CN211669232U - High-power laser bare chip test fixture - Google Patents
High-power laser bare chip test fixture Download PDFInfo
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- CN211669232U CN211669232U CN201922134473.1U CN201922134473U CN211669232U CN 211669232 U CN211669232 U CN 211669232U CN 201922134473 U CN201922134473 U CN 201922134473U CN 211669232 U CN211669232 U CN 211669232U
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Abstract
The utility model provides a bare chip test fixture of a high-power laser, which comprises a chip, a base, a turntable, a first adjusting frame, a second adjusting frame, a coupling lens and a power supply, wherein the turntable, the first adjusting frame, the second adjusting frame and the power supply are all arranged on the base; the rotary table is rotatably connected with the base, a plurality of blocking parts are arranged at the position, close to the edge, of the rotary table, the chip is placed on the upper surface of the rotary table, the negative electrode of the chip is in contact with the upper surface of the rotary table, and the side surface of the chip is abutted against the side surface of the blocking part; one end of the first adjusting frame, which is far away from the base, is propped against the positive electrode of the chip; one end of the second adjusting frame, which is far away from the base, is provided with a coupling lens, and the coupling lens is aligned to the light-emitting part of the chip; the rotary table and the first adjusting frame are both electrically connected with the power supply. The utility model discloses a stop part on the revolving stage prescribes a limit to the position of laser instrument chip, prevents that the chip from dropping to the opening that makes its light that sends can pass stop part reachs coupling lens, the follow-up detection step of being convenient for.
Description
Technical Field
The utility model relates to a laser equipment technical field especially relates to a naked chip test fixture of high-power laser.
Background
The high-power semiconductor laser has high reliability and high stability, is widely applied to the fields of optical storage, optical communication, national defense, industry, medical treatment and the like, and has the advantages of 635-1653 nm of output laser wavelength and large power adjustable range. In most application environments, the reliability of high power lasers is a determining factor, and is directly related to the quality of the laser.
Testing performance parameters of a laser chip is an important basis for judging the quality of the laser chip, and parameters such as output power, threshold input current and working voltage of the chip need to be tested. Because the laser chip is extremely small, the positioning of the bare chip is very inconvenient during testing, the existing testing method is to mount the bare chip on the transition heat sink by a low-melting-point eutectic soldering method and then test, if the bare chip is abnormal, both the chip and the transition heat sink are scrapped, and the testing efficiency is not ideal.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a can carry out prepositioning high-power laser instrument bare chip test fixture to laser instrument bare chip.
The technical scheme of the utility model is realized like this: the utility model provides a high-power laser bare chip test fixture, which comprises a chip (1), wherein a negative electrode is arranged on the end surface of one end of the chip (1), a positive electrode is arranged on the end surface of the other end of the chip (1), and a light-emitting part is arranged on the side surface of the chip (1); the device is characterized by further comprising a base (2), a rotary table (3), a first adjusting frame (4), a second adjusting frame (5), a coupling lens (6) and a power supply (7), wherein the rotary table (3), the first adjusting frame (4), the second adjusting frame (5) and the power supply (7) are all arranged on the base (2); the rotary table (3) is rotatably connected with the base (2), a plurality of blocking parts (31) are arranged at the position, close to the edge, of the rotary table (3), the chip (1) is placed on the upper surface of the rotary table (3), the negative electrode of the chip (1) is in contact with the upper surface of the rotary table (3), and the side surface of the chip (1) is abutted to the side surface of each blocking part (31); one end of the first adjusting frame (4) far away from the base (2) is propped against the positive electrode of the chip (1); one end of the second adjusting frame (5) far away from the base (2) is provided with a coupling lens (6), and the coupling lens (6) is aligned with the light emergent part of the chip (1); the rotary table (3) and the first adjusting frame (4) are both electrically connected with a power supply (7).
On the basis of the technical scheme, preferably, the blocking parts (31) are two oppositely arranged baffle plates, and the opening of one end of the blocking part (31) close to the center of the rotary table (3) is larger than the opening of the other end of the blocking part.
On the basis of the technical scheme, preferably, the first adjusting frame (4) comprises a first cantilever (41) and a probe (42), the first cantilever (41) is arranged at the top of the rotary table (3), and the first cantilever (41) is arranged in parallel with the base (2); one end of the first cantilever (41) close to the coupling lens (6) is provided with a probe (42), the probe (42) is fixedly connected with the first cantilever (41), and the probe (42) extends downwards along the vertical direction.
