CN211742018U

CN211742018U - Display card backboard with even PCB stress and no damage to protruding parts

Info

Publication number: CN211742018U
Application number: CN202020890696.0U
Authority: CN
Inventors: 杜正义
Original assignee: Dongguan Guangyang Electronic Plastic Co ltd
Current assignee: Dongguan Guangyang Electronic Plastic Co ltd
Priority date: 2020-05-25
Filing date: 2020-05-25
Publication date: 2020-10-23
Anticipated expiration: 2030-05-25

Abstract

The utility model belongs to the technical field of the computer attaches components and parts, concretely relates to PCB atress is even and can not harm the display card backplate of bulge. The display card back plate is provided with a hot-melting screw, a supporting rib, a part vacancy avoiding position, a heat conduction module accommodating position and a heat dissipation hole; the support ribs can form balanced support for the PCB, and most of PCB deformation stress is effectively eliminated; the part clearance position can prevent the protruding parts on the PCB from being extruded or distorted, and the electrical performance of the equipment is ensured; the heat conducting module containing positions and the heat dissipation holes can quickly evacuate heat generated by the PCB to the outside of the equipment, and the service life of the equipment is prolonged.

Description

Display card backboard with even PCB stress and no damage to protruding parts

Technical Field

The utility model belongs to the technical field of the computer attaches components and parts, concretely relates to PCB atress is even and can not harm the display card backplate of bulge.

Background

The PCB back plate is an important component for mounting a PCB circuit board, and generally has structural stability and excellent thermal conductivity. The existing computer PCB backboard such as a display card backboard has the following technical problems: 1. after the PCB is installed, the board body is stressed unevenly, so that larger deformation stress can be generated, and the electrical performance and the service life of equipment are influenced; 2. the protruding parts on the PCB can be distorted in the installation process, and the technical indexes and the service life of the equipment are influenced.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a PCB atress is even and can not harm the display card backplate of bulge to solve the technical problem that exists among the prior art.

The utility model discloses a solve its technical problem and the solution that provides does:

the utility model provides a PCB atress is even and can not harm projecting part's display card backplate, includes display card backplate A face and display card backplate B face, its characterized in that: the surface A of the display card back plate is provided with a plurality of hot-melting screws, a plurality of supporting ribs and at least one part avoidance space; the support ribs are arranged in the area where the hot melting screws are not arranged on the surface A of the display card back plate to form stress balance support for the PCB; the part avoidance position is arranged on the PCB and protrudes out of the corresponding part of the part so as to avoid damaging the part.

Further, the part clearance space comprises a first part clearance space, a second part clearance space and a third part clearance space.

Furthermore, the A surface of the display card back plate is also provided with a heat conduction module containing position, and four heat dissipation holes are uniformly formed around the heat conduction module containing position. Preferably, the diameter of the heat dissipation holes is 10 +/-0.2 mm.

Furthermore, a plurality of reinforcing structures are arranged on the surface A of the display card back plate to improve the mechanical strength of the display card back plate.

Furthermore, at least one logo installation position is arranged on the B surface of the display card back plate.

Furthermore, the PCB is stressed uniformly and does not damage the display card back plate of the protruding part, and a structure avoidance position is further arranged on the display card back plate.

Furthermore, the PCB is uniformly stressed and the display card back plate which does not damage the protruding parts is made of a PC + ABS material or a graphene + PA6 material.

Furthermore, the maximum thickness of the display card back plate which is stressed uniformly and does not damage the protruding parts does not exceed 0.6 mm.

Furthermore, the length of the display card back plate which is stressed uniformly and does not damage the protruding parts is 197.99 +/-0.5 mm, the width of the long side is 112.55 +/-0.4 mm, and the width of the short side is 105.33 +/-0.4 mm.

The beneficial technical effects are as follows:

1. the application provides a PCB atress is even and can not harm be provided with the hot melt screw on the display card backplate of salient part simultaneously, support rib and part and keep away the vacancy, support the region that the hot melt screw does not distribute on the backplate of rib setting, can form the stress balance support to the PCB circuit board, effectively eliminate most PCB deformation stress, the part keeps away the vacancy and sets up in the corresponding position of salient part on the PCB in order to avoid damaging the part.

