CN208208625U - Key device - Google Patents
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- CN208208625U CN208208625U CN201820870320.6U CN201820870320U CN208208625U CN 208208625 U CN208208625 U CN 208208625U CN 201820870320 U CN201820870320 U CN 201820870320U CN 208208625 U CN208208625 U CN 208208625U
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- China
- Prior art keywords
- switch pad
- key device
- metal clips
- switching circuit
- conductie
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Abstract
A kind of key device includes circuit board, switching circuit, conductie buffer part and metal clips.Circuit board has a surface.Switching circuit is set on this surface.Conductie buffer part is set in aforementioned surfaces.A part of switching circuit is between aforementioned surfaces and conductie buffer part.Metal clips covers conductie buffer part, and configures to deform towards circuit board and press conductie buffer part.
Description
Technical field
The utility model relates to a kind of key device, fills in particular to a kind of key with metal clips
It sets.
Background technique
For the use habit of current personal computer, key device is indispensable one of input equipment, to
Input text or number.Moreover, the consumer electronics product or industry that everyday life contacts such as use big
Type processing equipment all needs to be equipped with press-key structure as input equipment, to operate above-mentioned electronic product and process equipment.
It, generally can be by metal clips as the element of trigger switch for low Stroke Key or touch tablet.It is transporting
With metal clips usually need to cooperate the switching circuit on circuit board to do signal conduction triggering.However, metal clips carry out by
When pressure, it can mutually be hit with the switching circuit engagement pad (for example, copper sheet) on circuit board, cause the discordant sound.Namely
It says, the combination of aforementioned signal conducting triggering is operationally easy to produce noise.
Therefore, how to propose a kind of key device that can be solved the above problems, be that current industry wants investment development resources
One of solve the problems, such as.
Utility model content
In view of this, one of the utility model purpose is to propose a kind of key device that can effectively solve foregoing problems.
In order to achieve the above object, according to one of the utility model embodiment, a kind of key device includes circuit board, opens
Powered-down road, conductie buffer part and metal clips.Circuit board has a surface.Switching circuit is set on this surface.Conduction is slow
Stamping is set in aforementioned surfaces.A part of switching circuit is between aforementioned surfaces and conductie buffer part.Metal clips covers
Lid conductie buffer part, and configure to be deformed towards circuit board and press conductie buffer part.
In one or more embodiments of the utility model, the preceding sections of switching circuit include first switch pad and
Second switch pad.Second switch pad is separated with first switch pad.The metal clips system configuration of deformation is contacted conductive with pressing area
Bolster.Conductie buffer part is set to contact first switch pad and second switch pad.
In one or more embodiments of the utility model, orthographic projection of the pressing area in aforementioned surfaces is at least partly
It is overlapped in first switch pad and second switch pad.
In one or more embodiments of the utility model, the preceding sections of switching circuit include first switch pad.It opens
Powered-down road also includes second switch pad.Metal clips second switch pad in electrical contact.The metal clips system of deformation configures to press
Region contacts conductie buffer part.Orthographic projection of the pressing area in aforementioned surfaces is least partially overlapped in first switch pad.
In one or more embodiments of the utility model, conductie buffer part is conducting foam.
In one or more embodiments of the utility model, conductie buffer part is anisotropic conductive film.
In one or more embodiments of the utility model, conductie buffer part includes buffer structure and conduct piece.It is slow
Structure setting is rushed on surface, and between circuit board and metal clips.Conduct piece is set to buffer structure towards circuit board
Side, and it is opposite with the preceding sections of switching circuit.Metal clips configuration makes conduct piece and opens to press conductie buffer part
The preceding sections on powered-down road contact.
In one or more embodiments of the utility model, buffer structure has recess.Before recess adjacent circuit board
State surface.The preceding sections of conduct piece and switching circuit are located in recess.
In one or more embodiments of the utility model, buffer structure includes wall and buffer layer.Wall
It is set in aforementioned surfaces, and there is accommodating space.The preceding sections of switching circuit are located in accommodating space.Buffer layer is covered in
Recess is collectively formed on wall.Conduct piece is set to side of the buffer layer towards circuit board.
In one or more embodiments of the utility model, buffer layer is PET pad.