Further preferably, the first adjusting frame (4) further comprises a first X-axis adjusting mechanism (43), a Y-axis adjusting mechanism (44) and a Z-axis adjusting mechanism (45); the first X-axis adjusting mechanism (43) comprises a first X-axis lead screw (431) and a first X-axis sliding table (432), the first X-axis lead screw (431) is fixedly arranged on the base (2), the top of the first X-axis lead screw (431) is provided with the first X-axis sliding table (432), and the first X-axis sliding table (432) is in rotating or sliding connection with the first X-axis lead screw (431); wherein the extending direction of the base (2) is taken as an X axis, the width direction of the base (2) is taken as a Y axis, and the height direction of the base (2) is taken as a Z axis;
a Y-axis adjusting mechanism (44) is arranged on the first X-axis sliding table (432), the Y-axis adjusting mechanism (44) comprises a Y-axis lead screw (441) and a Y-axis sliding table (442), the Y-axis lead screw (441) is fixedly connected with the X-axis sliding table (432), and the Y-axis sliding table (442) is arranged at the top of the Y-axis lead screw (441); the Y-axis sliding table (442) is connected with a Y-axis lead screw (441) in a rotating or sliding manner;
a Z-axis adjusting mechanism (45) is arranged on the Y-axis sliding table (442), the Z-axis adjusting mechanism (45) comprises a Z-axis lead screw (451) and a Z-axis sliding table (452), the Z-axis lead screw (451) is vertically arranged at the top of the Y-axis sliding table (442), the Z-axis sliding table (452) is arranged on the side surface of the Z-axis lead screw (451), and the Z-axis sliding table (452) is in rotating or sliding connection with the Z-axis lead screw (451); the first cantilever (41) is fixedly arranged on the Z-axis sliding table (452).
Further preferably, the probe (42) comprises a cylinder (421), a needle (422) and a return spring (423), the cylinder (421) is fixedly connected with the first cantilever (41), the needle (422) is embedded in the cylinder (421), the needle (422) is slidably connected with the cylinder (421), one end of the needle (422) penetrates through the cylinder (421) to extend outwards, and the other end of the needle (422) is fixedly connected with the cylinder (421) through the return spring (423).
Further preferably, the second adjusting frame (5) comprises a second X-axis adjusting mechanism (51), the second X-axis adjusting mechanism (51) comprises a second X-axis lead screw (511) and a second X-axis sliding table (512), the second X-axis lead screw (511) is fixedly connected with the base (2), the second X-axis sliding table (512) is arranged at the top of the second X-axis lead screw (511), the second X-axis sliding table (512) is in rotating or sliding connection with the second X-axis lead screw (511), a second cantilever (52) is fixedly arranged on the second X-axis sliding table (512), and the coupling lens (6) is arranged at one end, close to the turntable (3), of the second cantilever (52).
Further preferably, a central axis of the coupling lens (6) is disposed orthogonal to a central axis of the turntable (3).
On the basis of the technical scheme, preferably, the rotary table (3) further comprises a semiconductor refrigerating sheet (32), the cold end of the semiconductor refrigerating sheet (32) is fixedly connected with the bottom of the rotary table (3), and the hot end of the semiconductor refrigerating sheet (32) is fixedly provided with a radiator (33); the semiconductor refrigerating sheet (32) is electrically connected with the power supply (7).
Further preferably, the semiconductor refrigeration device further comprises a motor (34), a temperature sensor (35) and a controller (36), wherein the motor (34) is fixedly connected with the base (2), an output shaft of the motor (34) is fixedly connected with the rotary table (3), the semiconductor refrigeration piece (32) is further provided with the temperature sensor (35), and the motor (34) and the temperature sensor (35) are both electrically connected with the controller (36).
