TWM566357U - Keyswitch device - Google Patents

Abstract

A keyswitch device includes a circuit board, a switch circuit, a conductive cushion member, and a metal dome. The circuit board has a surface. The switch circuit is disposed on the surface. The conductive cushion member is disposed on the surface. A part of the switch circuit is located between the surface and the conductive cushion member. The metal dome covers the conductive cushion member and is configured to deform toward the circuit board to press the conductive cushion member.

Description

Button device

This creation relates to a key device, and more particularly to a key device with a metal spring sheet.

In terms of current personal computer usage habits, the key device is one of the indispensable input devices for entering text or numbers. Not only that, all consumer electronics products or large-scale processing equipment used in industry need to be equipped with a button structure as an input device to operate the above-mentioned electronic products and processing equipment.

For low-stroke buttons or touchpads, metal shrapnels are generally used as components of trigger switches. In application, metal shrapnel usually needs to cooperate with the switch circuit on the circuit board for signal conduction trigger. However, when the metal elastic sheet is pressed, it will collide with the switch circuit contact pad (for example, a copper sheet) on the circuit board, causing an unpleasant sound. That is, the aforementioned combination of signal on triggers is prone to generate noise in operation.

Therefore, how to propose a key device that can solve the above problems is one of the problems that the industry is eager to invest in research and development resources.

In view of this, one object of the present invention is to propose a key device that can effectively solve the aforementioned problems.

In order to achieve the above object, according to an embodiment of the present invention, a key device includes a circuit board, a switch circuit, a conductive buffer, and a metal elastic piece. The circuit board has a surface. The switch circuit is disposed on this surface. The conductive buffer is disposed on the aforementioned surface. A part of the switching circuit is located between the aforementioned surface and the conductive buffer. The metal elastic piece covers the conductive buffer, and is configured to deform toward the circuit board to press the conductive buffer.

In one or more embodiments of the present invention, the aforementioned part of the switch circuit includes a first switch pad and a second switch pad. The second switch pad is separated from the first switch pad. The deformed metal dome is configured to contact the conductive buffer with the pressing area. The conductive buffer is disposed to contact the first switch pad and the second switch pad.

In one or more embodiments of the present invention, the orthographic projection of the pressing area on the aforementioned surface at least partially overlaps the first switch pad and the second switch pad.

In one or more embodiments of the present invention, the aforementioned portion of the switch circuit includes a first switch pad. The switching circuit also includes a second switching pad. The metal dome contacts the second switch pad electrically. The deformed metal dome is configured to contact the conductive buffer with the pressing area. The orthographic projection of the pressing area on the aforementioned surface at least partially overlaps the first switch pad.

In one or more embodiments of the present invention, the conductive buffer is a conductive foam.

In one or more embodiments of the present invention, the conductive buffer is an anisotropic conductive film.

In one or more embodiments of the present invention, the conductive buffer package Contains buffer structure and conductive parts. The buffer structure is disposed on the surface and is located between the circuit board and the metal spring sheet. The conductive member is disposed on a side of the buffer structure facing the circuit board, and is opposite to the aforementioned part of the switching circuit. The metal dome is configured to press the conductive buffer to contact the conductive member with the aforementioned portion of the switch circuit.

In one or more embodiments of the present invention, the buffer structure has a depression. The depression abuts the aforementioned surface of the circuit board. The conductive part and the aforementioned part of the switching circuit are located in the recess.

In one or more embodiments of the present invention, the buffer structure includes a spacer layer and a buffer layer. The spacer layer is disposed on the aforementioned surface and has an accommodation space. The aforementioned part of the switching circuit is located in the accommodation space. The buffer layer covers the spacer layer to form a depression together. The conductive member is disposed on a side of the buffer layer facing the circuit board.

In one or more embodiments of the present invention, the buffer layer is a PET pad.