In one or more embodiments of the utility model, the part of switching circuit includes first switch pad and the
Two switching mats.Second switch pad is separated with first switch pad.The metal clips system configuration of deformation contacts buffering knot with pressing area
Structure.The orthographic projection of pressing area and conduct piece in aforementioned surfaces is least partially overlapped in first switch pad and second switch pad.
In conclusion in the key device of the utility model, the switching circuit and metal clips that are set on circuit board
Between conductie buffer part can buffer impact caused by the metal clips of deformation.Moreover, conductie buffer part can also be provided
Conductive function.Therefore, user can use conductie buffer part as switch electricity when pressing the key device of the utility model
Buffering and conductive media between road and metal clips to efficiently reduce the sound of metal bump, and then reach reduction noise
Purpose.
The above be only to illustrate the problem of the utility model is to be solved, technical means to solve problem and its
The effect of generation etc., the detail of the utility model by below embodiment and correlative type in be discussed in detail.
Detailed description of the invention
For the above and other purpose, feature, advantage and embodiment of the utility model can be clearer and more comprehensible, institute's accompanying drawings
Be described as follows:
Figure 1A is to be painted the subelement according to the key device of one embodiment of the utility model under non-pressing state
Diagrammatic cross-section.
Figure 1B is the diagrammatic cross-section of the structure that is painted in Figure 1A under pressing state.
Fig. 2 is the local top view for being painted the circuit switch according to one embodiment of the utility model.
Fig. 3 A is to be painted the subelement according to the key device of another embodiment of the utility model in non-pressing state
Under diagrammatic cross-section.
Fig. 3 B is the diagrammatic cross-section of the structure that is painted in Fig. 3 A under pressing state.
Fig. 4 is the local top view for being painted the circuit switch according to another embodiment of the utility model.
Fig. 5 A is to be painted the subelement according to the key device of another embodiment of the utility model in non-pressing state
Under diagrammatic cross-section.
Fig. 5 B is the diagrammatic cross-section of the structure that is painted in Fig. 5 A under pressing state.
Fig. 6 A is to be painted the subelement according to the key device of another embodiment of the utility model in non-pressing state
Under diagrammatic cross-section.
Fig. 6 B is the diagrammatic cross-section of the structure that is painted in Fig. 6 A under pressing state.
Fig. 7 is to be painted the subelement according to the key device of another embodiment of the utility model under non-pressing state
Diagrammatic cross-section.
Wherein appended drawing reference are as follows:
100,200A, 200B, 300,400: key device
110: circuit board
110a: surface
111,211: switching circuit
111a, 211a: first switch pad
111b, 211b: second switch pad
120,220a, 220b, 320,420: conductie buffer part
130: metal clips
131: pressing area
321,421: buffer structure
321a: wall
321b: buffer layer
322: conduct piece
P: orthographic projection
R: recess
S: accommodating space
Specific embodiment
Multiple embodiments that the utility model will be disclosed with schema below, as clearly stated, in many practices
Details will be explained in the following description.It should be appreciated, however, that the details in these practices does not apply this with limitation practical new
Type.That is, the details in these practices is non-essential in the utility model some embodiments.In addition, to simplify
For the sake of schema, some known usual structures and element will be painted it in a manner of simply illustrating in the drawings.In embodiment
Schema omit portion of element, to clearly show that the technical characterstic of the utility model.Embodiment only to illustrate as example,
The range to be protected of the utility model can't be limited.Identical label will be used to indicate the same or similar in all schemas
Element.Being painted for these schemas is not painted for the clear connection relationship expressed in these embodiments between each element
The actual size of each element.
Please refer to Figure 1A and Figure 1B.Figure 1A is the key device 100 being painted according to one embodiment of the utility model
Diagrammatic cross-section of the subelement under non-pressing state.Figure 1B is that the section of the structure that is painted in Figure 1A under pressing state shows
It is intended to.As shown in Figure 1A and Figure 1B, the key device 100 of present embodiment can be the external connection keyboard used for desktop computer
The key of (for example, keyboard of the keyboard of PS2 interface or USB interface) or comprising key form input equipment (for example, notes
Touch tablet on this computer), but be not limited thereto.In other words, the concept of the key device 100 of the utility model can be applied
In any electronic product to press as input mode.
