CN211760339U - Polishing machine for processing silicon wafer - Google Patents
Polishing machine for processing silicon wafer Download PDFInfo
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- CN211760339U CN211760339U CN201921991593.7U CN201921991593U CN211760339U CN 211760339 U CN211760339 U CN 211760339U CN 201921991593 U CN201921991593 U CN 201921991593U CN 211760339 U CN211760339 U CN 211760339U
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Abstract
The utility model discloses a polishing machine for processing silicon wafers, when in use, the silicon wafers are placed on a mounting base, a lifting cylinder is started to drive a lifting rod to move downwards, and further drive a first cross rod and a second cross rod to move downwards, an upper end plate and a lower end plate not only can adjust a polishing disc to a proper position, but also have good stability, thereby being convenient for the use of a device body; after adjusting suitable position department with the disk of polishing of lower terminal plate lower extreme, drive the mounting base at start-up driving motor and rotate on firm seat, then silicon chip self also rotates, establish the post through inlaying on the firm seat and can make the mounting base stabilize the rotation, make the silicon chip stabilize the rotation at the lower extreme of disk of polishing, be convenient for improve the steadiness that the silicon chip was polished, spray through drain pipe and shower nozzle with the polishing solution this moment, in the mounting base pivoted, can drive the silicon chip and rotate along the disk of polishing and polish, the efficiency of polishing is improved, and is economical and practical, and the promotion is convenient for.
Description
Technical Field
The utility model relates to a silicon chip polishing equipment technical field specifically is a burnishing machine for silicon chip processing.
Background
At present, the burnishing machine stability that the enterprise adopted when carrying out polishing to the silicon chip man-hour is not enough, and polishing rate is limited, and this just leads to polishing efficiency to reduce, reduces whole production progress, exists not enoughly.
Accordingly, one skilled in the art provides a polishing machine for silicon wafer processing to solve the problems set forth in the background art described above.
Disclosure of Invention
An object of the utility model is to provide a burnishing machine for silicon chip processing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a polishing machine for processing silicon wafers comprises a base driving motor and an upper end plate; the left side of the upper end of the base is provided with a left supporting rod, the right side of the upper end of the base is provided with a right supporting rod, the upper end part of the right supporting rod is provided with a top plate, the upper end part of the left supporting rod is provided with a polishing solution box, the right end part of the polishing solution box is provided with a liquid outlet pipe, the end part of the liquid outlet pipe, which is far away from the polishing solution box, is provided with a spray head, the middle position of the upper end of the base is provided with a driving motor, the upper end part of the driving motor is provided with a driving rod, the upper end part of the driving rod is provided with a mounting base, the left supporting rod and the right supporting rod at the two ends of the mounting base are respectively provided with a stabilizing base, the lower side of the stabilizing base, which is close to the mounting base, is provided with a mounting plate corresponding to the mounting base, one end of the mounting plate and one end of the, and a silicon chip is placed at the upper side end part of the mounting base;
an upper end plate is arranged at the lower side end part of the top plate, a lower end plate is arranged at the lower end of the upper end plate, a telescopic rod is arranged between the right side of the upper end of the lower end plate and the upper end plate, a connecting end is arranged between the lower side end part of the telescopic rod and the lower end plate, an installation block is arranged at the upper end of the telescopic rod, a buffer spring is sleeved on the lower end telescopic rod of the installation block, moving cavities are arranged on the right front sides of the lower end plate and the upper end plate, a first cross rod and a second cross rod are arranged between the lower end plate and the inner side of the upper end plate in a mutually crossed manner, a second rotating shaft is arranged between the upper side end part of the first cross rod and the upper end plate, a fourth rotating shaft is arranged between the lower side end part of the first cross rod and the moving cavity inside the lower end plate, a third rotating shaft is arranged between the upper side end part of the second cross rod and the moving, and the middle position of the left end of the upper end plate is provided with a lifting cylinder, one side end part of the lifting cylinder, which is far away from the lifting installation rotating shaft, is provided with a lifting rod, a cross column is arranged between the intersections of the first cross rod and the second cross rod, one side end part of the lifting rod, which is far away from the lifting cylinder, is fixedly connected with the cross column, the lower side end part of the lower end plate is provided with a connecting block, and the lower side end part of the connecting block is provided with a polishing disc which is arranged corresponding to the silicon wafer.