In one or more embodiments of the present invention, the part of the switch circuit includes a first switch pad and a second switch pad. The second switch pad is separated from the first switch pad. The deformed metal dome is configured to contact the cushioning structure with the pressing area. The orthographic projection of the pressing area and the conductive member on the aforementioned surface at least partially overlaps the first switch pad and the second switch pad.

To sum up, in the key device of the present invention, the conductive buffer member provided between the switch circuit on the circuit board and the metal spring sheet can buffer the impact generated by the deformed metal spring sheet. Not only that, the conductive buffer can also provide the function of conducting electricity. Therefore, when the user presses the key device of this creation, the conductive buffer member can be used as a buffer and conductive medium between the switch circuit and the metal elastic piece. Media to effectively reduce the sound of metal collisions, thereby achieving the purpose of reducing noise.

The above is only used to explain the problems that this creation intends to solve, the technical means to solve the problems, and the effects they produce, etc. The specific details of this creation will be described in detail in the following embodiments and related drawings.

100, 200A, 200B, 300, 400‧‧‧ button devices

110‧‧‧Circuit board

110a‧‧‧ surface

111, 211‧‧‧ switch circuit

111a, 211a‧‧‧The first switch pad

111b, 211b‧‧‧Second switch pad

120, 220a, 220b, 320, 420‧‧‧ conductive buffer

130‧‧‧Metal shrapnel

131‧‧‧Press area

321, 421‧‧‧Buffer Structure

321a‧‧‧spacer

321b‧‧‧Buffer layer

322‧‧‧Conductive parts

P‧‧‧ Orthographic

R‧‧‧ Depression

S‧‧‧ accommodation space

In order to make the above and other purposes, features, advantages, and embodiments of this creation more comprehensible, the description of the drawings is as follows:

FIG. 1A is a schematic cross-sectional view showing some elements of a key device according to an embodiment of the present invention in an unpressed state.

FIG. 1B is a schematic cross-sectional view showing the structure in FIG. 1A in a pressed state.

FIG. 2 is a partial top view illustrating a circuit switch according to an embodiment of the present invention.

FIG. 3A is a schematic cross-sectional view showing some elements of a key device according to another embodiment of the present invention in an unpressed state.

FIG. 3B is a schematic cross-sectional view showing the structure in FIG. 3A in a pressed state.

FIG. 4 is a partial top view illustrating a circuit switch according to another embodiment of the present invention.

FIG. 5A is a schematic cross-sectional view showing some elements of a key device according to another embodiment of the present invention in an unpressed state.

FIG. 5B is a schematic cross-sectional view showing the structure in FIG. 5A in a pressed state.

FIG. 6A is a schematic cross-sectional view showing some elements of a key device according to another embodiment of the present invention in an unpressed state.

FIG. 6B is a schematic cross-sectional view showing the structure in FIG. 6A in a pressed state.

FIG. 7 is a schematic cross-sectional view showing some elements of a key device according to another embodiment of the present invention in an unpressed state.

In the following, multiple implementations of this creation will be disclosed graphically. For the sake of clarity, many practical details will be explained in the following description. However, it should be understood that these practical details should not be used to limit this creation. That is to say, in the implementation of this creative part, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner. The drawings in the embodiments omit some elements to clearly show the technical characteristics of the creation. The implementation method is only used as an example for illustration, and does not limit the scope of the creative protection. The same reference numbers will be used throughout the drawings to refer to the same or like parts. These drawings are shown for the purpose of clearly expressing the connection relationship between the elements in these embodiments, and are not intended to show the actual dimensions of the elements.

Please refer to Fig. 1A and Fig. 1B. FIG. 1A is a schematic cross-sectional view showing some elements of the key device 100 according to an embodiment of the present invention in an unpressed state. FIG. 1B is a schematic cross-sectional view showing the structure in FIG. 1A in a pressed state. As shown in FIG. 1A and FIG. 1B, the key device 100 in this embodiment may be an external keyboard (for example, a PS2 interface) for a desktop computer. (Such as a keyboard or a USB keyboard) or an input device (such as a touchpad on a notebook computer) in the form of a key, but not limited to this. In other words, the concept of the created key device 100 can be applied to any electronic product that uses pressing as an input method.