As shown in Figure 1A and Figure 1B, in present embodiment, key device 100 include circuit board 110, switching circuit 111,
Conductie buffer part 120 and metal clips 130.Circuit board 110 has surface 110a.Switching circuit 111 is set to this surface
On 110a.Conductie buffer part 120 is set on the surface 110a of circuit board 110.A part of switching circuit 111 is located at circuit board
Between 110 surface 110a and conductie buffer part 120.Metal clips 130 covers conductie buffer part 120, and configures with direction electricity
Road plate 110 deforms and presses conductie buffer part 120.
It referring to figure 2., is the local top view for being painted the circuit switch according to one embodiment of the utility model.Such as figure
Shown in 2, in present embodiment, part of the aforementioned switches circuit 111 between surface 110a and conductie buffer part 120 includes
First switch pads 111a and second switch pads 111b.Second switch pads 111b and separates with first switch pad 111a, and the two has
There are multiple extensions and arrangement interlaced with each other.As shown in Figure 1B, 130 system of the metal clips configuration of deformation is connect with pressing area 131
Touch conductie buffer part 120.Orthographic projection P (in Fig. 2 be represented by dotted lines) of the pressing area 131 on the surface 110a of circuit board 110
It is least partially overlapped to pad 111b in first switch pad 111a and second switch.
In some embodiments, conductie buffer part 120 is anisotropic conductive film (Anisotropic Conductive
Film,ACF).Anisotropic conductive film has the characteristic of vertical conduction.In some conductie buffer parts 120 be anisotropic conductive film
In embodiment, anisotropic conductive film is possessing insulating properties on its film surface direction, and on perpendicular to its film surface direction then
It is conductive.When metal clips 130 is not affected by pressing, anisotropy of the metal clips 130 not in contact with 111 top of switching circuit
Conductive film, therefore, metal clips 130 do not electrically conduct through anisotropic conductive film with switching circuit 111.Simultaneously as different side
Property conductive film is possessing insulating properties along its film surface direction, therefore, even if anisotropic conductive film is set with direct contact-making switch
Circuit 111, the first switch pad 111a and second switch pad 111b of switching circuit 111 will not also electrically conduct.Work as metal clips
130 it is depressed when, the pressing area 131 of metal clips 130 contacts anisotropic conductive film, since anisotropic conductive film is vertical
It is conductive in its film surface direction, therefore metal clips 130 electrically conducts through anisotropic conductive film with switching circuit 111.
Therefore, conductie buffer part 120 by metal clips 130 pressing area 131 press position can carry out Z-direction (also that is,
Perpendicular to the film surface direction of anisotropic conductive film) on electrically conduct.
It is configured by aforementioned structure, the metal clips 130 that the conductie buffer part 120 of present embodiment can buffer deformation is right
First switch pads impact caused by 111a and second switch pad 111b, and conductive function can be also provided when being pressed, is made
Obtaining first switch pad 111a and second switch pad 111b can electrically conduct via conductie buffer part 120 and metal clips 130.Cause
This, user press present embodiment key device 100 when, can use conductie buffer part 120 as switching circuit 111 with
Buffering and conductive media between metal clips 130 to efficiently reduce the sound of metal bump, and then reach reduction noise
Purpose.
In addition, the anisotropic conductive film as used in aforementioned embodiments has perpendicular to its film surface direction (Z axis
Direction) it can electrically conduct, and in the characteristic to insulate along its film surface direction (X/Y axis direction), only it is pressed in metal clips 130
When touching anisotropic conductive film, the phenomenon that electrically conducting can be just generated, therefore conductie buffer part 120 is at key device 100
It can be set when non-pressing state with touch switch circuit 111, and switching circuit 111 will not generate the phenomenon that electrically conducting,
Therefore the integral thickness of key device 100 can effectively be reduced.
A and Fig. 3 B referring to figure 3..Fig. 3 A is the key device 200A being painted according to another embodiment of the utility model
Diagrammatic cross-section of the subelement under non-pressing state.Fig. 3 B is the section of the structure that is painted in Fig. 3 A under pressing state
Schematic diagram.
