CN211744842U - Conductive member - Google Patents
Conductive member Download PDFInfo
- Publication number
- CN211744842U CN211744842U CN201922492933.8U CN201922492933U CN211744842U CN 211744842 U CN211744842 U CN 211744842U CN 201922492933 U CN201922492933 U CN 201922492933U CN 211744842 U CN211744842 U CN 211744842U
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- China
- Prior art keywords
- force reducing
- connecting portion
- conductive
- connecting part
- bending
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a conductive piece, which comprises a circuit layer for conducting electricity, wherein the circuit layer comprises a body, an extension part provided with a welding disc and a connecting part for connecting the body and the extension part; the connecting part is provided with a force reducing hole penetrating through the connecting part, the position of the force reducing hole is a bending area of the connecting part, and the connecting part can be bent along the bending area to enable the bonding pad to be connected with external equipment. Compared with the prior art, the utility model discloses a reliability is high for electrically conductive piece is buckled.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a circuit board field especially relates to an apply to electrically conductive of portable electronic product.
[ background of the invention ]
With the advent of the mobile internet age, the number of smart mobile devices is increasing. Among the mobile devices, the mobile phone is undoubtedly the most common and portable mobile terminal device. At present, the functions of a mobile phone are very diverse, one of which is a high-quality music function, and thus, a conductive member for playing sound is widely applied to the current smart mobile devices.
Related art electrically conductive including be used for electrically conductive circuit layer, cladding in the solder mask layer and the connection of circuit layer surface the circuit layer just expose in the pad of solder mask layer, in practical application, often need with the circuit layer carries out buckling of certain degree for the pad can be pasted and locate device shell surface and be connected with external equipment electricity in order to make things convenient for.
However, in the related art, since the thickness of the bending region of the conductive member is too thick, during the bending process, the stress of the bending region is concentrated, and particularly when the bending angle reaches 180 °, the conductive member is easy to bounce and tilt after being bent, thereby greatly reducing the reliability of the conductive member when being bent.
Therefore, there is a need to provide a new conductive device to solve the above technical problems.
[ Utility model ] content
An object of the utility model is to provide a high electrically conductive piece of reliability buckles.
In order to achieve the above object, the present invention provides a conductive member, which includes a circuit layer for conducting electricity, the circuit layer including a body, an extension portion provided with a pad, and a connection portion connecting the body and the extension portion; the connecting part is provided with a force reducing hole penetrating through the connecting part, the position of the force reducing hole is a bending area of the connecting part, and the connecting part can be bent along the bending area so as to enable the bonding pad to be connected with external equipment.
Preferably, the connecting portion includes a first connecting portion and a second connecting portion respectively connected to the body and spaced from each other, the extending portion includes a first extending portion and a second extending portion spaced from each other, the first extending portion is connected to the first connecting portion at a side away from the body, and the second extending portion is connected to the second connecting portion at a side away from the body; the force reducing hole is arranged through the first connecting part and/or the second connecting part.
Preferably, the force reducing holes comprise first force reducing holes penetrating through the first connecting portions and second force reducing holes penetrating through the second connecting portions, the first connecting portions can be bent along positions where the first force reducing holes are located, and the second connecting portions can be bent along positions where the second force reducing holes are located.
Preferably, the first force reducing holes comprise two force reducing holes which are arranged at intervals; the second force reducing holes comprise two force reducing holes which are arranged at intervals.
Preferably, the conductive member includes a solder mask layer covering the outer surface of the circuit layer, and one side of the extension portion, where the pad is disposed, is exposed out of the solder mask layer to form an electrical signal connection with the outside. Preferably, the conductive member is a flexible circuit board.
