CN211744838U - LED filament printed circuit board - Google Patents
LED filament printed circuit board Download PDFInfo
- Publication number
- CN211744838U CN211744838U CN201922279949.0U CN201922279949U CN211744838U CN 211744838 U CN211744838 U CN 211744838U CN 201922279949 U CN201922279949 U CN 201922279949U CN 211744838 U CN211744838 U CN 211744838U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- silver
- thick liquid
- printing ink
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims abstract description 21
- 239000004332 silver Substances 0.000 claims abstract description 21
- 238000007639 printing Methods 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000007650 screen-printing Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
The utility model discloses a LED filament printed circuit board, including ceramic substrate, metal support and silver thick liquid circuit, ceramic substrate's both ends are provided with metal support, and ceramic substrate's top surface silk-screen printing has the silver thick liquid circuit, and the top surface coating of silver thick liquid circuit has the protection printing ink. The utility model discloses a set up the printing ink layer and coat on the surface on silver-colored circuit layer, can play the guard action to the surface on silver-colored circuit layer after drying, avoid silver-colored circuit layer scotch and stain, lead to follow-up rosin joint or unable welding, and because the colour characteristic of protection printing ink itself leads to ceramic substrate just reverse side, have completely different reflection characteristic, make can adopt light sensor's mode to replace traditional CCD identification mode in the support production process, and the efficiency is improved, and the cost is reduced.
Description
Technical Field
The utility model relates to a circuit board field, in particular to LED filament printed circuit board.
Background
The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double side) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology.
At present, a packaging form of an LED filament is to print silver paste circuits on a ceramic substrate, form a conductive silver layer after sintering, and then weld LED chip pins and the silver layer circuits in a routing manner to form a loop. However, when a bracket manufacturer produces a bracket, the vibration disc is used for feeding, the printed circuit board continuously generates friction in the vibration disc and the track of the bracket machine, wherein part of the circuit board stays in the equipment for too long time, and the silver layer is easy to scratch and stain, so that a subsequent packaging factory is easy to perform false soldering or cannot solder in the routing process.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is overcome prior art's defect, provide a LED filament printed circuit board, possible avoid the circuit layer by the scotch and stain, lead to follow-up rosin joint or unable welding to because can adopt optical sensor's mode to replace traditional CCD identification mode in the support production process, promoted efficiency, reduce cost.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to a LED filament printed circuit board, including ceramic substrate, metal support and silver thick liquid circuit, ceramic substrate's both ends are provided with metal support, ceramic substrate's top surface silk-screen printing has silver thick liquid circuit, the top surface coating of silver thick liquid circuit has protection printing ink.
As a preferred technical scheme of the utility model, the colour of protection printing ink is not restricted to one, and thickness is 10-30 um.
As an optimal technical scheme of the utility model, ceramic substrate is connected with metal support through riveting and viscose.
As a preferred technical scheme of the utility model, ceramic substrate is provided with many and evenly distributes side by side, and leaves the clearance each other.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses a set up the printing ink layer and coat on the surface on silver-colored circuit layer, can play the guard action to the surface on silver-colored circuit layer after drying, avoid silver-colored circuit layer scotch and stain, lead to follow-up rosin joint or unable welding, and because the colour characteristic of protection printing ink itself leads to ceramic substrate just reverse side, have completely different reflection characteristic, make can adopt light sensor's mode to replace traditional CCD identification mode in the support production process, and the efficiency is improved, and the cost is reduced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the whole finished product of the present invention;
FIG. 2 is a diagram of the structure of the circuit board of the present invention;
fig. 3 is a cross-sectional view of the circuit board of the present invention;
in the figure: 1. a ceramic substrate; 2. a metal bracket; 3. silver paste circuit; 4. the ink is protected.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Wherein like reference numerals refer to like parts throughout.
Example 1
As shown in fig. 1-3, the utility model provides a LED filament printed circuit board, including ceramic substrate 1, metal support 2 and silver thick liquid circuit 3, ceramic substrate 1's both ends are provided with metal support 2, and ceramic substrate 1's top surface silk screen printing has silver thick liquid circuit 3, and the top surface coating of silver thick liquid circuit 3 has protection printing ink 4.
Further, the color of the protective ink 4 is not limited to one, and the thickness is 10 to 30 um.
The ceramic substrate 1 is connected to the metal holder 2 by riveting and gluing.
The ceramic substrate 1 is provided with a plurality of ceramic substrates which are evenly distributed side by side, and gaps are reserved among the ceramic substrates.
Specifically, after the silver paste circuit 3 is printed on the surface of the ceramic substrate 1 and formed, a layer of protective printing ink with a specific color is printed on the surface with the silver paste circuit 3 by a screen printing machine, the thickness of the protective printing ink is 10-30 microns, the protective printing ink is dried at a specific temperature, the printing ink has certain hardness and plays a role in protecting the circuit, then the circuit substrate is split into filaments on a splitting machine, the filament strips after the splitting are put into a vibration disc of a support machine for support production, the silver layer circuit is not damaged due to the protective effect of the printing ink in the production process, the filaments are put onto a metal support 2 through automatic equipment, the metal support 2 fixes two ends of the ceramic substrate 1 printed with the silver paste circuit 3 in a riveting and glue fixing mode, the protective printing ink 4 is cleaned after the production is finished, a proper amount of cleaning agent is added into an ultrasonic groove, the protective printing ink 4 is cleaned by controlling the vibration power of ultrasonic waves, because the cleaning link is added to the support, the vibration disc and the track do not need to be frequently cleaned in the daily production process of the support machine, part of labor cost is saved, the vibration disc and the track are finished after cleaning, and then the vibration disc and the track are delivered to a packaging factory for packaging the LED chip.
To sum up, the utility model discloses a set up the printing ink layer and coat on the surface on silver-colored circuit layer, can play the guard action to the surface on silver-colored circuit layer after drying, avoid silver-colored circuit layer scotch and stain, lead to follow-up rosin joint or unable welding, and because the colour characteristic of protection printing ink itself leads to ceramic substrate just reverse side (printed on circuit one side and not printed on circuit one side), have completely different reflection characteristics, make can adopt optical sensor's mode to replace traditional CCD identification mode in the support production process, and the efficiency is promoted, and the cost is reduced.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a LED filament printed circuit board, includes ceramic substrate (1), metal support (2) and silver thick liquid circuit (3), its characterized in that, the both ends of ceramic substrate (1) are provided with metal support (2), the top surface silk-screen printing of ceramic substrate (1) has silver thick liquid circuit (3), the top surface coating of silver thick liquid circuit (3) has protection printing ink (4).
2. An LED filament printed wiring board according to claim 1, characterized in that the color of the protective ink (4) is not limited to one and the thickness is 10-30 um.
3. The LED filament printed wiring board of claim 1, wherein the ceramic substrate (1) is connected to the metal support (2) by riveting and gluing.
4. The LED filament PCB of claim 1, wherein the ceramic substrate (1) is provided with a plurality of uniform side-by-side distribution with gaps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922279949.0U CN211744838U (en) | 2019-12-18 | 2019-12-18 | LED filament printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922279949.0U CN211744838U (en) | 2019-12-18 | 2019-12-18 | LED filament printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211744838U true CN211744838U (en) | 2020-10-23 |
Family
ID=72868817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922279949.0U Expired - Fee Related CN211744838U (en) | 2019-12-18 | 2019-12-18 | LED filament printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211744838U (en) |
-
2019
- 2019-12-18 CN CN201922279949.0U patent/CN211744838U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201023 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |