CN211792312U - SMT chip mounter - Google Patents

SMT chip mounter Download PDF

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Publication number
CN211792312U
CN211792312U CN202020966955.3U CN202020966955U CN211792312U CN 211792312 U CN211792312 U CN 211792312U CN 202020966955 U CN202020966955 U CN 202020966955U CN 211792312 U CN211792312 U CN 211792312U
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CN
China
Prior art keywords
suction nozzle
ring
chip mounter
joint
smt chip
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Active
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CN202020966955.3U
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Chinese (zh)
Inventor
张琦琦
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Hebei Weizheng Electronic Technology Co ltd
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Hebei Weizheng Electronic Technology Co ltd
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Priority to CN202020966955.3U priority Critical patent/CN211792312U/en
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Abstract

The utility model discloses a SMT chip mounter, including vacuum joint, the last contact of vacuum joint is hugged closely has the annular slab, and the fixed embedding of annular slab has the suction nozzle, and the last fixed sealed cowling that has cup jointed of vacuum joint is provided with the ring channel on the sealed cowling, is fixed with the ring on the annular slab, and the ring sets up with ring channel sliding insertion, and the parcel has the overcoat on the suction nozzle. Through increasing the overcoat on the suction nozzle for the suction nozzle when with the component contact, better with the component laminating, thereby improve and adsorb stably, simultaneously, the butt joint of joint ring is joined in marriage to the sealed cowling, can avoid suction nozzle and vacuum joint to appear leaking gas and influence the stable effect of suction.

Description

SMT chip mounter
Technical Field
The utility model belongs to the technical field of the SMT chip mounter, specifically be an SMT chip mounter.
Background
The rotating tower type chip mounter is characterized in that a component feeder is placed on a single-coordinate moving skip car, a substrate is placed on a workbench moving in an X/Y coordinate system, and a chip mounting head is installed on a rotating tower.
When the automatic component picking device works, the component feeder is moved to a material taking position by the skip car, the component is taken at the material taking position by the vacuum material sucking nozzle on the chip mounting head, the component is rotated to a chip mounting position (180 degrees from the material taking position) by the turret, and the component is attached to the substrate by adjusting the position and the direction of the component in the rotating process.
However, the existing vacuum material suction nozzle is made of metal material, has hard texture, and is not easy to adsorb elements, so that the elements fall off after being adsorbed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a SMT chip mounter to solve the difficult actuation component's of metal suction nozzle problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a SMT chip mounter, includes vacuum joint, vacuum joint goes up the contact and hugs closely there is the annular slab, the fixed embedding of annular slab has the suction nozzle, vacuum joint goes up the fixed sealed cowling that has cup jointed, be provided with the ring channel on the sealed cowling, be fixed with the ring on the annular slab, ring and ring channel sliding insert set up, the parcel has the overcoat on the suction nozzle.
Preferably, an internal thread is arranged on the inner wall of the vacuum connector, an external thread is arranged on the outer wall of the suction nozzle, and the external thread and the internal thread are connected with each other through threads, so that the suction nozzle and the vacuum connector can be conveniently mounted and dismounted.
Preferably, the outer sleeve is made of a rubber material, the outer sleeve and the suction nozzle are fixedly bonded through resin adhesive glue, the outer sleeve is soft, and the outer sleeve can be better attached to an element through deformation when contacting the element, so that the adsorption effect is guaranteed.
Preferably, the cross-section of the annular plate is circular, so that the stability of butt joint of the sealing cover and the annular plate is ensured, the sealing cover can play a role in preventing air leakage, and the stability of the suction force of the adsorption element is ensured.
Preferably, the vacuum joint, the annular plate and the suction nozzle are all made of stainless steel materials, so that the structural strength is ensured, and the suction nozzle part cannot be damaged when being frequently adsorbed.
Preferably, the sealing cover and the circular ring are both made of polyvinyl chloride materials, so that the sealing cover is good in durability and not easy to damage.
Preferably, the end of the outer sleeve is provided with an annular bulge which can be better contacted with the element to adsorb the element.
Compared with the prior art, the beneficial effects of the utility model are that: through increasing the overcoat on the suction nozzle for the suction nozzle when with the component contact, better with the component laminating, thereby improve and adsorb stably, simultaneously, the butt joint of joint ring is joined in marriage to the sealed cowling, can avoid suction nozzle and vacuum joint to appear leaking gas and influence the stable effect of suction.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a view of the ring and annular plate of the present invention;
fig. 3 is a structural diagram of the sealing cover and the annular groove of the present invention.
In the figure: 1. a vacuum joint; 11. an annular plate; 12. a suction nozzle; 13. a sealing cover; 14. an annular groove; 15. a circular ring; 16. a jacket; 161. an annular projection; 2. an external thread; 21. an internal thread.
Detailed Description
Referring to fig. 1, 2 and 3, an SMT chip mounter includes a vacuum connector 1, a ring plate 11 is closely contacted with the vacuum connector 1, a suction nozzle 12 is fixedly embedded in the ring plate 11, a sealing cover 13 is fixedly sleeved on the vacuum connector 1, an annular groove 14 is formed in the sealing cover 13, a ring 15 is fixed on the ring plate 11, the ring 15 and the annular groove 14 are slidably inserted, and an outer sleeve 16 wraps the suction nozzle 12.
Referring to fig. 1, an inner wall of the vacuum connector 1 is provided with an inner thread 21, an outer wall of the suction nozzle 12 is provided with an outer thread 2, and the outer thread 2 and the inner thread 21 are connected with each other through a thread, so that the suction nozzle 12 and the vacuum connector 1 can be conveniently mounted and dismounted.
Referring to fig. 1, the outer cover 16 is made of rubber material, the outer cover 16 is fixed to the suction nozzle 12 by resin adhesive, and the outer cover 16 is soft and can be better attached to the component by deformation when contacting the component, thereby ensuring the adsorption effect.
Referring to fig. 1, the cross section of the annular plate 11 is circular, so as to ensure the stable butt joint of the sealing cover 13 and the circular ring 15, and the sealing cover 13 can play a role in preventing air leakage, so as to ensure the stable suction force of the adsorption element.
Referring to fig. 1, the vacuum joint 1, the annular plate 11 and the suction nozzle 12 are made of stainless steel material, so that structural strength is ensured, and damage to the part of the suction nozzle 12 does not occur when frequent suction is performed.
Referring to fig. 1, the sealing cover 13 and the ring 15 are made of polyvinyl chloride material, so that the sealing cover is durable and not easy to damage.
Referring to fig. 1, the end of the outer sleeve 16 is provided with an annular protrusion 161 to better contact and absorb the component.
The working principle of the scheme is as follows: the vacuum joint 1 is connected with a vacuum pump through a pipeline and used for air suction, so that the suction nozzle 12 can adsorb elements, the annular plate 11 has a transitional connection effect, the suction nozzle 12 can suck the elements through a suction effect, the external thread 2 and the internal thread 21 are connected with each other through threads, the suction nozzle 12 and the vacuum joint 1 are convenient to mount and dismount, the sealing cover 13 can have an effect of preventing air leakage, the suction of the adsorbed elements is stable, the outer sleeve 16 is soft in texture, and can be better attached to the elements through deformation when in contact with the elements, so that the adsorption effect is ensured, the vacuum joint 1, the annular plate 11 and the suction nozzle 12 are made of stainless steel materials, the structural strength is ensured, when the components are frequently adsorbed, the damage of the suction nozzle 12 cannot occur, the sealing cover 13 and the annular ring 15 are made of polyvinyl chloride materials, the durability is good, the end part of the outer sleeve 16 is provided with an annular bulge, can be better contacted with the element to adsorb the element.

