CN211745080U - Radiator with elastic heat conduction block - Google Patents
Radiator with elastic heat conduction block Download PDFInfo
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- CN211745080U CN211745080U CN202020141447.1U CN202020141447U CN211745080U CN 211745080 U CN211745080 U CN 211745080U CN 202020141447 U CN202020141447 U CN 202020141447U CN 211745080 U CN211745080 U CN 211745080U
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Abstract
The utility model discloses a radiator with elasticity heat conduction piece for with the cooperation installation of electron integrated circuit board, be equipped with the radiating consumption device of a plurality of needs on the electron integrated circuit board, the radiator with elasticity heat conduction piece is including covering the cold drawing on the electron integrated circuit board, install quantity and position on the cold drawing with the elasticity heat conduction piece that the consumption device corresponds, elasticity heat conduction piece is sandwich structure, sandwich structure's intermediate level is the porous material layer of elasticity, sandwich structure's upper and lower floor is the heat-conducting plate. The utility model discloses realize the self-adaptation cooperation of radiator and electron integrated circuit board, greatly simplified the assembly flow, promoted assembly efficiency, reduced assembly cost.
Description
Technical Field
The present disclosure relates to a heat sink, and more particularly, to a heat sink for reinforcing electronic devices.
Background
Electronic boards in the reinforced electronic equipment such as VPX and CPCI generally need to be additionally provided with a radiator for reinforcement and heat dissipation. The traditional radiator and the electronic board are rigidly fastened, so that in order to avoid the crushing of the power consumption device by the radiator, a proper safety gap (gap filled with heat conduction interface materials) needs to be reserved between the bottom surface of the radiator and the power consumption device on the electronic board, the gap is too large to facilitate heat dissipation, and the gap is too small to cause overvoltage damage.
In practical application, the packaging size of the power consumption devices has deviation, the pasting link also has deviation such as high virtual deviation, and in addition, the processing of the radiator also has deviation, and the comprehensive factors cause that the gaps between the bottom surface of the radiator and each power consumption device are difficult to be ensured within a reasonable range. The traditional radiator needs to measure the clearance between each power consumption device on the electronic board card and the bottom surface of the radiator before installation, and the radiator needs to be repaired as long as one clearance does not meet the requirement until the installation condition is met. Therefore, the assembly method of the existing radiator and the electronic board card not only increases the assembly complexity and the assembly time, but also easily causes equipment damage.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a radiator with elasticity heat conduction piece, realizes the self-adaptation cooperation of radiator and electron integrated circuit board, has greatly simplified the assembly flow, has promoted assembly efficiency, has reduced assembly cost.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
the utility model provides a radiator with elasticity heat conduction piece for with the cooperation installation of electron integrated circuit board, be equipped with the radiating consumption device of a plurality of needs on the electron integrated circuit board, the radiator with elasticity heat conduction piece is including covering the cold drawing on the electron integrated circuit board, install quantity and position on the cold drawing with the elasticity heat conduction piece that the consumption device corresponds, elasticity heat conduction piece is sandwich structure, sandwich structure's intermediate level is the elasticity porous material layer, sandwich structure's upper and lower floor is the heat-conducting plate.
Preferably, the elastic porous material in the elastic porous material layer is metal rubber.
Preferably, a plurality of pulling aids are arranged on the edge of the cold plate.
Preferably, a plurality of locking devices are arranged on the edge of the cold plate.
Preferably, in a use state, a heat conduction interface material layer is filled between the elastic heat conduction block and the power consumption device.
Preferably, the heat-conducting interface material in the heat-conducting interface material layer is a sticky heat-conducting interface material.
Preferably, the cold plate is provided with a plurality of support columns facing the power consumption device, the support columns are provided with threaded holes, the electronic board card comprises a PCB board for mounting the power consumption device, the PCB board is provided with mounting holes corresponding to the threaded holes, and the radiator with the elastic heat conducting block is tightly matched with the electronic board card through fasteners penetrating through the mounting holes and the threaded holes.