As shown in FIG. 1A and FIG. 1B, in the present embodiment, the key device 100 includes a circuit board 110, a switch circuit 111, a conductive buffer 120, and a metal elastic piece 130. The circuit board 110 has a surface 110a. The switch circuit 111 is disposed on the surface 110a. The conductive buffer 120 is disposed on the surface 110 a of the circuit board 110. A part of the switching circuit 111 is located between the surface 110 a of the circuit board 110 and the conductive buffer 120. The metal elastic sheet 130 covers the conductive buffer 120 and is configured to deform toward the circuit board 110 to press the conductive buffer 120.

Please refer to FIG. 2, which is a partial top view illustrating a circuit switch according to an embodiment of the present invention. As shown in FIG. 2, in the present embodiment, a portion of the switch circuit 111 between the surface 110 a and the conductive buffer 120 includes a first switch pad 111 a and a second switch pad 111 b. The second switch pad 111b is separated from the first switch pad 111a, and both have a plurality of extending portions and are staggered with each other. As shown in FIG. 1B, the deformed metal dome 130 is configured to contact the conductive buffer 120 with the pressing region 131. The orthographic projection P of the pressing area 131 on the surface 110 a of the circuit board 110 (shown by a dashed line in the second figure) at least partially overlaps the first switch pad 111 a and the second switch pad 111 b.

In some embodiments, the conductive buffer 120 is an anisotropic conductive film (ACF). The anisotropic conductive film has a characteristic of vertical conductivity. In some embodiments in which the conductive buffer member 120 is an anisotropic conductive film, the anisotropic conductive film is insulated in a direction along the film surface thereof. It is conductive in the direction perpendicular to its film surface. When the metal dome 130 is not pressed, the metal dome 130 is not in contact with the anisotropic conductive film above the switching circuit 111. Therefore, the metal dome 130 is not electrically connected to the switch circuit 111 through the anisotropic conductive film. At the same time, since the anisotropic conductive film is insulated along its film surface direction, even if the anisotropic conductive film is provided to directly contact the switch circuit 111, the first switch pad 111a and the second switch pad of the switch circuit 111 111b will not be electrically conductive. When the metal elastic sheet 130 is pressed, the pressing area 131 of the metal elastic sheet 130 contacts the anisotropic conductive film. Since the anisotropic conductive film has conductivity in a direction perpendicular to the film surface thereof, the metal elastic sheet 130 transmits through the anisotropic conductive film. The film is electrically connected to the switching circuit 111. Therefore, the conductive buffer 120 can be electrically conducted in the Z-axis direction (that is, perpendicular to the film surface direction of the anisotropic conductive film) at a portion pressed by the pressing region 131 of the metal elastic sheet 130.

With the foregoing structural configuration, the conductive buffer member 120 of this embodiment can buffer the impact of the deformed metal elastic sheet 130 on the first switch pad 111a and the second switch pad 111b, and can also provide a conductive function when pressed. The first switch pad 111a and the second switch pad 111b can be electrically connected through the conductive buffer 120 and the metal elastic sheet 130. Therefore, when the user presses the key device 100 of this embodiment, the conductive buffer 120 can be used as a buffer and conductive medium between the switch circuit 111 and the metal elastic sheet 130 to effectively reduce the sound of metal collision, thereby achieving a reduction. The purpose of noise.

In addition, the anisotropic conductive film used in the foregoing embodiment has electrical conductivity in a direction perpendicular to the film surface direction (Z-axis direction), and is insulated in a direction along the film surface direction (X / Y-axis direction). Characteristics, only when the metal elastic sheet 130 is pressed to contact the anisotropic conductive film, the phenomenon of electrical conduction will occur, so The electrical buffer 120 can be disposed to contact the switch circuit 111 when the key device 100 is not pressed, and the switch circuit 111 does not cause electrical conduction, so the overall thickness of the key device 100 can be effectively reduced.

