CN211626406U

CN211626406U - Metering-grade 3D super-depth-of-field interference microscope system

Info

Publication number: CN211626406U
Application number: CN202020430193.5U
Authority: CN
Inventors: 阳宇春; 孙亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-03-30
Filing date: 2020-03-30
Publication date: 2020-10-02
Anticipated expiration: 2030-03-30

Abstract

The utility model discloses a metering-grade 3D super-depth-of-field interference microscope system, relating to the technical field of photoelectric nondestructive 3D detection; the microscope system comprises an optical microscope, a white light interference sensor, an xyz-axis electric displacement platform, a control module and a PC (personal computer) processor; the xyz-axis electric displacement platform comprises an xy-axis translation platform and a z-axis lifting module, the optical microscope is provided with an illumination light source and an image acquisition unit, the control module comprises an xyz electric control unit, a white light interference signal processor and a power module, the white light interference signal processor is connected with the white light interference sensor, and the image acquisition unit is used for acquiring image information of a target detection area and transmitting the image information to a PC (personal computer) processor; through implementing this technical scheme, can the nondestructive observation sample to can the super large area take a picture, 3D true color formation of image and the accurate measurement of 3D to the microscopic state on material surface, realize the detection precision of metering level, and keep the detail and the true colour of microscopic sample, have fine application prospect.

Description

Metering-grade 3D super-depth-of-field interference microscope system

Technical Field

The utility model relates to a photoelectric nondestructive 3D detects technical field, more specifically says, relates to a measurement level 3D super depth of field interference microsystem.

Background

Non-contact 3D surface inspection techniques describe the measurement and characterization of micro-or nano-scale features on a natural or machined surface by capturing 3D spatial coordinates of points on the surface of an object using non-destructive optical techniques; compared with the contact type surface detection technology, the optical detection system has the important advantages that the optical detection system can not damage an object to be detected and can pass through the transparent medium for measurement, so that the application field is rapidly developed and is widely applied to the technical fields of MEMS, semiconductors, nano materials, biomedicine, industrial detection, metering and the like; the most common optical inspection techniques mainly include white light interferometric profilometry, white light interferometric microscopy and confocal laser microscopy, each of which has its own specific advantages and disadvantages:

white light interference microscopy: the white light interference microscope adopts the principle of light interference to image, enables the z-axis resolution to reach 0.1nm through the nanometer vertical scanner and the interference objective lens, has very high 3D high-precision measurement, however, the price of the instrument is too high, and is only suitable for extremely small users. By the method, only a gray image and a black-and-white 3D model can be obtained, the apparent real texture and real color of the material are not shown, the interface between different components of a flat sample cannot be distinguished, only quantitative scale detection can be carried out, qualitative detection cannot be carried out, a white light interferometer cannot detect a steep angle, the method is limited by the surface reflectivity, and the use range is limited;

white light interference profilometer technology: the method scans the surface of a sample by using the confocal and spectrometer technology through the principle of white light spectral dispersion and confocal, obtains size point cloud data of the surface of the sample, and then carries out three-dimensional modeling; the detection precision of z-axis nanometer level can be realized; the method is the same as a white light interference microscope, only can obtain gray images and black and white 3D models, does not show the apparent real texture and real color of the material, cannot distinguish the interface between different components of a flat sample, and only can carry out quantitative detection; the application range is limited. It is worth mentioning that the white light interferometric scanning approach has the advantage of relatively low cost, so that the method still has general utility in the fine profile measurement process;

laser confocal microscopy: the method scans the surface of a sample by the principle of confocal imaging of laser and a small hole, performs three-dimensional modeling after obtaining point cloud data of micro appearance on the surface of the sample, can realize the detection precision of z-axis nanometer level, and has higher 3D high-precision measurement; however, the following technical problems exist in the instruments: the price is too high, the method is only suitable for extremely small users, only gray level images and black and white 3D models can be obtained, microscopic real colors of materials are not displayed, large-area 3D image collection is based on the principle that a plurality of 3D images are spliced into an oversized 3D model, new errors can be brought into an algorithm, the accuracy is reduced, and the method is suitable for small-range observation.

According to the technical problems of the existing optical detection technology, the inventor provides a 3D super-depth-of-field microscopic technology, the microscopic three-dimensional space structure information of an object is obtained by utilizing the small depth of field of a microscope and translating a focal plane up and down, optical multi-layer depth-of-field synthesis is realized, and a 3D model with real color and microscopic details is obtained on the basis, and the method is relatively low in cost. Nevertheless this application utility model people realize the utility model discloses the in-process discovers the above-mentioned 3D and surpasses the microtechnical limitation in depth of field and lies in: the optical microscope is limited by an illumination mode, field curvature, distortion, an algorithm and an optical depth of field algorithm of an optical lens, and an image has certain distortion; the instrument can not effectively detect smooth surfaces (such as mirror surfaces or ceramics) and transparent samples (such as glass), and the detection precision of light-colored samples with low contrast is obviously reduced; in addition, large-area 3D image acquisition is needed, a principle that a plurality of 3D models are spliced into an oversized 3D model is adopted, and a new error is brought into an algorithm, so that the detection precision cannot meet the detection requirement which is developed day by day; therefore, aiming at the technical problems, a metering-level 3D (three-dimensional) super-depth-of-field interference microscope system needs to be researched and designed urgently, the requirement of a microscope system which is low in relative cost, capable of detecting the 3D micro-nano size in a large area, capable of reflecting the real details and the real color of a sample, capable of comprehensively observing a target and capable of meeting increasingly complex fine detection requirements is met.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned prior art problems, an object of the present invention is to provide a metrology-level 3D super-depth-of-field interference microscopy system, which can photograph, 3D true color imaging, and 3D measurement a microscopic state of a material surface in a super-large area while observing a sample, and which can realize the detection precision of the metrology level while maintaining the details and the true color of the microscopic sample; the method is beneficial to scientific research personnel and detection workers to observe the micro-nano structure, the micro-size defect and the like of the sample rapidly and nondestructively, determines the defect grade and measures the 3D size to realize quantitative analysis, and has good application prospect.

The utility model adopts the technical scheme as follows:

the metering-level 3D super-depth-of-field interference microscope system comprises an optical microscope, a white light interference sensor, an xyz-axis electric displacement platform, a control module and a PC (personal computer) processor; the control module comprises an xyz electric control unit, a white light interference signal processor connected with the white light interference sensor and a power supply module; the control module is connected with a PC (personal computer) processor, and 3D imaging measurement software is arranged in the PC processor;

the optical microscope is provided with an illumination light source and an image acquisition unit, and the image acquisition unit is used for acquiring image information of an object target detection area and transmitting the image information to the PC processor;

the white light interference sensor is used for collecting the contour information of the target detection area and transmitting the contour information to the white light interference signal processor;

the xyz electric control unit is electrically connected with a driver of the xyz electric displacement platform and is used for setting a detection starting point, a detection end point and a scanning path and feeding back coordinate information of the detection point to the PC processor;

the xyz-axis electric displacement platform comprises an xy-axis translation platform and a z-axis lifting module, so that the optical microscope and the white light interference sensor can detect an object in a three-dimensional space formed in the xyz-axis direction;

the PC processor is used for receiving, analyzing and storing the object image information collected by the image collecting unit, the object contour information collected by the white light interference sensor and the coordinate data information corresponding to the xyz axis.

