CN211709829U - A sealed cap and encapsulating structure for encapsulating - Google Patents
A sealed cap and encapsulating structure for encapsulating Download PDFInfo
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- CN211709829U CN211709829U CN201922224186.XU CN201922224186U CN211709829U CN 211709829 U CN211709829 U CN 211709829U CN 201922224186 U CN201922224186 U CN 201922224186U CN 211709829 U CN211709829 U CN 211709829U
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- sealing cap
- circuit board
- encapsulating
- glue
- brim
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Abstract
The utility model discloses a sealing cap and encapsulating structure for encapsulating, from top to bottom include boss, brim of a hat and lower boss in proper order, the bottom area of brim of a hat is greater than the encapsulation hole area on the circuit board of waiting to encapsulate, the height of lower boss is less than the thickness of the circuit board of waiting to encapsulate, and the shape of lower boss and the shape phase-match of the encapsulation hole on the circuit board of waiting to encapsulate; the sealing cap is made of inert materials. The utility model provides a sealing cap for encapsulating adopts inert materials such as polytetrafluoroethylene or PP material that can not take place reaction or bonding with encapsulating glue for complement the encapsulation hole part that is unfavorable for encapsulating technology to go on that exists in the electronic product design of waiting to encapsulating, easy cleaning, improve the clean efficiency and the encapsulating product quality of encapsulating; the sealing cap can be recycled, so that the manufacturing cost of the product can be effectively reduced, the generation of garbage can be reduced, and the environment is effectively improved; the sealing cap is directly complemented by manual operation, and is simple and easy to operate.
Description
Technical Field
The utility model relates to a encapsulating packaging technology field especially relates to a sealed cap and encapsulating structure for encapsulating.
Background
At present, the electronic industry generally needs to perform a glue-pouring sealing process on electronic products with relatively severe working conditions, so as to ensure that the key electrical control part of the product cannot normally work due to the severe working conditions, or the service life of the key electrical control part is insufficient, such as rain, water immersion, humidity, vibration and the like. The existing electronic product needing glue filling is generally in structural design: a circuit board and a encapsulation shell fixed connection form the potting cavity of unilateral opening other direction seal or multi-direction opening, and no matter be unilateral opening or multi-direction opening, circuit board and encapsulation shell adopt screw fixed connection usually, therefore there is the encapsulation hole that link up the circuit board in the junction between them, leads to having great assembly gap between screw and the circuit board, greatly influences the encapsulating effect.
Therefore, the prior art is still in need of improvement and development in view of the problem of assembly clearance caused by the package hole of the electronic product.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sealed cap and encapsulating structure for encapsulating aims at solving the problem that there is great fit-up gap influence encapsulating effect in the junction of circuit board and encapsulation shell among the current electronic product.
In order to solve the above problem, the technical scheme of the utility model is as follows: a sealing cap for glue pouring comprises an upper boss, a brim and a lower boss from top to bottom in sequence, wherein the bottom area of the brim is larger than the area of a packaging hole in a circuit board to be glue poured, the height of the lower boss is smaller than the thickness of the circuit board to be glue poured, and the shape of the lower boss is matched with the shape of the packaging hole in the circuit board to be glue poured; the sealing cap is made of inert materials.
The sealing cap for glue pouring is characterized in that the width of the upper boss is half of the diameter of the cap peak.
The sealing cap for glue pouring is characterized in that the diameter of the cap peak is 2mm larger than that of a packaging hole in a circuit board to be glued, and the height of the cap peak is 2 mm.
The sealing cap for glue pouring is characterized in that the height of the lower boss is half of the thickness of a circuit board to be glued.
The sealing cap for glue pouring is characterized in that a gap between the lower boss and the hole wall of the packaging hole in the circuit board to be glued is 0.1 mm.
The sealing cap for glue pouring is made of polytetrafluoroethylene or PP.
The sealing cap for glue pouring is integrally formed, and the upper boss is formed by externally cutting two sides of the upper end of the cap peak.