Claims (7)

1. The SMT chip mounter comprises a vacuum connector (1) and is characterized in that: vacuum joint (1) is gone up the contact and is hugged closely annular plate (11), annular plate (11) fixed embedding has suction nozzle (12), vacuum joint (1) is gone up the fixed cup joint and is had sealed cowling (13), be provided with ring channel (14) on sealed cowling (13), be fixed with ring (15) on annular plate (11), ring (15) and ring channel (14) slip insert set up, the parcel has overcoat (16) on suction nozzle (12).
2. An SMT chip mounter according to claim 1, wherein: an internal thread (21) is arranged on the inner wall of the vacuum joint (1), an external thread (2) is arranged on the outer wall of the suction nozzle (12), and the external thread (2) and the internal thread (21) are connected with each other through threads.
3. An SMT chip mounter according to claim 1, wherein: the outer sleeve (16) is made of rubber materials, and the outer sleeve (16) and the suction nozzle (12) are fixedly bonded through resin bonding glue.
4. An SMT chip mounter according to claim 1, wherein: the section of the annular plate (11) is circular.
5. An SMT chip mounter according to claim 1, wherein: the vacuum joint (1), the annular plate (11) and the suction nozzle (12) are all made of stainless steel materials.
6. An SMT chip mounter according to claim 1, wherein: the sealing cover (13) and the circular ring (15) are both made of polyvinyl chloride materials.
7. An SMT chip mounter according to claim 1, wherein: the end of the outer sleeve (16) is provided with an annular protrusion (161).
CN202020966955.3U 2020-06-01 2020-06-01 SMT chip mounter Active CN211792312U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020966955.3U CN211792312U (en) 2020-06-01 2020-06-01 SMT chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020966955.3U CN211792312U (en) 2020-06-01 2020-06-01 SMT chip mounter

Publications (1)

Publication Number Publication Date
CN211792312U true CN211792312U (en) 2020-10-27

Family

ID=72956011

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020966955.3U Active CN211792312U (en) 2020-06-01 2020-06-01 SMT chip mounter

Country Status (1)

Country Link
CN (1) CN211792312U (en)

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