In the technical scheme, 3D imaging measurement software is installed in a PC processor, 1. the 3D imaging measurement software has the functions of collecting multilayer images and corresponding height position data, and the inherent small depth of field of a microscope has the characteristics that: the 3D imaging measurement software removes the fuzzy part outside the field depth in each layer of image through a definition comparison algorithm, retains the clear part inside the field depth in each layer of image, and finally passes through the retained clear part with high position data, namely when observing the fine apparent mass of a sample, the presented sample microscopic image has no local fuzzy and uniform definition, and can comprehensively understand all information quantity carried by the experimental sample through microscopic 3D imaging and modeling, so as to accurately express the microscopic actual data of the surface of a large object, and realize optical microscopic 3D imaging and modeling; 2. the 3D imaging measurement software has the function of performing 3D modeling by utilizing the sample surface topography data acquired by the white light interference sensor; 3. the 3D imaging measurement software has the function of fusing an optical microscopic 3D model and a 3D point cloud model obtained by a white light interference sensor; 4. the 3D imaging measurement software has the functions of single image measurement, measurement after splicing of a plurality of images, measurement after single 3D model measurement and splicing of a plurality of 3D models, 3D point cloud model fusion of an optical microscope 3D model and a white light interference sensor, and 3D imaging and measurement after fusion.

Further, the optical axis of the optical microscope and the optical axis of the white light interference sensor are parallel to each other.

Further, the optical axis of the optical microscope is not parallel to the optical axis of the white light interference sensor; when the two are not parallel, the optical microscope has a straight line L and a projection plane perpendicular to the straight line L, the straight line L is perpendicular to the optical axis of the optical microscope, the straight line L is perpendicular to the optical axis of the white light interference sensor, and an acute angle formed by two intersecting straight lines formed by the optical axis of the optical microscope and the optical axis of the white light interference sensor projected on the projection plane is between 0 and 60 degrees.

In the technical scheme, the optical axis of the optical microscope is defined as follows: the optical axis of the microscope lens coincides with the central axis of the objective lens, the lens which the light reflected by the sample reaches first is the first lens of the objective lens, and when the first lens of the objective lens is close to one side of the sample without an optical reflector, the optical axis of the first lens of the objective lens is the optical axis of the microscope; when the first lens of the objective lens is provided with the optical reflector on one side close to the sample, the light rays superposed with the optical axis of the first lens of the objective lens form mirror reflection through the reflector, and the straight line reflected according to the optical principle is the optical axis of the microscope.

The optical axis of the white light interference sensor in the technical scheme is defined as follows: the optical axis of the sensor lens is superposed with the central axis of the white light interference sensor, the lens which is the first lens of the sensor and is reached by the light reflected by the sample, and when the first lens of the sensor is close to one side of the sample without an optical reflector, the optical axis of the first lens of the sensor is the optical axis of the sensor; when the optical reflector is arranged on one side of the first lens of the sensor, which is close to the sample, light rays coincident with the optical axis of the first lens of the sensor form mirror reflection through the reflector, and a straight line reflected according to the optical principle is the optical axis of the white light interference sensor.

Further, the optical axis of the optical microscope is perpendicular to the actual motion plane of the xyz-axis electric displacement platform in the xy direction.

Furthermore, the optical axis of the optical microscope and the actual motion plane of the xyz-axis electric displacement platform in the xy direction are not perpendicular; when the two are not vertical, the swing angle of the optical axis of the optical microscope is between-90 degrees and 90 degrees by taking the vertical direction as a reference line.

Furthermore, xy axis translation platform and z axle lifting module design for the disconnect-type, the optical microscope with white light interference sensor installs on z axle lifting module, so that z axle lifting module does not follow xy axis translation platform synchronous motion, so this technical scheme designs xy axis translation platform as an organic whole, and the detected object is placed and is removed on xy axis translation platform.

Furthermore, the xy-axis translation stage and the z-axis lifting module are designed into an integral body, so that the z-axis lifting module moves synchronously with the xy-axis translation stage, and the optical microscope and the white light interference sensor are installed on the outer side of the xyz-axis electric displacement platform through a supporting device or above the xyz-axis integrated translation stage through a supporting frame. In the technical scheme, the xy-axis translation table and the z-axis lifting module are designed into an integral body, an object to be detected is placed on the integral type xyz-axis electric displacement platform to be detected along with synchronous movement of the integrated type xyz-axis electric displacement platform, and the object to be detected is in a motion state; and when the optical microscope and the optical detection sensor are arranged on the z-axis lifting module, the object to be detected is in a static state.

Furthermore, a high-precision displacement sensor is arranged in the xyz-axis electric displacement platform to acquire the position information of the xyz-axis electric displacement platform in real time and feed back the acquired position data to the PC processor for accurately controlling the movement distance of the xyz-axis electric displacement platform; the high-precision displacement sensor can select one of a magnetic grid or a grating.

Optionally, the scanning type comprises detecting surface color, microscopic detail texture, and 3D contour topography of the object.

Optionally, the image acquisition unit includes at least one of a color CCD or a color CMOS.

Optionally, the xyz electric control unit, the white light interference signal processor and the power module are installed in the same main control box, and a corresponding communication interface is provided on the outer shell and used for connecting the illumination light source, the xyz electric displacement platform, the white light interference sensor and the PC processor.

As described above, the present invention has at least the following advantages over the prior art:

1. the utility model discloses the advantages of optical microscope and white light interference technique are combined to microsystem detection method ingenious, and traditional white light interference microscope has greatly restricted its application because of its high price and bulky; the utility model discloses utilize white light interference sensor's white light interference principle, operate in the super depth of field of measurement level 3D interference microsystem, can the non-destructive observation sample in can the super large area take a picture to the microscopic state on material surface, the true color imaging of 3D, 3D measures, its testing result is for having the colour simultaneously, the detail texture, the super high accuracy measurement level image, data and model, realize the detection precision of measurement level and the detail and the true colour that keep the microscopic sample simultaneously, it is quick with the detection worker to do benefit to the scientific research personnel, the harmless observation sample micro-nano structure, small size defect etc, confirm defect level and measure 3D size and realize qualitatively, quantitative analysis.

2. The utility model discloses dispose the image acquisition unit among microsystem's the optical microscope, the image acquisition unit passes through software control give-out order, and give the PC treater with the image information feedback of gathering, show to the image that supplies to detect the worker and observe, and combine the design of xyz axle electric displacement platform and sensor, can carry out real-time observation to on-the-spot height and height sample not co-altitude level texture, details, colour and profile appearance, do benefit to and detect the worker and harmless, the slight state of overall observation sample, confirm the slight defect grade in surface.