Compared with the prior art, in the conductive piece of the utility model, the connecting part is provided with the force reducing hole which penetrates through the connecting part, the position of the force reducing hole is the bending region of the connecting part, and the connecting part can be bent along the bending region to connect the welding disc with external equipment; in the structure, the force reducing holes are formed in the bending areas, so that the stress of the bending areas of the conductive pieces can be effectively reduced, the phenomenon that the connecting parts rebound or warp after being bent is avoided, and the bending reliability of the conductive pieces is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic structural diagram of the conductive member of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a conductive member 100, which includes a circuit layer 1 for conducting electricity, a solder mask layer 2 covering the outer surface of the circuit layer 1, and a bonding pad (not shown) disposed on the circuit layer 1.
It should be noted that the structural form of the conductive device 100 is not limited, and may be set according to practical situations, for example, in the present embodiment, the conductive device 100 is a flexible circuit board.
In the present embodiment, the circuit layer 1 includes a main body 11, a connecting portion (not shown), and an extending portion (not shown); the connecting portion is respectively connected with the body 11 and the extending portion, and the extending portion is provided with the bonding pad and used for forming electric signal connection with the outside.
The connecting portion including connect respectively in body 11 and the first connecting portion 12 and the second connecting portion 13 that set up at an interval each other, the extension includes first extension 14 and the second extension 15 that set up at an interval each other, first extension 14 connect in first connecting portion 12 is kept away from body 11 one side, second extension 15 connect in second connecting portion 13 is kept away from body 11 one side.
The first extension portion 14 and the second extension portion 15 are respectively exposed out of the solder mask layer 2 for forming an electrical signal connection with an external device; further, in order to better ensure the reliability of the electrical connection between the circuit board 1 and the outside, the pad includes a first pad 31 and a second pad 32 which are arranged at an interval, the first pad 31 is attached to the first extension portion 14 to form an electrical signal connection between the first extension portion 14 and the outside, and the second pad 32 is attached to the second extension portion 15 to form an electrical signal connection between the second extension portion 15 and an external device.
In practical applications, it is often necessary to attach the conductive component to the housing of the electronic component, and at this time, the first connection portion 12 and/or the second connection portion 13 need to be bent, and in this embodiment, the first connection portion 12 is bent and folded along a first bending axis X, and the second connection portion 13 is bent and folded along a second bending axis Y.
In order to ensure the reliability after bending, a force reducing hole (not shown) for reducing the bending stress is provided at the bending position, that is, the force reducing hole penetrating through the first connecting portion 12 and/or the second connecting portion 13 is provided at the first connecting portion 12 and/or the second connecting portion 13, the position of the force reducing hole is used as a bending area of the connecting portion, a bending axis is located in the bending area, and the connecting portion can be bent along the bending axis in the bending area during use to connect the pad with an external device. It should be noted that, the specific positions and the number of the force reducing holes are not limited, and the force reducing holes may be specifically arranged according to the bending requirement of the conductive member in practical application. For example, in the present embodiment, since both the first connection portion 12 and the second connection portion 13 need to be bent, the force reducing holes include two sets and are arranged at intervals, one set of the force reducing holes is arranged to penetrate through the first connection portion 12, and the other set of the force reducing holes is arranged to penetrate through the second connection portion 13.
More specifically, the first connection portion 12 is provided with first force reducing holes 120 penetrating through the first connection portion 12, the first force reducing holes 120 are bending regions of the first connection portion 12, the first bending axis X is located within a range of the first force reducing holes 120, the first force reducing holes 120 include two holes and are respectively arranged at intervals along the first bending axis X, geometric central axes of the two first force reducing holes 120 coincide with the first bending axis X, when the first connection portion 12 needs to be bent, and the first connection portion 12 is bent along the first bending axis X, the first force reducing holes 120 can effectively reduce stress of the bending regions of the first connection portion 12, so that a phenomenon that the body 11 is rebounded or tilted after being attached is avoided; the second connecting portion 13 is provided with a second force reducing hole 130 penetrating through the second connecting portion, the second force reducing hole 130 is the bending region of the second connecting portion 13, the second bending axis Y is located within the range of the second force reducing hole 130, the second force reducing hole 130 comprises two holes and two holes are respectively arranged along the second bending axis Y at intervals, the geometric central axis of the second force reducing hole 130 coincides with the second bending axis Y, when the second connecting portion 13 needs to be bent, the second bending axis Y is arranged along the second bending axis Y when the second connecting portion 13 is bent, the second force reducing hole 130 can effectively reduce the stress of the bending region of the second connecting portion 13, and the phenomenon that the second connecting portion 12 is rebounded or tilted after being attached is avoided.
