CN207624687U - A kind of single formula semiconductor lead frame - Google Patents
A kind of single formula semiconductor lead frame Download PDFInfo
- Publication number
- CN207624687U CN207624687U CN201721860738.0U CN201721860738U CN207624687U CN 207624687 U CN207624687 U CN 207624687U CN 201721860738 U CN201721860738 U CN 201721860738U CN 207624687 U CN207624687 U CN 207624687U
- Authority
- CN
- China
- Prior art keywords
- metallic conduction
- material strip
- lead frame
- conduction piece
- single formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of single formula semiconductor lead frame, including material strip, it is connected to the metallic conduction piece of material strip wherein side, there is the metallic conduction piece welded plate of square structure, the welded plate to be equipped with the weld part of protrusion, the block machine that should extend from the ending vertical of welded plate.When assembly, the outer rim of semiconductor chip can be blocked using block machine, keeps semiconductor chip fixed, be convenient for scolding tin, and the finished product produced, block machine that can play the role of protecting semiconductor chip.In addition, the metallic conduction piece and the connecting position of connection sheet are equipped with can be with the embedded hole of clamping plastic cement, one end both sides that the connection sheet is used to connect with metallic conduction piece are equipped with groove can increase the fixing power of product and plastic cement by the design of embedded hole and groove.
Description
Technical field
The utility model is related to electronic component field technologies, refer in particular to a kind of single formula semiconductor lead frame.
Background technology
Traditional semiconductor light electrical chip, is brazed by traditional electrode, semiconductor by solder.Electrode, semiconductor,
The processing of solder is machined to one by one, is then screened by artificial or mold, and assembling, sealing-in forms, after sealing-in
There is still a need for screen trays one by one to carry out ageing, cleaning, plating.Product handles before raw material, fabricate and semi-finished product after work
It is one by one, when needing to carry out batch processing using mold screen tray, and entering next process in sequence processing procedure
It needs to repeat screen tray again, needs to put into a large amount of mold jig and artificial, cause production cost larger.
The processing of development with automated job and prevalence, semiconductor product is increasingly dependent on equipment completion, therefore goes out
Show entire row electrode of the direct punch forming on material strip, however in automation is processed, the welding between electrode and semiconductor
Not enough securely, it is susceptible to desoldering phenomenon, leads to the excellent good decline of product.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose is to provide a kind of single formula
Semiconductor lead frame, by the way that block machine is arranged, when assembly, can block semiconductor chip, convenient for being positioned when welding,
Make welding sequence that can be rapidly completed.
To achieve the above object, the utility model is using following technical solution：
A kind of single formula semiconductor lead frame, including material strip, the metallic conduction piece for being connected to material strip wherein side, it is described
There is metallic conduction piece the welded plate of square structure, the welded plate to be equipped with the weld part of protrusion, should be from the end of welded plate
The block machine vertically extended.
As a preferred embodiment, connected by connection sheet between the metallic conduction piece and material strip, the connection sheet be by
Horizontal part and bending part are constituted, and there are differences in height between plane and the plane of material strip where making metallic conduction piece.
As a preferred embodiment, be equipped with can be with the embedding of clamping plastic cement for the metallic conduction piece and the connecting position of connection sheet
Close hole.
As a preferred embodiment, one end both sides that the connection sheet is used to connect with metallic conduction piece are equipped with groove.
As a preferred embodiment, the vertically extending peak of the block machine is no more than plane where material strip.
As a preferred embodiment, the weld part is circular pad, which is equipped with the concave point that embossing is formed.
As a preferred embodiment, the material strip is equipped with long trough location hole and circular locating openings, each long trough positioning
Hole and circular locating openings are alternatively arranged.
The utility model has clear advantage and advantageous effect compared with prior art, specifically, by above-mentioned technology
Scheme it is found that its mainly due to devising material strip and multiple metallic conduction pieces for being integrally connected to material strip wherein side, name metal
The end of the welding Board position of conductive sheet is provided with block machine, and the vertically extending peak of block machine is put down where being no more than material strip
Face.When assembly, the outer rim of semiconductor chip can be blocked using block machine, keeps semiconductor chip fixed, be convenient for scolding tin, and
The finished product produced, block machine can play the role of protecting semiconductor chip.
More clearly to illustrate the structure feature and effect of the utility model, come below in conjunction with the accompanying drawings with specific embodiment pair
The utility model is described in detail.
Description of the drawings
Fig. 1 is the frame front view of the embodiment of the utility model.
Fig. 2 is the use state diagram of the embodiment of the utility model.
Description of drawing identification：
10, material strip 11, long trough location hole
12, circular locating openings 20, metallic conduction piece
21, welded plate 211, weld part
212, block machine 213, embedded hole
214, groove 22, connection sheet
221, horizontal part 222, bending part
30, semiconductor chip.
Specific implementation mode
It please refers to shown in Fig. 1 and Fig. 2, that show the concrete structures of the preferred embodiment of the utility model, are a kind of
Single formula semiconductor lead frame, including material strip 10, the metallic conduction piece 20 for being connected to the wherein side of material strip 10, the metal are led
Electric piece 20 has multi-disc, and each metallic conduction piece 20 is uniform and asks in a row away from ground setting shape.