3. The utility model discloses microsystem is realizing the detection precision of measurement level and is keeping the microscopic detail and the true colour on sample surface simultaneously, has fully considered optical microscope's optical axis and optical detection sensor's optical axis to have parallel mode and nonparallel mode, and the relative coordinate of the crossing point on object detection surface is extended through the optical axis of confirming optical microscope and sensor for the target detection region that marks both is the same, so that the fusion information phase-match of both; meanwhile, the optical microscope has the advantages that the optical axis of the optical microscope and the actual motion plane where the xy direction of the xyz-axis electric displacement platform is located have a vertical mode and a non-vertical mode, and the optical microscope has better practicability for on-site 3D imaging of height and undulation samples of different shapes, 3D sizes of defect parts of special samples and the like.

4. The utility model discloses be provided with high accuracy displacement sensor among microsystem's the electronic displacement platform of xyz axle, high accuracy displacement sensor can select one of magnetic grid or grating, a positional data and feed back it to the PC treater for real-time accurate collection xyz axle electronic displacement platform, coordinate information for proofreading control module feed back in advance, the actual precision of the grating of selection should "200 nanometers, in order to guarantee can real-time accurate collection displacement platform's positional information, PC treater has 3D formation of image measurement software of having simultaneously has the correction function that the z axle is beated, the small run-out of the z axle that produces to xy axle translation platform translation in-process through the algorithm carries out real-time compensation promptly, the most probable motion error that reduces the system, in order to improve the detection precision.

5. The utility model discloses microsystem has fully considered xy axle translation platform and the detection mode that z axle lifting module design formula as an organic whole or disconnect-type and detect the detection mode that the object is in motion state or quiescent condition among the electronic displacement platform of xyz axle, and at the practice application in-process, the homoenergetic super large area carries out 3D true color imaging to the microscopic state on material surface, shoots, accurate 3D measures, and the detection precision that realizes the metering level is simultaneously and is preserved the microscopic detail and the true colour on sample surface.

6. The utility model discloses microsystem detection method uses easy operation, has the characteristics of a key quick operation, can detect the position relation of sample apparent space point, straight line, face, such as surface roughness, the contained angle of space face and face, step height, micropore degree of depth etc. required parameter; meanwhile, the on-site 3D imaging of the fluctuating sample and the on-site measurement of the 3D size of the defective part of the sample are realized, the existing contact type measuring equipment can be replaced in most occasions, the price of the white light interference sensor is only 1/5-1/6 of a white light interference microscope, the white light interference sensor has the characteristics of no interference between adjacent points, ultra-small volume and contribution to system integration, and the white light interference sensor has good application prospect and is suitable for popularization and application.

Drawings

The invention will be described by way of example only and with reference to the accompanying drawings, in which

FIG. 1 is a schematic diagram of a metrology-level 3D super-depth-of-field interference microscopy system according to an embodiment of the present invention;

fig. 2 is a schematic diagram of an electrically adjustable z-axis lifting module in a metrology-level 3D super depth-of-field interference microscopy system according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a manual and electric dual-mode adjusting z-axis lifting module in a metrology-level 3D super-depth-of-field interference microscopy system according to an embodiment of the present invention;

fig. 4 is a partial schematic view of the optical axis of the optical microscope in fig. 3 and the optical axis of the white light interference sensor in the metrology-level 3D super depth-of-field interference microscope system according to the embodiment of the present invention arranged in parallel;

fig. 5 is a schematic diagram of the optical axis of the optical microscope in fig. 3 and the optical axis of the white light interference sensor in the metrology-level 3D super depth-of-field interference microscope system according to the embodiment of the present invention being not parallel;

fig. 6 is a schematic diagram of the separated installation of the optical microscope and the white light interference sensor in the metrology-level 3D super depth-of-field interference microscope system according to the embodiment of the present invention;

FIG. 7 is a schematic diagram of a z-axis lifting module of a metrology-level 3D super depth-of-field interference microscope system according to an embodiment of the present invention, the z-axis lifting module being capable of swinging;

fig. 8 is a partial schematic view of a metrology-level 3D super-depth-of-field interference microscopy system of an embodiment of the present invention in fig. 7;

fig. 9 is a schematic diagram of an xy-axis translation stage and a z-axis lifting module integrated design of a metrology-level 3D super depth-of-field interference microscopy system according to an embodiment of the present invention;

fig. 10 is a specific flowchart of the detection by using the metrology-level 3D super-depth-of-field interference microscopy system according to the embodiment of the present invention;

fig. 11 is a schematic flow chart illustrating a principle of a method for detecting a metrology-level 3D super-depth-of-field interference microscopy system according to an embodiment of the present invention;

FIG. 12 is a schematic diagram of optical 3D microscopic three-dimensional reconstruction by using the metrology-level 3D super-depth-of-field interference microscope system of the embodiment of the present invention to perform detection;

FIG. 13 is a 3D modeling actual process diagram of a detection method of a metrology-level 3D super-depth-of-field interference microscope system according to an embodiment of the present invention;

FIG. 14 is a 3D observation and measurement diagram of a measurement method of a metrology-level 3D super-depth-of-field interference microscope system according to an embodiment of the present invention;

fig. 15 is a schematic diagram of a bilinear difference algorithm in a method for detecting by using a metrology-level 3D super-depth-of-field interference microscopy system according to an embodiment of the present invention.

Description of reference numerals: 1-optical microscopy; 11-an objective lens; 12-ring light illuminator; 13-coaxial light illuminator; 14-an image acquisition unit; 15-optical axis of optical microscope; 2-white light interference sensor; 21-optical axis of the white light interference sensor; a 3-xyz axis electric displacement platform; 31-xy axis translation stage; a 32-z axis lift module; 4-upright post; 5, connecting blocks; 6-a base; 7-a main control box body; 71-xyz electric control unit; 72-a scan control unit; 8-PC processor; 9-coarse fine adjustment of the handle; 10-a support frame capable of swinging; 101-a rotating shaft; 102-a rotating shaft supporting seat; 103-locking mechanism.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

Example 1

The embodiment is substantially as shown in fig. 1 to 9: the embodiment provides a metering-grade 3D super-depth-of-field interference microscope system, which comprises an optical microscope 1, a white light interference sensor 2, an xyz-axis electric displacement platform 3, a corresponding control module and a PC (personal computer) processor 8; the optical microscope 1 is provided with an illumination light source and an image acquisition unit 14, wherein the image acquisition unit 14 is used for acquiring image information of a target detection area and transmitting the image information to the PC processor 8; the PC processor 8 is internally provided with 3D imaging measurement software; the white light interference sensor 2 is used for collecting the outline information of the target detection area and transmitting the outline information to the PC processor 8; the control module comprises an xyz electric control unit 71, a white light interference signal processor 72 connected with the white light interference sensor 2 and a power supply module, the white light interference signal processor 72 is connected with the PC processor 8, the PC processor 8 is used for setting the scanning type, the scanning interval and the sampling frequency of the white light interference sensor 2, and sending an instruction to trigger the image acquisition unit 14 and the white light interference sensor 2 to acquire data; the xyz electric control unit 71 is electrically connected with a driver of the xyz electric displacement platform 3 and connected with the PC processor 8, and sends an instruction to trigger the xyz electric displacement platform 3 to move, for setting a detection start point, a detection end point and a scanning path, and feeding back coordinate information of the detection point to the PC processor 8;

the xyz-axis electric displacement platform 3 comprises an xy-axis translation table 31 and a z-axis lifting module 32, and the xy-axis translation table 31 and the z-axis lifting module 32 are respectively connected with an xyz electric control unit 71, so that the optical microscope 1 and the white light interference sensor 2 detect an object in a three-dimensional space formed in the xyz-axis direction; preferably, as the embodiment, a high-precision displacement sensor is arranged in the xyz-axis electric displacement platform 3, and the high-precision displacement sensor may be one of a magnetic grid or a grating, and specifically may be installed on the xy-axis translation stage 31, and is used for accurately acquiring position information of the xy-axis translation stage 31 in real time and feeding back the acquired information data to the PC processor 8, so as to accurately control the movement distance of the xy-axis translation stage 31; specifically, the actual accuracy of the selected grating should be 200 nm, so as to ensure that the position information of the displacement platform can be accurately acquired in real time.

