CN211745131U

CN211745131U - Shielding case

Info

Publication number: CN211745131U
Application number: CN202020277032.7U
Authority: CN
Inventors: 徐晓勇
Original assignee: Xian Wingtech Electronic Technology Co Ltd
Current assignee: Xian Wingtech Electronic Technology Co Ltd
Priority date: 2020-03-09
Filing date: 2020-03-09
Publication date: 2020-10-23
Anticipated expiration: 2030-03-09

Abstract

The utility model discloses a shield cover uses on the PCB mainboard, and the shield cover includes: a shielding layer, an insulating layer and a signal layer; the signal layer is connected on the signal source of PCB mainboard, and the insulating layer setting is on the signal layer, and the shielding layer cover is established outside insulating layer, the signal layer and is connected on the PCB mainboard. The utility model discloses technical scheme gives a new function for the shield cover through above-mentioned shield cover, increases promptly on the shield cover and walks the line, to some lines of not walking well on the PCB mainboard, especially some power cords thicker, can use the utility model discloses a shield cover realizes. The utility model discloses a PCB of shield cover after for walks to provide more possibilities.

Description

Shielding case

Technical Field

The utility model relates to a surface mounting technical field, in particular to shield cover.

Background

As published patent application No. CN103415194A discloses an electromagnetic shield cover, including square shielding lid and the shielding of setting at the shielding lid periphery founds the wall, is equipped with a plurality of louvre on the shielding lid, and the shielding is founded and is equipped with the portion of leaning on that bends to the outside level on the wall, leans on portion and shielding to cover and all is equipped with a plurality of and crosses the line hole. The electromagnetic shielding cover is light in weight, can radiate heat of an electronic element and is good in shielding effect, but the electromagnetic shielding cover only can play a role in shielding electromagnetic signals and has certain limitation.

Disclosure of Invention

A primary object of the present invention is to provide a shielding cover for facilitating wiring thereon.

In order to achieve the above object, the utility model provides a shield cover uses on the PCB mainboard, and the shield cover includes: a shielding layer, an insulating layer and a signal layer; the signal layer is connected on the signal source of PCB mainboard, and the insulating layer setting is on the signal layer, and the shielding layer cover is established outside insulating layer, the signal layer and is connected on the PCB mainboard.

Preferably, the number of the signal layers and the insulating layers is multiple, and the multiple signal layers and the insulating layers are sequentially stacked.

Preferably, the number of the signal layers and the number of the insulating layers are equal, and the signal layers and the insulating layers are sequentially overlapped from bottom to top.

Preferably, the insulating layer is spread over the entire inner side of the shielding layer.

Preferably, the insulating layer is disposed adjacent to the signal layer.

Preferably, the shielding layer is made of metal.

Preferably, the insulating layer is made of an insulating material.

Preferably, the material of the signal layer is conductive metal.

Preferably, the shielding layer is connected to the PCB main board by soldering or fastening.

Preferably, the signal layer is connected to the signal source of the PCB main board by soldering or fastening.

The utility model discloses technical scheme gives a new function for the shield cover through above-mentioned shield cover, increases promptly on the shield cover and walks the line, to some lines of not walking well on the PCB mainboard, especially some power cords thicker, can use the utility model discloses a shield cover realizes. The utility model discloses a PCB of shield cover after for walks to provide more possibilities.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the shielding case of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Shielding layer	400	PCB mainboard
200	Insulating layer	500	On-board device
				300	Signal layer

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a shield cover.

In the embodiment of the present invention, as shown in fig. 1, the shielding case is applied on the PCB main board 400, and the shielding case includes: a shielding layer 100, an insulating layer 200, and a signal layer 300; the signal layer 300 is connected to a signal source of the PCB main board 400, the insulating layer 200 is disposed on the signal layer 300, and the shielding layer 100 covers the insulating layer 200 and the signal layer 300 and is connected to the PCB main board 400.

The utility model discloses technical scheme gives a new function for the shield cover through above-mentioned shield cover, increases promptly on the shield cover and walks the line, to some lines of not walking well on PCB mainboard 400, especially some thicker power cords, can use the utility model discloses a shield cover realizes. The utility model discloses a PCB of shield cover after for walks to provide more possibilities.

Further, the number of the signal layers 300 and the insulating layers 200 is plural, and the plural signal layers 300 and the insulating layers 200 are sequentially stacked. When a user needs to superpose a set of signals, a signal layer 300 can be added on the insulating layer 200, and then the insulating layer 200 is added.