The utility model provides a pair of naked chip test fixture of high-power laser instrument for prior art, has following beneficial effect:
(1) the utility model limits the position of the laser chip through the blocking part on the turntable, prevents the chip from falling off, and enables the light emitted by the chip to pass through the opening of the blocking part to reach the coupling lens, thereby facilitating the subsequent detection step;
(2) the light-emitting part of the chip and the extension line of the central shaft of the coupling lens both penetrate through the central shaft of the turntable, so that the process of adjusting the chip to align the center of the coupling lens is more convenient;
(3) the first adjusting frame can drive the first cantilever and the probe to be finely adjusted, so that the probe can be positioned at the anode of the chip, and the spring is arranged in the probe to prevent the chip from being crushed;
(4) the second adjusting frame can adjust the X axial position of the coupling lens and adjust the focal length of the coupling lens;
(5) the semiconductor refrigerating sheet can stabilize the temperature of the rotary table and prevent the output wavelength from changing due to heating of the chip when the chip is electrified.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a perspective view of a bare chip test fixture for high power laser of the present invention;
fig. 2 is a perspective view of the combination state of the chip, the turntable, the first adjusting frame, the second adjusting frame and the coupling lens of the bare chip testing fixture for high power laser according to the present invention;
FIG. 3 is a top view of FIG. 2;
fig. 4 is a perspective view of a first adjusting frame of the bare chip testing fixture for high power laser according to the present invention;
fig. 5 is a perspective view of a turntable of a high power laser bare chip test fixture of the present invention;
FIG. 6 is a right side view in half section of FIG. 5;
FIG. 7 is a top view of FIG. 5;
fig. 8 is a perspective view of a second adjusting frame of the bare chip testing fixture for high power laser according to the present invention;
fig. 9 is a front view of the probe of the bare chip test fixture for high power laser according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
As shown in fig. 1 combined with fig. 2 and fig. 3, the utility model provides a bare chip test fixture for high-power laser, which comprises a chip 1, a base 2, a turntable 3, a first adjusting frame 4, a second adjusting frame 5, a coupling lens 6 and a power supply 7, wherein a negative electrode is arranged on the end face of one end of the chip 1, a positive electrode is arranged on the end face of the other end of the chip 1, and a light-emitting part is arranged on the side face of the chip 1; the rotary table 3, the first adjusting frame 4, the second adjusting frame 5 and the power supply 7 are all arranged on the upper surface of the base 2; the rotary table 3 is rotatably connected with the base 2, a plurality of blocking parts 31 are arranged at the position, close to the edge, of the rotary table 3, the chip 1 is placed on the rotary table 3, the negative electrode of the chip 1 is in contact with the upper surface of the rotary table 3, and the side surface of the chip 1 is abutted against the side surface of the blocking part 31; one end of the first adjusting frame 4, which is far away from the base 2, is propped against the anode of the chip 1; one end of the second adjusting frame 5, which is far away from the base 2, is provided with a coupling lens 6, and the coupling lens 6 is aligned with the light emergent part of the chip 1; the rotary table 3 and the first adjusting frame 4 are both electrically connected with a power supply 7. The power supply 7 is respectively communicated with the anode and the cathode of the chip 1 through the first adjusting frame 4 and the rotary table 3, so that the chip 1 can be electrified to work. The light emitted by the light-emitting portion of the chip 1 can now enter the coupling lens 6. The stopper 31 can define the position of the chip 1 on the turntable 3, preventing the chip 1 from falling. The blocking portion 31 also enables light emitted from the light-emitting portion of the chip 1 to enter the coupling lens 6 through the blocking portion 31. When the light emergent portion faces the coupling lens 6, the center line of the light emergent portion coincides with the center line of the coupling lens 6. The coupling lens 6 is externally connected with a spectrometer, so that the parameters of the laser chip can be measured.
As shown in fig. 6, the blocking portion 31 is two opposite blocking plates, and an opening of one end of the blocking portion 31 near the center of the turntable 3 is larger than an opening of the other end thereof. That is, when the chip 1 is placed into the blocking portion 31, the chip 1 is placed from the end close to the center of the turntable 3 until the side surface of the chip 1 abuts against the end of the blocking portion 31 far from the center of the turntable 3. The blocking portion 31 does not block the normal light emission of the light emitting portion.
As shown in fig. 2 and fig. 5, the first adjustment frame 4 includes a first suspension arm 41 and a probe 42, the first suspension arm 41 is disposed on the top of the turntable 3, and the first suspension arm 41 is disposed parallel to the base 2; one end of the first cantilever 41 close to the coupling lens 6 is provided with a probe 42, the probe 42 is fixedly connected with the first cantilever 41, and the probe 42 extends downwards along the vertical direction. The first cantilever 41 fixes the probe 42 directly above the stopper 31, and the probe 42 is brought into contact with the positive electrode of the chip to energize the chip 1. The first cantilever 41 and/or the probe 42 may be generally in communication with the power source 7, with the other components being non-conductive. The probe 42 presses the chip 1 on the surface of the turntable 3, and can also play a role in limiting.