Please refer to Fig. 3A and Fig. 3B. FIG. 3A is a schematic cross-sectional view showing some components of a key device 200A according to another embodiment of the present invention in an unpressed state. FIG. 3B is a schematic cross-sectional view showing the structure in FIG. 3A in a pressed state.

As shown in FIG. 3A and FIG. 3B, in this embodiment, the key device 200A includes a circuit board 110, a switch circuit 211, a conductive buffer 220a, and a metal spring sheet 130. The circuit board 110, the metal spring sheet 130, and FIG. 1A The illustrated embodiments are the same, so reference may be made to the foregoing related description, and details are not described herein. The difference between this embodiment and the embodiment shown in FIG. 1A is that the portion of the switch circuit 211 of this embodiment between the surface 110 a of the circuit board 110 and the conductive buffer 220 a includes a first switch pad 211 a. The second switch pad 211b is located outside the outer edge of the conductive buffer 220a. That is, compared with the embodiment shown in FIG. 1A, the conductive buffer 220 a of this embodiment is shortened in the lateral direction to cover only the first switch pad 211 a. In addition, the metal elastic piece 130 of this embodiment is in electrical contact with the second switch pad 211b.

Please refer to FIG. 4, which is a partial top view illustrating a circuit switch according to another embodiment of the present invention. As shown in FIG. 4, in this embodiment, the second switch pad 211 b is separated from the first switch pad 211 a, and the second switch pad 211 b surrounds the outer edge of the first switch pad 211 a. As shown in FIG. 3B, the deformed metal elastic sheet 130 is configured to contact the conductive buffer 220 a with the pressing region 131. The orthographic projection P of the pressing area 131 on the surface 110a of the circuit board 110 (shown in FIG. 4 as (Dotted line) is at least partially overlapped with the first switch pad 211a.

In some embodiments, the conductive buffer 220a is a conductive foam or an anisotropic conductive film. When the metal elastic piece 130 is pressed, the pressing area 131 of the metal elastic piece 130 contacts the conductive buffer 220a, and the metal elastic piece 130 is electrically connected to the switch circuit 111 through the conductive buffer 220a. With the foregoing structural configuration, the conductive buffer 220a of this embodiment can cushion the impact of the deformed metal spring sheet 130 on the first switch pad 211a, and can also provide a conductive function when pressed, so that the first switch pad 211a It can be electrically conducted to the second switch pad 211b in sequence through the conductive buffer 220a and the metal elastic sheet 130.

Please refer to Fig. 5A and Fig. 5B. FIG. 5A is a schematic cross-sectional view showing some elements of a key device 200B according to another embodiment of the present invention in an unpressed state. FIG. 5B is a schematic cross-sectional view showing the structure in FIG. 5A in a pressed state.

As shown in FIG. 5A and FIG. 5B, in this embodiment, the key device 200B includes a circuit board 110, a switch circuit 211, a conductive buffer 220b, and a metal spring sheet 130, among which the circuit board 110, the switch circuit 211, and the metal spring sheet 130 It is the same as the embodiment shown in FIG. 3A, so reference may be made to the related descriptions above, and details are not described herein. The difference between this embodiment and the embodiment shown in FIG. 3A is that the conductive buffer 220b of this embodiment is provided to cover and contact the first switch pad 211a and the second switch pad 211b. In this embodiment, the conductive buffer 220b may be an anisotropic conductive film. The metal elastic piece 130 is configured so that the pressing area 131 contacts the conductive buffer 220b. The orthographic projection P of the pressing area 131 on the surface 110 a of the circuit board 110 (indicated by a dashed line in FIG. 4) at least partially overlaps the first switch pad 211 a. When the metal dome 130 is pressed, it conducts electricity The buffer 220 b can be electrically conducted in the Z-axis direction (that is, perpendicular to the film surface direction of the anisotropic conductive film) at a portion pressed by the pressing region 131 of the metal elastic sheet 130. The pressing area 131 of the metal elastic piece 130 contacts the conductive buffer 220b, and the metal elastic piece 130 is electrically connected to the switch circuit 211 through the conductive buffer 220b, so that the first switch pad 211a and the second switch pad 211b can pass through the conductive buffer 220b and metal The elastic piece 130 is electrically conductive.

