CN211578716U

CN211578716U - Chip heating test mechanism

Info

Publication number: CN211578716U
Application number: CN202020543002.6U
Authority: CN
Inventors: 荣国青; 门蒙; 张健星
Original assignee: Suzhou Huiken Electronic Technology Co ltd
Current assignee: Suzhou Huiken Electronic Technology Co ltd
Priority date: 2020-04-14
Filing date: 2020-04-14
Publication date: 2020-09-25
Anticipated expiration: 2030-04-14

Abstract

The utility model discloses a chip heating accredited testing organization, package include linkage unit, test element, heating unit and transmission structure, and linkage unit contains the tool connecting plate, and test element contains the base, and the heating unit contains the heating plate, and transmission structure contains connection substrate, suction nozzle fixed block, briquetting, suction nozzle. The utility model has the advantages that: the chip snatchs through transmission structure, places, and the position is placed accurately to the chip, and transmission structure need not the adjustment, and the process is few, saves man-hour, has improved the detection efficiency of chip, and support gasket, the pin in the gasket groove can prevent that the chip from damaging because of the excessive pressure in the transmission course, improves the qualification rate that the chip detected, reduces the loss, can protect the briquetting suction nozzle can not damage because of high temperature, and the heating plate adopts the machine tooling preparation simultaneously, just the utility model discloses a testing mechanism can detect four chips simultaneously, and a plurality of chips can be placed to the heating plate, can heat the test to last hundred chips simultaneously, and is efficient.

Description

Chip heating test mechanism

Technical Field

The utility model relates to a chip test technical field specifically is a chip heating accredited testing organization.

Background

With the development of science and technology, the development of the chip industry is faster and faster, and the miniaturization and multifunction of the chip are the development trend of the modern chip industry. Because the chip production needs hundreds of steps of processes, and the device failure can be caused by the error of any step, the chip detection link is very important, and the qualification rate of the chip production can be improved by adopting a good chip testing mechanism. Common chip detection mechanism often can only once detect one or two chips, and detection efficiency is low, and the chip does not have the protection at transmission in-process, often appears the crushing that excessive pressure leads to, damages, makes the chip cause very big waste, and every kind of detection of chip, all needs the change equipment, and the process is loaded down with trivial details, and detection efficiency is low, and when the change equipment, the chip appears bad damage easily in handling, causes very big loss.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip heating accredited testing organization to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a chip heating test mechanism comprises a connecting unit, a test unit, a heating unit and a transmission structure, wherein the connecting unit comprises a jig connecting plate, four first chip grooves which are linearly arranged are arranged on the jig connecting plate, four gasket grooves which are arranged in a square shape are arranged on the jig connecting plate, and the gasket grooves are symmetrically arranged on the front side and the rear side of the first chip grooves;

the test unit comprises a base, four second chip grooves and four second pins are linearly arranged on the base, and a second induction groove and a first induction groove are respectively arranged on the front side and the rear side of each second chip groove;

the heating unit comprises a heating plate, a third chip groove is formed in the heating plate, and handles are arranged on the left side and the right side of the heating plate;

the transmission structure comprises a connecting substrate, a suction nozzle fixing block, a pressing block and a suction nozzle, wherein the suction nozzle fixing block is fixed on the connecting substrate, the pressing block is arranged below the suction nozzle fixing block and connected with the connecting substrate, and the suction nozzle is fixed on the suction nozzle fixing block and connected with the connecting substrate and the pressing block.

Further preferably, the jig connecting plate is provided with four first pins which are arranged on two sides of the first chip groove, the distance between every two adjacent first pins is equal to the distance between every two adjacent second pins, and the gasket groove is internally connected with a supporting gasket.

Preferably, the press block is provided with two positioning holes, and the distance between the two positioning holes is equal to the distance between the two adjacent second pins.

Further preferably, the first chip groove and the third chip groove are both designed to be through grooves, the second chip groove is designed to be blind grooves, and through holes are formed in the bottoms of the first chip groove and the third chip groove.

Preferably, the transmission structure is provided with two suction nozzles and two suction nozzle fixing blocks, and the distance between the two adjacent first chip grooves, the two second chip grooves and the two third chip grooves is equal to the distance between the two suction nozzles.

Further preferably, the third chip slot is designed to be a plurality of slots and is uniformly arranged on the heating plate.

Further preferably, the third chip groove on the heating plate is designed by machining and cutting.

Further preferably, the first sensing slot and the second sensing slot have different depths, are designed in a straight line, and penetrate through the center of the second chip slot.