In addition, in order to adapt to the detection of chips 1 with different specifications and facilitate the fine adjustment of the position of the probe 42, as shown in fig. 4, a first X-axis adjusting mechanism 43, a Y-axis adjusting mechanism 44 and a Z-axis adjusting mechanism 45 are further arranged on the first adjusting frame 4; the first X-axis adjusting mechanism 43 includes a first X-axis lead screw 431 and a first X-axis sliding table 432, the first X-axis lead screw 431 is fixedly disposed on the base 2, the top of the first X-axis lead screw 431 is provided with the first X-axis sliding table 432, and the first X-axis sliding table 432 is rotatably or slidably connected with the first X-axis lead screw 431; wherein the extending direction of the base 2 is taken as an X axis, the width direction of the base 2 is taken as a Y axis, and the height direction of the base 2 is taken as a Z axis;
a Y-axis adjusting mechanism 44 is arranged on the first X-axis sliding table 432, the Y-axis adjusting mechanism 44 comprises a Y-axis lead screw 441 and a Y-axis sliding table 442, the Y-axis lead screw 441 is fixedly connected with the X-axis sliding table 432, and the Y-axis sliding table 442 is arranged at the top of the Y-axis lead screw 441; the Y-axis sliding table 442 is rotatably or slidably connected to a Y-axis lead screw 441;
a Z-axis adjusting mechanism 45 is arranged on the Y-axis sliding table 442, the Z-axis adjusting mechanism 45 comprises a Z-axis lead screw 451 and a Z-axis sliding table 452, the Z-axis lead screw 451 is vertically arranged at the top of the Y-axis sliding table 442, the Z-axis sliding table 452 is arranged on the side surface of the Z-axis lead screw 451, and the Z-axis sliding table 452 is rotatably or slidably connected with the Z-axis lead screw 451; the first arm 41 is fixedly provided on the Z-axis slide table 452. The first X-axis adjusting mechanism 43, the Y-axis adjusting mechanism 44, and the Z-axis adjusting mechanism 45 can precisely adjust and position-lock the positions of the first cantilever 41 and the probe 42, so that frequent adjustment is not required when testing the same type of chip 1. The first X-axis adjustment mechanism 43, the Y-axis adjustment mechanism 44, and the Z-axis adjustment mechanism 45 may also be implemented using a commercially available integrated multi-dimensional adjustment platform.
As shown in fig. 9, in order to prevent the probes 42 from crushing the chip 1, the probes 42 are of an elastic structure. The probe 42 includes barrel 421, syringe needle 422 and reset spring 423, barrel 421 and first cantilever 41 fixed connection, the embedded syringe needle 422 that is equipped with of barrel 421, syringe needle 422 and barrel 421 sliding connection, the outside extension of barrel 421 is passed to one end of syringe needle 422, the other end of syringe needle 422 passes through reset spring 423 and barrel 421 fixed connection. The needle 422 retracts after abutting against the positive electrode of the chip 1, and can also adapt to chips 1 with different thicknesses.
As shown in fig. 8, the second adjusting frame 5 includes a second X-axis adjusting mechanism 51, the second X-axis adjusting mechanism 51 includes a second X-axis lead screw 511 and a second X-axis sliding table 512, the second X-axis lead screw 511 is fixedly connected to the base 2, the second X-axis sliding table 512 is disposed on the top of the second X-axis lead screw 511, the second X-axis sliding table 512 rotates or slides with the second X-axis lead screw 511, a second cantilever 52 is fixedly disposed on the second X-axis sliding table 512, and the coupling lens 6 is disposed at one end of the second cantilever 52 close to the turntable 3. The second X-axis adjusting mechanism 51 on the second adjusting frame 5 can adjust the focal length of the coupling lens 6, so that the light emitted from the light emergent portion can be better focused after entering the coupling lens 6. Of course, the second adjusting frame 5 can also be adjusted finely by using a three-axis adjusting structure or a multi-dimensional adjusting platform similar to the first adjusting frame 4.
As a further improvement of the present invention, the center axis of the coupling lens 6 is disposed orthogonal to the center axis of the turntable 3. The adjusting structure can be simpler, and the adjusting process is simplified.
As shown in fig. 6, in order to make the chip 1 in a stable working state, the turntable 3 further includes a semiconductor cooling plate 32, a cold end of the semiconductor cooling plate 32 is fixedly connected with the bottom of the turntable 3, and a hot end of the semiconductor cooling plate 32 is fixedly provided with a radiator 33; the semiconductor refrigerating sheet 32 is electrically connected with the power supply 7. The semiconductor cooling plate 32 can cool the chip 1, maintain the temperature of the chip 1 stable, and prevent the output wavelength from changing.
