CN217468860U

CN217468860U - Terminal structure of chip socket

Info

Publication number: CN217468860U
Application number: CN202123440047.4U
Authority: CN
Inventors: 卢髦
Original assignee: Jialian Technology Shanghai Co ltd
Current assignee: Jialian Technology Shanghai Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-09-20
Anticipated expiration: 2031-12-31

Abstract

The utility model discloses a terminal structure of a chip socket, which comprises a first terminal part (201) and a second terminal part (202); the first terminal portion (201) is integrally formed by a first bending piece (2011), a second bending piece (2012) and a third bending piece (2013); the second terminal portion (202) is integrally formed by a fourth bending piece (2021), a fifth bending piece (2022) and a sixth bending piece (2023); the second bending sheet (2012) and the fifth bending sheet (2022) are fixed in an intersecting manner; the top end of the first bending piece (2011) and the top end of the fourth bending piece (2021) are fixed and form an integral structure. The utility model discloses a chip socket's terminal structure, mechanical strength and elasticity are better, can contact with the contact of treater chip bottom is firm more, and it is lower to make the accuracy requirement, can effectively improve chip socket's yields.

Description

Terminal structure of chip socket

Technical Field

The utility model relates to an electronic equipment mainboard and connector field of making especially relate to a chip socket's terminal structure.

Background

The Land Grid Array (LGA) socket is a novel chip socket, and is used for realizing electrical pressure welding connection between a Printed Circuit Board (PCB) and a processor (CPU or GPU) chip, so as to realize power supply and Circuit transmission between the processor (CPU or GPU) chip and the Printed Circuit Board (PCB). Terminals arranged in a matrix shape are arranged on the Land Grid Array (LGA) slot and used for being abutted against contacts at the bottom of a processor (CPU or GPU) chip, so that the processor (CPU or GPU) chip is electrically connected with a chip socket. In the terminal of the chip socket in the prior art, a bending part with an inclination angle is arranged at the top of the terminal, and the top end of the bending part is abutted against a contact at the bottom of a processor (CPU or GPU) chip, so that the electrical connection between the processor (CPU or GPU) chip and the chip socket is realized. However, in the prior art, the bent portion with an inclined angle may generate a horizontal displacement at the top end of the chip as the processor (CPU or GPU) chip is pressed down, which puts a very high requirement on the precision of the terminal manufacture, thereby resulting in a high defective rate of the chip socket.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a chip socket's terminal structure.

The utility model provides a terminal structure of a chip socket, which comprises a first terminal part (201) and a second terminal part (202); the first terminal portion (201) is integrally formed by a first bending piece (2011), a second bending piece (2012) and a third bending piece (2013); the second terminal portion (202) is integrally formed by a fourth bending piece (2021), a fifth bending piece (2022) and a sixth bending piece (2023); the second bending sheet (2012) and the fifth bending sheet (2022) are fixed in an intersecting manner; the top end of the first bending piece (2011) and the top end of the fourth bending piece (2021) are fixed and form an integral structure.

The utility model provides a terminal structure of chip socket still includes terminal top board (203), terminal top board (203) set up first piece (2011) of buckling reaches the top of fourth piece (2021) of buckling and with first piece (2011) of buckling reaches fourth piece (2021) of buckling forms a body structure. The third bending piece (2013) and the sixth bending piece (2023) are arranged in parallel. The included angles between the second bending sheet (2012) and the third bending sheet (2013) and between the fifth bending sheet (2022) and the sixth bending sheet (2023) are equal and between 120 degrees and 150 degrees. The included angles between the second bending sheet (2012) and the first bending sheet (2011) and between the fifth bending sheet (2022) and the fourth bending sheet (2021) are equal and between 120 degrees and 150 degrees. The included angles between the second bending sheet (2012) and the first bending sheet (2011) and between the fifth bending sheet (2022) and the fourth bending sheet (2021) are arc included angles.

The utility model provides a chip socket's terminal structure, mechanical strength and elasticity are better, can contact with the contact of treater (CPU or GPU) chip bottom more firm, and it is lower to make the accuracy requirement, can effectively improve chip socket's yields.

