layer, and the actuating portion is arranged on the first side surface of the buffer layer and is used for actuating the buffer layer to move along the buffer layer.

Wherein, the thickness of the fixed part of the conducting layer is larger than that of the actuating part.

The periphery of the buffer layer is provided with an extension wall, and the extension wall is wrapped on the periphery of the fixing part of the conducting layer.

The first area of the fixing part is arranged around the periphery of the second area of the fixing part.

The utility model has the advantages of, borrow by the conducting layer as the medium that switches on with the base plate, then the shell fragment only participates in the process that triggers to switch on, and the indirect circuit unit contact on with the base plate has the buffer layer between shell fragment and the conducting layer, and absorbs the produced noise when shell fragment and conducting layer contact, consequently reduces the produced noise of shell fragment when triggering to switch on.

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

Drawings

FIG. 1 is a side sectional view of a first embodiment of the present invention;

fig. 2 is a top view of a first embodiment of the present invention;

FIG. 3 is an enlarged side view of a portion of the components of the first embodiment of the present invention;

fig. 4 is a side view cross section action diagram of the first embodiment of the present invention;

fig. 5 is a side sectional view of a second embodiment of the present invention;

fig. 6 is a top view of a second embodiment of the present invention;

fig. 7 is a side view cross section action diagram of a second embodiment of the present invention;

fig. 8 is a side sectional view of a third embodiment of the present invention;

fig. 9 is a top view of a third embodiment of the present invention;

fig. 10 is a side view cross-sectional action diagram of a third embodiment of the present invention.

Wherein, the reference numbers:

10.

10A substrate

11, 11A first line unit

12. 12A second line unit 20 key unit

21. 21A

conductive layer

211, 211A fixing part

211a first region 211b second region

212.

212A actuator

22, 22A buffer layer

221A extension wall 23 spring

231 deformation zone 24 protection layer

241 against the spacing layer of the flange 25

26 conductive adhesive

Detailed Description

The technical solutions adopted by the present invention to achieve the above-mentioned objects are further described below in conjunction with the drawings and the embodiments of the present invention, wherein the drawings have been simplified for illustrative purposes only, and the structure or method of the present invention is described by describing the elements and the relationships between the elements of the present invention, so that the elements shown in the drawings are not represented by actual numbers, actual shapes, actual sizes, and actual proportions, and the sizes or size proportions have been enlarged or simplified, thereby providing better illustrations, and the actual numbers, actual shapes, or actual size proportions have been selectively designed and arranged, and the detailed layout of the elements may be more complicated.

Referring to fig. 1 and 2, the key device of the present invention includes a substrate 10 and a key unit 20.

A first circuit unit 11 and a second circuit unit 12 are disposed on the substrate 10, and the first circuit unit 11 and the second circuit unit 12 are insulated from each other. In one embodiment, the first circuit unit 11 is disposed around the periphery of the second circuit unit 12, and a distance is left between the first circuit unit 11 and the second circuit unit 12.

Referring to fig. 1 to 3, the key unit 20 is disposed on the substrate 10, and the key unit 20 includes a conductive layer 21, a buffer layer 22 and a resilient sheet 23. The conductive layer 21 is a deformable layer, which is disposed on the substrate 10 and electrically connected to the first circuit unit 11, and the conductive layer 21 is insulated from the second circuit unit 12 when not deformed. The conductive layer 21 includes a fixed portion 211 and an actuating portion 212 connected to each other, the fixed portion 211 is adjacent to an outer periphery of the actuating portion 212, wherein the fixed portion 211 is electrically connected to the first circuit unit 11 of the substrate 10. In one embodiment, the fixing portion 211 and the first circuit unit 11 can be electrically connected through a conductive adhesive 26. The position of the actuating portion 212 corresponds to the second circuit unit 12 of the substrate 10, but a gap d exists between the actuating portion 212 and the second circuit unit 12 of the substrate 10, and the actuating portion 212 is selectively electrically connected to the second circuit unit 12 of the substrate 10, that is, when the conductive layer 21 is deformed by pressure, the actuating portion 212 contacts with the second circuit unit 12 of the substrate 10 to form an electrical connection. The buffer layer 22 is disposed on the conductive layer 21, and the conductive layer 21 is disposed between the buffer layer 22 and the substrate 10. In one embodiment, the buffering layer 22 is a deformable insulating material, and preferably can be selected from an insulating material with noise absorption buffering function, such as Rubber (Rubber), Silicon (Silicon), Foam (Foam), pet (polyethylene terephthalate), pu (polyurethane), etc., and a glue is disposed between the buffering layer 22 and the fixing portion 211, but no glue is disposed between the buffering layer 22 and the actuating portion 212. The elastic sheet 23 is disposed on the buffer layer 22, the buffer layer 22 is disposed between the elastic sheet 23 and the conductive layer 21, the elastic sheet 23 has a deformation region 231, and the position of the deformation region 231 corresponds to the position of the actuating portion 212 of the conductive layer 21. In an embodiment, a protection layer 24 is disposed on the elastic sheet 23, the elastic sheet 23 is located between the protection layer 24 and the buffer layer 22, the protection layer 24 covers an outer surface of the elastic sheet 23 and is connected to the buffer layer 22, a pressing flange 241 may be disposed on the protection layer 24, a position of the pressing flange 241 corresponds to a position of the deformation region 231 of the elastic sheet 23, and the pressing flange 241 is used for applying an external force to deform the elastic sheet 23.