Please refer to Fig. 6A and Fig. 6B. FIG. 6A is a schematic cross-sectional view showing some elements of a key device 300 according to another embodiment of the present invention in an unpressed state. FIG. 6B is a schematic cross-sectional view showing the structure in FIG. 6A in a pressed state.

As shown in FIG. 6A and FIG. 6B, in the present embodiment, the key device 300 includes a circuit board 110, a switch circuit 111, a conductive buffer 320, and a metal spring 130, wherein the circuit board 110, the switch circuit 111, and the metal spring 130 The embodiment is the same as that shown in FIG. 1A, and therefore reference may be made to the foregoing related descriptions, and details are not described herein. The difference between this embodiment and the embodiment shown in FIG. 1A is that the conductive buffer member 320 of this embodiment includes a buffer structure 321 and a conductive member 322. The buffer structure 321 is disposed on the surface 110 a of the circuit board 110 and is located between the circuit board 110 and the metal elastic sheet 130. The conductive member 322 is disposed on a side of the buffer structure 321 facing the circuit board 110, and is opposite to the aforementioned portion of the switch circuit 111 located between the surface 110 a and the conductive buffer 320.

Specifically, the buffer structure 321 includes a spacer layer 321 a and a buffer layer 321 b. The spacer layer 321 a is disposed on the surface 110 a of the circuit board 110 and has an accommodation space S. The portion of the aforementioned switching circuit 111 between the surface 110a and the conductive buffer 320 (that is, including the first switching pad 111a and the second switching pad 111b (As shown in FIG. 2) is located in the accommodation space S. The buffer layer 321b covers the spacer layer 321a. The conductive member 322 is disposed on a side of the buffer layer 321 b facing the circuit board 110. The metal elastic piece 130 is arranged to press the buffer layer 321b to deform the buffer layer 321b, and further, the conductive member 322 is in contact with the first switch pad 111a and the second switch pad 111b of the switch circuit 111.

As shown in FIG. 6B and with reference to FIG. 2, in this embodiment, the deformed metal elastic sheet 130 is configured to press the region 131 to contact the buffer layer 321 b of the buffer structure 321. The orthographic projection of the pressing area 131 and the conductive member 322 on the surface 110 a of the circuit board 110 (refer to the dotted line in FIG. 2) at least partially overlap the first switch pad 111 a and the second switch pad 111 b.

When the metal elastic sheet 130 is pressed, the pressing area 131 of the metal elastic sheet 130 contacts the buffer layer 321b of the buffer structure 321, and the buffer layer 321b is also pressed, which can cause the conductive member 322 to move toward the switch circuit 111, and then the conductive member 322 contacts the switch circuit. 111. With the foregoing structural configuration, the buffer layer 321b of this embodiment can cushion the impact of the deformed metal spring sheet 130 on the first switch pad 111a and the second switch pad 111b, and can also provide conductivity with the conductive member 322 when pressed This function enables the first switch pad 111a and the second switch pad 111b to be electrically conducted through the conductive member 322.

In some embodiments, the buffer layer 321b is a polyethylene terephthalate (PET) pad. In other embodiments, the buffer layer 321b may also be made of conductive foam, anisotropic conductive film, or Rubber, and the conductive member 322 may be omitted.