The PC processor 8 is used for receiving, analyzing and storing the object image information collected by the image collecting unit 14, and the object contour information and the coordinate data corresponding to the xyz axis collected by the white light interference sensor 2, and is used for three-dimensional imaging and modeling.

Specifically, the optical microscope 1 provided in this embodiment includes a microscope lens, the microscope lens may be an existing high power microscope, or an industrial single-tube low power microscope, and the specific structure and working principle thereof are the prior art and are not the invention of the present disclosure, and therefore are not described herein again; an illumination light source is arranged on the microscope head, specifically, an illuminator for providing the illumination light source is arranged on the microscope head, the rotation of the illuminator can be a coaxial light illuminator 13, an annular light illuminator 12, an oblique incidence illuminator or a polarized light illuminator, the illumination light source is an LED light source, the illuminator provides a high-brightness LED light source for a microscope lens, and the coaxial illuminator is designed in an L-shaped structure, so that the design volume can be reduced; thus, the microscope lens of this embodiment integrates the high-magnification objective lens 11, the coaxial illuminator and the objective lens 11 into a whole, and the half-reflecting and half-transmitting reflector is arranged at the corresponding position in the high-magnification objective lens 11, so as to achieve the effect of coaxial illumination; the lower end face of the lens body is provided with the objective lens 11 turntable, a plurality of objective lenses 11 can be arranged and switched, and the detection requirements of different multiples are met.

The optical microscope 1 and the white light interference sensor 2 provided by this embodiment are connected with a z-axis lifting module through a connecting block 5, the z-axis lifting module is installed on a base 6 through an upright post 4, and the z-axis lifting module is configured with a lifting driver for driving a microscope lens to move along the vertical direction, the driver is directly connected with an xyz electric control unit 71, and the lifting driver in the lifting module drives the connecting block 5 and the microscope lens and the white light interference sensor 2 to move up or down along the vertical direction.

The xy-axis translation stage 31 provided in this embodiment may be a manual or electric linear xy-translation stage, or may be an existing piezoelectric nano-displacement stage; as shown in fig. 1 and fig. 2, the xy-axis translation stage 31 and the z-axis lifting module 32 may be designed to be separated, for example, the optical microscope 1 and the white light interference sensor 2 are installed on the z-axis lifting module 32 in this embodiment, and the z-axis lifting module 32 is installed on one side of the xy-axis translation stage 31 through the column 4, so that the z-axis lifting module 32 does not move synchronously with the xy-axis translation stage 31.

The optical microscope 1 and the white light interference sensor 2 provided in this embodiment may be mounted on the z-axis lifting module 32 through one connection block 5, or may be mounted on the z-axis lifting module 32 through different connection blocks 5 as shown in fig. 6.

The microscope system of this embodiment provides an image collecting unit 14 with a built-in control circuit board, the control circuit board is connected with a PC processor 8 and a power module, the image collecting unit 14 is located at the upper end of a microscope lens, the image collecting unit 14 is configured to collect an observation sample image below the microscope lens, the image collecting unit 14 provided by this embodiment specifically uses an existing color CCD photosensitive chip or color CMOS photosensitive chip to ensure that the sample color is obtained, such as the photosensitive chip of sony IMX22, a real color sample surface texture structure can be obtained, the image collecting unit 14 feeds back image information to the PC processor 8 to be displayed as an image for a detection worker to observe, and combines with the design of a driver in a z-axis lifting module, which can perform real-time observation on fine defects on different height levels of a field fluctuating sample, and is beneficial for the field detection worker to observe a large object fine defect representation mode on the field while observing the sample without damage, and determining the grade of the fine defects of the sample by combining with the overall observation of the microscopic target.

In combination with the connection of the image acquisition unit 14 and the PC processor 8, the drive of the z-axis lifting module 32 provided in this embodiment specifically uses a five-phase stepping motor, and the lifting transmission structure may specifically use a rack-and-pinion structure, so as to ensure the moving stability of the microscope lens; specifically, the five-phase stepper motor in this embodiment can prevent the step loss phenomenon in the moving process, accurately record the distance of the upper body or the descending movement of the microscope, and ensure the accuracy of the final measurement, so that the elevation control unit controls the elevation driver to drive the connecting block 5, and the micro lens and the white light interference sensor 2 connected with the connecting block 5 to ascend or descend along the vertical direction, and can dynamically observe the fine defects of large samples with large height and undulation in real time; so z axle lift module 32 drives the microscope head and seeks out the sample peak and the minimum of fluctuation of height to carry out the multilayer scanning through mobile terminal, gather this layer of image and transmit to mobile terminal through image acquisition module when every layer is scanned, and then do benefit to the site detection worker and carry out accurate comprehensive analysis to the slight quality of sample, in order to obtain the slight quality information of accurate sample.

The control module provided by the embodiment is arranged in a main control box body 7, the main control box body 7 is designed into an integrated box body, a corresponding communication interface is arranged on an outer shell, and an xyz electric control unit 71, a white light interference signal processor 72 and a power module are contained in the integrated box body; the PC processor 8 is configured to receive, analyze and store the image information collected by the image collection unit 14 and the height position data of the relief sample and perform 3D modeling of the sample surface, the object contour information collected by the white light interference sensor 2 and the xy-axis coordinate data of the relief sample and perform 3D modeling of the sample surface, and coordinate information processing corresponding to the xyz-axis.

The PC processor 8 is provided with 3D imaging measurement software, the PC processor 8 receives image information acquired by the image acquisition module and receives z-axis height position data of a fluctuating sample obtained by the fact that a driver in a z-axis lifting module drives a microscope to move up and down, the multilayer scanning height position data and image information of corresponding layers enter the 3D imaging measurement software in the mobile terminal, accurate 3D modeling of the microscopic surface of the detected sample is achieved, and actual data of the surface microcosmic of a large object are accurately expressed; the real-time observation of the fine defects can be realized while the on-site height and undulation sample is not damaged, and the microscopic actual data of the surface of the large object can be accurately expressed through the surface texture structure with uniform definition, so that the real-time observation method has a good application prospect.