For further providing automatic control by temperature change and 3 position control's of revolving stage function, the utility model discloses still include motor 34, temperature sensor 35 and controller 36, motor 34 and 2 fixed connection of base, the output shaft and the 3 fixed connection of revolving stage of motor 34 still are provided with temperature sensor 35 on the semiconductor refrigeration piece 32, and motor 34 and temperature sensor 35 all with 36 electric connection of controller. Since the motor 34 has a position locking function, the turntable 3 is prevented from being accidentally rotated. The temperature sensor 35 can detect the temperature signal, and the controller 36 drives the semiconductor chilling plate 32 to work or close. The purpose of stabilizing the chip 1 is achieved. The motor 34 may be implemented as a servo motor or a stepping motor.
In addition, as shown in fig. 1, the base 2 is provided with a plurality of mounting holes, so that the positions of the turntable 3, the first adjusting frame 4 and the second adjusting frame 5 can be adjusted as required, and the detection requirements of different chips can be met. In addition, since the chip 1 has a very small size, it is preferable to use an external CCD camera to aim at the chip 1 and the stopper 31 for assisting the work when adjusting the chip position.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A high-power laser bare chip test fixture comprises a chip (1), wherein a negative electrode is arranged on one end face of the chip (1), a positive electrode is arranged on the other end face of the chip (1), and a light-emitting part is arranged on the side face of the chip (1); the method is characterized in that: the device is characterized by further comprising a base (2), a rotary table (3), a first adjusting frame (4), a second adjusting frame (5), a coupling lens (6) and a power supply (7), wherein the rotary table (3), the first adjusting frame (4), the second adjusting frame (5) and the power supply (7) are all arranged on the base (2); the rotary table (3) is rotatably connected with the base (2), a plurality of blocking parts (31) are arranged at the position, close to the edge, of the rotary table (3), the chip (1) is placed on the upper surface of the rotary table (3), the negative electrode of the chip (1) is in contact with the upper surface of the rotary table (3), and the side surface of the chip (1) is abutted to the side surface of each blocking part (31); one end of the first adjusting frame (4) far away from the base (2) is propped against the positive electrode of the chip (1); one end of the second adjusting frame (5) far away from the base (2) is provided with a coupling lens (6), and the coupling lens (6) is aligned with the light emergent part of the chip (1); the rotary table (3) and the first adjusting frame (4) are both electrically connected with a power supply (7).
2. The high power laser bare chip test fixture of claim 1, wherein: the blocking parts (31) are two oppositely arranged baffle plates, and an opening at one end of each blocking part (31) close to the center of the rotary table (3) is larger than an opening at the other end of each blocking part.
3. The high power laser bare chip test fixture of claim 1, wherein: the first adjusting frame (4) comprises a first cantilever (41) and a probe (42), the first cantilever (41) is arranged at the top of the rotary table (3), and the first cantilever (41) and the base (2) are arranged in parallel; one end of the first cantilever (41) close to the coupling lens (6) is provided with a probe (42), the probe (42) is fixedly connected with the first cantilever (41), and the probe (42) extends downwards along the vertical direction.
4. The high power laser bare chip test fixture of claim 3, wherein: the first adjusting frame (4) further comprises a first X-axis adjusting mechanism (43), a Y-axis adjusting mechanism (44) and a Z-axis adjusting mechanism (45); the first X-axis adjusting mechanism (43) comprises a first X-axis lead screw (431) and a first X-axis sliding table (432), the first X-axis lead screw (431) is fixedly arranged on the base (2), the top of the first X-axis lead screw (431) is provided with the first X-axis sliding table (432), and the first X-axis sliding table (432) is in rotating or sliding connection with the first X-axis lead screw (431); wherein the extending direction of the base (2) is taken as an X axis, the width direction of the base (2) is taken as a Y axis, and the height direction of the base (2) is taken as a Z axis;
a Y-axis adjusting mechanism (44) is arranged on the first X-axis sliding table (432), the Y-axis adjusting mechanism (44) comprises a Y-axis lead screw (441) and a Y-axis sliding table (442), the Y-axis lead screw (441) is fixedly connected with the X-axis sliding table (432), and the Y-axis sliding table (442) is arranged at the top of the Y-axis lead screw (441); the Y-axis sliding table (442) is connected with a Y-axis lead screw (441) in a rotating or sliding manner;
a Z-axis adjusting mechanism (45) is arranged on the Y-axis sliding table (442), the Z-axis adjusting mechanism (45) comprises a Z-axis lead screw (451) and a Z-axis sliding table (452), the Z-axis lead screw (451) is vertically arranged at the top of the Y-axis sliding table (442), the Z-axis sliding table (452) is arranged on the side surface of the Z-axis lead screw (451), and the Z-axis sliding table (452) is in rotating or sliding connection with the Z-axis lead screw (451); the first cantilever (41) is fixedly arranged on the Z-axis sliding table (452).
