CN210112535U

CN210112535U - Foam for shock absorption protection

Info

Publication number: CN210112535U
Application number: CN201920744520.1U
Authority: CN
Inventors: 李长青
Original assignee: Qingdao New Changqing Electronic Technology Co Ltd
Current assignee: Qingdao New Changqing Electronic Technology Co Ltd
Priority date: 2019-05-22
Filing date: 2019-05-22
Publication date: 2020-02-21
Anticipated expiration: 2029-05-22

Abstract

The utility model discloses a foam for shock absorption and protection, which comprises a release paper layer, a graphite layer laid on the release paper layer through a bonding layer, a lower foam body layer, a heat-conducting adhesive layer and an upper foam body layer which are positioned above the graphite layer, wherein the lower foam body layer and the upper foam body layer are adhered into a whole through the heat-conducting adhesive layer; the foam body layer and the upper foam body layer both comprise a buffer part and a heat conduction part, buffer foam particles are filled in the buffer part, a graphite column and heat conduction silicon particles are filled in the heat conduction parts of the lower foam body layer and the upper foam body layer respectively, a heat dissipation copper foil is installed in the heat dissipation copper foil layer and consists of a plurality of copper foils in a bow-shaped structure, a heat dissipation channel is formed in the heat dissipation copper foil, and a plurality of heat dissipation holes are formed in a metal heat dissipation plate layer.

Description

Foam for shock absorption protection

Technical Field

The utility model relates to a bubble cotton technical field specifically is a shock attenuation is cotton with bubble.

Background

The foam is a material foamed by plastic particles, and is called foam for short. The foam is divided into PU foam, antistatic foam, conductive foam, EPE, antistatic EPE, PORON, CR, EVA, bridging PE, SBR, EPDM, etc.

The foam has the characteristics of elasticity, light weight, quick pressure-sensitive fixation, convenient use, free bending, ultrathin volume, reliable performance and the like. The damping device is commonly used in the field of electronic products and has the characteristics of low cost, firm connection and good damping effect. However, the existing foam has poor heat dissipation effect, so that the working temperature of an electronic product cannot be reduced in time, and the performance and the service life of the product are directly influenced; therefore, the utility model provides a shock attenuation protection with heat dissipation efficiency is with bubble cotton to solve the above-mentioned problem that exists.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a shock attenuation is cotton with bubble to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a foam for shock absorption protection comprises a release paper layer, a graphite layer laid on the release paper layer through an adhesive layer, a lower foam body layer, a heat-conducting adhesive layer and an upper foam body layer, wherein the lower foam body layer, the heat-conducting adhesive layer and the upper foam body layer are positioned above the graphite layer; the foam body layer and the upper foam body layer both comprise a buffer part and a heat conduction part, buffer foam particles are filled in the buffer part, a graphite column and heat conduction silicon particles are filled in the heat conduction parts of the lower foam body layer and the upper foam body layer respectively, a heat dissipation copper foil is installed in the heat dissipation copper foil layer and consists of a plurality of copper foils in a bow-shaped structure, a heat dissipation channel is formed in the heat dissipation copper foil, and a plurality of heat dissipation holes are formed in a metal heat dissipation plate layer.

As an optimal technical scheme of the utility model, the graphite post is connected on the graphite layer to be connected with heat-conducting glue layer based on the graphite post, the intraformational heat conduction silicon granule of bubble cotton body is connected to the heat-conducting glue layer, and links to each other with heat dissipation copper foil layer through heat conduction silicon granule, and metal heat dissipation plate layer is connected to the heat dissipation copper foil layer.

As an optimized technical scheme, a plurality of heat conduction posts are vertically arranged in the radiating hole and distributed at equal intervals.

As an optimized technical scheme of the utility model, the heat conduction portion on the upper foam body layer is "T" shape heat conduction portion, and its upper portion "T" head aligns the setting of heat dissipation copper foil.

As an optimized technical scheme of the utility model, the metal heat dissipation sheet layer is the heat conduction copper sheet.

As an optimized technical proposal of the utility model, the graphite layer is an elastic graphite layer.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a shock attenuation protection is with bubble cotton, through elastic graphite layer, heat-conducting glue film, heat dissipation copper foil layer and the metal heat dissipation sheet layer that sets up to and the cotton body layer of bubble and the heat conduction portion that sets up of last bubble under, can effectively reduce the operating temperature of electronic product, improve the performance of product and prolong its life.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