As shown in Fig. 3 A and Fig. 3 B, in present embodiment, key device 200A includes circuit board 110, switching circuit
211, conductie buffer part 220a and metal clips 130, wherein circuit board 110 and metal clips 130 and implementation shown in figure 1A
Mode is identical, therefore can refer to aforementioned associated description, herein without repeating.Present embodiment is compared to embodiment party shown in figure 1A
In place of the difference of formula, it is that the switching circuit 211 of present embodiment is located at the surface 110a and conductie buffer part of circuit board 110
Part between 220a includes that first switch pads 211a, and second switch pad 211b be located at conductie buffer part 220a outer rim it
Outside.Also that is, the conductie buffer part 220a of present embodiment is only covered relative to embodiment shown in figure 1A in lateral upper shorten
Lid first switch pads 211a.In addition, the metal clips 130 of present embodiment is second switch pad 211b in electrical contact.
It referring to figure 4., is the local top view for being painted the circuit switch according to another embodiment of the utility model.Such as
Shown in Fig. 4, in present embodiment, second switch pads 211b and separates with first switch pad 211a, and second switch pads 211b ring
It is around in except the outer rim of first switch pad 211a.As shown in Figure 3B, 130 system of metal clips of deformation configures with pressing area 131
Contact conductie buffer part 220a.Orthographic projection P of the pressing area 131 on the surface 110a of circuit board 110 is (with dotted line table in Fig. 4
Show) it is least partially overlapped in first switch pad 211a.
In some embodiments, conductie buffer part 220a is conducting foam or anisotropic conductive film.When metal clips 130
When depressed, the pressing area 131 of metal clips 130 contacts conductie buffer part 220a, and metal clips 130 penetrates conductie buffer
Part 220a electrically conducts with switching circuit 111.It is configured by aforementioned structure, the conductie buffer part 220a of present embodiment can delay
The metal clips 130 for rushing deformation is impacted to caused by first switch pad 211a, and conductive function can be also provided when being pressed,
So that first switch pad 211a can sequentially electrically conduct via conductie buffer part 220a and metal clips 130 to second switch pad
211b。
A and Fig. 5 B referring to figure 5..Fig. 5 A is the key device 200B being painted according to another embodiment of the utility model
Diagrammatic cross-section of the subelement under non-pressing state.Fig. 5 B is the section of the structure that is painted in Fig. 5 A under pressing state
Schematic diagram.
As shown in Fig. 5 A and Fig. 5 B, in present embodiment, key device 200B includes circuit board 110, switching circuit
211, conductie buffer part 220b and metal clips 130, wherein circuit board 110, switching circuit 211 and metal clips 130 and figure
Embodiment shown in 3A is identical, therefore can refer to aforementioned associated description, herein without repeating.Present embodiment is compared to Fig. 3 A
Shown in embodiment difference in place of, be that covering is set in the conductie buffer part 220b of present embodiment and contact first is opened
It closes pad 211a and second switch pads 211b.In this embodiment, conductie buffer part 220b can be anisotropic conductive film.Metal
The configuration of 130 system of elastic slice contacts conductie buffer part 220b with pressing area 131.Surface 110a of the pressing area 131 in circuit board 110
On orthographic projection P (being represented by dotted lines in Fig. 4) it is least partially overlapped in first switch pad 211a.When metal clips 130 is pressed
When pressure, conductie buffer part 220b can carry out Z-direction (also at the position that the pressing area 131 by metal clips 130 presses
That is, perpendicular to the film surface direction of anisotropic conductive film) on electrically conduct.The pressing area 131 of metal clips 130 contacts conduction
Bolster 220b, metal clips 130 electrically conduct through conductie buffer part 220b with switching circuit 211, also make first switch
Pad 211a can electrically conduct with second switch pad 211b via conductie buffer part 220b and metal clips 130.
Please refer to Fig. 6 A and Fig. 6 B.Fig. 6 A is the key device 300 being painted according to another embodiment of the utility model
Diagrammatic cross-section of the subelement under non-pressing state.Fig. 6 B is the section of the structure that is painted in Fig. 6 A under pressing state
Schematic diagram.