5. The high power laser bare chip test fixture of claim 3, wherein: probe (42) include barrel (421), syringe needle (422) and reset spring (423), barrel (421) and first cantilever (41) fixed connection, and barrel (421) are embedded to be equipped with syringe needle (422), syringe needle (422) and barrel (421) sliding connection, and barrel (421) is outwards extended is passed to the one end of syringe needle (422), and reset spring (423) and barrel (421) fixed connection are passed through to the other end of syringe needle (422).
6. The high power laser bare chip test fixture of claim 3, wherein: second adjustment frame (5) include second X axle adjustment mechanism (51), second X axle adjustment mechanism (51) include second X axle lead screw (511) and second X axle slip table (512), second X axle lead screw (511) and base (2) fixed connection, second X axle lead screw (511) top is provided with second X axle slip table (512), second X axle slip table (512) rotate or sliding connection with second X axle lead screw (511), fixed second cantilever (52) that are provided with on second X axle slip table (512), coupling lens (6) set up the one end that is close to revolving stage (3) in second cantilever (52).
7. The high power laser bare chip test fixture as claimed in claim 6, wherein: the central axis of the coupling lens (6) is arranged orthogonally to the central axis of the turntable (3).
8. The high power laser bare chip test fixture of claim 1, wherein: the turntable (3) further comprises a semiconductor refrigerating sheet (32), the cold end of the semiconductor refrigerating sheet (32) is fixedly connected with the bottom of the turntable (3), and the hot end of the semiconductor refrigerating sheet (32) is fixedly provided with a radiator (33); the semiconductor refrigerating sheet (32) is electrically connected with the power supply (7).
9. The high power laser bare chip test fixture of claim 8, wherein: still include motor (34), temperature sensor (35) and controller (36), motor (34) and base (2) fixed connection, the output shaft and revolving stage (3) fixed connection of motor (34), still be provided with temperature sensor (35) on semiconductor refrigeration piece (32), motor (34) and temperature sensor (35) all with controller (36) electric connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922134473.1U CN211669232U (en) | 2019-12-03 | 2019-12-03 | High-power laser bare chip test fixture |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922134473.1U CN211669232U (en) | 2019-12-03 | 2019-12-03 | High-power laser bare chip test fixture |
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| CN211669232U true CN211669232U (en) | 2020-10-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880979A (en) * | 2021-01-19 | 2021-06-01 | 苏州长光华芯光电技术股份有限公司 | Double-station device for testing luminous chip |
| CN112909726A (en) * | 2021-01-20 | 2021-06-04 | 苏州长光华芯光电技术股份有限公司 | Multifunctional testing device for laser chip |
| CN114272970A (en) * | 2021-12-29 | 2022-04-05 | 江西陆航精密制造有限公司 | Single-shaft temperature control rotary table with uniform heat dissipation |
| CN115144734A (en) * | 2022-07-29 | 2022-10-04 | 河北圣昊光电科技有限公司 | Swing adjusting device and chip testing machine with same |
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2019
- 2019-12-03 CN CN201922134473.1U patent/CN211669232U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880979A (en) * | 2021-01-19 | 2021-06-01 | 苏州长光华芯光电技术股份有限公司 | Double-station device for testing luminous chip |
| CN112880979B (en) * | 2021-01-19 | 2023-11-28 | 苏州长光华芯光电技术股份有限公司 | Double-station device for testing light-emitting chip |
| CN112909726A (en) * | 2021-01-20 | 2021-06-04 | 苏州长光华芯光电技术股份有限公司 | Multifunctional testing device for laser chip |
| CN114272970A (en) * | 2021-12-29 | 2022-04-05 | 江西陆航精密制造有限公司 | Single-shaft temperature control rotary table with uniform heat dissipation |
| CN115144734A (en) * | 2022-07-29 | 2022-10-04 | 河北圣昊光电科技有限公司 | Swing adjusting device and chip testing machine with same |
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