In the figure: 1. a release paper layer; 2. a graphite layer; 3. a lower foam body layer; 4. a heat-conducting adhesive layer; 5. a foam body layer is arranged; 6. a heat-dissipating copper foil layer; 7. a metal heat dissipation plate layer; 8. a PET protective film layer; 9. a buffer section; 10. a heat conducting portion; 11. cushioning foam particles; 12. a graphite column; 13. thermally conductive silicon particles; 14. a heat-dissipating copper foil; 15. a heat dissipation channel; 16. heat dissipation holes; 17. a heat-conducting column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1, the present invention provides a technical solution: a foam for shock absorption protection comprises a release paper layer 1, a graphite layer 2 laid on the release paper layer 1 through an adhesive layer, a lower foam body layer 3, a heat-conducting adhesive layer 4 and an upper foam body layer 5 which are positioned above the graphite layer 2, wherein the lower foam body layer 3 and the upper foam body layer 5 are adhered into a whole through the heat-conducting adhesive layer 4, a heat-radiating copper foil layer 6 is arranged on the upper foam body layer 5, the heat-radiating copper foil layer 6 is connected with a metal heat-radiating plate layer 7, and the metal heat-radiating plate layer 7 is positioned below a PET (polyethylene terephthalate) protective film layer 8; lower bubble cotton body layer 3 and last bubble cotton body layer 5 all include buffer 9 and heat-conducting part 10, and the intussuseption of buffer 9 fills buffering foam particle 11, fills a graphite post 12 and heat conduction silicon granule 13 in lower bubble cotton body layer 3 and the heat-conducting part 10 of last bubble cotton body layer 5 respectively, install heat dissipation copper foil 14 in the heat dissipation copper foil layer 6, heat dissipation copper foil 14 comprises the copper foil of a plurality of "bow" font structures, and heat dissipation channel 15 has been seted up to its inside, be equipped with a plurality of louvres 16 on the metal heat dissipation sheet layer 7.

Graphite layer 2 connects graphite post 12 to be connected with heat-conducting adhesive layer 4 based on graphite post 12, heat-conducting adhesive layer 4 is connected the heat conduction silicon granule 13 in the cotton body layer of bubble, and links to each other with heat dissipation copper foil layer 6 through heat conduction silicon granule 13, and metal heat dissipation plate layer 7 is connected to heat dissipation copper foil layer 6.

A plurality of heat conduction columns 17 are longitudinally arranged in the heat dissipation holes 16, and the heat conduction columns 17 are distributed at equal intervals.

The heat conducting part 10 on the upper foam body layer 5 is a T-shaped heat conducting part, and the T-shaped head at the upper part of the heat conducting part is aligned to the heat-radiating copper foil 14, so that the heat conduction efficiency can be improved, and the heat conduction time is shortened.

The metal heat dissipation plate layer 7 is a heat conduction copper sheet.

The graphite layer 2 is an elastic graphite layer.

The working principle is as follows:

will tear the back off from type ply 1, glue the one side on graphite layer 2 to treating radiating electronic parts, the heat of electronic parts passes through graphite layer 2 conduction and gives graphite post 12 in the cotton body layer 3 of bubble down, give heat-conducting glue layer 4 by graphite post 12 conduction, give the heat conduction silicon granule 13 in the cotton body layer 5 of bubble again with the heat conduction, heat-conducting silicon granule 13 gives heat dissipation copper foil layer 6 and metal heat dissipation sheet layer 7 with the heat conduction, heat dissipation channel 15 and louvre 16 in heat dissipation copper foil layer 6 and the metal heat dissipation sheet layer 7 dispel the heat to the heat, reach radiating purpose.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The foam for shock absorption protection is characterized by comprising a release paper layer (1), a graphite layer (2) laid on the release paper layer (1) through an adhesive layer, a lower foam body layer (3) positioned above the graphite layer (2), a heat-conducting adhesive layer (4) and an upper foam body layer (5), wherein the lower foam body layer (3) and the upper foam body layer (5) are adhered into a whole through the heat-conducting adhesive layer (4), a heat-radiating copper foil layer (6) is arranged on the upper foam body layer (5), the heat-radiating copper foil layer (6) is connected with a metal heat-radiating plate layer (7), and the metal heat-radiating plate layer (7) is positioned below a PET (polyethylene terephthalate) protection film layer (8); lower bubble cotton body layer (3) and last bubble cotton body layer (5) all include buffer (9) and heat-conducting part (10), pack buffering foam particle (11) in buffer (9), fill one graphite post (12) and heat conduction silicon granule (13) in heat-conducting part (10) of lower bubble cotton body layer (3) and last bubble cotton body layer (5) respectively, install heat dissipation copper foil (14) in heat dissipation copper foil layer (6), heat dissipation copper foil (14) comprise the copper foil of a plurality of "bow" font structures, and heat dissipation channel (15) have been seted up to its inside, be equipped with a plurality of louvres (16) on metal heat dissipation sheet layer (7).

2. The foam for shock absorption and protection as claimed in claim 1, wherein the graphite layer (2) is connected with the graphite column (12) and is connected with the heat conducting adhesive layer (4) based on the graphite column (12), the heat conducting adhesive layer (4) is connected with the heat conducting silicon particles (13) in the upper foam body layer (5) and is connected with the heat dissipation copper foil layer (6) through the heat conducting silicon particles (13), and the heat dissipation copper foil layer (6) is connected with the metal heat dissipation plate layer (7).

3. The foam for shock absorption and protection as claimed in claim 1, wherein a plurality of heat conduction columns (17) are longitudinally arranged in the heat dissipation holes (16), and the plurality of heat conduction columns (17) are distributed at equal intervals.

4. The foam for shock absorption and protection as claimed in claim 1, wherein the heat conducting portion (10) on the upper foam body layer (5) is a T-shaped heat conducting portion, and the upper T-shaped head is aligned with the heat dissipating copper foil (14).

5. The foam for shock absorption and protection as claimed in claim 1, wherein the metal heat dissipation plate layer (7) is a heat conductive copper sheet.

6. The foam for shock absorption and protection as claimed in claim 1, wherein the graphite layer (2) is an elastic graphite layer.