Example 2

Example 2 is substantially the same as example 1 except that: as a preferable aspect of embodiment 1, as shown in fig. 4 and 5, the optical axis 15 of the optical microscope 1 and the optical axis 21 of the white light interference sensor 2 have a parallel manner and a non-parallel manner; when the two are not parallel, the optical microscope has a straight line L and a projection plane perpendicular to the straight line L, the straight line L is perpendicular to the optical axis 15 of the optical microscope 1, the straight line L is perpendicular to the optical axis 21 of the white light interference sensor 2, and an acute angle formed by two intersecting straight lines formed by the optical axis 15 of the optical microscope 1 and the optical axis 21 of the white light interference sensor 2 projected on the projection plane is between 0 and 60 degrees; before detection, the relative coordinates of the intersection point of the optical axis 15 of the optical microscope 1 and the optical axis 21 of the white light interference sensor 2 extending on the standard surface are determined for calibration, and the target detection areas of the two are ensured to be the same, so that the fusion information of the two is matched; the system deviation caused by the angle inclination of the white light interference sensor 2 is automatically corrected by the PC processor 8, and the final data is ensured to be three-dimensional data with real appearance.

Example 3

Example 3 is essentially the same as example 1, except that: as a preferable scheme of the embodiment 1, as shown in fig. 3 and 7, the optical axis 15 of the optical microscope 1 provided by the present embodiment has a perpendicular mode and a non-perpendicular mode with respect to the actual motion plane where the xy direction of the xyz-axis electric displacement platform 3 is located; when the two are not perpendicular, the swing angle of the optical microscope 1 is between-90 ° and 90 ° with the vertical direction as a reference line. The system deviation caused by the angle inclination of the sample is automatically corrected by the PC processor 8, and the final data is ensured to be three-dimensional data of real appearance.

Example 4

Example 4 is essentially the same as example 3, with the main differences compared to example 3: as shown in fig. 7 and 8, the optical axis 15 of the optical microscope 1 provided in this embodiment is not perpendicular to the actual movement plane of the xy direction of the xyz-axis electric displacement platform, and the swingable support frame 10 is provided at the bottom of the pillar on which the z-axis lifting module 32 is installed, specifically, the swingable support frame 10 includes a rotating shaft 101 connected to the pillar, a rotating shaft support base 102 fixedly installed on the base 6, and a locking mechanism 103, so as to swing the pillar, drive the z-axis lifting module 32 installed on the pillar, and swing the optical microscope 1 installed on the z-axis lifting module 32 through the connection block 5, and with the vertical direction as a reference line, the swing angle of the optical microscope 1 is between-90 ° and 90 °, so as to implement the detection of a detection sample with a complicated structure, and have good practicability.

Example 5

Example 5 is essentially the same as example 3, and compared with example 3, the main difference is that: as shown in fig. 9, in this embodiment, the xy-axis translation stage 31 and the z-axis lifting module 32 may also be designed as an integral body, so that the z-axis lifting module 32 moves synchronously with the xy-axis translation stage 31, and the optical microscope 1 and the white light interference sensor 2 are installed outside the xyz-axis electric displacement platform 3 through a fixed support device or installed above the xy-axis translation stage 31 through a support frame (e.g., a gantry). In the embodiment, the xy-axis translation stage 31 and the z-axis lifting module 32 are designed into an integral body, an object to be detected is placed on the integral type xyz-axis electric displacement platform 3 to be detected along with synchronous movement of the integrated type xyz-axis electric displacement platform, the object to be detected is in a motion state, and the optical microscope 1 and the white light interference sensor 2 are in a static state; of course, in this embodiment, the optical microscope 1 and the white light interference sensor 2 may also be mounted on the xyz-axis electric displacement platform 3, so that the optical microscope 1 and the white light interference sensor 2 are in a motion state to detect a stationary object, and both can effectively complete sample detection.

Example 6

The embodiment is substantially as shown in fig. 10 and 11: fig. 10 and fig. 11 respectively show a specific work flow diagram and a schematic diagram for detection by using the metrology-level 3D super-depth-of-field interference microscope system according to an embodiment of the present invention, and the specific detection method thereof includes the following steps:

the method comprises the following steps: acquiring a real-time clear optical image of the optical microscope 1, setting the center of the image as a starting point position, and determining a detection starting point and a detection end point; the specific operation method comprises the following steps:

1. manually adjusting the coarse and fine adjustment handle 9 or sending an ascending/descending instruction to the z-axis lifting module 32, observing a microscopic image in a screen of the PC processor 8 until the microscopic image is completely clear or partially clear, and setting the center of the image as a plane motion starting point;

2. sending a lifting instruction to the xyz-axis electric displacement platform 3, executing the instruction by a driver and a controller in the xyz electric control unit 71 to lift the z-axis lifting module, driving the optical microscope to lift by the z-axis lifting module, finding the highest point of a fluctuating sample in a target detection area by the optical microscope in combination with the motion of the xy-axis translation table, and determining the position of the highest point (namely, a z-axis scanning starting point) in the PC processor;

3. sending a descending instruction to an xyz-axis electric displacement platform, executing the instruction by a driver and a controller in an xyz electric control unit so as to enable a z-axis lifting module to ascend and descend, driving an optical microscope to descend by the z-axis lifting module, finding the lowest point of a fluctuating sample in a target detection area through the optical microscope by combining the motion of an xy-axis translation table, and determining the position of the lowest point (namely, a z-axis scanning terminal point) in a PC (personal computer) processor;

step two: determining a moving detection starting point, a moving detection end point, a scanning distance, a scanning path and a scanning speed of a plane xy direction of a target detection area in a PC (personal computer), and accurately determining the target detection area;

step three: triggering the optical microscope and the xyz-axis electric displacement platform, enabling the optical microscope to realize micro-optical 3D scanning in a preset target detection area according to a preset scanning path, acquiring images of each layer by using an image acquisition unit configured on the optical microscope, simultaneously recording z-axis height position data of the layer, sending the z-axis height position data of each layer and the corresponding scanning image into 3D imaging measurement software in a PC (personal computer) processor for 3D synthesis, realizing micro-optical 3D modeling and measurement of a single view field of a sample, obtaining an optical display image and an optical microscope 3D model of the target detection area, and enabling the xyz-axis electric displacement platform to return to a starting point after scanning; the optical-level microscopic 3D scanning result obtained in the step at least comprises a conventional microscopic image, a super depth of field planar image and an optical microscopic 3D model of a target detection area, and one or more of a panoramic conventional microscopic image spliced by multi-view conventional microscopic images, a panoramic super depth of field planar image spliced by multi-view super depth of field planar images and a panoramic optical microscopic 3D model spliced by a multi-view optical microscopic 3D model;

in the third step, the 3D modeling method includes the following steps:

s1, scanning in the z direction through the xyz-axis electric displacement platform, acquiring multi-layer sequence images of the surface of the object in the z direction, acquiring the z-axis current height value corresponding to each layer of image, ensuring that the whole sequence image covers the highest point and the lowest point of a three-dimensional relief surface in a target detection area in the scanning range, and recording z-axis height position data corresponding to each layer of sequence image while acquiring the sequence images;