To sum up, in the above structure, through the arrangement of the first force reducing hole 120 and the second force reducing hole 130, the stress of the bending region of the conductive device 100 is effectively reduced, and the phenomenon that the connecting portion is rebounded or tilted after being bent is avoided, so that the bending reliability of the conductive device 100 is high.
In the present embodiment, the solder mask layer 2 covers the outer surfaces of the main body 11, the first connection portion 12, and the second connection portion 13.
Specifically, the solder mask layer 2 comprises a solder mask layer main body 21, the solder mask layer main body 21 covers the body 11, the first connecting portion 12 and the second connecting portion 13 respectively, and the solder mask layer main body 21 covers the force reducing hole completely.
Furthermore, the solder mask layer 2 further includes a first portion 22 protruding from the main body 21 of the solder mask layer and a second portion 23 protruding from the main body 21 of the solder mask layer; the first portion 22 is used for covering one end of the first extension portion 14 away from the first pad 31; the second portion 23 is used for covering one end of the second extending portion 15 away from the second pad 32.
Compared with the prior art, in the conductive piece of the utility model, the connecting part is provided with the force reducing hole which penetrates through the connecting part, the position of the force reducing hole is the bending region of the connecting part, and the connecting part can be bent along the bending region to connect the welding disc with external equipment; in the structure, the force reducing holes are formed in the bending areas, so that the stress of the bending areas of the conductive pieces can be effectively reduced, the phenomenon that the connecting parts rebound or warp after being bent is avoided, and the bending reliability of the conductive pieces is improved.
The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.
Claims (6)
1. The utility model provides a conductive piece, its is including being used for electrically conductive circuit layer, circuit layer includes the body, is equipped with the extension of pad and connects the body with the connecting portion of extension, its characterized in that, connecting portion are equipped with and run through the power reduction hole on it, the position at power reduction hole place does the regional of buckling of connecting portion, connecting portion can be followed regional the buckling makes the pad is connected with external equipment.
2. The conductive device of claim 1, wherein the connecting portion includes a first connecting portion and a second connecting portion connected to the body respectively and spaced apart from each other, the extending portion includes a first extending portion and a second extending portion spaced apart from each other, the first extending portion is connected to the first connecting portion at a side away from the body, and the second extending portion is connected to the second connecting portion at a side away from the body; the force reducing hole is arranged through the first connecting part and/or the second connecting part.
3. The conductive device of claim 2, wherein the force reducing holes include a first force reducing hole formed through the first connection portion and a second force reducing hole formed through the second connection portion, the first connection portion is bent along a position of the first force reducing hole, and the second connection portion is bent along a position of the second force reducing hole.
4. The conductive member of claim 3, wherein the first force reducing holes comprise two and are spaced apart from each other; the second force reducing holes comprise two force reducing holes which are arranged at intervals.
5. The conductive device as claimed in claim 1, wherein the conductive device includes a solder mask layer covering the outer surface of the circuit layer, and one side of the extension portion where the bonding pad is disposed is exposed to the solder mask layer for forming an electrical signal connection with the outside.
6. The conductive device of any one of claims 1-5, wherein the conductive device is a flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922492933.8U CN211744842U (en) | 2019-12-31 | 2019-12-31 | Conductive member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922492933.8U CN211744842U (en) | 2019-12-31 | 2019-12-31 | Conductive member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211744842U true CN211744842U (en) | 2020-10-23 |
Family
ID=72868415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922492933.8U Expired - Fee Related CN211744842U (en) | 2019-12-31 | 2019-12-31 | Conductive member |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211744842U (en) |
-
2019
- 2019-12-31 CN CN201922492933.8U patent/CN211744842U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201023 Termination date: 20211231 |