CN211654785U - Material storage device for silicon wafers in vacuum coating process - Google Patents
Material storage device for silicon wafers in vacuum coating process Download PDFInfo
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- CN211654785U CN211654785U CN202020420448.XU CN202020420448U CN211654785U CN 211654785 U CN211654785 U CN 211654785U CN 202020420448 U CN202020420448 U CN 202020420448U CN 211654785 U CN211654785 U CN 211654785U
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Abstract
The utility model discloses a stock device of silicon chip among vacuum coating technology mainly leads to the workman to put into the silicon chip and can make the easy cracked problem of silicon chip for a short time in order to solve the current storage position of taking in the device of silicon chip. Comprises a main shell; the main outer plate is fixed on the outer surface of the main shell; the silicon wafer storage device comprises partition plates, a silicon wafer storage device and a control device, wherein a shaft groove is formed in the side edge of each partition plate; the first connecting piece is connected to the side edge of the partition plate; the second connecting piece is connected to the side edge of the partition board and is connected with the first connecting piece; the movable shaft is connected to the crossed upper ends of the first connecting piece and the second connecting piece and is positioned in the shaft groove; the fixed shaft is fixed on the side edge of the partition plate; the sliding block is transversely arranged and fixed on the side edge of the partition plate, and the sliding block is positioned in the main shell and used for the partition plate to slide. The utility model discloses obtained deposit the silicon chip can not damage and can effectual fixed advantage.
Description
Technical Field
The utility model relates to a silicon chip packing field, in particular to material storing device for silicon chips in a vacuum coating process.
Background
The solar silicon wafer is an important component of a solar cell, a plurality of working procedures are needed during production of the solar silicon wafer, and the solar silicon wafer is large in brittleness and very fragile. When each process is switched, the solar silicon wafer is required to be stored in the silicon wafer storage device, and the production process requirements of the solar silicon wafer and the solar cell can be met.
At present, the cost is saved by adopting manual storage in consideration of large economic cost of a machine during storage of silicon wafers; the silicon wafer storage position inside the existing storage device is fixed, the gap is small, the silicon wafer is easy to shake due to the fact that the gap is large, the stored gap is small and fixed, when the silicon wafer is inserted into the partition plate, the silicon wafer is often obliquely inserted, the straight insertion is often difficult, but due to the fact that workers shake hands, the silicon wafer and the partition plate are prone to being touched rigidly when the silicon wafer is inserted, the silicon wafer can be cracked, and therefore the device capable of expanding the storage space of the silicon wafer and capable of shrinking and fixing the silicon wafer is important.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a stock device of silicon chip among vacuum coating technology to solve the current device of accomodating the silicon chip in the position of depositing of silicon chip lead to the workman to put into for a short time and can make the silicon chip easily cracked problem.
In order to achieve the above purpose, the embodiment of the present invention adopts the following scheme:
a material storage device for silicon wafers in a vacuum coating process is characterized by comprising:
a main housing;
the main outer plate is fixed on the outer surface of the main shell;
the plurality of partition plates are arranged between the main shells, silicon wafers are stored between the partition plates, and shaft grooves are formed in the side edges of the partition plates;
the first connecting piece is connected to the side edge of the partition plate;
the second connecting piece is connected to the side edge of the partition board and connected with the first connecting piece, and the first connecting piece and the second connecting piece are connected to form a cross;
the movable shaft is connected to the crossed upper ends of the first connecting piece and the second connecting piece and is positioned in the shaft groove;
the fixed shaft is connected to the crossed lower end of the first connecting piece and the second connecting piece and is fixed on the side edge of the partition board;
the sliding block is transversely arranged and fixed on the side edge of the partition plate, and the sliding block is positioned in the main shell and used for the partition plate to slide.
The surface of baffle is equipped with cotton pad, prevents to extrude bad silicon chip when the baffle is shrink to utilize first connecting piece and second connecting piece linkage, make the removal that each baffle can realize the equidistance, make things convenient for putting into of silicon chip, can not lead to putting into of silicon chip to damage because the space is too little, and the baffle can also shrink under the linkage of first connecting piece and second connecting piece, can not lead to the silicon chip to rock and damage because the space between the baffle is too big.