s2, calculating the focusing clear values of all pixel points or pixel point sets in sequence images at different heights by adopting a focusing evaluation function, comparing the pixel points or pixel point sets at the same xy coordinate position in all the sequence images, finding out the focusing evaluation maximum value of the pixel points or pixel point sets at different layers, wherein the maximum value corresponds to the layer with the clearest focusing under the xy coordinate, and taking the height value of the layer with the clearest focusing as the height value z1 of the object surface in the local area;

s3, taking the pixel or pixel set of the picture corresponding to the focus evaluation maximum position as the DFD (Depth From Defocus) image pixel value of the area, obtaining the local clearest image, sequentially calculating all the pixels or pixel sets, finally synthesizing the completely focused clear super Depth-of-field planar image, taking the super Depth-of-field planar image as the skin, and reconstructing a three-dimensional color map capable of reflecting the surface topography of the object by combining the xy coordinate values corresponding to the z1 value and the zl value in the step S2 to complete an optical 3D microscopic model:

specifically, fig. 12 shows the optical 3D microscopic three-dimensional reconstruction schematic diagram in the super depth of field microscopic detection method of the embodiment of the present invention, its reconstruction algorithm: the optical 3D microscopic imaging algorithm is based on the focusing definition calculation of images of different layers, the edge sharpening degree of the focusing definition images is higher in a general mode, and a gradient operator is used

The method has isotropy and rotation invariance, edges and lines in different trends in the image can be highlighted, the image edges are sharper when the defocusing amount is smaller, and therefore the image gray gradient can be used for evaluating the focusing degree of the image. The second-order partial derivative is carried out on the linear differential Laplacian operator to obtain a high-frequency component, so that a relatively sharp edge is obtained, and the linear differential Laplacian operator can be used as an estimator of the high-frequency component. The focus sharpness values for each point in the different levels are calculated as follows:

because the differential calculation data volume is large, the patent uses the differential calculation which is easy to calculate to replace the complex differential calculation, simultaneously considers the texture change of the image, adds the variable step length step between the pixels to calculate the second order difference, and the single point definition value calculation formula is as follows:

ML(x,y)＝|2f(x,y)-f(x-step,y)-f(x+step,y)|+|2f(x,y)-f(x,y-step)-f(x,y

and for the whole image, collecting the position data corresponding to all the point definition maximum values to obtain the final 3D image data.

As shown in fig. 13 and 14, the above-mentioned 3D imaging measurement software has a function of acquiring multi-layer images and corresponding height position data, and the inherent small depth of field of the microscope is: the 3D imaging measurement software removes the fuzzy part outside the field depth in each layer of image through a definition comparison algorithm, retains the clear part inside the field depth in each layer of image, and finally passes through the retained clear part with high position data, namely when observing the fine apparent mass of a sample, the presented sample microscopic image has uniform definition, and can comprehensively understand all information carried by an experimental sample through microcosmic 3D imaging and modeling, so as to accurately express microcosmic actual data on the surface of a large object, and realize optical microscopic 3D imaging and modeling;

s4, after modeling of the single-view 3D microscope is completed, the xyz-axis electric displacement platform moves to an adjacent area according to a set program, the steps S1, S2 and S3 are executed again to obtain a second adjacent-view 3D microscopic model, and by analogy, a plurality of conventional microscopic images, super-depth-of-field planar images and optical microscopic 3D models covering the whole target detection area are obtained, and the conventional microscopic images, the super-depth-of-field planar images and the optical microscopic 3D models are spliced respectively to obtain a panoramic conventional microscopic image, a panoramic super-depth-of-field planar image and a panoramic optical microscopic 3D model in the target detection area.

The synthesis splicing can be divided into conventional microscopic image splicing, super-depth-of-field planar image splicing and 3D model splicing: and finally, obtaining an optical display image and an optical microscope 3D model of the target detection area:

1) and (3) common plane splicing:

after the 3D imaging measurement software collects a first picture, the xy-axis translation table is manually moved or an xy-direction moving instruction is sent out by a PC (personal computer) processor, a driver and a controller in the xyz electric control unit execute the instruction to drive the electric xy-axis translation table to move, a sample moves to a preset adjacent second visual field, the software collects a second picture, the two pictures are spliced in the software, and by analogy, a large-area microscopic image far exceeding the area of a single visual field is obtained.

2) And (3) splicing the super-depth-of-field plane and the 3D model:

A1. starting from an xy direction starting point, sending an optical microscope 3D scanning instruction at a PC processor, executing the instruction by a driver and a controller in an xyz electric control unit to enable a z-axis lifting module to move to drive an optical microscope and a white light interference sensor to synchronously move, scanning from the z-axis starting point direction to a z-axis terminal point, acquiring sequence images in multiple layers and recording height position data of corresponding layers, synthesizing the images and the height position data in 3D imaging measurement software, and automatically returning the z-axis lifting module to the z-axis starting point according to program setting after a first super depth-of-field plane image and a 3D model are completed; the method is a complete single-view optical microscope 3D scanning process, and a super depth-of-field planar image and a 3D model of the region can be obtained.

A2. Manually moving the xy-axis translation stage or sending an xy-direction plane movement instruction on a PC (personal computer) processor, executing the instruction by a driver and a controller in the xyz electric control unit so as to move the xy-axis translation stage, moving the sample to a preset second adjacent field of view, and repeatedly executing the optical microscopic 3D scanning process in the step A1, thereby completing a second scanning action and obtaining a second super depth-of-field plane image or a 3D model; the first super-depth-of-field planar image or the 3D model and the second super-depth-of-field planar image or the 3D model are automatically spliced in 3D imaging measurement software to complete the visual field expansion of the super-depth-of-field planar image and the 3D observation; by analogy, the platform moves according to a bow-shaped plane, a plurality of visual fields are obtained to realize splicing, and finally a large-area 3D model or a super-depth-of-field plane image to be observed can be obtained until a preset terminal point in the plane direction is reached. Large-area 3D observation far exceeding a single view field area and large-area optical super-depth-of-field plane image measurement are realized; the above-mentioned general image mosaic algorithm and 3D model mosaic algorithm are adopted as a prior art, and are not described herein again.

The common plane splicing, the super-depth-of-field plane splicing and the 3D model splicing can be realized by the following method: the starting point and the end point of the xy-axis translation stage are set in 3D imaging measurement software of the PC processor, the software automatically judges the acquisition number and the advancing direction of an acquisition path, the PC processor automatically executes automatic splicing, and the acquisition of large-area common plane splicing, super-field depth plane splicing and 3D model splicing is completed at one time.