As a further aspect of the present invention: the lower ends of the liquid outlet pipe and the spray head are arranged corresponding to the silicon wafer and the mounting base.
As a further aspect of the present invention: lift cylinder, driving motor and polishing solution case all with external power source and then outside singlechip electric connection, and the model of outside singlechip is: PIC18F 4610-I/P.
As a further aspect of the present invention: and a cross rotating shaft is arranged between the first cross rod and the second cross rod and the connection of the cross columns.
As a further aspect of the present invention: an installation rotating shaft is arranged between the installation connection of the lifting cylinder and the upper end plate.
Compared with the prior art, the beneficial effects of the utility model are that: when the device is used, the silicon wafer is placed on the mounting base, the lifting cylinder is started to drive the lifting rod to move downwards, so that the first cross rod and the second cross rod are driven to move downwards, the upper end plate and the lower end plate can adjust the polishing disc to a proper position, and the polishing disc has good stability and is convenient to use; after adjusting suitable position department with the disk of polishing of lower terminal plate lower extreme, drive the mounting base at start-up driving motor and rotate on firm seat, then silicon chip self also rotates, establish the post through inlaying on the firm seat and can make the mounting base stabilize the rotation, make the silicon chip stabilize the rotation at the lower extreme of disk of polishing, be convenient for improve the steadiness that the silicon chip was polished, spray through drain pipe and shower nozzle with the polishing solution this moment, in the mounting base pivoted, can drive the silicon chip and rotate along the disk of polishing and polish, the efficiency of polishing is improved, and is economical and practical, and the promotion is convenient for.
Drawings
Fig. 1 is a schematic structural diagram of a polishing machine for silicon wafer processing.
FIG. 2 is a schematic structural diagram of a polishing machine A for processing silicon wafers.
In the figure: 1-base, 2-left support rod, 3-stabilizing base, 4-mounting plate, 5-mounting groove, 6-polishing liquid box, 7-embedded column, 8-embedded groove, 9-liquid outlet pipe, 10-liquid outlet head, 11-mounting base, 12-silicon chip, 13-polishing disc, 14-first rotating shaft, 15-connecting block, 16-second rotating shaft, 17-lower end plate, 18-upper end plate, 19-first cross rod, 20-second cross rod, 21-third rotating shaft, 22-fourth rotating shaft, 23-moving cavity, 24-mounting block, 25-telescopic rod, 26-buffer spring, 27-connecting end, 28-top plate, 29-right support rod, 30-mounting rotating shaft, 31-lifting cylinder, 32-lifting rod, 33-cross column, 34-cross rotating shaft, 35-driving rod and 36-driving motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, in an embodiment of the present invention, a polishing machine for processing silicon wafers includes a base 1, a driving motor 36 and an upper end plate 18; a left support rod 2 is arranged on the left side of the upper end of the base 1, a right support rod 29 is arranged on the right side of the upper end of the base 1, a top plate 28 is arranged at the upper side end of the right support rod 29, a polishing solution box 6 is arranged at the upper side end of the left support rod 2, a liquid outlet pipe 9 is arranged at the right side end of the polishing solution box 6, a spray head 10 is arranged at one side end of the liquid outlet pipe 9 far away from the polishing solution box 6, a driving motor 36 is arranged at the middle position of the upper end of the base 1, a driving rod 35 is arranged at the upper side end of the driving motor 36, a mounting base 11 is arranged at the upper side end of the driving rod 35, stabilizing bases 3 are arranged on the left support rod 2 and the right support rod 29 at two ends of the mounting base 11, a mounting plate 4 corresponding to the mounting base 11 is arranged at the lower side of one end of each stabilizing base, the upper end part of the mounting plate 4 is provided with an embedded column 7, the two lower ends of the mounting base 11 are provided with embedded grooves 8 corresponding to the embedded columns 7, and the upper end part of the mounting base 11 is provided with a silicon wafer 12;