The Conductive layer 21 may be made of various Conductive materials, such as Conductive tape (Conductive tape), copper Foil (Cu-Foil), aluminum Foil (Al-Foil), Conductive Mylar (Conductive Mylar), Conductive foam (Conductive foam), etc., and in one embodiment, the Conductive layer 21 is a Conductive cloth woven by a Conductive material.

There are various embodiments of the method for forming the gap d between the actuating portion 212 of the conductive layer 21 and the second circuit unit 12 of the substrate 10, and the following description is not limited thereto.

Referring to fig. 1, fig. 2 and fig. 4, in an embodiment, the fixing portion 211 of the conductive layer 21 includes a first region 211a and a second region 211b, the first region 211a of the fixing portion 211 is electrically connected to the first circuit unit 11, and a spacer layer 25 made of an insulating material is disposed between the second region 211b of the fixing portion 211 and the first circuit unit 11 to pad up a partial area of the conductive layer 21, so that the gap d is formed between the actuating portion 212 of the conductive layer 21 and the second circuit unit 12 of the substrate 10. When a user presses the pressing flange 241 of the passivation layer 24, the deformation region 231 of the elastic sheet 23 deforms to push against the buffer layer 22, and the buffer layer 22 further presses the actuating portion 212 of the conductive layer 21, so that the actuating portion 212 of the conductive layer 21 spans the gap d after being pressed and deformed, and the actuating portion 212 contacts with the second circuit unit 12 of the substrate 10 to form an electrical connection.

Referring to fig. 5 to 7, in an embodiment, the thickness of the fixing portion 211A of the conductive layer 21A is greater than the thickness of the actuating portion 212A, so that the gap d is formed between the actuating portion 212A of the conductive layer 21A and the second circuit unit 12 of the substrate 10. When a user presses the pressing flange 241 of the passivation layer 24, the deformation region 231 of the elastic sheet 23 deforms and pushes against the buffer layer 22A, and the buffer layer 22A further presses the actuating portion 212A of the conductive layer 21A, so that the actuating portion 212A of the conductive layer 21A is pressed and deformed to cross the gap d, and the actuating portion 212A contacts with the second circuit unit 12 of the substrate 10 to form an electrical connection.

Referring to fig. 8 to 10, in an embodiment, a thickness of a partial region of the first circuit unit 11A of the substrate 10A is greater than a thickness of the second circuit unit 12A, and the partial region of the first circuit unit 11A of the substrate 10A corresponds to a position of the fixing portion 211 of the conductive layer 21, so that the gap d is formed between the actuating portion 212 of the conductive layer 21 and the second circuit unit 12A of the substrate 10. When a user presses the pressing flange 241 of the passivation layer 24, the deformation region 231 of the elastic sheet 23 deforms and pushes against the buffer layer 22A, and the buffer layer 22A further presses the actuating portion 212 of the conductive layer 21, so that the actuating portion 212 of the conductive layer 21 is pressed and deformed to cross the gap d, and the actuating portion 212 contacts with the second circuit unit 12A of the substrate 10A to form an electrical connection.

Further, as shown in fig. 5 and 8, the periphery of the buffer layer 22A is bent downward to form an extension wall 221A, the extension wall 211A covers the periphery of the fixing

portions

211A, 211 of the

conductive layers

21A, 21, and the end of the extension portion 211A abuts against the

first circuit units

11, 11A of the

substrates

10, 10A to seal the

conductive layers

21A, 21 between the buffer layer 22A and the

substrates

10, 10A, so that when the

actuating portions

212A, 212 of the

conductive layers

21A, 21 contact with the second circuit unit 12A to form an electrical connection, the sound generated by the contact can be blocked between the extension walls of the

conductive layers

21A, 21, 22A, 221A and the

substrates

10, 10A, thereby achieving the effect of further noise reduction.