2. Still be provided with heat conduction module on the display card backplate and hold the position and evenly distributed a plurality of louvre around heat conduction module holding position, can carry the heat that PCB produced to the equipment outside through the louvre fast through the heat conduction module such as metal heat conduction structure or the metal heat conduction structure that has the fan to improve the heat conductivility of equipment, guarantee the electrical property and the life of equipment.

3. The graphene and PA6 material has excellent heat-conducting property, and can effectively improve the heat-conducting property of the backboard.

The technical solutions and technical effects of the present application will be described in detail below with reference to the drawings and the detailed description of the present application.

Drawings

FIG. 1: a schematic structural diagram of a side A of the display card backboard;

FIG. 2: the structure of the back plate B of the display card is shown schematically.

And (3) identification and explanation:

10-hot melt screw, 20-support rib, 30-heat conduction module accommodating position, 40-first part vacancy avoiding position, 50-second part vacancy avoiding position, 60-third part vacancy avoiding position, 70-strengthening structure, 80-structure vacancy avoiding position, 90-logo arranging position and 100-heat dissipation hole.

Detailed Description

Referring to fig. 1 and 2, the graphics card back panel of the present application, which is uniformly stressed and does not damage the protruding parts, includes a graphics card back panel inner side and a graphics card back panel outer side, for convenience of description, the graphics card back panel a side represents the inner side of the back panel, and the graphics card back panel B side represents the outer side of the back panel. The A surface of the display card back plate is provided with a plurality of hot melting screws 10, a plurality of supporting ribs 20, a heat conduction module accommodating position 30, a first part vacancy avoiding position 40, a second part vacancy avoiding position 50, a third part vacancy avoiding position 60, a strengthening structure 70 (namely a reinforcing rib), a structure vacancy avoiding position 80 and heat dissipation holes 100.

The support rib 20 is arranged on the area of the A surface of the display card backboard where the hot melt screw 10 is not arranged so as to form stress balance support for the PCB; the first part space avoiding position 40, the second part space avoiding position 50 and the third part space avoiding position 60 are arranged at corresponding positions of the protruding parts on the PCB, so that the protruding circuit parts are prevented from being damaged during installation. Meanwhile, the first part space avoiding position 40, the second part space avoiding position 50 and the third part space avoiding position 60 can also prevent the surface of the product from generating stress marks.

The heat conduction module accommodating position 30 is arranged in an orientation corresponding to a component with a relatively large heat generation amount on the PCB such as a sound card chip or other operation chip. In order to enhance heat dissipation, a plurality of heat dissipation holes 100 are uniformly formed around the heat conduction module accommodating position 30, and the heat dissipation holes 100 are through holes. In application, a metal heat conduction structure or a metal heat conduction structure with a fan can be used as a heat conduction module, and heat generated by the PCB can be quickly exhausted out of the equipment through the heat conduction module and the heat dissipation holes 100.

The reinforcing structure 70, that is, the reinforcing ribs are arranged on the surface a of the display card backboard, and a plurality of reinforcing ribs form a three-dimensional network which is communicated with each other on the surface a of the display card backboard, so that the mechanical strength of the backboard can be effectively increased.

In order to conveniently paste up the label or the brand mark, a logo placing position is further arranged on the surface B of the display card back plate. The logo can be quickly installed in a bonding or buckling connection mode.

This application PCB atress is even and can not harm on the display card backplate of projecting part and still be provided with the structure and keep away vacancy 80, and the vacancy 80 can play good guide effect at the in-process of display card backplate installation is kept away to the structure, can also prevent to collide with in addition.

The display card backboard with the uniform stress and the capability of not damaging the protruding parts of the PCB disclosed in the embodiment is manufactured by adopting a PC + ABS material through an injection molding process, the maximum thickness of the board body is not more than 0.6mm, the length of the display card backboard is 197.99 +/-0.5 mm, the width of a long edge is 112.55 +/-0.4 mm, the width of a short edge is 105.33 +/-0.4 mm, and the diameter of the heat dissipation hole (100) is 10 +/-0.2 mm.

