CN217468859U - Connecting terminal for chip slot - Google Patents
Connecting terminal for chip slot Download PDFInfo
- Publication number
- CN217468859U CN217468859U CN202123425600.7U CN202123425600U CN217468859U CN 217468859 U CN217468859 U CN 217468859U CN 202123425600 U CN202123425600 U CN 202123425600U CN 217468859 U CN217468859 U CN 217468859U
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- China
- Prior art keywords
- terminal
- terminal portion
- solder ball
- chip
- bottom end
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Connecting Device With Holders (AREA)
Abstract
The utility model discloses a connecting terminal for a chip slot, which comprises a first terminal part (201), a second terminal part (202) and a solder ball (203); a gap (204) is arranged between the bottom end of the first terminal part (201) and the bottom end of the second terminal part (202); the solder ball (203) is disposed in the void (204) near the top end thereof and soldered to the bottom end of the first terminal portion (201) and the bottom end of the second terminal portion (202). The utility model discloses a connecting terminal for chip slot, novel structure, it is more firm with the tin ball welding, thereby not only can prevent that the tin ball of connecting terminal bottom from shifting or coming off when transportation, storage or assembly and leading to chip socket function failure and can effectively reduce the technological degree of difficulty that the tin ball was gone into to the value, improve the quality of chip slot.
Description
Technical Field
The utility model relates to an electronic equipment mainboard and connector field of making especially relate to a connecting terminal for chip slot.
Background
The Land Grid Array (LGA) socket is a novel chip socket, and is used for realizing electrical pressure welding connection between a Printed Circuit Board (PCB) and a processor (CPU or GPU) chip, so as to realize power supply and Circuit transmission between the processor (CPU or GPU) chip and the Printed Circuit Board (PCB). The grid array (LGA) slot of the connecting plate is provided with connecting terminals arranged in a matrix shape, and the bottom of each terminal is provided with a solder ball, so that the connecting terminals are welded with a Printed Circuit Board (PCB) through the solder balls. In the connection terminal in the prior art, as shown in fig. 1, an L-shaped bent portion 101 is disposed at the bottom of the connection terminal, and a solder ball is soldered at the bottom of the L-shaped bent portion, so as to solder the connection terminal to a Printed Circuit Board (PCB). However, in the connecting terminal with the structure in the prior art, the position of the solder ball is difficult to fix in the welding process, and the process requirement is high; in addition, in the connecting terminal with the structure in the prior art, although the solder balls are welded with the connecting terminal, the firmness degree is not good, and the solder balls are easy to shift or even fall off in the transportation or storage process, so that the function failure of the chip socket is caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a connecting terminal for chip slot.
The utility model provides a connecting terminal for chip slot, its characterized in that: comprises a first terminal portion (201), a second terminal portion (202) and a solder ball (203); a gap (204) is arranged between the bottom end of the first terminal part (201) and the bottom end of the second terminal part (202); the solder ball (203) is disposed in the void (204) near the top end thereof and soldered to the bottom end of the first terminal portion (201) and the bottom end of the second terminal portion (202).
A first bending leg (211) extending in the direction of the second terminal part (202) is arranged at the bottom of the first terminal part (201); a second bending leg (212) towards the first terminal part (201) is arranged at the bottom of the second terminal part (202); the first bending foot (211) and the second bending foot (212) are respectively inserted into the solder ball (203) from two sides and are welded with the solder ball (203). The first bending leg (211) and the second bending leg (212) are S-shaped structures formed by a first bending part (2111) and a second bending part (2112). The utility model provides a connecting terminal for chip slot still includes an insulating socket (213), insulating socket (213) are rectangle column structure, insulating socket (213) are equipped with the first through-hole that is used for wearing to establish first terminal part (201) and are used for wearing to establish the second through-hole of second terminal part (202); the first terminal portion (201) and the second terminal portion (202) are inserted into the first through hole and the second through hole, respectively.
The utility model provides a connecting terminal for chip slot, novel structure, it is more firm with the solder ball welding, thereby not only can prevent that the solder ball of connecting terminal bottom from shifting or coming off when transportation, storage or assembly and leading to chip socket function failure and can effectively reduce the technological degree of difficulty that the value goes into the solder ball, improves the quality of chip slot.
