CN218873692U - Mould is used in carborundum chip welding solder processing - Google Patents

Mould is used in carborundum chip welding solder processing Download PDF

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Publication number
CN218873692U
CN218873692U CN202223131133.1U CN202223131133U CN218873692U CN 218873692 U CN218873692 U CN 218873692U CN 202223131133 U CN202223131133 U CN 202223131133U CN 218873692 U CN218873692 U CN 218873692U
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water
cooling
mould
cooling water
integrally formed
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CN202223131133.1U
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Chinese (zh)
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袁圆
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Wuxi Nanda Electronic Solder Co ltd
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Wuxi Nanda Electronic Solder Co ltd
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Abstract

The utility model discloses a mould is used in processing of silicon carbide chip welding solder relates to mould technical field, for solving current mould and needing to slowly cool off along with the room temperature at the in-process cooling of using, refrigerated time cycle is longer, causes the problem that influences the efficiency of mould processing. The hydraulic cylinder is arranged below the cooling water pool, an extension outer frame is arranged on the outer wall of one side of the cooling water pool, an end surface groove and a water suction pump are arranged on the outer wall of one side of the extension outer frame, and the end surface groove and the extension outer frame are integrally formed; further comprising: the cylinder piston rod, it sets up the cooling pond, cylinder piston rod and hydraulic cylinder integrated into one piece set up, and cylinder piston rod and the bottom mechanical seal in cooling pond are connected, and the top of cylinder piston rod installs and bears a platform, and the upper end that bears a platform is provided with the mould and puts the seat, and the mould is put the seat and is born a platform integrated into one piece setting.