The first connecting piece, the second connecting piece, the fixed shaft and the sliding block are arranged in an up-down symmetrical mode relative to the center of the main shell, and are located on the left side and the right side of the partition plate to stabilize the partition plate to move.
Preferably, the crossed upper end of the first connecting piece and the second connecting piece is further provided with a moving block, the middle of the moving block penetrates through the moving shaft, the middle of the moving block transversely penetrates through the long shaft, a first spring is arranged between each moving block, and the middle of the first spring sleeve penetrates through the long shaft. The moving block has pre-opened acting force under the action of the first spring, and can move and extend more easily, so that the partition plate is promoted to move easily.
Preferably, still be equipped with the stabilization block in the middle of the main casing body, pass the major axis in the upper portion of stabilization block, the lower extreme is equipped with the briquetting, the briquetting is horizontal setting, and the bottom of briquetting is equipped with the second spring.
Preferably, the upper part of the stabilizing block body is provided with an upper long transverse block and a lower long transverse block, the upper long transverse block is positioned at the top of the stabilizing block body, the lower long transverse block is positioned below the long shaft, rolling wheels are arranged in the upper long transverse block and the lower long transverse block, and the rolling wheels are used for sliding of the stabilizing moving block.
Preferably, a gear is arranged at the center of the main shell, toothed bars are arranged on two sides of the gear and connected with the pressing block, a pin shaft is arranged in the middle of the gear and penetrates through the main outer plate, a shaft block is arranged in the middle of the outer surface of the main outer plate and penetrates through the shaft block, a rotating handle is arranged on the shaft block, and the pin shaft is connected with the rotating handle. Under the elastic force action of the second spring, the pressing block is easier to lift, the rotating handle is easier to rotate, the partition plate is easy to retract, and the efficiency is improved.
Preferably, be equipped with the buckle in the turning handle, the bottom of buckle is "T" shape, the bottom of buckle still is equipped with the third spring, and the top is equipped with according to the axle, pass the turning handle according to the axle, outer lane a week of axle piece is equipped with a plurality of catching grooves, the catching groove is "T" shape for the buckle is detained and is gone into fixedly. The vertical notch in the buckle groove is larger than the transverse plate at the bottom of the buckle plate, so that the buckle plate can easily enter the buckle groove and is fixed under the rotation of the rotating handle.
Preferably, the two sides of the main shell are also provided with extension mechanisms, and the extension mechanisms are provided with
A sub-housing;
the outer surface of the auxiliary outer plate is movably connected with the outer surface of the main outer plate, and a vertical sliding groove is formed in the auxiliary shell and can slide on the auxiliary outer plate;
and the transverse sliding groove is positioned above the auxiliary shell and used for sliding the sliding block in.
Preferably, an upper short transverse block and a lower short transverse block are further arranged in the auxiliary shell, a short shaft is arranged between the upper short transverse block and the lower short transverse block, and rolling wheels are further arranged in the upper short transverse block and the lower short transverse block and used for enabling the moving block to slide in.
Preferably, the short shaft is further provided with an correcting block, and the correcting block can slide on the short shaft and is used for adjusting the short shaft to keep the same center with the long shaft. The correcting block slides to adjust the position of the short shaft by the short transverse block, and only one side of the short shaft is fixed on the auxiliary shell, and the collision end of the other side of the short shaft and the long shaft is easy to displace under the movement of the moving block, so that the correcting block is required to be moved to the collision end of the long shaft in advance for fixing.
A using method of a silicon wafer storage device in a vacuum coating process comprises the following steps:
turning over the extension mechanism to enable the auxiliary outer plate in the extension mechanism to be flush with the main outer plate and to be kept on the same vertical plane, shifting the correction block, enabling the correction block to slide to adjust the central position of the short shaft if the deviation between the short shaft and the long shaft is not in the same center, and adjusting the short shaft and the long shaft to be on the same central line;
the rotating handle is rotated to enable the gear to rotate, the gear drives the rack rod to move up and down, the pressing block extrudes the third spring towards the gear to drive the stabilizing block to move, the upper long transverse block and the lower long transverse block are moved stably and quickly, the moving block moves under the pressure of the upper long transverse block to drive the first connecting piece and the second connecting piece to rotate, the first connecting piece and the second connecting piece rotate around the fixed shaft, the moving shaft moves downwards in the shaft groove, and finally the partition plates are driven to move, slide in the main shell by the aid of the sliding blocks and slide into the transverse sliding grooves, so that distances among the partition plates are expanded at equal intervals;
the pressing shaft is pressed down, the pressing shaft pushes the bottom of the buckling plate to be buckled and pressed in the buckling groove of the shaft block, then the rotating handle is slightly rotated to enable the bottom of the buckling plate to be fixed in the buckling groove, the rotating handle is fixed and cannot rotate, at the moment, a silicon wafer can be placed between the partition plates, the rotating handle is loosened after the partition plates are fully placed, the partition plates rotate reversely, and the operation is completed after the partition plates retract.