A glue filling structure for glue filling is disclosed, wherein the glue filling structure comprises a circuit board, a heat dissipation shell and a sealing cap; the heat dissipation shell is of a groove type, assembling gaps for inserting the circuit board are formed inwards on two sides of a groove opening of the heat dissipation shell, and a nut seat is arranged at the bottom of the heat dissipation shell; a packaging hole is formed in the position, corresponding to the nut seat, of the circuit board, and the circuit board is fixed on the heat dissipation shell through a screw which penetrates through the packaging hole and is connected with the nut seat; the lower boss of the sealing cap is inserted into the packaging hole.
The beneficial effects of the utility model include: the utility model provides a sealing cap for encapsulating adopts inert materials such as polytetrafluoroethylene or PP material that can not take place reaction or bonding with encapsulating glue for complement the encapsulation hole part that is unfavorable for encapsulating technology to go on that exists in the electronic product design of waiting to encapsulating, easy cleaning, improve the clean efficiency and the encapsulating product quality of encapsulating; the sealing cap can be recycled, so that the manufacturing cost of the product can be effectively reduced, the generation of garbage can be reduced, and the environment is effectively improved; the sealing cap is directly complemented by manual operation, and is simple and easy to operate.
Drawings
Fig. 1 is a schematic structural diagram of a first viewing angle of a sealing cap for glue pouring according to the present invention.
Fig. 2 is a schematic structural diagram of a second viewing angle of the sealing cap for glue pouring of the present invention.
Fig. 3 is a schematic structural diagram of a third viewing angle of the sealing cap for glue pouring of the present invention.
Fig. 4 is a cross-sectional structural view of a glue filling structure for glue filling of the present invention.
Fig. 5 is a longitudinal section structure diagram of a glue filling structure for glue filling of the present invention.
Description of reference numerals: 1. an upper boss; 2. a brim; 3. a lower boss; 4. a circuit board; 5. a heat dissipation housing; 6. a screw; 7. a sealing strip; 8. and assembling the gap.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
As shown in fig. 1-3, the utility model provides a sealing cap for encapsulating, its integrated into one piece includes boss 1, brim of a hat 2 and lower boss 3 from top to bottom in proper order. Wherein, the upper boss 1 is formed by the circumcision of the upper end both sides of brim of a hat 2, and further, the width that goes of upper boss 1 both sides to cut is half of the brim of a hat 2 diameter to it draws out after using up to go. The bottom area of brim of a hat 2 is greater than the encapsulation hole area on the circuit board 4 of treating the encapsulating, also the diameter ratio encapsulation hole's of brim of a hat 2 diameter ratio diameter is big, in practical application, the diameter ratio encapsulation hole's of brim of a hat 2 diameter ratio is 2mm big generally, when guaranteeing that brim of a hat 2 can seal the encapsulation hole completely, also prevent that brim of a hat 2 is too big to damage the components and parts on the circuit board 4 of treating the encapsulating, and the height of brim of a hat 2 only is 2mm for the sealing cap is whole more light. The height of boss 3 is less than the thickness of the circuit board 4 of waiting to the encapsulating down, and in practical application, the height of boss 3 down is half of the circuit board 4 thickness of waiting to the encapsulating to prevent that the sealing cap from filling in behind the encapsulation hole, is difficult to take out, and the shape of boss 3 down and the shape phase-match of the encapsulation hole on the circuit board 4 of waiting to the encapsulating, and it is only 0.1mm with encapsulation hole pore wall clearance, and the leakproofness is good.