Advantageous effects

The utility model discloses a chip heating accredited testing organization is a chip accredited testing organization of high accuracy, and the chip snatchs, places through drive structure, and the position is placed to the chip accurate, and drive structure need not the adjustment, and the process is few, saves man-hour, has improved the detection efficiency of chip, and the support gasket in the gasket groove, pin can prevent that the chip from damaging because of the excessive pressure in the transmission process, improve the qualification rate that the chip detected, reduce the loss, and the suction nozzle can not be protected because of high temperature to the briquetting, and the heating plate adopts the machine tooling preparation simultaneously, just the utility model discloses a accredited testing organization can detect four chips simultaneously, and a plurality of chips can be placed to the heating plate, can heat the test to last hundred chips simultaneously, and is efficient.

Drawings

Fig. 1 is a schematic structural diagram of a chip heating test mechanism according to an embodiment of the present invention.

Reference numerals

11-a jig connecting plate, 12-a first chip groove, 13-a gasket groove, 14-a supporting gasket, 15-a first pin, 21-a base, 22-a first induction groove, 23-a second pin, 24-a second chip groove, 25-a second induction groove, 31-a heating plate, 32-a third chip groove, 33-a handle, 41-a connecting substrate, 42-a suction nozzle fixing block, 43-a pressing block, 44-a suction nozzle, 45-a buckle and 46-a positioning hole.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

Examples

As shown in fig. 1, a chip heating test mechanism includes a connection unit, a test unit, a heating unit and a transmission structure, wherein the connection unit includes a jig connection plate 11, four first chip grooves 12 arranged in a straight line are disposed on the jig connection plate 11, four gasket grooves 13 arranged in a square shape are disposed on the jig connection plate 11, and the gasket grooves 13 are symmetrically disposed on the front and rear sides of the first chip grooves 12;

the testing unit comprises a base 21, wherein four second chip grooves 24 and four second pins 23 which are linearly arranged are arranged on the base 21, and a second induction groove 25 and a first induction groove 22 are respectively arranged at the front side and the rear side of each second chip groove 24;

the heating unit comprises a heating plate 31, a third chip groove 32 is formed in the heating plate 31, and handles 33 are arranged on the left side and the right side of the heating plate 31;

the transmission structure comprises a connecting substrate 41, a suction nozzle fixing block 42, a pressing block 43 and a suction nozzle 44, wherein the suction nozzle fixing block 42 is fixed on the connecting substrate 41, the pressing block 43 is arranged below the suction nozzle fixing block and connected with the connecting substrate 41, and the suction nozzle 44 is fixed on the suction nozzle fixing block 42 and connected with the connecting substrate 41 and the pressing block 43.

Four first pins 15 are arranged on the jig connecting plate 11 and are arranged on two sides of the first chip groove 12, the distance between every two adjacent first pins 15 is equal to the distance between every two adjacent second pins 23, and the supporting gaskets 14 are connected in the gasket grooves 13. The number of the supporting gaskets 14 can be designed according to the required height of the chip, so that the transmission structure is limited, the PCB connected with the chip and the jig connecting plate 11 is protected, and the loss caused by damage due to overvoltage is avoided.

The press block 43 is provided with two positioning holes 46, the distance between the two positioning holes 46 is equal to the distance between two adjacent second pins 23, so that the press block 43 can accurately move downwards onto the base 21, and the chip can be accurately placed into or taken out of the second chip groove 24 by the transmission structure.

The first chip groove 12 and the third chip groove 32 are all designed to be through grooves, the second chip groove 24 is designed to be blind grooves, and through holes are formed in the bottoms of the through grooves. A PCB is connected below the jig connecting plate 11, and a chip can be directly connected to the PCB in the first chip groove 12; the heating plate 31 is connected with a heat source, and the chip is in direct contact with the heat source in the third chip groove 32, so that the test effect is good; the second chip groove 24

The lower part is connected with a tester which is used for carrying out related tests on the chip through the through hole.

The transmission structure is provided with two suction nozzles 44 and two suction nozzle fixing blocks 42, the distances between the two adjacent first chip grooves 12, the two second chip grooves 24 and the two third chip grooves 32 are equal to the distance between the two suction nozzles 44, the transmission structure can be conveniently transmitted to the test unit from the connecting unit and then transmitted to the heating unit, the transmission structure does not need to be adjusted, the transmission structure can be directly transmitted, the working procedures are reduced, the time is saved, and the working efficiency is improved.

The third chip groove 32 adopts a multi-groove design, is uniformly arranged on the heating plate 31, and can simultaneously perform heating test on a plurality of chips. The utility model discloses a heating accredited testing organization, the third chip groove 32 on heating plate 31 adopts the range design of eight lines sixteen rows, can realize heating the test to one hundred twenty eight chips at every turn, and efficiency of software testing is high.