The utility model discloses beneficial effect:
the utility model relates to a silicon wafer storage device in vacuum coating process, which drives a stable block body to move by rotating a rotating handle, so that a moving block can stably slide between an upper long transverse block and a lower long transverse block, a first connecting piece and a second connecting piece are rotated by a fixed shaft, and finally, a partition plate is driven to move, and the distance between the partition plates is enlarged at equal intervals, so that the silicon wafer can be obliquely put in without being damaged; the utility model discloses obtained deposit the silicon chip can not damage and can effectual fixed, be fit for the beneficial effect that the silicon chip of different thickness was deposited.
Drawings
Fig. 1 is a schematic view of the middle partition board of the present invention after being unfolded.
Fig. 2 is a schematic diagram of the middle partition board of the present invention after being contracted.
Fig. 3 is a schematic view of the components connected by the middle partition plate of the present invention.
Fig. 4 is a schematic diagram of the components inside the middle main casing of the present invention.
Fig. 5 is a schematic diagram of the parts at the center position inside the middle main casing body of the present invention.
Fig. 6 is a half-sectional schematic view of the middle rotating handle of the present invention.
Fig. 7 is a front view of the middle partition plate of the present invention after being unfolded.
Fig. 8 is a schematic view of the extension mechanism of the present invention.
Fig. 9 is a schematic view of the middle corrective block of the present invention.
1. Main casing 2, partition 3, main outer plate
4. Extension mechanism 5, first connecting piece 6, second connecting piece
7. Movable shaft 8, fixed shaft 9 and moving block
10. Long shaft 11, first spring 12, stable block
13. An upper long transverse block 14, a lower long transverse block 15 and a pressing block
16. Gear rod 17, second spring 18, gear
19. Shaft block 20, rotating handle 21 and pinch plate
22. Third spring 41, sub outer plate 42, lateral sliding groove
43. Auxiliary shell 44, upper short transverse block 45 and lower short transverse block
46. Vertical sliding groove 47, short shaft 48 and correcting block
201. Cotton pad 202, slide block 203, axle slot
181. Pin shaft 191, fastening slot 211 and press shaft
Detailed Description
In order to make the objects and technical solutions of the present invention clear and fully described, and the advantages thereof more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some, but not all, embodiments of the present invention and are not to be considered as limiting, and that all other embodiments can be made by one of ordinary skill in the art without any inventive work.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. But it is obvious. To one of ordinary skill in the art, the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
As shown in fig. 1-2, a silicon wafer storage device in a vacuum coating process is characterized by comprising: a main housing 1; a main outer plate 3, wherein the main outer plate 3 is fixed on the outer surface of the main shell 1; the silicon wafer storage device comprises a main shell 1, a plurality of partition plates 2 and a plurality of supporting plates 2, wherein the partition plates 2 are arranged between the main shell 1, silicon wafers are stored between the partition plates 2, and shaft grooves 203 are formed in the side edges of the partition plates 2; the first connecting piece 5 is connected to the side edge of the partition board 2; the second connecting piece 6 is connected to the side edge of the partition board 2 and connected with the first connecting piece 5, and the first connecting piece 5 and the second connecting piece 6 are connected to form a cross; the movable shaft 7 is connected to the crossed upper ends of the first connecting piece 5 and the second connecting piece 6, and is positioned in the shaft groove 203; the fixed shaft 8 is connected to the crossed lower ends of the first connecting piece 5 and the second connecting piece 6, and is fixed on the side edge of the partition board 2; a sliding block 202, the sliding block 202 is transversely arranged and fixed on the side of the partition board 2, and the sliding block 202 is positioned in the main shell 1 for the partition board 2 to slide.