The utility model provides a be provided with the hot melt screw simultaneously on the display card backplate, support rib and part and keep away the vacancy, support the region that the hot melt screw did not distribute on the display card backplate of rib setting, can form the stress balance support to the PCB circuit board, effectively eliminate most PCB deformation stress, the part keeps away the vacancy and sets up the corresponding position of outstanding part on the PCB, can prevent that the salient part on the PCB from receiving the extrusion or distortion. Still be provided with heat conduction module on the display card backplate and hold the position and evenly distributed a plurality of louvre around heat conduction module holding position, can carry the heat that PCB produced to the equipment outside from the louvre fast through the heat conduction module to improve the heat conductivility of equipment, guarantee the electrical property and the life of equipment.

While the technical solutions and effects of the present invention have been described in detail with reference to the drawings and the specific embodiments of the present invention, it should be noted that the specific embodiments disclosed in the specification are only preferred embodiments of the present invention, and those skilled in the art can develop other embodiments based on the embodiments; any simple modification and equivalent replacement without departing from the innovative concepts of the present invention is covered by the present invention and is within the scope of the present patent.

Claims

1. The utility model provides a PCB atress is even and can not harm projecting part's display card backplate, includes display card backplate A face and display card backplate B face, its characterized in that:

the A surface of the display card back plate is provided with a plurality of hot melting screws (10), a plurality of supporting ribs (20) and at least one part avoidance space; the support rib (20) is arranged on the area, to which the hot melt screw (10) is not arranged, of the A surface of the display card back plate to form stress balance support for the PCB; the part avoidance positions are arranged on the PCB and protrude out of the corresponding parts of the parts so as to avoid damaging the parts.

2. The graphic card backboard of claim 1, wherein the PCB is uniformly stressed and does not damage the protruding parts, and the graphic card backboard is characterized in that: the part clearance space comprises a first part clearance space (40), a second part clearance space (50) and a third part clearance space (60).

3. The graphic card backboard of claim 1, wherein the PCB is uniformly stressed and does not damage the protruding parts, and the graphic card backboard is characterized in that: the A face of the display card back plate is further provided with a heat conduction module containing position (30), and four heat dissipation holes (100) are uniformly formed in the periphery of the heat conduction module containing position (30).

4. The graphics card backplane of claim 3 wherein the PCB is uniformly stressed without damaging the protruding parts, wherein: the diameter of the heat dissipation hole (100) is 10 +/-0.2 mm.

5. The graphic card backboard of claim 1, wherein the PCB is uniformly stressed and does not damage the protruding parts, and the graphic card backboard is characterized in that: a surface A of the display card back plate is also provided with a plurality of reinforcing structures (70) to improve the mechanical strength of the display card back plate.

6. The graphic card backboard of claim 1, wherein the PCB is uniformly stressed and does not damage the protruding parts, and the graphic card backboard is characterized in that: and at least one logo placement position (90) is arranged on the B surface of the display card back plate.

7. The graphic card backboard of claim 1, wherein the PCB is uniformly stressed and does not damage the protruding parts, and the graphic card backboard is characterized in that: the display card back plate of the PCB is even in stress and does not damage the protruding parts, and a structure avoidance position (80) is further arranged on the display card back plate.

8. The graphics card backplane of any of claims 1-7 wherein the PCB is uniformly stressed without damaging the protruding parts, wherein: the display card back plate with the uniform stress and without damaging the protruding parts is made of a PC + ABS material or a graphene + PA6 material.

9. The graphics card backplane of any of claims 1-7 wherein the PCB is uniformly stressed without damaging the protruding parts, wherein: the maximum thickness of the display card back plate which is stressed uniformly and does not damage the protruding parts does not exceed 0.6 mm.

10. The graphics card backplane of any of claims 1-7 wherein the PCB is uniformly stressed without damaging the protruding parts, wherein: the length of the display card back plate which is stressed uniformly and does not damage the protruding parts is 197.99 +/-0.5 mm, the width of the long side is 112.55 +/-0.4 mm, and the width of the short side is 105.33 +/-0.4 mm.