Drawings

Fig. 1 is a schematic structural diagram of a terminal structure of a chip socket according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, the terminal structure of the chip socket provided by the present embodiment includes a first terminal portion 201 and a second terminal portion 202; the first terminal portion 201 is integrally formed of a first bending piece 2011, a second bending piece 2012 and a third bending piece 2013; the second terminal portion 202 is integrally formed by the fourth bending portion 2021, the fifth bending portion 2022 and the sixth bending portion 2023; second bending strap 2012 and fifth bending strap 2022 are fixed in a crossed manner; the top end of the first bending strip 2011 and the top end of the fourth bending strip 2021 are fixed to form an integral structure. As can be appreciated by those skilled in the art, the terminal structure with such a structure has better mechanical strength and elasticity, and can be more firmly contacted with the contact at the bottom of the processor (CPU or GPU) chip, so as to ensure the transmission performance of power and signals between the processor (CPU or GPU) chip and the Printed Circuit Board (PCB). In addition, the terminal structure with the structure can not generate horizontal displacement when a processor (CPU or GPU) chip is pressed down, so that the manufacturing precision requirement of the terminal structure is lower, and the manufacturing cost is convenient to reduce; in addition, with the terminal structure with the structure, when a processor (CPU or GPU) chip is pressed down, the first terminal part 201 and the second terminal part 202 can be longitudinally deformed, so that the positions of the bottom of the first terminal part 201 and the bottom of the second terminal part 202 can be adjusted, the positions of the solder balls arranged at the bottom of the first terminal part 201 and the bottom of the second terminal part 202 can be adjusted, the position of the solder ball can be guided, the requirement on accuracy of entering the solder ball can be reduced, the manufacturing cost is further facilitated, and the yield of the chip socket is improved.

The connection terminal for a chip socket provided in this embodiment further includes a terminal top plate (203), wherein the terminal top plate (203) is disposed at the top ends of the first bending piece 2011 and the fourth bending piece 2021 and forms an integral structure with the first bending piece 2011 and the fourth bending piece 2021. Those skilled in the art will appreciate that the terminal top plate (203) may further enhance the connection accuracy of the chip socket to the contacts on the bottom of the processor (CPU or GPU) chip.

The third bending piece 2013 and the sixth bending piece 2023 are disposed in parallel.

The included angles between the second bending straps 2012 and the third bending straps 2013 and between the fifth bending straps 2022 and the sixth bending straps 2023 are equal and between 120 degrees and 150 degrees.

The included angles between the second bending straps 2012 and the first bending straps 2011 and between the fifth bending straps 2022 and the fourth bending straps 2021 are equal and between 120 degrees and 150 degrees.

Those skilled in the art will understand that the included angle between the second bending strap 2012 and the third bending strap 2013 and between the fifth bending strap 2022 and the sixth bending strap 2023 is too large, or the included angle between the second bending strap 2012 and the first bending strap 2011 and between the fifth bending strap 2022 and the fourth bending strap 2021 is too large, which results in a poor rigidity of the terminal structure, and a poor elasticity of the terminal structure when the included angle is too small. The two included angles are set between 120 degrees and 150 degrees, so that the terminal structure provided by the embodiment has better rigidity and elasticity.

The included angles between the second bending sheet 2012 and the first bending sheet 2011 and between the fifth bending sheet 2022 and the fourth bending sheet 2021 are arc included angles. As will be understood by those skilled in the art, the arc-shaped included angle may provide better elasticity to the first and second

terminal portions

201 and 202.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A terminal structure of a chip socket is characterized by comprising a first terminal part (201) and a second terminal part (202); the first terminal portion (201) is integrally formed by a first bending piece (2011), a second bending piece (2012) and a third bending piece (2013); the second terminal portion (202) is integrally formed by a fourth bending piece (2021), a fifth bending piece (2022) and a sixth bending piece (2023); the second bending sheet (2012) and the fifth bending sheet (2022) are fixed in an intersecting manner; the top end of the first bending sheet (2011) and the top end of the fourth bending sheet (2021) are fixed to form an integral structure.

2. The terminal structure of the die pad of claim 1, further comprising a terminal top plate (203), wherein the terminal top plate (203) is disposed at the top end of the first bending piece (2011) and the fourth bending piece (2021) and forms an integral structure with the first bending piece (2011) and the fourth bending piece (2021).

3. The terminal structure of a chip socket according to claim 2, wherein the third bending piece (2013) and the sixth bending piece (2023) are arranged in parallel.

4. The terminal structure of a chip socket according to claim 3, wherein the included angles between the second bending piece (2012) and the third bending piece (2013) and between the fifth bending piece (2022) and the sixth bending piece (2023) are equal and between 120 degrees and 150 degrees.

5. The terminal structure of chip socket according to claim 4, wherein the included angles between the second bending piece (2012) and the first bending piece (2011) and between the fifth bending piece (2022) and the fourth bending piece (2021) are equal and between 120 degrees and 150 degrees.

6. The terminal structure of chip socket according to claim 5, wherein the included angles between the second bending piece (2012) and the first bending piece (2011) and between the fifth bending piece (2022) and the fourth bending piece (2021) are arc-shaped included angles.