The surface of baffle 2 is equipped with cotton pad 201, prevent extrusion bad silicon chip when baffle 2 contracts, and utilize first connecting piece 5 and the linkage of second connecting piece 6, make the removal that each baffle 2 can realize the equidistance, make things convenient for putting into of silicon chip, can not lead to putting into of silicon chip to damage because the space is too little, and baffle 2 can also contract under the linkage of first connecting piece 5 and second connecting piece 6, can not lead to the silicon chip to rock and damage because the space between the baffle 2 is too big.
The first connecting piece 5, the second connecting piece 6, the fixed shaft 8 and the sliding block 202 are arranged up and down symmetrically relative to the center of the main shell 1 and are positioned at the left side and the right side of the partition board 2 to stabilize the partition board 2 to move.
Specifically, as shown in fig. 3, a moving block 9 is further disposed at the crossed upper end of the first connecting member 5 and the second connecting member 6, the middle of the moving block 9 penetrates through the moving shaft 7, the middle of the moving block 9 transversely penetrates through the long shaft 10, a first spring 11 is disposed between each moving block 9, and the middle of a sleeve of the first spring 11 penetrates through the long shaft 10. The movable block 9 has a pre-opening acting force under the action of the first spring 11, and the movable block 9 can move and stretch more easily, so that the partition board 2 is promoted to move easily.
Specifically, as shown in fig. 4, a stabilizing block 12 is further disposed in the middle of the main housing 1, the upper portion of the stabilizing block 12 penetrates through the long shaft 10, the lower end of the stabilizing block is provided with a pressing block 15, the pressing block 15 is transversely disposed, and the bottom of the pressing block 15 is provided with a second spring 17.
Specifically, the upper portion of the stable block 12 is provided with an upper long transverse block 13 and a lower long transverse block 14, the upper long transverse block 13 is located at the top of the stable block 12, the lower long transverse block 14 is located below the long shaft 10, and rolling wheels are arranged in the upper long transverse block 13 and the lower long transverse block 14 and used for sliding the stable moving block 9.
Specifically, as shown in fig. 5, a gear 18 is disposed at the center of the main housing 1, rack bars 16 are disposed at two sides of the gear 18, the rack bars 16 are connected to the pressing block 15, a pin shaft 181 is disposed in the middle of the gear 18, the pin shaft 181 penetrates through the main outer plate 3, a shaft block 19 is disposed in the middle of the outer surface of the main outer plate 3, the pin shaft 181 penetrates through the shaft block 19, a rotating handle 20 is disposed on the shaft block 19, and the pin shaft 181 is connected to the rotating handle 20. Under the action of the elastic force of the second spring 17, the pressing block 15 is easier to lift, the rotating handle 20 is easier to rotate, the partition plate 2 is easier to retract, and the efficiency is improved.
Specifically, as shown in fig. 6, a buckle plate 21 is arranged in the rotating handle 20, the bottom of the buckle plate 21 is in a "T" shape, a third spring 22 is further arranged at the bottom end of the buckle plate 21, a pressing shaft 211 is arranged at the top end of the buckle plate, the pressing shaft 211 penetrates through the rotating handle 20, a plurality of buckle grooves 191 are formed in the periphery of the outer ring of the shaft block 19, and the buckle grooves 191 are in a "T" shape and used for buckling and fixing the buckle plate 21. The vertical notch in the fastening groove 191 is larger than the transverse plate at the bottom of the fastening plate 21, so that the fastening plate 21 can easily enter the fastening groove 191 and be fixed under the rotation of the rotating handle 20.
Specifically, as shown in fig. 8, the extension mechanism 4 is further provided on both sides of the main casing 1, and the extension mechanism 4 has a sub-casing 43; the outer surface of the sub outer plate 41 is movably connected with the outer surface of the main outer plate 3, the sub housing 43 is provided with a vertical sliding groove 46, the horizontal sliding groove 42 can slide on the sub outer plate 41, and the horizontal sliding groove 42 is positioned above the sub housing 43 and used for sliding in the sliding block 202.
Specifically, the sub-housing 43 is further provided with an upper short transverse block 44 and a lower short transverse block 45, a short shaft 47 is arranged between the upper short transverse block 44 and the lower short transverse block 45, and rolling wheels are further arranged in the upper short transverse block 44 and the lower short transverse block 45 and used for sliding the moving block 9 in.
Specifically, the short shaft 47 is further provided with an aligning block 48, and the aligning block 48 can slide on the short shaft 47 for adjusting the short shaft 47 to keep the same center with the long shaft 10. The position of the short shaft 47 of the correcting block 48 is adjusted by sliding the short transverse block, and only one side of the short shaft 47 is fixed on the sub-housing 43, and the collision end of the other side and the long shaft 10 is easy to displace under the movement of the moving block 9, so that the correcting block 48 needs to be moved to the collision end of the long shaft 10 in advance for fixing.
A using method of a silicon wafer storage device in a vacuum coating process comprises the following steps:
turning over the extension mechanism 4 to enable the auxiliary outer plate 41 in the extension mechanism 4 to be flush with the main outer plate 3 and to be kept on the same vertical plane, shifting the correction block 48, if the deviation between the short shaft 47 and the long shaft 10 is not in the same center, enabling the correction block 48 to slide to adjust the center position of the short shaft 47, and adjusting the short shaft 47 and the long shaft 10 to be on the same center line;
rotating the rotating handle 20, as shown in fig. 7, rotating the gear 18, the gear 18 drives the rack bar 16 to move up and down, and the pressing block 15 presses the third spring 22 towards the gear 18, driving the stabilizing block 12 to move, stably and quickly moving the upper long transverse block 13 and the lower long transverse block 14, the moving block 9 moves under the pressure of the upper long transverse block 13, driving the first connecting piece 5 and the second connecting piece 6 to rotate, the first connecting piece 5 and the second connecting piece 6 rotate around the fixed shaft 8, the moving shaft 7 moves down in the shaft groove 203, and finally, driving the partition plates 2 to move, and sliding in the main housing 1 by using the sliding block 202 and sliding into the transverse sliding grooves 42, so that the distances between the partition plates 2 are expanded at equal intervals;
the pressing shaft 211 is pressed down, the pressing shaft 211 pushes the bottom of the buckling plate 21 to be buckled and pressed in the buckling groove 191 of the shaft block 19, then the lower rotating handle 20 is slightly rotated, the bottom of the buckling plate 21 is fixed in the buckling groove 191, the rotating handle 20 is fixed and cannot rotate, at this time, a silicon wafer can be placed between the partition plates 2, after the partition plates are fully placed, the rotating handle 20 is loosened, the rotating handle is rotated reversely, the partition plates 2 are retracted, and the operation is completed.
The utility model discloses can realize that the equidistance of baffle 2 expandes, make things convenient for the silicon chip to put into, can not damage the silicon chip because the space between the baffle 2 is too little to baffle 2 can also the withdrawal of equidistance, reduces the space, reduces the rocking distance of silicon chip, guarantees the safety of silicon chip, the utility model discloses a removal and the withdrawal of baffle 2 are applicable to the silicon chip of different thickness and deposit, and the utilization ratio improves greatly.
Although the invention has been described with respect to illustrative embodiments thereof so that those skilled in the art can understand the invention, it is to be understood that the invention is not limited to the disclosed embodiments, but rather, is intended to cover all modifications and variations within the spirit and scope of the invention as defined and defined by the appended claims.
Claims (9)
1. A material storage device for silicon wafers in a vacuum coating process is characterized by comprising:
a main housing;
the main outer plate is fixed on the outer surface of the main shell;
the plurality of partition plates are arranged between the main shells, silicon wafers are stored between the partition plates, and shaft grooves are formed in the side edges of the partition plates;
the first connecting piece is connected to the side edge of the partition plate;
the second connecting piece is connected to the side edge of the partition board and connected with the first connecting piece, and the first connecting piece and the second connecting piece are connected to form a cross;
the movable shaft is connected to the crossed upper ends of the first connecting piece and the second connecting piece and is positioned in the shaft groove;
the fixed shaft is connected to the crossed lower end of the first connecting piece and the second connecting piece and is fixed on the side edge of the partition board;
the sliding block is transversely arranged and fixed on the side edge of the partition plate, and the sliding block is positioned in the main shell and used for the partition plate to slide.
2. The silicon wafer storage device in a vacuum coating process according to claim 1, wherein a moving block is further arranged at the crossed upper end of the first connecting piece and the second connecting piece, the middle of the moving block penetrates through the moving shaft, the middle of the moving block transversely penetrates through the long shaft, a first spring is arranged between each moving block, and the middle of the first spring sleeve penetrates through the long shaft.