Preferably, the supporting column is a cylinder, the mounting hole is a circular hole, the aperture of the mounting hole is matched with the threaded hole, and the diameter of the supporting column is larger than that of the mounting hole.
Preferably, a surface of the cold plate, which faces away from the power consumption device, is provided with heat dissipation fins.
Preferably, one surface of the cold plate facing the power consumption device is provided with an installation groove, and the installation groove is internally provided with a heat pipe.
According to the radiator with the elastic heat conducting block, the elastic heat conducting block is mounted on the radiator, and the elastic deformation of the elastic heat conducting block can completely cover the gap deviation between the power consumption device and the bottom surface of the radiator and can not be damaged by overvoltage, so that the radiator and the electronic board card can be matched in a self-adaptive mode; and the elastic heat-conducting block adopts an interlayer structure, so that the stability of the structure of the elastic heat-conducting block is improved, and the high heat-conducting property is ensured, thereby greatly simplifying the assembly process, improving the assembly efficiency and reducing the assembly cost.
Drawings
Fig. 1 is a schematic structural diagram of a heat sink with an elastic heat conduction block according to the present application;
FIG. 2 is a schematic structural view of an elastic heat-conducting block of the present application;
FIG. 3 is a schematic view of the fitting of the heat sink with the elastic heat-conducting block and the electronic board card;
FIG. 4 is a schematic view of the heat sink with elastic thermal conductive mass and electronic board card not assembled;
FIG. 5 is a partial enlarged view of a portion a in FIG. 4;
fig. 6 is a schematic diagram of the heat sink with the elastic heat-conducting block after being locked and assembled with the electronic board card.
In the drawings: 1. a cold plate; 2. a locking device; 3. a pulling aid; 4. an elastic heat-conducting block; 41. a heat conducting plate; 42. a layer of resilient porous material; 5. a support pillar; 6. an electronic board card; 7. a PCB board; 8. a power consumption device; 9. a layer of thermally conductive interface material; 10. a fastener.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
As shown in fig. 1, in one embodiment, a heat sink with an elastic heat-conducting block is provided, and the heat sink is used for being installed in cooperation with an electronic board card 6, so that heat dissipation of components on the electronic board card 6 is realized, and normal operation of the components is ensured.
Usually, a plurality of power consumption devices 8 which need to dissipate heat are arranged on the electronic board card 6, the heat sink with the elastic heat conduction block comprises a cold plate 1 covering the electronic board card 6, and the elastic heat conduction blocks 4 with the number and the positions corresponding to the power consumption devices 8 are arranged on the cold plate 1.
The elastic heat-conducting block 4 has elasticity, so that the connection between the electronic board card 6 and the radiator is converted into flexible connection, the elastic heat-conducting block 4 can be properly deformed according to the gap between the electronic board card 6 and the radiator, the reliable installation between the electronic board card 6 and the radiator is ensured, and overlarge pressure on the power consumption device 8 can be avoided.
As shown in fig. 2, the elastic heat-conducting block 4 is a sandwich structure, the middle layer of the sandwich structure is an elastic porous material layer 42, and the upper and lower layers of the sandwich structure are heat-conducting plates 41.
Elastic heat conduction block 4 is regular integrative structure in this embodiment, and the stability of self structure is high to adopt rigid heat conduction plate 41 centre gripping in flexible elasticity porous material both sides, both guaranteed the heat conduction effect, can avoid elasticity porous material direction of height inflation again.
The elastic heat-conducting block 4 in this embodiment is made of a material having high thermal conductivity to ensure the heat-conducting property. And the elastic porous material is a material with good thermal conductivity, and for the spring in the middle layer, the elastic porous material is adopted for filling in the embodiment, so that the influence on the thermal conductivity caused by the gap between the upper layer and the lower layer can be avoided, the elastic heat-conducting block 4 can be prevented from forming an integrated structure, the elastic adjusting effect is good, and the damage to the power consumption device 8 is small.
In one embodiment, the resilient porous material in the resilient porous material layer 42 is metal rubber. It should be noted that, on the premise that the elastic porous material has good elasticity and thermal conductivity, the specific material used is not strictly limited.
In order to facilitate the insertion and extraction of the assembled heat sink and electronic board card 6 into and from the main body of the device, in an embodiment, the edges of the cold plate 1 are provided with a plurality of extraction aids 3.
To facilitate the fastening of the assembled heat sink and electronics board 6 to the body of the device, in one embodiment, the cold plate 1 is provided with a plurality of locking devices 2 at its edges.
As shown in fig. 3, when the heat sink is mounted on the electronic board 6, the heat sink is covered on the electronic board 6.
As shown in fig. 4, a plurality of support columns 5 are further installed on one surface of the cold plate 1 facing the power consumption device 8, threaded holes are formed in the support columns 5, the electronic board card 6 comprises a PCB board 7 used for installing the power consumption device 8, and installation holes corresponding to the threaded holes are formed in the PCB board 7.
When radiator and electron integrated circuit board 6 are the fastening, align support column 5 with the mounting hole, elasticity heat conduction piece 4 aligns with the radiating consumption device 8 of needs this moment to elasticity heat conduction piece 4 is for contacting with consumption device 8, and elasticity heat conduction piece 4 does not produce deformation promptly.
As shown in fig. 5, in order to eliminate the thermal contact resistance between the elastic thermal conductive block 4 and the power consumption device 8, in an embodiment, in a use state, a thermal interface material layer 9 is filled between the elastic thermal conductive block 4 and the power consumption device 8.
Further, the thermal interface material in the thermal interface material layer 9 is a sticky thermal interface material. So as to avoid the heat-conducting interface material from shifting or falling off in the subsequent use process.
As shown in fig. 6, the heat sink with the elastic heat-conducting block is tightly fitted to the electronic board card 6 by a fastener 10 penetrating the mounting hole and the threaded hole. In the process that radiator and electronic board card 6 fasten, elasticity heat conduction piece 4 slowly produces deformation by the extrusion after contacting with consumption device 8, reaches the locking state after, elasticity heat conduction piece 4 stops compression deformation, closely cooperates the heat dissipation in order to realize consumption device 8 between the two.
In one embodiment, the supporting column 5 is a cylinder, the mounting hole is a circular hole, the diameter of the mounting hole is matched with that of the threaded hole, and the diameter of the supporting column 5 is larger than that of the mounting hole.
The mounting hole is matched with the threaded hole so as to realize the limit of the radiator in the horizontal direction and avoid the relative displacement between the radiator and the electronic board card 6 after the fastening of the fastening piece 10; the diameter of the supporting column 5 is larger than the aperture of the mounting hole, so that the vertical limiting of the radiator is realized, and the damage of components caused by the change of the gap between the fastening piece 10 and the radiator after the fastening is avoided.
It should be noted that the horizontal direction and the vertical direction are referred to with reference to the orientation shown in fig. 6.
In an embodiment, a surface of the cold plate 1 facing away from the power consumption device 8 is provided with heat dissipation fins for increasing a heat dissipation area and improving a heat dissipation efficiency.
In an embodiment, a mounting groove is formed in one surface of the cold plate 1 facing the power consumption device 8, and a heat pipe is mounted in the mounting groove and used for rapidly equalizing the temperature.
The thermal conductivity of the elastic porous material can be optimized by adjusting the material, the pore density, the porosity, the processing technology and the like of the elastic porous material.
And the pressure of the embodiment on the electronic board card 6 is determined by the compression deformation amount and the elastic modulus of the elastic heat conduction block 4. The elastic modulus of the elastic heat-conducting block 4 is mainly determined by the elastic porous material, and the elastic modulus of the elastic porous material can be set by changing the material, the pore density, the porosity, the processing technology and the like of the elastic porous material.