Wherein, the metallic conduction piece 20 has the welded plate 21 of square structure, as the anode of semiconductor chip or negative
Pole.Connected by connection sheet 22 between the metallic conduction piece 20 and material strip 10, which is by horizontal part 221 and bending
Portion 222 is constituted, and makes between 20 place plane of metallic conduction piece and the plane of material strip 10 that there are differences in height.
The welded plate 21 is equipped with the weld part 211 of protrusion, the block machine that should extend from the ending vertical of welded plate 21
212,212 vertically extending peak of the block machine is no more than 10 place plane of material strip.When assembly, as shown in Fig. 2, utilizing block machine
212 can block the outer rim of semiconductor chip 30, when using welding manner shown in Fig. 2, upper and lower two panels metallic conduction piece 20
Semiconductor chip is clamped and is limited with block machine 212, keeps semiconductor chip fixed, is convenient for scolding tin, and produce
Finished product, block machine 212 can play the role of protecting semiconductor chip.
The metallic conduction piece 20 and the connecting position of connection sheet 22 are equipped with can be described with the embedded hole 213 of clamping plastic cement
One end both sides that connection sheet 22 is used to connect with metallic conduction piece 20 are equipped with groove 214.Embedded hole 213 herein and groove
214 design can increase the fixing power of product and plastic cement.
The weld part 211 is circular pad, which is equipped with the concave point that embossing is formed, this region is semiconductor core
Piece contact area, the weld strength of semiconductor chip and conductive metal sheet can be effectively increased by increasing embossing, prevent from falling off.The material
Band 10 is equipped with long trough location hole 11 and circular locating openings 12, each long trough location hole 11 and the interval of circular locating openings 12 row
Row.
In conclusion the design focal point of the utility model is, mainly due to devising material strip 10 and multiple integrally connect
It is connected to the metallic conduction piece 20 of the wherein side of material strip 10, the end of 21 position of welded plate of name metallic conduction piece 20 is provided with block machine
212,212 vertically extending peak of the block machine is no more than 10 place plane of material strip.When assembly, it can be kept off using block machine 212
The firmly outer rim of semiconductor chip keeps semiconductor chip fixed, is convenient for scolding tin, and the finished product produced, block machine 212 can rise
To the effect of protection semiconductor chip.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change
Change and modify, is still within the scope of the technical solutions of the present invention.
Claims (7)
1. a kind of single formula semiconductor lead frame, it is characterised in that：Including material strip（10）, be connected to the gold of material strip wherein side
Belong to conductive sheet（20）, welded plate of the metallic conduction piece with square structure（21）, weldering of the welded plate equipped with protrusion
Socket part（211）, it is somebody's turn to do the block machine that extended from the ending vertical of welded plate（212）.
2. a kind of single formula semiconductor lead frame according to claim 1, it is characterised in that：The metallic conduction piece
（20）With material strip（10）Between pass through connection sheet（22）Connect, the connection sheet（22）It is by horizontal part（221）And bending part（222）
It constitutes, makes metallic conduction piece（20）Place plane and material strip（10）Plane between there are differences in height.
3. a kind of single formula semiconductor lead frame according to claim 2, it is characterised in that：The metallic conduction piece
（20）With connection sheet（22）Connecting position be equipped with can be with the embedded hole of clamping plastic cement（213）.
4. a kind of single formula semiconductor lead frame according to claim 2, it is characterised in that：The connection sheet（22）With
In with metallic conduction piece（20）One end both sides to connect are equipped with groove（214）.
5. a kind of single formula semiconductor lead frame according to claim 1, it is characterised in that：The block machine（212）It hangs down
The peak directly extended is no more than material strip（10）Place plane.
6. a kind of single formula semiconductor lead frame according to claim 1, it is characterised in that：The weld part（211）
For circular pad, which is equipped with the concave point that embossing is formed.
7. a kind of single formula semiconductor lead frame according to claim 1, it is characterised in that：The material strip（10）On set
There is long trough location hole（11）And circular locating openings（12）, each long trough location hole（11）And circular locating openings（12）Interval row
Row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721860738.0U CN207624687U (en) | 2017-12-27 | 2017-12-27 | A kind of single formula semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721860738.0U CN207624687U (en) | 2017-12-27 | 2017-12-27 | A kind of single formula semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207624687U true CN207624687U (en) | 2018-07-17 |
Family
ID=62830470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721860738.0U Active CN207624687U (en) | 2017-12-27 | 2017-12-27 | A kind of single formula semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207624687U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023029366A1 (en) * | 2021-09-01 | 2023-03-09 | 广东海德亚科技有限公司 | Shape memory alloy wire welding assembly, shape memory alloy wire welding method, and shape memory alloy wire fixedly-welded product |
-
2017
- 2017-12-27 CN CN201721860738.0U patent/CN207624687U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023029366A1 (en) * | 2021-09-01 | 2023-03-09 | 广东海德亚科技有限公司 | Shape memory alloy wire welding assembly, shape memory alloy wire welding method, and shape memory alloy wire fixedly-welded product |
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