CN211700043U - Mould for batch capacitor production wicking - Google Patents
Mould for batch capacitor production wicking Download PDFInfo
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- CN211700043U CN211700043U CN202020489354.8U CN202020489354U CN211700043U CN 211700043 U CN211700043 U CN 211700043U CN 202020489354 U CN202020489354 U CN 202020489354U CN 211700043 U CN211700043 U CN 211700043U
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Abstract
The utility model discloses a batch capacitor production mould for tin immersion, which comprises a rectangular outer shell and a ceramic wafer placing area arranged at the bottom end inside the outer shell, wherein the ceramic wafer placing area is divided into a plurality of containing cavities distributed in a matrix manner, and the ceramic wafer is vertically placed in the containing cavities and is not contacted with the bottoms of the containing cavities; a liquid inlet is formed in the side face of the outer shell body, corresponding to the upper portion of the ceramic chip placing area, and a liquid outlet hole is formed in the bottom end of each accommodating cavity. The utility model discloses a mould for batch production can realize the fixed and effective clamping action to welded potsherd and pin line through the design to holding chamber size, and efficiency is high-efficient, can reduce the cost to later stage mould maintenance moreover.
Description
Technical Field
The utility model belongs to the tinning die field, concretely relates to mould for batch electric capacity production wicking.
Background
In the traditional process of manufacturing the capacitor, single tin plating or manual tin plating is mostly adopted in the tin plating step, and the production efficiency is low in the manufacturing mode, so that the requirement on an electronic element cannot be met. Therefore, in recent years, capacitor manufacturers and equipment suppliers mainly pursue the research and development of processes and equipment related to batch tin plating. In the existing research, a crucible mold used in batch tinning inevitably uses a clamp for fixing a welded ceramic wafer and a lead wire together, so that the clamp used before and after tinning has a process of clamping and releasing the clamp, and the mold is troublesome and time-consuming to clean after tinning is finished.
SUMMERY OF THE UTILITY MODEL
To the problem, the utility model provides a mould for batch electric capacity production wicking.
Realize above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes:
a batch capacitor production tin immersion die comprises a rectangular outer shell and a ceramic wafer placing area arranged at the bottom end inside the outer shell, wherein the ceramic wafer placing area is divided into a plurality of containing cavities distributed in a matrix manner, and ceramic wafers are vertically placed in the containing cavities and are not in contact with the bottoms of the containing cavities; a liquid inlet is formed in the side face of the outer shell body, corresponding to the upper portion of the ceramic chip placing area, and a liquid outlet hole is formed in the bottom end of each accommodating cavity.
As a further improvement of the utility model: the area of the liquid outlet hole is larger than 1/2 of the area of the bottom of the containing cavity.
As a further improvement of the utility model: the liquid outlet holes are rectangular, circular or elliptical.
As a further improvement of the utility model: the opening degree of the accommodating cavity is of a structure with a step shape gradually increasing from bottom to top, and comprises a first step area, a second step area and a third step area which are sequentially arranged, and the top end of a ceramic wafer vertically placed in the accommodating cavity is lower than the top surface of the accommodating cavity.
As a further improvement of the utility model: the sizes of the first step area, the second step area and the third step area in the length direction are kept consistent and are 1-2mm larger than the ceramic chip, the height of the first step area is larger than the radius of the ceramic chip, the width of the first step area is smaller than the thickness of the ceramic chip, the width of the third step area is larger than the sum of the thicknesses of the welded ceramic chip and the lead wire, the second step area is a transition area with gradually increased width, and the distance from the third step area to the bottom end of the containing cavity is larger than the diameter of the ceramic chip.
As a further improvement of the utility model: the bottom end of the liquid inlet is higher than the top plane of the ceramic chip placing area.
As a further improvement of the utility model: the device also comprises a hoisting hole arranged above the liquid inlet.
The utility model has the advantages that: the utility model discloses a mould for batch production can realize the fixed and effective clamping action to welded potsherd and pin line through the design to holding chamber size, and efficiency is high-efficient, can reduce the cost to later stage mould maintenance moreover.
Drawings
Fig. 1 is a schematic sectional view of a mold according to the present invention;
FIG. 2 is a schematic structural view of the accommodating chamber, the ceramic sheet and the lead wires placed therein;
wherein: 1-outer shell, 2-ceramic chip placing area, 3-containing cavity, 301-first step area, 302-second step area, 303-third step area, 4-liquid inlet, 5-liquid outlet, 6-hoisting hole, 7-ceramic chip and 8-pin line.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following description is made in detail for the application of the principles of the present invention with reference to the accompanying drawings.
The assembly die which is fired by high-temperature ceramic materials and can be used for batch capacitor production and tin immersion comprises a rectangular outer shell 1 and a ceramic wafer placing area 2 arranged at the bottom end inside the outer shell 1, wherein the ceramic wafer placing area 2 is divided into a plurality of containing cavities 3 distributed in a matrix manner, and a ceramic wafer 7 is vertically placed in the containing cavities 3 and is not contacted with the bottoms of the containing cavities 3; a group of side faces of the outer shell 1 correspond to the upper portion of the ceramic chip placing area 2, and a liquid inlet 4 is formed in the upper portion of the ceramic chip placing area, and each bottom end of the accommodating cavity 3 is provided with a liquid outlet 5.
