CN105702592B - A kind of COB welding methods and manufacture method - Google Patents
A kind of COB welding methods and manufacture method Download PDFInfo
- Publication number
- CN105702592B CN105702592B CN201610197685.2A CN201610197685A CN105702592B CN 105702592 B CN105702592 B CN 105702592B CN 201610197685 A CN201610197685 A CN 201610197685A CN 105702592 B CN105702592 B CN 105702592B
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- bonding wire
- series arm
- cob
- bank
- attached
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000003466 welding Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000004020 luminiscence type Methods 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
A kind of COB manufacture methods, including manufacture substrate step, die bond step and bonding wire step, bonding wire step：（1）In some LED chips in rods arranged in horizontal line, it is attached to form the first series arm using First Line arc-welding line between adjacent LED chip；（2）Head and the tail between adjacent first series arm are attached to form the second series arm using the second bank bonding wire；（3）In staggered two rows of LED chips, it is attached to form the 3rd series arm using the second bank bonding wire between adjacent LED chip；（4）Head and the tail between second series arm and the 3rd series arm are attached to form the 4th series arm using the second bank bonding wire；（5）It is attached between the positive and negative anodes and pad of 4th series arm using the 3rd bank bonding wire.Since three kinds of bank bonding wires separate independent welding, reduce bonding equipment and replace the frequency of bonding wire craft, so as to improve welding efficiency, the probability that entanglement occurs can also be reduced.
Description
Technical field
The present invention relates to COB technologies, especially a kind of COB welding methods and manufacture method.
Background technology
The manufacturing process of COB generally comprises die bond and the several steps of bonding wire, and traditional COB wire soldering methods are according to LED core
Piece puts in order what is welded, since the arrangement position of LED chip is different with spacing distance, is possible between LED chip
Different bonding wire crafts is needed, so, if carrying out bonding wire according to traditional wire soldering method LED chip all to COB,
Bonding equipment, which needs to change multiple bonding wire craft, could complete bonding wire step.Replacing the time that bonding wire craft is delayed every time can all prolong
The manufacturing time of long COB；In addition, frequently switching between different bonding wires, bonding wire entanglement is be easy to cause.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of COB welding methods and manufacture method, bonding wire are efficient.
In order to solve the above technical problems, one of technical scheme is：A kind of COB wire soldering methods, including following step
Suddenly：
（1）In some LED chips in rods arranged in horizontal line, connected between adjacent LED chip using First Line arc-welding line
Connect to form the first series arm；
（2）Head and the tail between adjacent first series arm are attached to form the second series connection branch using the second bank bonding wire
Road；
（3）In staggered two rows of LED chips, shape is attached using the second bank bonding wire between adjacent LED chip
Into the 3rd series arm；
（4）Head and the tail between second series arm and the 3rd series arm are attached to form using the second bank bonding wire
Four series arms；
（5）It is attached between the positive and negative anodes and pad of 4th series arm using the 3rd bank bonding wire；
The bonding wire of COB is completed by three sets of bonding wire crafts, every suit bonding wire craft completes a kind of welding of bank bonding wire.Due to
Three kinds of bank bonding wires separate independent welding, and every suit technique is continuously finished to be needed to carry out a kind of bank of classification on whole COB
Welding, reduces bonding equipment and replaces the frequency of bonding wire craft, so as to improve welding efficiency, can also reduce the probability that entanglement occurs.
As an improvement, the LED chip is positive cartridge chip.
As an improvement, the die bond direction of the LED chip in adjacent first series arm is on the contrary, so as to multiple first
It can be easy to quick die bond during series arm.
In order to solve the above technical problems, the two of technical scheme are：A kind of COB manufacture methods, including manufacture base
Plate step, die bond step and bonding wire step, the bonding wire step comprise the following steps：
（1）In some LED chips in rods arranged in horizontal line, connected between adjacent LED chip using First Line arc-welding line
Connect to form the first series arm；
（2）It is attached to form the second series connection using the second bank bonding wire between the head and the tail chip of adjacent first series arm
Branch；
（3）In staggered two rows of LED chips, shape is attached using the second bank bonding wire between adjacent LED chip
Into the 3rd series arm；
（4）Head and the tail between second series arm and the 3rd series arm are attached to form using the second bank bonding wire
Four series arms；
（5）It is attached between the positive and negative anodes of 4th series arm and the pad of substrate using the 3rd bank bonding wire；
The bonding wire of COB is completed by three sets of bonding wire crafts, every suit bonding wire craft completes a kind of welding of bank bonding wire.Due to
Three kinds of bank bonding wires separate independent welding, and every suit technique is continuously finished to be needed to carry out a kind of bank of classification on whole COB
Welding, reduces bonding equipment and replaces the frequency of bonding wire craft, so as to improve welding efficiency, can also reduce the probability that entanglement occurs.
