CN105702592A - COB welding method and manufacturing method - Google Patents
COB welding method and manufacturing method Download PDFInfo
- Publication number
- CN105702592A CN105702592A CN201610197685.2A CN201610197685A CN105702592A CN 105702592 A CN105702592 A CN 105702592A CN 201610197685 A CN201610197685 A CN 201610197685A CN 105702592 A CN105702592 A CN 105702592A
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- CN
- China
- Prior art keywords
- bonding wire
- cob
- series arm
- led chip
- bank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003466 welding Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000004020 luminiscence type Methods 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a COB manufacturing method. The COB manufacturing method comprises a substrate manufacturing step, a die bonding step and a wire bonding step, wherein the wire bonding step comprises the following steps: step (1), in a plurality of LED (Light-Emitting Diode) chips which are arranged in an in-line arrangement, connecting adjacent LED chips by first line arc bonding wires to form first series branches; step (2), connecting adjacent first series branches end to end by a second line arc bonding wire to form a second series branch; step (3), in two rows of staggered LED chips, connecting adjacent LED chips by the second line arc bonding wire to form a third series branch; step (4), connecting the second series branches and the third series branch end to end by the second line arc bonding wire to form a fourth series branch; and step (5), connecting positive and negative electrodes and a bonding pad of the fourth series branch by a third line arc bonding wire. Since three line arc bonding wires are welded separately and independently, thus the frequency of replacing a bonding wire process by a wire bonding machine can be reduced, the welding efficiency can be improved and the probability of occurrence of confusions can be reduced.
Description
Technical field
The present invention relates to COB technology, especially one COB welding method and manufacture method。
Background technology
The manufacturing process of COB generally comprises die bond and the several step of bonding wire, traditional COB wire soldering method is to carry out welding according to putting in order of LED chip, owing to the arrangement position of LED chip is different with spacing distance, different bonding wire crafts it is likely to require between LED chip, so, if all of LED chip of COB is carried out bonding wire by wire soldering method traditionally, bonding equipment needs to change repeatedly bonding wire craft just can complete bonding wire step。The time that replacing bonding wire craft is incured loss through delay every time all can extend the manufacturing time of COB；It addition, switching between different bonding wires frequently, it is easy to cause bonding wire entanglement。
Summary of the invention
The technical problem to be solved is to provide a kind of COB welding method and manufacture method, and bonding wire efficiency is high。
For solving above-mentioned technical problem, one of technical scheme is: a kind of COB wire soldering method, comprises the following steps:
(1) some in, in the LED chip of rods arranged in horizontal line, adopting First Line arc-welding line to be attached forming the first series arm between adjacent LED chip；
(2) head and the tail between adjacent first series arm adopt the second bank bonding wire to be attached forming the second series arm；
(3), in two staggered row's LED chips, the second bank bonding wire between adjacent LED chip, is adopted to be attached forming the 3rd series arm；
Head and the tail between (4) second series arms and the 3rd series arm adopt the second bank bonding wire to be attached forming the 4th series arm；
The 3rd bank bonding wire is adopted to be attached between both positive and negative polarity and the pad of (5) the 4th series arms；
Being overlapped bonding wire craft by three and complete the bonding wire of COB, every suit bonding wire craft completes the welding of a kind of bank bonding wire。Due to the separately independent welding of three kinds of bank bonding wires, every suit technique is continuously finished on whole COB needs to carry out the welding of the bank of a kind, reduces bonding equipment and changes the frequency of bonding wire craft, thus improving welding efficiency, it is also possible to reduces the probability that entanglement occurs。
As improvement, described LED chip is positive cartridge chip。
As improvement, the die bond of the LED chip in adjacent first series arm is in opposite direction, thus can be easy to quick die bond when having multiple first series arm。
For solving above-mentioned technical problem, the two of technical scheme are: a kind of COB manufacture method, and including manufacturing substrate step, die bond step and bonding wire step, described bonding wire step comprises the following steps:
(1) some in, in the LED chip of rods arranged in horizontal line, adopting First Line arc-welding line to be attached forming the first series arm between adjacent LED chip；
(2) the second bank bonding wire is adopted to be attached forming the second series arm between the head and the tail chip of adjacent first series arm；
(3), in two staggered row's LED chips, the second bank bonding wire between adjacent LED chip, is adopted to be attached forming the 3rd series arm；
Head and the tail between (4) second series arms and the 3rd series arm adopt the second bank bonding wire to be attached forming the 4th series arm；
The 3rd bank bonding wire is adopted to be attached between both positive and negative polarity and the pad of substrate of (5) the 4th series arms；
Being overlapped bonding wire craft by three and complete the bonding wire of COB, every suit bonding wire craft completes the welding of a kind of bank bonding wire。Due to the separately independent welding of three kinds of bank bonding wires, every suit technique is continuously finished on whole COB needs to carry out the welding of the bank of a kind, reduces bonding equipment and changes the frequency of bonding wire craft, thus improving welding efficiency, it is also possible to reduces the probability that entanglement occurs。