As shown in figs. 6 a and 6b, in present embodiment, key device 300 include circuit board 110, switching circuit 111,
Conductie buffer part 320 and metal clips 130, wherein shown in circuit board 110, switching circuit 111 and metal clips 130 and Figure 1A
Embodiment it is identical, therefore can refer to aforementioned associated description, herein without repeating.Present embodiment is compared to shown in figure 1A
In place of the difference of embodiment, it is that the conductie buffer part 320 of present embodiment includes buffer structure 321 and conduct piece 322.
Buffer structure 321 is set on the surface 110a of circuit board 110, and between circuit board 110 and metal clips 130.It is conductive
Part 322 is set to side of the buffer structure 321 towards circuit board 110, and is located at surface 110a with switching circuit 111 and delays with conduction
Preceding sections between stamping 320 are opposite.
Specifically, buffer structure 321 includes wall 321a and buffer layer 321b.Wall 321a is set to circuit
On the surface 110a of plate 110, and there is accommodating space S.Aforementioned switches circuit 111 is located at surface 110a and conductie buffer part 320
Between part (i.e. comprising first switch pad 111a and second switch pad 111b part, as shown in Figure 2) be located at accommodating space S
It is interior.Buffer layer 321b is covered on wall 321a.Conduct piece 322 is set to side of the buffer layer 321b towards circuit board 110.
The configuration of metal clips 130 deforms buffer layer 321b to press buffer layer 321b, and then makes conduct piece 322 and switching circuit
111 first switch pad 111a and second switch pad 111b contact.
As shown in Figure 6B, and cooperate referring to Fig. 2, in present embodiment, 130 system of metal clips of deformation is configured to press
The buffer layer 321b of the contact of region 131 buffer structure 321.Pressing area 131 and conduct piece 322 are on the surface of circuit board 110
Orthographic projection (can refer to the dotted line in Fig. 2) on 110a is least partially overlapped in first switch pad 111a and second switch pad
111b。
When metal clips 130 is depressed, the pressing area 131 of metal clips 130 contacts the buffering of buffer structure 321
Layer 321b, buffer layer 321b is also depressed, it is mobile towards switching circuit 111 can to drive conduct piece 322, and then make conduct piece
322 touch switch circuits 111.It is configured by aforementioned structure, the buffer layer 321b of present embodiment can buffer the metal of deformation
Elastic slice 130 pads first switch to be impacted caused by 111a and second switch pad 111b, can also be when being pressed with conduct piece
322 provide conductive function, so that first switch pads 111a and second switch pad 111b and can electrically conduct via conduct piece 322.
In some embodiments, buffer layer 321b is polyethylene terephthalate (polyethylene
Terephthalate, PET) pad.In other embodiments, buffer layer 321b also can for conducting foam, anisotropic conductive film or
It is Pubber material, then aforesaid conductive part 322 can omit.
Please refer to Fig. 7, be painted according to the subelement of the key device 400 of another embodiment of the utility model in
Diagrammatic cross-section under non-pressing state.As shown in fig. 7, key device 400 includes circuit board 110, opens in present embodiment
Powered-down road 111, conductie buffer part 420 and metal clips 130, wherein circuit board 110, switching circuit 111 and metal clips 130
It is identical as embodiment shown in Fig. 6 A, therefore can refer to aforementioned associated description, herein without repeating.Present embodiment compared to
In place of the difference of embodiment shown in Fig. 6 A, it is the buffer structure 421 that the conductie buffer part 420 of present embodiment is included
For single structure.Buffer structure 421 has recess R.The surface 110a of the adjacent circuit board 110 of the R that is recessed.Conduct piece 322 and preceding
It states part of the switching circuit 111 between surface 110a and conductie buffer part 120 and (pads 111a and second comprising first switch
The part of switching mat 111b, as shown in Figure 2) it is located in recess R (also that is, being located in accommodating space S).
In some embodiments, buffer structure 421 is single structure made by PET.In practical application, buffering
Structure 421 also can be conducting foam, anisotropic conductive film or Pubber material, then aforesaid conductive part 322 can omit.