As an improvement, the centre position of the substrate is equipped with circular crystal bonding area, it is respectively equipped with just in the both sides of crystal bonding area
Pole pad and negative terminal pad.
As an improvement, positive terminal pad and negative terminal pad are arc-shaped, and set along the edge in die bond region.
As an improvement, in the die bond step, some LED chips are fixed respectively in the symmetrical Liang Geban areas in die bond region
Two luminescence units are formed, the LED chip arrangement of two luminescence units is symmetrical set, so as to cause in whole die bond region
Uniform in light emission.
As an improvement, in the luminescence unit, inline LED chip is wrong close to the centre position in die bond region
Begin to rehearse row two rows of LED chips close to the edge in die bond region.
As an improvement, the LED chip is positive cartridge chip.
As an improvement, the die bond direction of the LED chip in adjacent first series arm is on the contrary, so as to multiple first
It can be easy to quick die bond during series arm.
The caused compared with prior art beneficial effect of the present invention is：
The bonding wire of COB is completed by three sets of bonding wire crafts, every suit bonding wire craft completes a kind of welding of bank bonding wire.Due to
Three kinds of bank bonding wires separate independent welding, and every suit technique is continuously finished to be needed to carry out a kind of bank of classification on whole COB
Welding, reduces bonding equipment and replaces the frequency of bonding wire craft, so as to improve welding efficiency, can also reduce the probability that entanglement occurs.
Brief description of the drawings
Fig. 1 is COB top views.
Fig. 2 is bonding wire craft flow chart.
Embodiment
With reference to Figure of description, the invention will be further described.
A kind of COB manufacture methods, including die bond step and bonding wire step, comprise the following steps：
（1）Die bond；As shown in Figure 1, the centre position of substrate is equipped with circular crystal bonding area, set respectively in the both sides of crystal bonding area
There are positive terminal pad 2 and negative terminal pad 3；The positive terminal pad and negative terminal pad are arc-shaped, and are set along the edge in die bond region；
Fix some LED chips 7 respectively in the symmetrical Liang Geban areas in die bond region and form two luminescence units 1, two luminescence units 1
LED chip 7 arrangement be symmetrical set；In the luminescence unit 1, inline LED chip 7 is in die bond region
Between position, staggered two rows of LED chips 7 are close to the edge in die bond region；The LED chip 7 is positive cartridge chip, adjacent
The die bond direction of LED chip 7 in one series arm is opposite；
（2）Bonding wire；As shown in Fig. 2, specifically include following steps：
（2.1）In some LED chips 7 in rods arranged in horizontal line, between adjacent LED chip 7 using First Line arc-welding line 4 into
Row connection forms the first series arm；
（2.2）It is attached to form second using the second bank bonding wire 5 between the head and the tail chip of adjacent first series arm
Series arm；
（2.3）In staggered two rows of LED chips 7, connected between adjacent LED chip 7 using the second bank bonding wire 5
Connect to form the 3rd series arm；
（2.4）Head and the tail between second series arm and the 3rd series arm are attached shape using the second bank bonding wire 5
Into the 4th series arm；
（3.5）It is attached between the positive and negative anodes of 4th series arm and the pad of substrate using the 3rd bank bonding wire 6.
The second bank bonding wire 5 of the present embodiment and the 3rd bank bonding wire 6 are the bank of i.e. wire length length（Such as wire length
More than the width of twice of chip）, as SQ banks, that is, platform arc is less than across chip scale 50% bank, but the second bank refers to
Connection between chip and chip, the 3rd bank refer to that, for the connection between chip and substrate, First Line arc-welding line 4 is bonding wire
The short bank of length（As wire length is less than or equal to the width of twice of chip）, if QA banks are only with the line of a break
Arc.
The bonding wire of COB is completed by three sets of bonding wire crafts, every suit bonding wire craft completes a kind of welding of bank bonding wire.Due to
Three kinds of bank bonding wires separate independent welding, and every suit technique is continuously finished to be needed to carry out a kind of bank of classification on whole COB
Welding, reduces bonding equipment and replaces the frequency of bonding wire craft, so as to improve welding efficiency, can also reduce the probability that entanglement occurs.
Simultaneously for arrangements of chips on substrate relatively closely in the case of, step（2.2）In, if adjacent first series arm
Head and the tail chip between distance be less than the distance between twice chip, then can be attached using the first bank；Step（2.3）
In, if in staggered two rows of LED chips 7, the distance between less than twice chip of distance, also may be used between adjacent LED chip 7
To be attached using First Line arc-welding line.
Due to simplifying the action of bonding equipment, the run trace of bonding equipment is relatively more regular, it is possible to passes through butt welding
Line machine, which is programmed, realizes full-automatic bonding wire.In wire bonding process is automated, 7 position of LED chip identification skill can be used
Art, the electrode position of accurate definite LED chip 7, so as to improve the quality of automation bonding wire.