As improvement, the centre position of described substrate is provided with the crystal bonding area of circle, is respectively provided on two sides with positive terminal pad and negative terminal pad in crystal bonding area。
It is circular arc as improvement, positive terminal pad and negative terminal pad, and arranges along the edge in die bond region。
As improvement, in described die bond step, fixing some LED chips respectively and form two luminescence units in the Liang Geban district that die bond region is symmetrical, the LED chip of two luminescence units is arranged and is symmetrical set, it is thus possible to make uniform in light emission in whole die bond region。
As improvement, in described luminescence unit, inline LED chip is near the centre position in die bond region, and two staggered row's LED chips are near the edge in die bond region。
As improvement, described LED chip is positive cartridge chip。
As improvement, the die bond of the LED chip in adjacent first series arm is in opposite direction, thus can be easy to quick die bond when having multiple first series arm。
The present invention is compared with prior art had the benefit that
Being overlapped bonding wire craft by three and complete the bonding wire of COB, every suit bonding wire craft completes the welding of a kind of bank bonding wire。Due to the separately independent welding of three kinds of bank bonding wires, every suit technique is continuously finished on whole COB needs to carry out the welding of the bank of a kind, reduces bonding equipment and changes the frequency of bonding wire craft, thus improving welding efficiency, it is also possible to reduces the probability that entanglement occurs。
Accompanying drawing explanation
Fig. 1 is COB top view。
Fig. 2 is bonding wire craft flow chart。
Detailed description of the invention
Below in conjunction with Figure of description, the invention will be further described。
A kind of COB manufacture method, including die bond step and bonding wire step, comprises the following steps:
(1) die bond；As it is shown in figure 1, the centre position of substrate is provided with the crystal bonding area of circle, it is respectively provided on two sides with positive terminal pad 2 and negative terminal pad 3 in crystal bonding area；Described positive terminal pad and negative terminal pad are circular arc, and arrange along the edge in die bond region；Fixing some LED chips 7 respectively in the Liang Geban district that die bond region is symmetrical and form two luminescence units 1, the LED chip 7 of two luminescence units 1 is arranged and is symmetrical set；In described luminescence unit 1, inline LED chip 7 is near the centre position in die bond region, and two staggered row's LED chips 7 are near the edge in die bond region；Described LED chip 7 is positive cartridge chip, and the die bond of the LED chip 7 in adjacent first series arm is in opposite direction；
(2) bonding wire；As in figure 2 it is shown, specifically include following steps:
(2.1), in some LED chips 7 in rods arranged in horizontal line, First Line arc-welding line 4 between adjacent LED chip 7, is adopted to be attached forming the first series arm；
(2.2) the second bank bonding wire 5 is adopted to be attached forming the second series arm between the head and the tail chip of adjacent first series arm；
(2.3), in two staggered row's LED chips 7, the second bank bonding wire 5 between adjacent LED chip 7, is adopted to be attached forming the 3rd series arm；
Head and the tail between (2.4) second series arms and the 3rd series arm adopt the second bank bonding wire 5 to be attached forming the 4th series arm；
The 3rd bank bonding wire 6 is adopted to be attached between both positive and negative polarity and the pad of substrate of (3.5) the 4th series arms。
The second bank bonding wire 5 of the present embodiment and the 3rd bank bonding wire 6 are the bank (if wire length is more than the width of twice chip) of i.e. wire length length, if SQ bank and platform arc are across the chip scale bank less than 50%, but the second bank refers to the connection between chip and chip, 3rd bank refers to for the connection between chip and substrate, First Line arc-welding line 4 is the bank (if wire length is less than or equal to the width of twice chip) that wire length is short, such as QA bank namely only with the bank of a break。
Being overlapped bonding wire craft by three and complete the bonding wire of COB, every suit bonding wire craft completes the welding of a kind of bank bonding wire。Due to the separately independent welding of three kinds of bank bonding wires, every suit technique is continuously finished on whole COB needs to carry out the welding of the bank of a kind, reduces bonding equipment and changes the frequency of bonding wire craft, thus improving welding efficiency, it is also possible to reduces the probability that entanglement occurs。
Simultaneously for, in the more close situation of arrangements of chips on substrate, in step (2.2), if the spacing of the head and the tail chip of adjacent first series arm is less than the distance between twice chip, then the first bank being adopted to be attached；In step (2.3), if in two staggered row's LED chips 7, the spacing of adjacent LED chip 7 is less than the distance between twice chip, it would however also be possible to employ First Line arc-welding line is attached。
Owing to simplifying the action of bonding equipment, the run trace of bonding equipment is relatively more regular, it is possible to by bonding equipment is programmed realizing the bonding wire of full-automation。In automatization's wire bonding process, it is possible to adopting LED chip 7 location recognition technology, accurately determining the electrode position of LED chip 7, thus improving the quality of automatization's bonding wire。
Claims (10)
1. a COB wire soldering method, it is characterised in that comprise the following steps:
(1) some in, in the LED chip of rods arranged in horizontal line, adopting First Line arc-welding line to be attached forming the first series arm between adjacent LED chip；
(2) the second bank bonding wire is adopted to be attached forming the second series arm between the head and the tail chip of adjacent first series arm；
(3), in two staggered row's LED chips, the second bank bonding wire between adjacent LED chip, is adopted to be attached forming the 3rd series arm；
Head and the tail between (4) second series arms and the 3rd series arm adopt the second bank bonding wire to be attached forming the 4th series arm；
The 3rd bank bonding wire is adopted to be attached between both positive and negative polarity and the pad of substrate of (5) the 4th series arms；
Being overlapped bonding wire craft by three and complete the bonding wire of COB, every suit bonding wire craft completes the welding of a kind of bank bonding wire。
2. a kind of COB wire soldering method according to claim 1, it is characterised in that: described LED chip is positive cartridge chip。
3. a kind of COB wire soldering method according to claim 1, it is characterised in that: the die bond of the LED chip in adjacent first series arm is in opposite direction。
4. a COB manufacture method, including die bond step and bonding wire step, it is characterised in that: described bonding wire step comprises the following steps:
(1) some in, in the LED chip of rods arranged in horizontal line, adopting First Line arc-welding line to be attached forming the first series arm between adjacent LED chip；
(2) the second bank bonding wire is adopted to be attached forming the second series arm between the head and the tail chip of adjacent first series arm；
(3), in two staggered row's LED chips, the second bank bonding wire between adjacent LED chip, is adopted to be attached forming the 3rd series arm；
Head and the tail between (4) second series arms and the 3rd series arm adopt the second bank bonding wire to be attached forming the 4th series arm；
The 3rd bank bonding wire is adopted to be attached between both positive and negative polarity and the pad of substrate of (5) the 4th series arms；
Being overlapped bonding wire craft by three and complete the bonding wire of COB, every suit bonding wire craft completes the welding of a kind of bank bonding wire。
5. a kind of COB manufacture method according to claim 4, it is characterised in that: the centre position of described substrate is provided with the crystal bonding area of circle, is respectively provided on two sides with positive terminal pad and negative terminal pad in crystal bonding area。
6. a kind of COB manufacture method according to claim 5, it is characterised in that: described positive terminal pad and negative terminal pad are circular arc, and arrange along the edge in die bond region。
7. a kind of COB manufacture method according to claim 4, it is characterized in that: in described die bond step, fixing some LED chips respectively in the Liang Geban district that die bond region is symmetrical and form two luminescence units, the LED chip of two luminescence units is arranged and is symmetrical set。
8. a kind of COB manufacture method according to claim 7, it is characterised in that: in described luminescence unit, inline LED chip is near the centre position in die bond region, and two staggered row's LED chips are near the edge in die bond region。
9. a kind of COB manufacture method according to claim 4, it is characterised in that: described LED chip is positive cartridge chip。
10. a kind of COB manufacture method according to claim 4, it is characterised in that: the die bond of the LED chip in adjacent first series arm is in opposite direction。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197685.2A CN105702592B (en) | 2016-03-31 | 2016-03-31 | A kind of COB welding methods and manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197685.2A CN105702592B (en) | 2016-03-31 | 2016-03-31 | A kind of COB welding methods and manufacture method |
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| Publication Number | Publication Date |
|---|---|
| CN105702592A true CN105702592A (en) | 2016-06-22 |
| CN105702592B CN105702592B (en) | 2018-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610197685.2A Active CN105702592B (en) | 2016-03-31 | 2016-03-31 | A kind of COB welding methods and manufacture method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957950A (en) * | 2016-06-30 | 2016-09-21 | 广州市鸿利光电股份有限公司 | LED wire bonding method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140217433A1 (en) * | 2010-11-22 | 2014-08-07 | Cree, Inc. | Light emitter devices and methods for light emitting diode (led) chips |
| US20140291706A1 (en) * | 2012-12-21 | 2014-10-02 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Light emitting diode device |
| CN104465429A (en) * | 2014-12-01 | 2015-03-25 | 南通富士通微电子股份有限公司 | Quad flat no-lead packaging piece welding method |
| CN104813457A (en) * | 2012-11-16 | 2015-07-29 | 株式会社新川 | Wire bonding device and wire bonding method |
-
2016
- 2016-03-31 CN CN201610197685.2A patent/CN105702592B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140217433A1 (en) * | 2010-11-22 | 2014-08-07 | Cree, Inc. | Light emitter devices and methods for light emitting diode (led) chips |
| CN104813457A (en) * | 2012-11-16 | 2015-07-29 | 株式会社新川 | Wire bonding device and wire bonding method |
| US20140291706A1 (en) * | 2012-12-21 | 2014-10-02 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Light emitting diode device |
| CN104465429A (en) * | 2014-12-01 | 2015-03-25 | 南通富士通微电子股份有限公司 | Quad flat no-lead packaging piece welding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957950A (en) * | 2016-06-30 | 2016-09-21 | 广州市鸿利光电股份有限公司 | LED wire bonding method |
| CN105957950B (en) * | 2016-06-30 | 2019-02-19 | 鸿利智汇集团股份有限公司 | A kind of LED wire soldering method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105702592B (en) | 2018-05-08 |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant before: Guangzhou Hongli Tronic Co., Ltd. |
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