Preferably, the elastic modulus is set to be sufficient to ensure that under high load impact, the elastic heat-conducting block 4 does not significantly compress away from the surface of the power consumption device 8.
The compression deformation amount of the elastic heat-conducting block 4 mainly depends on the thickness of the elastic heat-conducting block 4, namely, the elastic heat-conducting block 4 with different thicknesses is selected according to the power consumption devices 8 with different specifications, so that the pressure of the elastic heat-conducting block 4 on the electronic board card 6 can be effectively controlled, and the damage to the power consumption devices 8 is small while the better heat-conducting effect is ensured.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a radiator with elasticity heat conduction piece for with electron integrated circuit board (6) cooperation installation, be equipped with a plurality of on electron integrated circuit board (6) and need radiating consumption device (8), its characterized in that, radiator with elasticity heat conduction piece is including covering cold board (1) on electron integrated circuit board (6), install quantity and position on cold board (1) with elasticity heat conduction piece (4) that consumption device (8) correspond, elasticity heat conduction piece (4) are sandwich structure, sandwich structure's intermediate level is elasticity porous material layer (42), sandwich structure's upper and lower floor is heat-conducting plate (41).
2. The heat sink with elastic heat-conducting block as recited in claim 1, wherein the elastic porous material in the elastic porous material layer (42) is metal rubber.
3. The heat sink with elastic heat-conducting block as claimed in claim 1, wherein a plurality of extraction aids (3) are mounted at the edge of the cold plate (1).
4. The heat sink with elastic heat-conducting block as recited in claim 1, wherein a plurality of locking means (2) are installed at the edge of the cold plate (1).
5. The heat sink with an elastic heat-conducting block according to claim 1, wherein, in a use state, a heat-conducting interface material layer (9) is filled between the elastic heat-conducting block (4) and the power consumption device (8).
6. The heat sink with elastic heat-conducting block as claimed in claim 5, wherein the heat-conducting interface material in the heat-conducting interface material layer (9) is a viscous heat-conducting interface material.
7. The heat sink with the elastic heat conduction block as claimed in claim 5, wherein a plurality of support posts (5) are further installed on a surface of the cold plate (1) facing the power consumption device (8), threaded holes are formed in the support posts (5), the electronic board card (6) comprises a PCB (7) for installing the power consumption device (8), installation holes corresponding to the threaded holes are formed in the PCB (7), and the heat sink with the elastic heat conduction block is tightly fitted with the electronic board card (6) through fasteners (10) penetrating through the installation holes and the threaded holes.
8. The heat sink with elastic heat conduction block as claimed in claim 7, wherein the supporting pillar (5) is a cylinder, the mounting hole is a circular hole, the diameter of the mounting hole is adapted to the threaded hole, and the diameter of the supporting pillar (5) is larger than the diameter of the mounting hole.
9. The heat sink with elastic heat-conducting block as claimed in claim 1, wherein the side of the cold plate (1) facing away from the power consuming device (8) is provided with heat-dissipating fins.
10. The heat sink with elastic heat conduction block as claimed in claim 1, wherein a mounting groove is provided on a side of the cold plate (1) facing the power consumption device (8), and a heat pipe is mounted in the mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020141447.1U CN211745080U (en) | 2020-01-21 | 2020-01-21 | Radiator with elastic heat conduction block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020141447.1U CN211745080U (en) | 2020-01-21 | 2020-01-21 | Radiator with elastic heat conduction block |
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| CN211745080U true CN211745080U (en) | 2020-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020141447.1U Active CN211745080U (en) | 2020-01-21 | 2020-01-21 | Radiator with elastic heat conduction block |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286466A (en) * | 2021-05-21 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
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2020
- 2020-01-21 CN CN202020141447.1U patent/CN211745080U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286466A (en) * | 2021-05-21 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
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