Please refer to FIG. 7, which is a schematic cross-sectional view showing some elements of a key device 400 according to another embodiment of the present invention in an unpressed state. Illustration. As shown in FIG. 7, in this embodiment, the key device 400 includes a circuit board 110, a switch circuit 111, a conductive buffer 420, and a metal spring sheet 130. The circuit board 110, the switch circuit 111, and the metal spring sheet 130 are shown in FIG. 6A. The illustrated embodiments are the same, so reference may be made to the foregoing related description, and details are not described herein. The difference between this embodiment and the embodiment shown in FIG. 6A is that the buffer structure 421 included in the conductive buffer 420 of this embodiment is a one-piece structure. The buffer structure 421 has a recess R. The recess R abuts the surface 110 a of the circuit board 110. The conductive member 322 and the aforementioned switching circuit 111 are located between the surface 110a and the conductive buffer 120 (that is, the portion including the first switch pad 111a and the second switch pad 111b, as shown in FIG. 2) is located in the recess R (also That is, it is located in the accommodation space S).

In some embodiments, the buffer structure 421 is a one-piece structure made of PET. In practical applications, the buffer structure 421 may also be a conductive foam, an anisotropic conductive film, or a Rubber material, and the aforementioned conductive member 322 may be omitted.

From the above detailed description of the specific implementation of this creation, it can be clearly seen that, in the key device of this creation, the conductive buffer member provided between the switch circuit on the circuit board and the metal dome can cushion the deformed metal dome. The impact. Not only that, the conductive buffer can also provide the function of conducting electricity. Therefore, when the user presses the key device of this creation, the conductive buffer member can be used as a buffer and conductive medium between the switch circuit and the metal spring sheet, so as to effectively reduce the sound of metal collision, thereby achieving the purpose of reducing noise.

Although this creation has been disclosed as above in implementation, it is not intended to limit this creation. Any person skilled in this art can make various modifications and retouches without departing from the spirit and scope of this creation, so the protection of this creation Range when Subject to the scope of the attached patent application.

Claims (11)

A key device includes: a circuit board having a surface; a switch circuit disposed on the surface; and a conductive buffer member disposed on the surface, wherein a part of the switch circuit is located between the surface and the conductive buffer member. And a metal spring sheet covering the conductive buffer member and configured to deform the conductive buffer member and press the conductive buffer member. The key device according to claim 1, wherein the part of the switch circuit includes: a first switch pad; and a second switch pad separated from the first switch pad, wherein the deformed metal spring sheet is configured The conductive buffer is contacted with a pressing area, and the conductive buffer is arranged to contact the first switch pad and the second switch pad. The button device according to claim 2, wherein an orthographic projection of the pressing area on the surface at least partially overlaps the first switch pad and the second switch pad. The key device according to claim 1, wherein the part of the switch circuit includes a first switch pad, the switch circuit further includes a second switch pad, and the metal spring piece electrically contacts the second switch pad, deforming the The metal elastic sheet is configured to contact the conductive buffer with a pressing area, and an orthographic projection of the pressing area on the surface at least partially overlaps the first switch pad. The button device according to claim 4, wherein the conductive buffer is a conductive foam. The key device according to claim 2 or 4, wherein the conductive buffer member is an anisotropic conductive film. The key device according to claim 1, wherein the conductive buffer includes: a buffer structure provided on the surface and between the circuit board and the metal spring sheet; and a conductive member provided on the buffer The structure faces one side of the circuit board and is opposite to the portion of the switch circuit, wherein the metal spring piece is configured to press the conductive buffer member to contact the conductive member with the portion of the switch circuit. The key device according to claim 7, wherein the buffer structure has a recess, the recess is adjacent to the surface of the circuit board, and the conductive member and the portion of the switch circuit are located in the recess. The key device according to claim 8, wherein the buffer structure comprises: a spacer layer disposed on the surface, and having an accommodation space, wherein the part of the switch circuit is located in the accommodation space; A buffer layer covers the spacer layer to form the depression together, wherein the conductive member is disposed on a side of the buffer layer facing the circuit board. The button device according to claim 9, wherein the buffer layer is a PET pad. The key device according to claim 7, wherein the part of the switch circuit includes: a first switch pad; and a second switch pad separated from the first switch pad, wherein the deformed metal spring sheet is configured The buffer structure is contacted with a pressing area, and an orthographic projection of the pressing area and the conductive member on the surface at least partially overlaps the first switch pad and the second switch pad.