an upper end plate 18 is arranged at the lower side end part of the top plate 28, a lower end plate 17 is arranged at the lower end of the upper end plate 18, a telescopic rod 25 is arranged between the right side of the upper end of the lower end plate 17 and the upper end plate 18, a connecting end 27 is arranged between the lower side end part of the telescopic rod 25 and the lower end plate 17, an installation block 24 is arranged at the upper end of the telescopic rod 25, a buffer spring 26 is sleeved on the telescopic rod 25 at the lower end of the installation block 24, moving cavities 23 are respectively arranged at the front sides of the right ends of the lower end plate 17 and the upper end plate 18, a first cross rod 19 and a second cross rod 20 are arranged between the inner sides of the lower end plate 17 and the upper end plate 18 in a mutually crossed manner, a second rotating shaft 16 is arranged between the upper side end part of the first cross rod 19 and the upper end plate 18, a fourth rotating shaft 22 is arranged between the lower side end part of the first cross rod 19 and the moving cavity 23 inside the lower end plate 17, and a first rotating shaft 14 is arranged between the lower end part of the second cross rod 20 and the lower end plate 17, a lifting cylinder 31 is arranged at the middle position of the left end of the upper end plate 18, a lifting rod 32 is arranged at one side end part of the lifting cylinder 31 far away from the lifting installation rotating shaft 30, a cross column 33 is arranged between the cross of the first cross rod 19 and the second cross rod 20, a side end part of the lifting rod 32 far away from the lifting cylinder 31 is fixedly connected with the cross column 33, a connecting block 15 is arranged at the lower end part of the lower end plate 17, and a polishing disc 13 arranged corresponding to the silicon wafer 12 is arranged at the lower end part of the connecting block 15.
The lower ends of the liquid outlet pipe 9 and the spray head 10 are arranged corresponding to the silicon wafer 12 and the mounting base 11.
A cross rotating shaft 34 is arranged between the connection of the first cross rod 19 and the second cross rod 20 and the cross column 33.
An installation rotating shaft 30 is arranged between the installation connection of the lifting cylinder 31 and the upper end plate 18.
The utility model discloses a theory of operation is:
the utility model relates to a burnishing machine for silicon chip processing, this device is applicable to multiple silicon chip processing occasion, during the use, places the silicon chip on mounting base 11, starts lift cylinder 32 and drives lifter 32 and move down, and then drives first crossbar 19 and second crossbar 20 and move down, and upper end plate 18 and lower end plate 17 not only can adjust polishing disc 13 to appropriate position, and itself also has fine stability, is convenient for the use of device body; after adjusting suitable position department with lower terminal plate 17 lower extreme's the mill 13, start driving motor 36 and drive mounting base 11 and rotate on firm seat 3, then silicon chip 12 self also rotates, establish post 7 through inlaying on firm seat 3 and can make mounting base 11 firm rotation, make silicon chip 12 rotate at the lower extreme of mill 13 is stable, be convenient for improve the steadiness that silicon chip 12 was polished, spray polishing solution through drain pipe 9 and shower nozzle 10 this moment, in mounting base 11 pivoted, can drive silicon chip 12 and rotate along mill 13 and polish, the efficiency of burnishing and polishing has been improved, and is economical and practical, and convenient for popularize.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A polishing machine for processing silicon wafers comprises a base (1), a driving motor (36) and an upper end plate (18); it is characterized in that a left support rod (2) is arranged on the left side of the upper end of a base (1), a right support rod (29) is arranged on the right side of the upper end of the base (1), a top plate (28) is arranged at the end part of the upper side of the right support rod (29), a polishing solution box (6) is arranged at the end part of the upper side of the left support rod (2), a liquid outlet pipe (9) is arranged at the end part of the right side of the polishing solution box (6), a spray head (10) is arranged at the end part of one side, far away from the polishing solution box (6), of the liquid outlet pipe (9), a driving motor (36) is arranged at the middle position of the upper end of the base (1), a driving rod (35) is arranged at the end part of the upper side of the driving motor (36), a mounting base (11) is arranged at the end part of the upper side of the driving rod (35), stabilizing bases (3) are respectively arranged on the left support rod (2) and the right support rod (, and mounting groove (5) that correspond the setting with mounting base (11) are all seted up to the one end of mounting panel (4) and firm seat (3), and the upside tip of mounting panel (4) all is equipped with inlays establishes post (7), and the downside both ends of mounting base (11) all are equipped with and inlay establishes the groove (8) of establishing that inlays that post (7) correspond the setting, and silicon chip (12) have been placed to the upside tip of mounting base (11).