By above for the detailed description of specific embodiment of the present utility model, it is apparent that in the utility model
Key device in, the conductie buffer part being set between the switching circuit and metal clips on circuit board can buffer the gold of deformation
Belong to impact caused by elastic slice.Moreover, conductive function can also be provided in conductie buffer part.Therefore, user is pressing this reality
When with novel key device, can use conductie buffer part as between switching circuit and metal clips buffering and conductive matchmaker
It is situated between, to efficiently reduce the sound of metal bump, and then achievees the purpose that reduce noise.
Although the utility model is disclosed as above with embodiment, so it is any ripe not to limit the utility model
The related technical personnel of this field are known, without departing from the spirit and scope of the utility model, when various change and profit can be made
Decorations, therefore the protection scope of the utility model is subject to the protection scope institute defender of view the attached claims.
Claims (11)
1. a kind of key device, characterized by comprising:
One circuit board has a surface；
One switching circuit is set on the surface；
One conductie buffer part, is set on the surface, and wherein a part of the switching circuit is located at the surface and the conductie buffer
Between part；And
One metal clips covers the conductie buffer part, and configures to deform towards the circuit board and press the conductie buffer part.
2. key device as described in claim 1, which is characterized in that the part of the switching circuit includes:
One first switch pad；And
One second switch pad is separated with the first switch pad,
The metal clips system wherein deformed, which configures, contacts the conductie buffer part and the conductie buffer part quilt with a pressing area
It is arranged to contact the first switch pad and the second switch pad.
3. key device as claimed in claim 2, which is characterized in that the orthographic projection of the pressing area on a surface is at least
Partially overlap the first switch pad and the second switch pad.
4. key device as described in claim 1, which is characterized in that the part of switching circuit includes a first switch pad,
The switching circuit also includes a second switch pad, metal clips second switch pad in electrical contact, the metal clips of deformation
System's configuration contacts the conductie buffer part with a pressing area, and the orthographic projection of the pressing area on a surface is at least partly
It is overlapped in the first switch pad.
5. key device as claimed in claim 4, which is characterized in that the conductie buffer part is a conducting foam.
6. key device as claimed in claim 2 or 4, which is characterized in that the conductie buffer part is an anisotropic conductive film.
7. key device as described in claim 1, which is characterized in that the conductie buffer part includes:
One buffer structure is set on the surface, and between the circuit board and the metal clips；And
One conduct piece is set to side of the buffer structure towards the circuit board, and opposite with the part of the switching circuit,
Wherein metal clips configuration contacts the conduct piece with the part of the switching circuit to press the conductie buffer part.
8. key device as claimed in claim 7, which is characterized in that the buffer structure has a recess, which should
The surface of circuit board, and the part of the conduct piece and the switching circuit is located in the recess.
9. key device as claimed in claim 8, which is characterized in that the buffer structure includes:
One wall is set on the surface, and has an accommodating space, and wherein the part of the switching circuit is located at the accommodating
In space；And
One buffer layer is covered in the recess is collectively formed on the wall, wherein the conduct piece be set to the buffer layer towards
The side of the circuit board.
10. key device as claimed in claim 9, which is characterized in that the buffer layer is PET pad.
11. key device as claimed in claim 7, which is characterized in that the part of the switching circuit includes:
One first switch pad；And
One second switch pad is separated with the first switch pad,
The metal clips system wherein deformed, which configures, contacts the buffer structure with a pressing area, and the pressing area is led with this
The orthographic projection of electric part on a surface is least partially overlapped in the first switch pad and the second switch pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820870320.6U CN208208625U (en) | 2018-06-06 | 2018-06-06 | Key device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820870320.6U CN208208625U (en) | 2018-06-06 | 2018-06-06 | Key device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208208625U true CN208208625U (en) | 2018-12-07 |
Family
ID=64495935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820870320.6U Active CN208208625U (en) | 2018-06-06 | 2018-06-06 | Key device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208208625U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110471565A (en) * | 2019-02-21 | 2019-11-19 | 光宝电子(广州)有限公司 | Touch device |
-
2018
- 2018-06-06 CN CN201820870320.6U patent/CN208208625U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110471565A (en) * | 2019-02-21 | 2019-11-19 | 光宝电子(广州)有限公司 | Touch device |
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