Third chip groove 32 on heating plate 31 adopts the machining cutting design, makes simply, conveniently, practices thrift the cost, just the utility model discloses a heating accredited testing organization, heating plate 31 adopt this kind of metal material of stainless steel to make, but high temperature resistant detects, when the heating test, can not take place deformation, and is durable, and guarantees that the chip can not damage because of heating plate 31 deformation.

The depths of the first induction groove 22 and the second induction groove 25 are not equal, the two are designed in a straight line and penetrate through the center of the second chip groove 24, and the first induction groove 22 and the second induction groove 25 are connected with an inductor for inducing whether a chip is placed in place in the second chip groove 24.

The lower part of the pressing block 43 is provided with a bulge, the bulge is provided with a through hole and is connected with the suction nozzle 44, and when the chip is heated and tested, the bulge can ensure that the heating test of the transmission structure can be smoothly carried out.

The side of the connection substrate 41 of the transmission structure is provided with two hasps 45 which are connected with the manipulator for fixing the transmission structure.

The second pin 23 is designed to be a truncated cone step type and is used for guiding the pressing block 43 of the transmission structure to move downwards, the chip can be prevented from being damaged by the excessive downward distance of the transmission structure, and the second pin 23 is accurately positioned.

The utility model discloses a chip heating accredited testing organization can test four chips simultaneously, and its work flow is as follows:

s1), the transmission structure moves downward to the connection unit, the pressing plate 43 moves downward along the first pin 15 on the jig connection plate 11, and the suction nozzle 44 takes out the chip connected with the PCB from the first chip slot 12;

s2) the transmission structure drives the chip to move from the connection unit to the test unit, the pressing block 23 descends along the second pin 23 to the round step of the second pin 23 to stop, the transmission structure puts the chip into the test unit, and the bulge on the pressing block 23 tightly covers the chip to test the chip;

s3), after the test of the test unit is finished, the chip is taken out from the second chip groove 24 by the transmission structure and is transmitted to the third chip groove 32 of the heating plate 31 for high temperature resistance test;

s4), the chip is removed by the transmission structure.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.

Claims

1. The utility model provides a chip heating accredited testing organization, includes linkage unit, test element, heating element and transmission structure, its characterized in that: the connecting unit comprises a jig connecting plate (11), four first chip grooves (12) which are linearly arranged are formed in the jig connecting plate (11), four gasket grooves (13) which are arranged in a square shape are formed in the jig connecting plate (11), and the gasket grooves (13) are symmetrically arranged on the front side and the rear side of the first chip grooves (12);

the testing unit comprises a base (21), four second chip grooves (24) and four second pins (23) which are arranged in a straight line are arranged on the base (21), and a second induction groove (25) and a first induction groove (22) are respectively arranged on the front side and the rear side of each second chip groove (24);

the heating unit comprises a heating plate (31), a third chip groove (32) is formed in the heating plate (31), and handles (33) are arranged on the left side and the right side of the heating plate (31);

the transmission structure comprises a connecting substrate (41), a suction nozzle fixing block (42), a pressing block (43) and a suction nozzle (44), wherein the suction nozzle fixing block (42) is fixed on the connecting substrate (41), the pressing block (43) is arranged below the suction nozzle fixing block and connected with the connecting substrate (41), and the suction nozzle (44) is fixed on the suction nozzle fixing block (42) and connected with the connecting substrate (41) and the pressing block (43).

2. The chip heating test mechanism of claim 1, wherein: be equipped with four first pins (15) on tool connecting plate (11), it arranges in the both sides in first chip groove (12), adjacent two distance between first pin (15) equals with distance between two adjacent second pins (23), gasket groove (13) in-connection has support pad (14).

3. The chip heating test mechanism of claim 1, wherein: two positioning holes (46) are formed in the pressing block (43), and the distance between the two positioning holes (46) is equal to the distance between the two adjacent second pins (23).

4. The chip heating test mechanism of claim 1, wherein: the first chip groove (12) and the third chip groove (32) are both designed to be through grooves, the second chip groove (24) is designed to be blind grooves, and through holes are formed in the bottoms of the second chip grooves.

5. The chip heating test mechanism of claim 1, wherein: the transmission structure is provided with two suction nozzles (44) and two suction nozzle fixing blocks (42), and the distance between the two adjacent first chip grooves (12), the two second chip grooves (24) and the two third chip grooves (32) is equal to the distance between the two suction nozzles (44).

6. The chip heating test mechanism of claim 1, wherein: the third chip groove (32) adopts a multi-groove design and is uniformly arranged on the heating plate (31).

7. The chip heating test mechanism of claim 1, wherein: and a third chip groove (32) on the heating plate (31) adopts a machining and cutting design.

8. The chip heating test mechanism of claim 1, wherein: the depths of the first induction groove (22) and the second induction groove (25) are not equal, and the first induction groove and the second induction groove are designed in a straight line and penetrate through the center of the second chip groove (24).