2. The polishing machine for silicon wafer processing as claimed in claim 1, wherein an upper end plate (18) is arranged at the lower end of the top plate (28), a lower end plate (17) is arranged at the lower end of the upper end plate (18), a telescopic rod (25) is arranged between the right side of the upper end of the lower end plate (17) and the upper end plate (18), a connecting end (27) is arranged between the lower end of the telescopic rod (25) and the lower end plate (17), a mounting block (24) is arranged at the upper end of the telescopic rod (25), a buffer spring (26) is sleeved on the lower end telescopic rod (25) of the mounting block (24), a moving cavity (23) is arranged on the front surfaces of the right ends of the lower end plate (17) and the upper end plate (18), a first cross rod (19) and a second cross rod (20) are arranged between the inner sides of the lower end plate (17) and the upper end plate (18) in a mutually crossed manner, and a second rotating shaft (16) is arranged between the upper end of the first cross rod (19) A fourth rotating shaft (22) is arranged between the lower side end part of the first cross rod (19) and a moving cavity (23) in the lower end plate (17), a third rotating shaft (21) is arranged between the upper side end part of the second cross rod (20) and the moving cavity (23) in the upper end plate (18), a first rotating shaft (14) is arranged between the lower side end part of the second cross rod (20) and the lower end plate (17), a lifting cylinder (31) is arranged in the middle of the left end of the upper end plate (18), a lifting rod (32) is arranged at one side end part, far away from the lifting installation rotating shaft (30), of the lifting cylinder (31), a cross column (33) is arranged between the intersections of the first cross rod (19) and the second cross rod (20), one side end part, far away from the lifting cylinder (31), of the lifting rod (32) is fixedly connected with the cross column (33), a connecting block (15) is arranged at the lower side end part of the lower end plate (17), and the lower side end part of the connecting block (15) is provided with a polishing disc (13) which is arranged corresponding to the silicon wafer (12).
3. The polisher for silicon wafer processing as set forth in claim 1, wherein the lower ends of the liquid outlet pipe (9) and the shower head (10) are disposed corresponding to the silicon wafer (12) and the mounting base (11).
4. The polishing machine for silicon wafer processing as claimed in claim 2, wherein the lifting cylinder (31), the driving motor (36) and the polishing solution box (6) are all electrically connected with an external power supply and an external singlechip, and the external singlechip is of the type: PIC18F 4610-I/P.
5. A polisher for silicon wafer processing as set forth in claim 2 wherein a cross-bar pivot (34) is mounted between the connection of the first and second cross-bars (19, 20) to the cross-post (33).
6. The polishing machine for silicon wafer processing as claimed in claim 2 or 4, wherein a mounting rotating shaft (30) is arranged between the lifting cylinder (31) and the mounting connection of the upper end plate (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921991593.7U CN211760339U (en) | 2019-11-18 | 2019-11-18 | Polishing machine for processing silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921991593.7U CN211760339U (en) | 2019-11-18 | 2019-11-18 | Polishing machine for processing silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211760339U true CN211760339U (en) | 2020-10-27 |
Family
ID=72962457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921991593.7U Active CN211760339U (en) | 2019-11-18 | 2019-11-18 | Polishing machine for processing silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211760339U (en) |
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2019
- 2019-11-18 CN CN201921991593.7U patent/CN211760339U/en active Active
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