Description

Mould is used in carborundum chip welding solder processing
Technical Field
The utility model relates to the technical field of molds, specifically a silicon carbide chip is mould for welding solder processing.
Background
Most of welding solders for silicon carbide chips are lead-free solders, the lead-free solders mean that the chemical components of the solders do not contain lead, the most used lead-free solders are tin-silver-copper lead-free solders, and the most used lead-free solders are considered to be the best choice for replacing tin-lead solders by the industry, and the solders need to be processed into shapes which are in line with the appearance outline of the chip by means of a mold before the silicon carbide chips are welded.
For example, application numbers are: 202010200960.8 (mold for welding silicon carbide chip with solder), which is provided with multiple sets of wing plate grooves and web plate grooves; wherein, multiunit pterygoid lamina recess has different length respectively, the middle part and the web recess of pterygoid lamina recess communicate with each other, form the positioning groove that can process multiple size shaped steel, positioning groove's shape and the multiple shaped steel shape phase-match of treating processing, the length of pterygoid lamina recess shortens along web recess outside-in gradually, the width of pterygoid lamina recess and web recess is greater than and treats the thickness of welded steel plate, the tight mechanism in top of steel plate top at web recess lateral wall is installed to the lateral wall of web recess, the tight mechanism in top includes one or more bolt.
The mould is required to be slowly cooled along with the room temperature during the cooling and cooling process, the cooling time period is long, and the mould processing efficiency is affected, so that the mould for processing the silicon carbide chip welding solder is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carborundum chip mould for welding solder processing to solve the in-process cooling needs of using of the current mould that proposes in the above-mentioned background and slowly cool off along with the room temperature, refrigerated time cycle is longer, causes the problem of the efficiency of influence mould processing.
In order to achieve the above purpose, the utility model provides a following technical scheme: a die for processing welding solders of silicon carbide chips comprises a cooling water tank, a hydraulic cylinder is arranged below the cooling water tank, an extension outer frame is arranged on the outer wall of one side of the cooling water tank, an end surface groove and a water pump are arranged on the outer wall of one side of the extension outer frame, and the end surface groove and the extension outer frame are integrally formed;
further comprising:
the cylinder piston rod is arranged in the cooling water tank, the cylinder piston rod and the hydraulic cylinder are integrally formed, the cylinder piston rod is mechanically and hermetically connected with the bottom of the cooling water tank, a bearing support table is mounted at the top of the cylinder piston rod, a mold placing seat is arranged at the upper end of the bearing support table, and the mold placing seat and the bearing support table are integrally formed;
the processing template is arranged inside the mold placing seat, the processing template is fixedly connected with the mold placing seat through screws, a corresponding die groove is formed inside the processing template, and the corresponding die groove and the processing template are integrally formed;
the water outlet and the water inlet are arranged on the outer wall of the cooling water pool, and two ends of the water outlet and two ends of the water inlet are respectively communicated with the inside of the cooling water pool and the inside of the extension outer frame;
the cold water pipe is arranged in the extension outer frame, a water pump connector and a water injection connector are respectively arranged at two ends of the cold water pipe, the water pump connector and the water injection connector are both integrally formed with the cold water pipe, and a blower is arranged at the rear end of the cold water pipe.
Preferably, the outer wall around the processing template is provided with an outer edge plate, the outer edge plate and the processing template are integrally formed, the upper end of the outer edge plate is provided with a lifting handle, and the lifting handle and the outer edge plate are integrally formed.
Preferably, the outer wall of the cold water pipe is provided with an integrated winding piece, and the integrated winding piece and the cold water pipe are integrally formed.
Preferably, the water pump connector and the water injection connector are respectively connected with the water outlet end and the water inlet of the water suction pump in a sealing mode.
Preferably, a temperature sensor is arranged on the front end face of the cooling water tank, and the sensing end of the temperature sensor is positioned inside the cooling water tank.
Preferably, the water inlet end of the water suction pump is connected with the water outlet in a sealing mode.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a fill into the inside that corresponds the die cavity respectively with molten state's leadless solder, then drive the cylinder piston rod shrink through hydraulic cylinder, and then drive the mould and put the seat and immerse the cooling water of cooling pond inside, thereby make the cooling water carry out quick cooling to the processing template and the leadless solder that corresponds the inside filling of die cavity, after the cooling, the cylinder piston rod return, then the pulling is carried and is drawn the processing template and take off, and take out every shaping leadless solder that corresponds the die cavity inside, reach the purpose of high efficiency processing, it needs slowly to cool off along with the room temperature to have overcome current mould at the in-process cooling of using, refrigerated time cycle is longer, cause the problem of the efficiency of influence mould processing.
2. The temperature sensor monitors the water temperature inside the cooling water pool in real time, when the water temperature is higher than the room temperature, the water suction pump is started to pump out cooling water, then the cooling water is injected into the cooling water pool again after the water is guided through the cold water pipe, air cooling treatment is carried out on the water by the opened blower when the water is guided through the cold water pipe, the temperature is reduced to be lower than the room temperature, and the durability of cooling the die is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the silicon carbide chip soldering flux processing mold of the present invention;
FIG. 2 is a schematic view of the internal structure of the mold placing base of the present invention;
FIG. 3 is a schematic view of the internal structure of the cooling water pool of the present invention;
fig. 4 is a schematic view of the internal structure of the extended outer frame of the present invention;
in the figure: 1. a cooling water pool; 2. a temperature sensor; 3. a hydraulic cylinder; 4. extending the outer frame; 5. an end face groove; 6. a water pump; 7. a cylinder piston rod; 8. a bearing support platform; 9. a mould placing seat; 10. processing a template; 11. corresponding to the die cavity; 12. an outer edge plate; 13. lifting a handle; 14. a water outlet; 15. a water inlet; 16. a cold water pipe; 17. a water pump joint; 18. integrally winding the sheet; 19. a blower; 20. a water injection joint.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, the present invention provides an embodiment: a die for welding and welding a solder on a silicon carbide chip comprises a cooling water pool 1, wherein a hydraulic cylinder 3 is arranged below the cooling water pool 1, an extension outer frame 4 is arranged on the outer wall of one side of the cooling water pool 1, an end surface groove 5 and a water suction pump 6 are arranged on the outer wall of one side of the extension outer frame 4, and the end surface groove 5 and the extension outer frame 4 are integrally formed;
further comprising:
the cylinder piston rod 7 is arranged in the cooling water pool 1, the cylinder piston rod 7 and the hydraulic cylinder 3 are integrally formed, the cylinder piston rod 7 is in mechanical sealing connection with the bottom of the cooling water pool 1, a bearing support table 8 is installed at the top of the cylinder piston rod 7, a mold placing seat 9 is arranged at the upper end of the bearing support table 8, and the mold placing seat 9 and the bearing support table 8 are integrally formed;
the processing template 10 is installed inside the mold placing seat 9, the processing template 10 is fixedly connected with the mold placing seat 9 through screws, a corresponding die groove 11 is formed inside the processing template 10, and the corresponding die groove 11 and the processing template 10 are integrally formed;
the water outlet 14 and the water inlet 15 are arranged on the outer wall of the cooling water pool 1, and two ends of the water outlet 14 and the water inlet 15 are respectively communicated with the inside of the cooling water pool 1 and the inside of the extension outer frame 4;
and a cold water pipe 16 disposed inside the extension outer frame 4, wherein a water pump connector 17 and a water injection connector 20 are respectively disposed at two ends of the cold water pipe 16, the water pump connector 17 and the water injection connector 20 are integrally formed with the cold water pipe 16, and a blower 19 is disposed at a rear end of the cold water pipe 16.
Referring to fig. 2, an outer edge plate 12 is disposed on the peripheral outer wall of the processing template 10, the outer edge plate 12 and the processing template 10 are integrally formed, a lifting handle 13 is disposed at the upper end of the outer edge plate 12, the lifting handle 13 and the outer edge plate 12 are integrally formed, the outer edge plate 12 disposed on the peripheral outer wall of the processing template 10 plays a role of bearing the lifting handle 13 at the outer edge, and the lifting handle 13 disposed at the upper end of the outer edge plate 12 plays a role of facilitating the lifting and taking out of the processing template 10.
Referring to fig. 4, an integrated winding sheet 18 is disposed on an outer wall of the cold water pipe 16, the integrated winding sheet 18 and the cold water pipe 16 are integrally formed, and the integrated winding sheet 18 disposed on the outer wall of the cold water pipe 16 increases a contact area between water and air cooling.
Referring to fig. 1 and 4, the water pump connector 17 and the water injection connector 20 are respectively connected to the water outlet end and the water inlet 15 of the water pump 6 in a sealing manner, so as to facilitate the flow guiding of the cooling water by the cold water pipe 16.
Referring to fig. 1, a temperature sensor 2 is disposed on a front end surface of a cooling water pool 1, a sensing end of the temperature sensor 2 is located inside the cooling water pool 1, and the temperature sensor 2 disposed on the front end surface of the cooling water pool 1 plays a role in detecting the water temperature inside the cooling water pool 1 in real time.
Referring to fig. 1 and 3, the water inlet end of the water pump 6 is hermetically connected to the water outlet 14.
The working principle is as follows: when the mould is used, the processing template 10 is installed inside the mould placing seat 9, then the lead-free solder in a molten state is filled into the corresponding mould grooves 11 respectively, then the hydraulic cylinder 3 drives the cylinder piston rod 7 to contract, and further the mould placing seat 9 is driven to sink into the cooling water inside the cooling water tank 1, so that the cooling water can rapidly cool the lead-free solder filled in the processing template 10 and the corresponding mould grooves 11, after cooling, the cylinder piston rod 7 returns to the original position, then the lifting handle 13 is pulled to take the processing template 10 down, and the formed lead-free solder inside each corresponding mould groove 11 is taken out, so that the purpose of high-efficiency processing is achieved, the temperature sensor 2 monitors the water temperature inside the cooling water tank 1 in real time, when the water temperature is higher than the room temperature, the water suction pump 6 is started to pump out the cooling water, then the cooling water is injected back into the cooling water tank 1 after being guided by the cold water pipe 16, air cooling treatment is carried out by the air blower 19 started when the water is guided in the cold water pipe 16, the cold water is lower than the room temperature, the cooling durability of the mould is improved, and the silicon carbide chip welding operation is completed.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. A die for welding and welding a solder on a silicon carbide chip comprises a cooling water tank (1), wherein a hydraulic cylinder (3) is arranged below the cooling water tank (1), an extension outer frame (4) is arranged on the outer wall of one side of the cooling water tank (1), an end surface groove (5) and a water suction pump (6) are arranged on the outer wall of one side of the extension outer frame (4), and the end surface groove (5) and the extension outer frame (4) are integrally formed;
the method is characterized in that: further comprising:
the cooling water tank comprises a cylinder piston rod (7) which is arranged in the cooling water tank (1), the cylinder piston rod (7) and a hydraulic cylinder (3) are integrally formed, the cylinder piston rod (7) is in mechanical sealing connection with the bottom of the cooling water tank (1), a bearing support table (8) is installed at the top of the cylinder piston rod (7), a mold placing seat (9) is arranged at the upper end of the bearing support table (8), and the mold placing seat (9) and the bearing support table (8) are integrally formed;
the processing template (10) is installed inside the mold placing seat (9), the processing template (10) is fixedly connected with the mold placing seat (9) through screws, a corresponding die groove (11) is formed inside the processing template (10), and the corresponding die groove (11) and the processing template (10) are integrally formed;
the water outlet (14) and the water inlet (15) are arranged on the outer wall of the cooling water pool (1), and two ends of the water outlet (14) and the water inlet (15) are respectively communicated with the inside of the cooling water pool (1) and the inside of the extension outer frame (4);
the cold water pipe (16) is arranged in the extension outer frame (4), two ends of the cold water pipe (16) are respectively provided with a water pump connector (17) and a water injection connector (20), the water pump connector (17) and the water injection connector (20) are both arranged in an integrated mode with the cold water pipe (16), and a blower (19) is arranged at the rear end of the cold water pipe (16).
2. The die for silicon carbide chip soldering solder according to claim 1, wherein: the processing mould plate is characterized in that outer edge plates (12) are arranged on the peripheral outer walls of the processing mould plate (10), the outer edge plates (12) and the processing mould plate (10) are integrally formed, a lifting handle (13) is arranged at the upper end of each outer edge plate (12), and the lifting handle (13) and the outer edge plates (12) are integrally formed.
3. The die for silicon carbide chip soldering solder according to claim 1, wherein: an integrated winding sheet (18) is arranged on the outer wall of the cold water pipe (16), and the integrated winding sheet (18) and the cold water pipe (16) are integrally formed.
4. The die for silicon carbide chip soldering solder according to claim 1, wherein: the water pump connector (17) and the water injection connector (20) are respectively connected with the water outlet end and the water inlet (15) of the water suction pump (6) in a sealing mode.
5. The die for silicon carbide chip soldering solder according to claim 1, wherein: be provided with temperature sensor (2) on the preceding terminal surface in cooling pond (1), the response end of temperature sensor (2) is located the inside in cooling pond (1).
6. The die for silicon carbide chip soldering solder according to claim 1, wherein: the water inlet end of the water suction pump (6) is hermetically connected with the water outlet (14).
CN202223131133.1U 2022-11-24 2022-11-24 Mould is used in carborundum chip welding solder processing Active CN218873692U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223131133.1U CN218873692U (en) 2022-11-24 2022-11-24 Mould is used in carborundum chip welding solder processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223131133.1U CN218873692U (en) 2022-11-24 2022-11-24 Mould is used in carborundum chip welding solder processing

Publications (1)

Publication Number Publication Date
CN218873692U true CN218873692U (en) 2023-04-18

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ID=85950004

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223131133.1U Active CN218873692U (en) 2022-11-24 2022-11-24 Mould is used in carborundum chip welding solder processing

Country Status (1)

Country Link
CN (1) CN218873692U (en)

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