Moreover, since the glue is only disposed at the fixing portion 211 and not at the actuating portion 212 between the buffer layer 22 and the conductive layer 21, when the conductive layer 21 is a woven conductive fabric, the situation that the glue overflows the pores of the conductive fabric to adhere to the second circuit unit 12 when the actuating portion 212 is separated from the second circuit unit 12 can be avoided.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention in any way, and the present invention has been disclosed in the above embodiments, but not limited to the above embodiments, and any person who knows commonly in any technical field can make modifications or equivalent changes within the scope of the technical solution of the present invention.

Of course, the present invention can have other embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present invention without departing from the spirit and the essence of the present invention, and these corresponding changes and modifications should fall within the protection scope of the claims of the present invention.

Claims

1. A key device, comprising:

a substrate, on which a first circuit unit and a second circuit unit are arranged, the first circuit unit and the second circuit unit are insulated from each other;

a key unit disposed on the substrate, comprising:

a buffer layer having a first side and a second side;

the elastic sheet is provided with a deformation area, and the periphery of the elastic sheet is connected with the second side surface of the buffer layer; and

the conducting layer is arranged on the first side face of the buffer layer and comprises a fixing part and an actuating part which are connected, the actuating part of the conducting layer corresponds to the deformation region of the elastic sheet, the fixing part is adjacent to the outer periphery of the actuating part, the fixing part is electrically connected with the first circuit unit of the substrate, the actuating part corresponds to the second circuit unit of the substrate, and a gap is formed between the actuating part and the second circuit unit of the substrate.

2. The key device of claim 1, further comprising a spacer layer, wherein the fixing portion comprises a first region and a second region connected to each other, the first region of the fixing portion is electrically connected to the first circuit unit of the substrate, the second region of the fixing portion is attached to the first side of the buffer layer, and the spacer layer is made of an insulating material and disposed between the conductive layer and the substrate, and corresponds to the second region of the fixing portion, such that the gap is formed between the actuating portion and the second circuit unit of the substrate.

3. The key device of claim 1, wherein the thickness of the fixing portion of the conductive layer is greater than the thickness of the actuating portion, such that the gap is formed between the actuating portion and the second circuit unit of the substrate.

4. The key device of claim 1, wherein the thickness of the partial region of the second circuit unit is greater than the thickness of the first circuit unit, the partial region of the second circuit unit corresponding to the position of the fixing portion of the conductive layer, such that the gap is formed between the actuating portion and the second circuit unit of the substrate.

5. The key device according to any one of claims 1 to 4, wherein the peripheral edge of the buffer layer has an extended wall, the extended wall wraps the peripheral edge of the fixing portion of the conductive layer, and the peripheral edge of the extended wall abuts against the first circuit unit of the substrate.

6. The key device according to any one of claims 1 to 4, wherein the first circuit unit is disposed around a periphery of the second circuit unit.

7. The key device according to any one of claims 1-4, further comprising a protective layer covering an outer surface of the resilient sheet.

8. The key device of claim 7, wherein the top surface of the protection layer has a pressing flange aligned with the deformation region of the resilient sheet.

9. The key device according to any one of claims 1 to 4, wherein the conductive layer is a conductive cloth woven with a conductive material.

10. The key device according to any one of claims 1 to 4, wherein the conductive layer is connected to the first circuit unit by a conductive adhesive.

11. A key unit, comprising:

a buffer layer having a first side and a second side;

the elastic sheet is arranged on the second side surface of the buffer layer and is provided with a deformation area; and

the conducting layer is arranged on the first side face of the buffer layer and is provided with an actuating part and a fixing part, the actuating part of the conducting layer corresponds to the deformation area of the elastic sheet, the fixing part is adjacent to the outer periphery of the actuating part, and the thickness of the actuating part is smaller than or equal to that of the fixing part.

12. The key unit of claim 11, further comprising a spacer layer, wherein the actuating portion has a thickness equal to a thickness of the fixing portion, the fixing portion comprises a first region and a second region connected to each other, the second region of the fixing portion is attached to the first side of the buffer layer, and the spacer layer is made of an insulating material and disposed on the second region of the fixing portion.

13. The key unit of claim 11, wherein the thickness of the fixed portion of the conductive layer is greater than the thickness of the actuating portion.

14. The key unit according to any one of claims 11 to 13, wherein the peripheral edge of the buffer layer has an extended wall, and the extended wall is wrapped around the peripheral edge of the fixing portion of the conductive layer.

15. The key unit of claim 12, wherein the first area of the securing portion surrounds a periphery of the second area of the securing portion.

16. The key unit according to any one of claims 11-13, further comprising a protective layer covering an outer surface of the dome.

17. The key unit according to any one of claims 11 to 13, wherein the conductive layer is a conductive cloth woven with a conductive material.