The utility model discloses a sealed cap for encapsulating adopts inert materials such as polytetrafluoroethylene or PP material, can not take place reaction or bonding, easily cleanness with encapsulating glue. The utility model discloses a sealing cap is applicable to the encapsulating structure in figure 4 and 5, is a plurality of direction openings in the encapsulating structural design in figure 4 and 5, and concrete encapsulating sealing process is as follows:
the glue filling structure shown in fig. 4 and 5 is designed as follows: the product is formed by combining three parts, including a circuit board 4, a heat dissipation shell 5 of an aluminum profile and the sealing cap; the heat dissipation shell 5 is of a groove type, two sides of a groove opening of the heat dissipation shell 5 are inwards correspondingly provided with an assembly gap 8 for inserting the circuit board 4, and the circuit board 4 is inserted into the heat dissipation shell 5 along the assembly gap 8 to be combined with the heat dissipation shell 5; the bottom of the heat dissipation shell 5 is provided with a nut seat, the circuit board 4 is correspondingly provided with a packaging hole, and the circuit board 4 is fixed on the aluminum profile heat dissipation shell 5 by passing the packaging hole of the circuit board 4 through a screw 6 and connecting with the nut seat. The part of the glue filling structure needing glue filling is a cavity area formed by the circuit board 4 and the heat dissipation shell 5, the formed cavity is opened in the front and back directions, and a larger gap exists between the heat dissipation shell 5 and the circuit board 4 due to the packaging hole part fixed by the screws 6. Therefore, can adopt the utility model discloses a lower boss 3 of sealed cap fills in the encapsulation hole and complements, prevents that glue from spilling from the encapsulation hole. Specifically, the lower boss 3 of the sealing cap is in sealing complement with the packaging hole, the sealing strip 7 is used for sealing complement of one opening of the cavity, chemical reaction with glue filling glue is avoided, the curing condition is lower than that of the glue filling glue, residual glue is easy to remove after curing, gaps existing in the sealing complement position are sealed, the sealant is generally solder resist, the glue is characterized in that surface drying can be started after glue dispensing for 3-5 minutes, the cured glue is similar to a rubber band, after one corner is selected and torn, all the glue can be completely removed at one time, no redundant residues exist, after the sealing glue is placed for 3-5 minutes and surface drying is finished, a jig is used for basically fixing a product subjected to surface drying of the solder resist, and further manual glue filling or automatic machine glue filling is facilitated. And after the glue pouring and sealing are finished, curing by using the curing conditions recommended by the glue pouring glue, and directly removing the sealant, namely finishing the glue pouring and sealing of the target electronic product. Wherein, the sealing cap can be repeatedly used, the cost is reduced, and the resource is saved.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (8)
1. A sealing cap for glue pouring is characterized by sequentially comprising an upper boss, a brim and a lower boss from top to bottom, wherein the bottom area of the brim is larger than the area of a packaging hole in a circuit board to be glue poured, the height of the lower boss is smaller than the thickness of the circuit board to be glue poured, and the shape of the lower boss is matched with the shape of the packaging hole in the circuit board to be glue poured; the sealing cap is made of inert materials.
2. The sealing cap for potting a glue of claim 1, wherein the upper boss has a width of half a diameter of the visor.
3. The sealing cap for potting of a glue of claim 1, wherein the brim has a diameter 2mm larger than a diameter of the encapsulation hole on the circuit board to be potted, and a height of the brim is 2 mm.
4. The sealing cap for potting compound of claim 1, wherein the height of the lower boss is half the thickness of the circuit board to be potted.
5. The sealing cap for glue filling of claim 1, wherein the gap between the lower boss and the wall of the packaging hole on the circuit board to be glue filled is 0.1 mm.
6. The sealing cap for glue pouring according to claim 1, characterized in that it is made of polytetrafluoroethylene or PP.
7. The sealing cap for pouring sealant according to claim 1, wherein the sealing cap is integrally formed, and the upper boss is formed by two edges of the upper end of the brim in a circumscribed manner.
8. A glue filling structure for glue filling, which is characterized by comprising a circuit board, a heat dissipation shell and a sealing cap according to any one of claims 1 to 7; the heat dissipation shell is of a groove type, assembling gaps for inserting the circuit board are formed inwards on two sides of a groove opening of the heat dissipation shell, and a nut seat is arranged at the bottom of the heat dissipation shell; a packaging hole is formed in the position, corresponding to the nut seat, of the circuit board, and the circuit board is fixed on the heat dissipation shell through a screw which penetrates through the packaging hole and is connected with the nut seat; the lower boss of the sealing cap is inserted into the packaging hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922224186.XU CN211709829U (en) | 2019-12-12 | 2019-12-12 | A sealed cap and encapsulating structure for encapsulating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922224186.XU CN211709829U (en) | 2019-12-12 | 2019-12-12 | A sealed cap and encapsulating structure for encapsulating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211709829U true CN211709829U (en) | 2020-10-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922224186.XU Active CN211709829U (en) | 2019-12-12 | 2019-12-12 | A sealed cap and encapsulating structure for encapsulating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211709829U (en) |
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2019
- 2019-12-12 CN CN201922224186.XU patent/CN211709829U/en active Active
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