Wherein, the area of the liquid outlet hole 5 is larger than 1/2 of the bottom area of the accommodating cavity 3. The liquid outlet holes 5 can be in various shapes, and are mainly rectangular, circular or elliptical.
In order to ensure the vertical upward placement of the ceramic sheet 7 placed in the receiving cavity 3 and to fix the positions of the ceramic sheet 7 and the lead wires 8 without using a jig. The specific structure of the accommodating cavity 3 is a structure with gradually increasing opening degree in a step shape from bottom to top, and comprises a first step area 301, a second step area 302 and a third step area 303 which are sequentially arranged, and the top end of a ceramic wafer 7 vertically placed in the accommodating cavity 3 is lower than the top surface of the accommodating cavity 3. The sizes of the first step area 301, the second step area 302 and the third step area 303 in the length direction are consistent and are 1-2mm larger than the ceramic plate 7, and the gaps ensure that the tin liquid smoothly flows downwards. The height of the first step area 301 is larger than the radius of the ceramic plate 7, the width of the first step area is smaller than the thickness of the ceramic plate 7, the ceramic plate 7 is clamped, and meanwhile, the bottom end of the ceramic plate 7 is prevented from contacting with the bottom of the accommodating cavity 3 to block the liquid outlet hole 5. The width of the third step area 303 is greater than the sum of the thicknesses of the welded ceramic plate 7 and the welded lead wire 8, and is slightly greater than the sum of the thicknesses of the welded ceramic plate 7 and the welded lead wire 8 in actual design, so that the third step area has a fixed clamping effect on one hand, and ensures the downward flow of tin liquid on the other hand. The second stepped region 302 is a transition region with gradually increasing width, and the distance from the third stepped region 303 to the bottom end of the accommodating cavity 3 is greater than the diameter of the ceramic plate 7. Before tinning, the lead wire 8 is placed in the accommodating cavity by using a clamp, the ceramic wafer 7 and the lead wire 8 are contacted with each other in the space limited by the accommodating cavity, the position is kept stable, and then the ceramic wafer is sent into a tinning furnace to leach tin liquor, so that tinning welding is completed.
The bottom end of the liquid inlet 4 is higher than the top plane of the ceramic chip 7 placing area 2.
The device also comprises a hoisting hole 6 arranged above the liquid inlet 4 and used for cleaning and detinning the mold in the later period.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a mould for batch electric capacity production wicking which characterized in that: the ceramic wafer placing area is divided into a plurality of containing cavities which are distributed in a matrix manner, and the ceramic wafer is vertically placed in the containing cavities and is not contacted with the bottoms of the containing cavities; a liquid inlet is formed in the side face of the outer shell body, corresponding to the upper portion of the ceramic chip placing area, and a liquid outlet hole is formed in the bottom end of each accommodating cavity.
2. The die for batch production of tin dipping of capacitors as claimed in claim 1, wherein: the area of the liquid outlet hole is larger than 1/2 of the area of the bottom of the containing cavity.
3. The die for batch production of tin dipping of capacitors as claimed in claim 2, wherein: the liquid outlet holes are rectangular, circular or elliptical.
4. The die for batch production of tin dipping of capacitors as claimed in claim 1, wherein: the opening degree of the accommodating cavity is of a structure with a step shape gradually increasing from bottom to top, and comprises a first step area, a second step area and a third step area which are sequentially arranged, and the top end of a ceramic wafer vertically placed in the accommodating cavity is lower than the top surface of the accommodating cavity.
5. The die for batch production of tin dipping of capacitors as claimed in claim 4, wherein: the sizes of the first step area, the second step area and the third step area in the length direction are kept consistent and are 1-2mm larger than the ceramic chip, the height of the first step area is larger than the radius of the ceramic chip, the width of the first step area is smaller than the thickness of the ceramic chip, the width of the third step area is larger than the sum of the thicknesses of the welded ceramic chip and the lead wire, the second step area is a transition area with gradually increased width, and the distance from the third step area to the bottom end of the containing cavity is larger than the diameter of the ceramic chip.
6. The die for batch production of tin dipping of capacitors as claimed in claim 1, wherein: the bottom end of the liquid inlet is higher than the top plane of the ceramic chip placing area.
7. The die for batch production of tin dipping of capacitors as claimed in claim 1, wherein: the device also comprises a hoisting hole arranged above the liquid inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020489354.8U CN211700043U (en) | 2020-04-07 | 2020-04-07 | Mould for batch capacitor production wicking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020489354.8U CN211700043U (en) | 2020-04-07 | 2020-04-07 | Mould for batch capacitor production wicking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211700043U true CN211700043U (en) | 2020-10-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020489354.8U Active CN211700043U (en) | 2020-04-07 | 2020-04-07 | Mould for batch capacitor production wicking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211700043U (en) |
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2020
- 2020-04-07 CN CN202020489354.8U patent/CN211700043U/en active Active
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