Claims (10)
1. a kind of COB wire soldering methods, it is characterised in that comprise the following steps：
（1）In some LED chips in rods arranged in horizontal line, shape is attached using First Line arc-welding line between adjacent LED chip
Into the first series arm；
（2）It is attached to form the second series connection branch using the second bank bonding wire between the head and the tail chip of adjacent first series arm
Road；
（3）In staggered two rows of LED chips, it is attached to form using the second bank bonding wire between adjacent LED chip
Three series arms；
（4）Head and the tail between second series arm and the 3rd series arm are attached to form the 4th string using the second bank bonding wire
Join branch；
（5）It is attached between the positive and negative anodes of 4th series arm and the pad of substrate using the 3rd bank bonding wire；
The bonding wire of COB is completed by three sets of bonding wire crafts, every suit bonding wire craft completes a kind of welding of bank bonding wire.
A kind of 2. COB wire soldering methods according to claim 1, it is characterised in that：The LED chip is positive cartridge chip.
A kind of 3. COB wire soldering methods according to claim 1, it is characterised in that：LED core in adjacent first series arm
The die bond direction of piece is opposite.
4. a kind of COB manufacture methods, including die bond step and bonding wire step, it is characterised in that：The bonding wire step includes following
Step：
（1）In some LED chips in rods arranged in horizontal line, shape is attached using First Line arc-welding line between adjacent LED chip
Into the first series arm；
（2）It is attached to form the second series connection branch using the second bank bonding wire between the head and the tail chip of adjacent first series arm
Road；
（3）In staggered two rows of LED chips, it is attached to form using the second bank bonding wire between adjacent LED chip
Three series arms；
（4）Head and the tail between second series arm and the 3rd series arm are attached to form the 4th string using the second bank bonding wire
Join branch；
（5）It is attached between the positive and negative anodes of 4th series arm and the pad of substrate using the 3rd bank bonding wire；
The bonding wire of COB is completed by three sets of bonding wire crafts, every suit bonding wire craft completes a kind of welding of bank bonding wire.
A kind of 5. COB manufacture methods according to claim 4, it is characterised in that：The centre position of the substrate is equipped with circle
The crystal bonding area of shape, positive terminal pad and negative terminal pad are respectively equipped with the both sides of crystal bonding area.
A kind of 6. COB manufacture methods according to claim 5, it is characterised in that：The positive terminal pad and negative terminal pad are in
It is arc-shaped, and set along the edge in die bond region.
A kind of 7. COB manufacture methods according to claim 4, it is characterised in that：In the die bond step, in die bond region
Some LED chips are fixed in symmetrical Liang Geban areas respectively and form two luminescence units, the LED chip arrangement of two luminescence units
It is symmetrical set.
A kind of 8. COB manufacture methods according to claim 7, it is characterised in that：It is inline in the luminescence unit
LED chip close to the centre position in die bond region, staggered two rows of LED chips are close to the edge in die bond region.
A kind of 9. COB manufacture methods according to claim 4, it is characterised in that：The LED chip is positive cartridge chip.
A kind of 10. COB manufacture methods according to claim 4, it is characterised in that：LED in adjacent first series arm
The die bond direction of chip is opposite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197685.2A CN105702592B (en) | 2016-03-31 | 2016-03-31 | A kind of COB welding methods and manufacture method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197685.2A CN105702592B (en) | 2016-03-31 | 2016-03-31 | A kind of COB welding methods and manufacture method |
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| Publication Number | Publication Date |
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| CN105702592A CN105702592A (en) | 2016-06-22 |
| CN105702592B true CN105702592B (en) | 2018-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610197685.2A Active CN105702592B (en) | 2016-03-31 | 2016-03-31 | A kind of COB welding methods and manufacture method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957950B (en) * | 2016-06-30 | 2019-02-19 | 鸿利智汇集团股份有限公司 | A kind of LED wire soldering method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465429A (en) * | 2014-12-01 | 2015-03-25 | 南通富士通微电子股份有限公司 | Quad flat no-lead packaging piece welding method |
| CN104813457A (en) * | 2012-11-16 | 2015-07-29 | 株式会社新川 | Wire bonding device and wire bonding method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9000470B2 (en) * | 2010-11-22 | 2015-04-07 | Cree, Inc. | Light emitter devices |
| US9029905B2 (en) * | 2012-12-21 | 2015-05-12 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Light emitting diode device |
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- 2016-03-31 CN CN201610197685.2A patent/CN105702592B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104813457A (en) * | 2012-11-16 | 2015-07-29 | 株式会社新川 | Wire bonding device and wire bonding method |
| CN104465429A (en) * | 2014-12-01 | 2015-03-25 | 南通富士通微电子股份有限公司 | Quad flat no-lead packaging piece welding method |
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| CN105702592A (en) | 2016-06-22 |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant before: Guangzhou Hongli Tronic Co., Ltd. |
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