3. The silicon wafer storage device in a vacuum coating process according to claim 2, wherein a stabilizing block is further arranged in the middle of the main housing, the upper part of the stabilizing block penetrates through the long shaft, the lower end of the stabilizing block is provided with a pressing block, the pressing block is transversely arranged, and the bottom of the pressing block is provided with a second spring.
4. The silicon wafer storage device in a vacuum coating process according to claim 3, wherein the upper portion of the stable block is provided with an upper long transverse block and a lower long transverse block, the upper long transverse block is located at the top of the stable block, the lower long transverse block is located below the long shaft, and rolling wheels are arranged in the upper long transverse block and the lower long transverse block and used for enabling the stable moving block to slide.
5. The silicon wafer storage device in a vacuum coating process according to claim 4, wherein a gear is arranged at the center of the main housing, toothed bars are arranged at two sides of the gear, the toothed bars are connected with the pressing block, a pin shaft is arranged in the middle of the gear, the pin shaft penetrates through the main outer plate, a shaft block is arranged in the middle of the outer surface of the main outer plate, the pin shaft penetrates through the shaft block, a rotating handle is arranged on the shaft block, and the pin shaft is connected with the rotating handle.
6. The silicon wafer storage device in a vacuum coating process according to claim 5, wherein the turning handle is provided with a buckle plate, the bottom of the buckle plate is T-shaped, the bottom end of the buckle plate is further provided with a third spring, the top end of the buckle plate is provided with a press shaft, the press shaft penetrates through the turning handle, a plurality of buckle grooves are formed in the periphery of the outer ring of the shaft block, and the buckle grooves are T-shaped and used for buckling and fixing the buckle plate.
7. The silicon wafer storage device in a vacuum coating process according to claim 1, wherein the main housing is further provided with extension mechanisms at both sides thereof, and the extension mechanisms are provided with extension mechanisms
A sub-housing;
the outer surface of the auxiliary outer plate is movably connected with the outer surface of the main outer plate, and a vertical sliding groove is formed in the auxiliary shell and can slide on the auxiliary outer plate;
and the transverse sliding groove is positioned above the auxiliary shell and used for sliding the sliding block in.
8. The silicon wafer storage device in a vacuum coating process according to claim 7, wherein the sub-housing further comprises an upper short transverse block and a lower short transverse block, a short shaft is arranged between the upper short transverse block and the lower short transverse block, and rolling wheels are further arranged in the upper short transverse block and the lower short transverse block for sliding in the moving block.
9. The apparatus for storing silicon wafers in a vacuum deposition process according to claim 8, wherein the short axis further comprises an alignment block, the alignment block can slide on the short axis for adjusting the short axis to be centered with the long axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020420448.XU CN211654785U (en) | 2020-03-28 | 2020-03-28 | Material storage device for silicon wafers in vacuum coating process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020420448.XU CN211654785U (en) | 2020-03-28 | 2020-03-28 | Material storage device for silicon wafers in vacuum coating process |
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| CN211654785U true CN211654785U (en) | 2020-10-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466794A (en) * | 2020-11-24 | 2021-03-09 | 长江存储科技有限责任公司 | Thin film deposition device and wafer boat assembly |
| CN113562309A (en) * | 2021-09-27 | 2021-10-29 | 徐州和润电子材料有限公司 | Silicon wafer lossless storage device for manufacturing communication electronic product |
-
2020
- 2020-03-28 CN CN202020420448.XU patent/CN211654785U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466794A (en) * | 2020-11-24 | 2021-03-09 | 长江存储科技有限责任公司 | Thin film deposition device and wafer boat assembly |
| CN112466794B (en) * | 2020-11-24 | 2021-12-03 | 长江存储科技有限责任公司 | Thin film deposition device and wafer boat assembly |
| CN113562309A (en) * | 2021-09-27 | 2021-10-29 | 徐州和润电子材料有限公司 | Silicon wafer lossless storage device for manufacturing communication electronic product |
| CN113562309B (en) * | 2021-09-27 | 2021-12-14 | 徐州和润电子材料有限公司 | Silicon wafer lossless storage device for manufacturing communication electronic product |
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