Step four: triggering a white light interference sensor and an xyz-axis electric displacement platform, wherein the white light interference sensor realizes scanning in a preset target detection area according to a preset scanning path, and scanning the same area of the target detection area of the optical microscope in the third step; and sending the obtained height z data, scanning data and corresponding xy-axis coordinate data into imported 3D imaging measurement software for real-time reconstruction to obtain an image or a 3D point cloud model of the target detection area, and specifically comprising the following steps:

a1, manually adjusting the coarse and fine adjustment handle or sending an ascending/descending instruction through a PC processor to ensure that the distance between the white light interference sensor and the surface of the sample is kept within a working range, and ensuring that the PC processor software obtains the single-point height position data of the surface of the sample;

a2, presetting a starting point, a terminal point and a traveling route of the xy-axis translation table through a PC processor; the detection type and the acquisition frequency of the white light interference sensor are the 3D profile morphology of the target area and the like;

a3, starting to collect the position data of the xy-axis translation stage in the xy direction and synchronously collecting the height data of the white light interference sensor in real time according to the preset travelling route, and transmitting the position data and the height data to the PC processor till the detection end point.

a4, carrying out real-time 3D reconstruction on the xyz axis data acquired in the step a3 by using 3D imaging measurement software in a PC processor to obtain a 3D point cloud model with a preset area consistent with a scanning area of an optical microscope, and realizing 3D observation and 3D measurement of the sample to be measured.

Step five: fusing an optical microscopic 3D model obtained by microscopic optical level 3D scanning with a 3D point cloud model obtained by a white light interference sensor, and fusing a super depth-of-field planar image or a conventional microscopic image obtained by microscopic optical level 3D scanning with the 3D point cloud model obtained by the white light interference sensor to obtain a metering level 3D model of a target detection area, wherein the method specifically comprises the following steps;

b1, determining the offset data of the optical axis of the optical microscope and the optical axis of the white light interference sensor in the xy direction and recording the offset data into a PC processor to ensure that the microscope lens and the white light interference sensor are kept at a proper height;

b2, executing optical-level 3D scanning imaging to obtain an optical microscope 3D model and an image of the target detection area, wherein the process is completed, and the xyz-axis translation stage returns to the starting point of optical scanning;

b3, driving the sample by the xy-axis translation table, and moving according to the calibrated offset data to ensure that the scanning area of the optical microscope is consistent with that of the white light interference sensor;

b4, performing white light interference surface 3D scanning imaging to obtain a white light interference scanning image or a 3D model;

b5, fusing the optical microscope 3D model obtained in the step b2 with the white light interference 3D model obtained in the step b4 or fusing the image obtained in the step b2 with the white light interference 3D image obtained in the step b4 to obtain a completely new magnitude-counting 3D model with accurate three-dimensional data, optical color and texture, thereby completing the detection.

Wherein, the detection result obtained by the optical microscope and the detection result obtained by the white light interference sensor are fused; the method specifically comprises the following fusion modes:

c1, extracting texture, details and color of the single-view conventional microscopic image, and fusing the texture, details and color with a 3D point cloud model obtained by a white light interference sensor of the corresponding target detection area;

c2, extracting texture, details and color of the panoramic image after splicing the multi-view conventional microscopic image, and fusing the texture, details and color with a 3D point cloud model obtained by a white light interference sensor in a corresponding target detection area;

c3, extracting texture, detail and color of the single-view super-depth-of-field plane image, and fusing the texture, detail and color with a 3D point cloud model obtained by a white light interference sensor of a corresponding target detection area; the single-view super-depth-of-field planar image is a super-depth-of-field planar image of the area which is synthesized by a three-dimensional reconstruction algorithm from images with different heights in a single view;

c4, extracting texture, detail and color of the panoramic super-depth of field planar image formed after the multi-view super-depth of field planar image is spliced, and fusing the texture, detail and color with a 3D point cloud model obtained by a white light interference sensor corresponding to the target detection area; the panoramic super-depth-of-field image is a panoramic super-depth-of-field planar image containing multi-field depth-of-field information, which is synthesized by a plurality of adjacent single-field super-depth-of-field planar images through an image splicing algorithm;

and c5, extracting the xyz axis data of the 3D model obtained by the white light interference sensor to replace the xyz axis data of the optical microscope 3D model in the corresponding region, and realizing the fusion of the 3D point cloud model and the optical microscope 3D model in the target detection region.

In this embodiment, a 3D point cloud model obtained by a white light interference sensor and a panoramic super-depth-of-field planar image obtained by an optical microscope are taken as an example in a fusion process a, and 3D data in the fusion process are 3D point cloud data formed by z-axis height data acquired by the white light interference sensor and xy-axis coordinate data obtained by a magnetic grating sensor or a grating sensor installed on an xy-axis coordinate plane; the specific fusion method comprises the following steps:

(1) determining that the optical axis of the optical microscope and the optical axis of the white light interference sensor extend to overlap at the intersection point of the object detection surface through the calibration plate xyz shaft electric displacement platform, and the output coordinates are consistent;

(2) calibrating the optical microscope through a calibration plate, determining the magnification of image pixels of the optical microscope, and establishing the magnification relation between the image pixels and the actual size;

(3) fixing the xy-axis coordinate position in the xyz-axis electric displacement platform, adjusting the z-axis height of the optical microscope, and reconstructing a single-view super-depth-of-field image of the object at the position; then moving the xy-axis coordinate position of the object to detect the single-view super-depth-of-field planar image of the adjacent area of the object; by analogy, a plurality of single-view super-depth-of-field plane images forming the target detection area are obtained; finally, fusing the multiple single-view super-depth-of-field planar images through an image splicing algorithm to obtain a panoramic depth planar image of the whole target detection area;

(4) calculating the actual coordinate position of the xy axis corresponding to each point image pixel on the full depth-of-field planar image according to the xy coordinate position of the center point of the first full depth-of-field planar image obtained in the step (3) and by combining the camera image magnification ratio calibrated in the step (2);

(5) scanning the area where the panoramic deep plane image is located by using a white light interference sensor to obtain an accurate 3D height data set Q (x, y, z) in the target area;

(6) in order to make xy coordinate position that each pixel point in the panoramic super depth of field image is located, combine the high accuracy 3D height data set Q (x, y, z) that white light interference sensor obtained, because in the 3D height data that white light interference sensor obtained, every point that its x, y position correspond does not necessarily coincide completely in the panoramic super depth of field image pixel point, so calculate the final accurate height of corresponding pixel point through bilinear difference algorithm, the calculation method is as shown in FIG. 15: wherein, P is the actual x, y coordinate, Q corresponding to a pixel point on the panoramic super depth of field image₁₁，Q₁₂，Q₂₁，Q₂₂The nearest 4 adjacent points of the P point respectively.

For the P point, the 3D data scanned by 4 adjacent white light interference sensors are taken and are respectively Q₁₁，Q₁₂，Q₂₁，Q₂₂3D data of the measured object are respectively obtained from the white light interference sensor and the grating sensor on the xy coordinate axis;

first, linear interpolation calculation is performed twice in the X direction to obtain height values of R1 and R2.

Then, one interpolation calculation is performed in the Y direction. And obtaining the actual height of the xy coordinate position corresponding to the pixel point.

According to the method, the corresponding height of the points corresponding to all the pixels of the panoramic deep plane map is calculated by combining the calculation method with the 3D height data of the white light interference sensor, and finally the completely new calculation-level 3D model with accurate three-dimensional data, optical color and texture is obtained.