Preferably, the number of the signal layers 300 and the number of the insulating layers 200 are equal, and the plurality of signal layers 300 and the plurality of insulating layers 200 are sequentially stacked from bottom to top. The shield can includes at least a three-layer structure, but is not limited to three layers. The outermost layer is a shield layer 100, an insulation layer 200 is arranged next to the shield layer 100, and a signal layer 300 is closely attached to the insulation layer 200.

The shield according to the present invention will be described in detail with reference to specific embodiments.

The technical scheme of the utility model provide a shield cover, this shield cover structure includes the triplex, and one of which is shielding layer 100, and this shielding layer 100 is the same with ordinary shield cover, and shielding layer 100's effect is shielding outside electromagnetic signal, and it covers at outermost, and the line of walking on with the inside device of PCB and shield cover is comprehensive to be protected. The second is an insulating layer 200 made of insulating material, the insulating layer 200 is inside the shielding layer 100 and separates the shielding layer 100 from the signal layer 300, so that the signal layer 300 is not short-circuited with the shielding layer 100. The insulating layer 200 may be formed only where there is a signal, may be formed only on the on-board device 500, or may be spread over the entire inner side of the shielding layer 100. The third is a signal layer 300, the signal layer 300 is made of conductive metal, and two pins of the signal layer are welded to a signal source of the PCB main board 400, so that signals in the shielding case are connected through the signal layer 300.

The shield can includes at least a three-layer structure, but is not limited to three layers. The outermost layer is a shield layer 100, an insulation layer 200 is arranged next to the shield layer 100, and a signal layer 300 is closely attached to the insulation layer 200. When a user needs to superpose a set of signals, a signal layer 300 can be added on the insulating layer 200, and then the insulating layer 200 is added. The insulating layer 200 and the signal layer 300 are sequentially stacked, and shield cans with different layers can be manufactured according to the structure and the process.

The outermost shielding layer 100 is made of metal, and the shielding layer 100 is attached to the PCB main board 400 to shield electromagnetic interference. The insulating layer 200 and the signal layer 300 are both inside the shielding layer 100 and protected by the shielding layer 100. The signal layer 300 and the shielding layer 100 are separated by the middle insulating layer 200, and the insulating layer 200 can be removed at the place without the signal layer 300, so that a user can lay an insulating material at the place with the signal layer 300 according to the requirement of the user, and the cost is reduced.

The signal layer 300 is tightly attached to the insulating layer 200, and its extended pins are connected to the signal source on the PCB motherboard 400 by soldering, or by fastening or other means. The signal layer 300 is made of conductive metal and its resistance should be as small as possible. The signal layer 300 may be a connection for two signals, or may be a connection for three or more signals, and the extended legs are the channels for the connection.

When this shield cover and PCB mainboard 400 laminate, shielding layer 100 and signal layer 300 that it included all need laminate with the position that corresponds on PCB mainboard 400, and the mode of laminating can be modes such as welding or lock.

When some signals are walked the line and are more difficult, can pass through the technical scheme of the utility model wiring, skip sensitive area, walk the line from the shield cover. The technical scheme is not limited to the mobile phone and can be applied to any product field with the shielding case.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A shielding case applied to a PCB main board, the shielding case comprising: a shielding layer, an insulating layer and a signal layer; the signal layer is connected on the signal source of PCB mainboard, the insulating layer sets up on the signal layer, the shielding layer cover is established insulating layer, signal layer are outer and be connected on the PCB mainboard, the shielding layer shields outside electromagnetic signal and will device on the PCB mainboard with walk the line comprehensive protection on the shield cover.

2. The shielding case of claim 1, wherein the number of the signal layers and the insulating layers is plural, and the plural signal layers and the insulating layers are sequentially stacked.

3. The shielding case of claim 2, wherein the number of the signal layers and the number of the insulating layers are equal, and a plurality of the signal layers and the insulating layers are sequentially stacked from bottom to top.

4. The shield of claim 1, wherein the insulating layer extends over the entire inside of the shield.

5. The shielding cage of claim 1, wherein said insulating layer is disposed adjacent to said signal layer.

6. The shield of claim 1, wherein the shield layer is made of metal.

7. The shielding cage of claim 1, wherein said insulating layer is made of an insulating material.

8. The shielding cage of claim 1, wherein said signal layer is a conductive metal.

9. The shielding cage of claim 1, wherein said shielding layer is attached to said PCB motherboard by soldering or snap-fitting.

10. The shielding cage of claim 1, wherein said signal layer is connected to said signal source on said PCB motherboard by soldering or snap-fitting.