CN101593607A - Improved triangle wedge packaging type silver plated patch inductor - Google Patents
Improved triangle wedge packaging type silver plated patch inductor Download PDFInfo
- Publication number
- CN101593607A CN101593607A CNA2008100619410A CN200810061941A CN101593607A CN 101593607 A CN101593607 A CN 101593607A CN A2008100619410 A CNA2008100619410 A CN A2008100619410A CN 200810061941 A CN200810061941 A CN 200810061941A CN 101593607 A CN101593607 A CN 101593607A
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- China
- Prior art keywords
- triangle wedge
- inductor
- silver plated
- type silver
- packaging type
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Improved triangle wedge packaging type silver plated patch inductor is the power inductor that a kind of triangle wedge is electroplated on four sides, it is characterized in that distribution terminal and pad use side separate, lay respectively at the end face and the bottom surface of product, thus reduced the product height also be more conducive to the bottom well contact with pad.The end face distribution adopts full-automatic heat fusion welding technology, is convenient to automated production.The magnet shielding structure of the anti-electromagnetic interference of the present invention simultaneously also has high power, high magnetic saturation, Low ESR, advantage such as electric current is big.
Description
Technical field
The present invention relates to the processing and the electro-plating method of magnet ring structure.More specifically, relate to and in the magnet ring manufacturing is handled, use triangle to electroplate method with the magnet ring fluting on four sides.
Background technology
Along with the develop rapidly of electronics and information industry, paster electron-like element is adopted in a large number.Chip inductor is exactly one of them.At present in the chip inductor on market, coating is inductor bottom more usually.Therefore, distribution is difficult to control the inductance height dimension later on, also give ensuing be fixed on to work on the pad make troubles.Thereby have influence on quality and efficient in the chip inductor production process.
Summary of the invention
The objective of the invention is: a kind of improved SMT Inductor is provided, and its magnet ring has groove, and there is triangle wedge four sides coating electrode at the diagonal angle.Improve the product efficiency and the quality of SMT Inductor.
Advantage of the present invention is: by can control the height dimension of chip inductor more accurately at inductance end face distribution.Adopted full-automatic heat fusion welding technology to be convenient to automated production, improved production efficiency greatly, reduced cost and fraction defective.
Description of drawings
Fig. 1 is a stereogram of the present invention
Fig. 2 is a vertical view of the present invention
Fig. 3 is an end view of the present invention
Fig. 4 is a upward view of the present invention
Embodiment
As Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, a kind of improved SMT Inductor comprises that magnet ring is 1. upright with magnetic core group 2., and 3. copper cash passes through from magnet ring groove 1., is welded on the 1. positive triangle wedge shape electrode of magnet ring.
Claims (4)
1. an improved SMT Inductor comprises having two triangle wedges electrodeposited coating on four sides on magnet ring 1. 4..
2. improved SMT Inductor according to claim 1 is characterized in that: 1. upright with magnetic core group 2. by magnet ring.
3. improved SMT Inductor according to claim 1 and 2 is characterized in that: magnetic core has groove on 2..
4. according to claim 1,2 or 3 described improved SMT Inductor, it is characterized in that: 3. copper cash passes through from magnet ring groove 1., is welded on the 1. positive triangle electroplated electrode of magnet ring and 4. goes up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100619410A CN101593607A (en) | 2008-05-27 | 2008-05-27 | Improved triangle wedge packaging type silver plated patch inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100619410A CN101593607A (en) | 2008-05-27 | 2008-05-27 | Improved triangle wedge packaging type silver plated patch inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101593607A true CN101593607A (en) | 2009-12-02 |
Family
ID=41408201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100619410A Pending CN101593607A (en) | 2008-05-27 | 2008-05-27 | Improved triangle wedge packaging type silver plated patch inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101593607A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103093938A (en) * | 2011-11-08 | 2013-05-08 | 胜美达集团株式会社 | Magnetic component and method for manufacturing magnetic component |
| CN110148514A (en) * | 2019-06-14 | 2019-08-20 | 深圳市京泉华科技股份有限公司 | The manufacturing method of transformer and transformer |
| CN111584186A (en) * | 2020-05-08 | 2020-08-25 | 兰州空间技术物理研究所 | Annular inductor structure for surface mounting |
-
2008
- 2008-05-27 CN CNA2008100619410A patent/CN101593607A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103093938A (en) * | 2011-11-08 | 2013-05-08 | 胜美达集团株式会社 | Magnetic component and method for manufacturing magnetic component |
| CN103093938B (en) * | 2011-11-08 | 2016-04-27 | 胜美达集团株式会社 | The manufacture method of magnetic part and magnetic part |
| CN110148514A (en) * | 2019-06-14 | 2019-08-20 | 深圳市京泉华科技股份有限公司 | The manufacturing method of transformer and transformer |
| CN111584186A (en) * | 2020-05-08 | 2020-08-25 | 兰州空间技术物理研究所 | Annular inductor structure for surface mounting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Wu Yuanyuan Document name: Notification of Passing Examination on Formalities |
|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Wu Yuanyuan Document name: Notification that Application Deemed to be Withdrawn |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20091202 |