The white light interference sensor is a sensor for detecting the position or the shape of a measured object by using a white light interference technology, and the detection principle is as follows: by adopting a white light interference principle with an original confocal setting, the position of the central fringe of a white light interference pattern can change along with the external displacement input change, and the measured displacement can be measured by detecting the position of the central fringe through a photoelectric conversion module. White light interference technology is a prior art and is not described herein in detail; the white light interference sensor has the following characteristics: the device is insensitive to vibration, high in noise ratio, dual in vertical scanning/inclined scanning mode, 0.4 micron in minimum measurable thickness, free of interference between adjacent points, and capable of realizing ultra-small volume and facilitating system integration; the utility model discloses the high advantage of resolution ratio of white light interference sensor has been utilized, can provide the accurate information of the microcosmic three-dimensional space morphological structure of object the key lies in its formation of image principle that combines optical microscope, can carry out the true color imaging of 3D to the microscopic state of super large area to the material surface, shoot, accurate 3D measures, obtain the testing result who has colour, more detail texture, the measurement of ultra-high precision degree of a meter image, data and model, the microcosmic detail and the true colour that have the sample surface are kept simultaneously to the detection precision that realizes the measurement of degree of a meter.

Example 7

Example 7 is substantially the same as example 6 except that: in this embodiment, a 3D point cloud model obtained by a white light interference sensor and a single-view super-depth-of-field planar image obtained by an optical microscope are fused in an exemplary process B, and the specific fusion method includes the following steps:

(1) fixing the xy-axis coordinate position in the xyz-axis electric displacement platform, adjusting the z-axis height of the optical microscope, and reconstructing a single-view super-depth-of-field image of the object at the position; calculating the xy actual coordinate position corresponding to each point image pixel on the single-view super-depth-of-field image;

(2) the single-view super-depth-of-field picture is rectangular, two diagonal points of the rectangle are taken according to the size of the microscopic view range, and the two diagonal points are determined as a scanning starting point and an end point of the white light interference sensor; and (3) obtaining an accurate 3D height data set Q (x, y) in the region, wherein the data fusion calculation method is the same as the step (6) in the process A, so the details are not repeated, and finally obtaining a 3D point cloud model and an optical single-view super-depth-of-field plane image fusion model obtained by the white light interference sensor.

Example 8

Example 8 is essentially the same as example 6, except that: in this embodiment, for example, the method for extracting xyz axis data of a 3D point cloud model obtained by a white light interference sensor to replace the xyz axis data of the optical microscope 3D model in the corresponding region includes the following steps:

(1) step one, step two, step three and step four in the process of the embodiment 6 are executed;

(2) the optical microscopic 3D model and the white light interference sensor scanning 3D model can be directly obtained through the process, the starting point and the end point of the optical microscopic 3D model and the white light interference sensor scanning model in the xy direction are consistent, all data of the xyz axis of the white light interference sensor scanning model are directly extracted, the data in the xyz direction are led into the three-dimensional coordinate of the optical microscopic 3D model to generate a new model, the model generated by the white light interference sensor is taken as the standard, and the method has the following two modes:

firstly, the point of the optical microscopic 3D model and the scanning model of the white light interference sensor is superposed in the xy direction, then the xyz value of the point of the white light interference sensor is taken, and simultaneously the RGB value and the gray value of the point of the optical model are taken as the final result for modeling;

secondly, if the points of the optical microscope 3D model and the white light interference sensor scanning model do not coincide in the xy direction, taking the xyz value of the white light interference sensor scanning model point W1, and simultaneously obtaining the RGB value and the gray value of the optical microscope 3D model point W2 (the point closest to the point W1 in the xy direction is the point W2) as the final result for modeling;

(3) after the process is finished, the original optical microscopic 3D model is deleted, and a completely new metering-level 3D model of accurate three-dimensional data, optical color and texture can be obtained.

To sum up, the utility model discloses the ingenious advantage that has combined optical microscope and white light interference microtechnology of microsystem detection method, the operation is in the super depth of field interference microsystem of measurement level 3D, can take a picture by the super large area to the microscopic state on material surface when can the nondestructive observation sample, 3D true color imaging, 3D measures, its testing result is for having the colour simultaneously, the detail texture, the measurement order image of super high accuracy, data and model, realize the detection precision of measurement order and the detail and the true colour that keep the microscopic sample simultaneously, do benefit to scientific research personnel and detection worker quick, the observation sample micro-nano structure of harmless, small size defect etc., confirm the defect grade and measure 3D size and realize quantitative analysis, have fine application prospect and practical value.

The present invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification, and to any novel method or process steps or any novel combination of features disclosed.

Claims

1. The magnitude 3D super depth of field interference microscope system is characterized in that: the device comprises an optical microscope, a white light interference sensor, an xyz-axis electric displacement platform, a control module and a PC (personal computer) processor; the control module comprises an xyz electric control unit, a white light interference signal processor connected with the white light interference sensor and a power supply module; the control module is connected with a PC (personal computer) processor, and 3D imaging measurement software is arranged in the PC processor;

2. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the optical axis of the optical microscope and the optical axis of the white light interference sensor are parallel to each other.

3. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the optical axis of the optical microscope is not parallel to the optical axis of the white light interference sensor; when the two are not parallel, the optical microscope has a straight line L and a projection plane perpendicular to the straight line L, the straight line L is perpendicular to the optical axis of the optical microscope, the straight line L is perpendicular to the optical axis of the white light interference sensor, and an acute angle formed by two intersecting straight lines formed by the optical axis of the optical microscope and the optical axis of the white light interference sensor projected on the projection plane is between 0 and 60 degrees.

4. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: and the optical axis of the optical microscope is vertical to the actual motion plane of the xyz-axis electric displacement platform in the xy direction.

5. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the optical axis of the optical microscope is not perpendicular to the actual motion plane of the xyz-axis electric displacement platform in the xy direction; when the two are not vertical, the swing angle of the optical axis of the optical microscope is between-90 degrees and 90 degrees by taking the vertical direction as a reference line.

6. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the xy-axis translation table and the z-axis lifting module are designed to be separated, and the optical microscope and the white light interference sensor are installed on the z-axis lifting module, so that the z-axis lifting module does not synchronously move along with the xy-axis translation table.

7. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the xy-axis translation stage and the z-axis lifting module are designed into an integral body, so that the z-axis lifting module moves synchronously with the xy-axis translation stage, and the optical microscope and the white light interference sensor are installed outside the xy-z-axis electric displacement platform through a supporting device or above the xy-axis translation stage through a supporting frame.

8. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: and a high-precision displacement sensor is arranged in the xyz-axis electric displacement platform to acquire the position information of the xyz-axis electric displacement platform in real time and feed back the acquired position data to the PC processor for accurately controlling the moving distance of the xyz-axis electric displacement platform.

9. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the image acquisition unit at least comprises one of a color CCD or a color CMOS.

10. The metrology-level 3D super-depth-of-field interference microscopy system of claim 1, wherein: the xyz electric control unit, the white light interference signal processor and the power module are arranged in the same main control box body, and the outer shell is provided with a corresponding communication interface for connecting the illumination light source, the xyz shaft electric displacement platform, the white light interference sensor and the PC processor.