Drawings
Fig. 1 is a schematic diagram of a connecting terminal structure in the prior art according to the background of the present invention;
fig. 2 is a schematic structural view of a first terminal portion and a second terminal portion of a connection terminal for a chip socket according to the present invention;
fig. 3 is a schematic view illustrating an assembly of an insulating socket, a first terminal portion and a second terminal portion in a connection terminal for a chip socket according to the present invention;
fig. 4 is an assembly diagram of a first terminal portion, a second terminal portion and a solder ball of a connection terminal for a chip socket according to the present invention;
fig. 5 is a schematic bottom view of a connection terminal for a chip socket according to the present invention;
fig. 6 is a schematic structural view of the first bending leg and the second bending leg of the connection terminal for the chip socket according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 2 to 6, the connection terminal for a chip socket provided in the present embodiment includes a first terminal portion 201, a second terminal portion 202, and a solder ball 203; a gap 204 is formed between the bottom end of the first terminal part 201 and the bottom end of the second terminal part 202; a portion of the solder ball 203 near the top end thereof is disposed in the void 204 and soldered to the bottom end of the first terminal portion 201 and the bottom end of the second terminal portion 202. As can be understood by those skilled in the art, the connecting terminal for the chip socket provided in the present embodiment has two welding portions between the solder ball 203 and the connecting terminal, so that the solder ball 203 can be firmly welded to the first terminal portion 201 and the second terminal portion 202, and cannot be displaced or fall off during transportation, storage and mounting, thereby effectively ensuring the chip socket function.
A first bending leg 211 extending toward the second terminal portion 202 is provided at the bottom of the first terminal portion 201; a second bending leg 212 is provided at the bottom of the second terminal portion 202 in the direction of the first terminal portion 201; the first bending leg 211 and the second bending leg 212 are respectively inserted into the solder ball 203 from two sides and soldered to the solder ball 203. As will be understood by those skilled in the art, the first bending leg 211 and the second bending leg 212 are inserted into the solder ball 203, and then the solder ball 203 is soldered, so that the first terminal portion 201 and the second terminal portion 202 are more firmly fixed to the solder ball 203; in addition, in the process, the solder balls 203 are fixed in an inserting mode and then are welded, so that the process difficulty of welding the solder balls 203 is reduced.
The first and second bent legs 211 and 212 have an S-shaped structure formed by first and second bent portions 2111 and 2112. As can be understood by those skilled in the art, the second bent portion 2112 is used for inserting the solder ball 203; the first bending portion 2111 is used for increasing the elasticity between the first terminal portion 201 or the second terminal portion 202 and the second bending portion 2112, so that the connection terminal for the chip socket provided by the embodiment has better mechanical performance, thereby ensuring the electrical connection performance between the processor (CPU or GPU) chip and the Printed Circuit Board (PCB).
The connection terminal for a chip socket provided in this embodiment further includes an insulating socket 213, the insulating socket 213 is a rectangular column-shaped structure, and the insulating socket 213 is provided with a first through hole for penetrating the first terminal portion 201 and a second through hole for penetrating the second terminal portion 202; the first terminal portion 201 and the second terminal portion 202 are inserted into the first through hole and the second through hole, respectively. It will be understood by those skilled in the art that the first terminal portion 201 and the second terminal portion 202 can be fixed by the insulation socket 213, so that the connection terminal structure for a chip socket provided by the present embodiment is more stable.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (4)
1. A connecting terminal for a chip socket, characterized in that: comprises a first terminal portion (201), a second terminal portion (202) and a solder ball (203); a gap (204) is arranged between the bottom end of the first terminal part (201) and the bottom end of the second terminal part (202); a portion of the solder ball (203) near the top end thereof is disposed in the void (204) and soldered to the bottom end of the first terminal portion (201) and the bottom end of the second terminal portion (202).
2. The connection terminal for a chip socket according to claim 1, wherein: a first bending leg (211) extending in the direction of the second terminal part (202) is arranged at the bottom of the first terminal part (201); a second bending leg (212) towards the first terminal part (201) is arranged at the bottom of the second terminal part (202); the first bending foot (211) and the second bending foot (212) are respectively inserted into the solder ball (203) from two sides and are welded with the solder ball (203).
3. The connection terminal for a chip socket according to claim 2, wherein: the first bending leg (211) and the second bending leg (212) are S-shaped structures formed by a first bending part (2111) and a second bending part (2112).
4. A connection terminal for chip sockets according to claim 3, characterized in that: the insulating socket (213) is of a rectangular columnar structure, and the insulating socket (213) is provided with a first through hole for penetrating the first terminal part (201) and a second through hole for penetrating the second terminal part (202); the first terminal portion (201) and the second terminal portion (202) are inserted into the first through hole and the second through hole, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123425600.7U CN217468859U (en) | 2021-12-31 | 2021-12-31 | Connecting terminal for chip slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123425600.7U CN217468859U (en) | 2021-12-31 | 2021-12-31 | Connecting terminal for chip slot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217468859U true CN217468859U (en) | 2022-09-20 |
Family
ID=83262149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123425600.7U Active CN217468859U (en) | 2021-12-31 | 2021-12-31 | Connecting terminal for chip slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217468859U (en) |
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2021
- 2021-12-31 CN CN202123425600.7U patent/CN217468859U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |