CN211578712U

CN211578712U - Caching device for silicon wafer automatic production line

Info

Publication number: CN211578712U
Application number: CN202020693263.6U
Authority: CN
Inventors: 彭加山; 彭晓芳
Original assignee: Suzhou Laijin Electromechanical Automation Co ltd
Current assignee: Suzhou Laijin Electromechanical Automation Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-09-25
Anticipated expiration: 2030-04-30

Abstract

The utility model discloses a silicon chip is buffer memory device for automation line, the on-line screen storage device comprises a base, the base top is provided with the push jack, and four spliced poles of push jack upside outer wall fixedly connected with, spliced pole fixedly connected with axletree board, and axletree board upside outer wall fixedly connected with vertical scroll, vertical scroll one end fixedly connected with movable block, and movable block swing joint have the lead screw, the equal fixedly connected with mount in lead screw both ends, and mount fixedly connected with roof. The utility model discloses can be through the automation that increases production process, the silicon chip quantity that can prevent to produce is huge, and unable in time letter sorting is in order to realize follow-up buffer memory, can prevent that the silicon chip from stacking too much and be unfavorable for the production operation, can be convenient for the transport in later stage and store, prevents that the silicon chip from scattering in disorder and occupying space, can satisfy the buffer memory of large amount silicon chip, can carry out jet-propelled dust removal to the silicon chip surface that the conveying was come, prevents that the silicon chip surface from having the dust.

Description

Caching device for silicon wafer automatic production line

Technical Field

The utility model relates to a silicon chip buffer memory technical field especially relates to a silicon chip is buffer memory device for automation line.

Background

The silicon element is one of the most abundant elements in the earth crust, and the content of the silicon element in the earth crust reaches 25.8 percent, thereby providing an inexhaustible source for the production of monocrystalline silicon. The silicon chip is used as a component of a chip, and is widely applied to aviation, aerospace, industry, agriculture and national defense, and even to every common family.

After the silicon block is cut into the silicon wafer, a plurality of production steps are required, but the silicon wafer cut at present needs to be cached by manual operation due to the fact that no specific device is used for assisting, so that subsequent processing can be completed, when the number of the silicon wafers is large, manual operation is difficult to achieve, the production of the silicon wafer is greatly influenced, and therefore the caching device for the production line is required to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a caching device for a silicon wafer automatic production line.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a silicon chip is buffer memory device for automation line, includes the base, the base top is provided with the push jack, and four spliced poles of push jack upside outer wall fixedly connected with, spliced pole fixedly connected with axletree board, and axletree board upside outer wall fixedly connected with vertical scroll, vertical scroll one end fixedly connected with movable block, and movable block swing joint has the lead screw, the equal fixedly connected with mount in lead screw both ends, and mount fixedly connected with roof.

As a further aspect of the present invention: a conveying plate is movably connected above the base.

As a further aspect of the present invention: both sides of the base are provided with a silicon wafer box, and a silicon wafer hole is formed in the silicon wafer box.

As a further aspect of the present invention: the outer wall fixedly connected with support frame of silicon chip case, and support frame fixedly connected with slide.

As a further aspect of the present invention: the outer wall of the sliding seat is fixedly connected with a controller, and the inner wall of the sliding seat is connected with a support in a sliding manner.

As a further aspect of the present invention: the support is fixedly connected with a slide rail, and the slide rail is connected with a track in a sliding manner.

As a further aspect of the present invention: the outer wall of the upper side of the top plate is fixedly connected with an air pressure box, the outer walls of the two sides of the air pressure box are fixedly connected with air pipes, and one ends of the air pipes are fixedly connected with spray heads.

The utility model has the advantages that:

1. by arranging the base, the push piece and the vertical shaft, the device can be controlled by the numerical control panel, so that the push piece pushes the silicon wafers to move, the automation of the production process is improved, the reciprocating motion is realized by arranging the lead screw and the moving block, the large number of the produced silicon wafers can be prevented, and the silicon wafers cannot be sorted in time to realize subsequent cache;

2. by arranging the conveying plate, the silicon wafer box and the silicon wafer holes, the silicon wafers after production and cutting can be conveyed to the cache area in time, the situation that the silicon wafers are stacked too much and are not beneficial to production operation is prevented, the silicon wafers can be placed in the silicon wafer box, later-stage carrying and storage are facilitated, and the silicon wafers are prevented from occupying space in a scattered manner;

3. by arranging the sliding seat, the support and the controller, the controller can control the upward movement of the silicon wafer box, so that the caching of the silicon wafers is facilitated, the transverse movement of the silicon wafer box can be realized through the sliding rail and the rail, the backward movement of the filled silicon wafer box is facilitated, and meanwhile, other silicon wafer boxes move to continue caching, so that the caching of a large number of silicon wafers is met;

4. through setting up atmospheric pressure case, gas-supply pipe and shower nozzle, can carry out jet-propelled dust removal to the silicon chip surface that conveys, prevent that there is the dust on silicon chip surface.

Drawings

Fig. 1 is a schematic view of an overall structure of a cache apparatus for an automatic silicon wafer production line according to embodiment 1;

fig. 2 is a schematic view of a front view structure of a cache device for an automatic silicon wafer production line according to embodiment 1;

fig. 3 is a schematic partial structural diagram of a cache device for an automatic silicon wafer production line according to embodiment 1;

fig. 4 is a schematic view of an overall structure of a caching apparatus for an automatic silicon wafer production line according to embodiment 2.

In the figure: the device comprises a base 1, a push sheet 2, a connecting column 3, a shaft plate 4, a vertical shaft 5, a moving block 6, a lead screw 7, a fixing frame 8, a top plate 9, a conveying plate 10, a silicon wafer box 11, a silicon wafer hole 12, a supporting frame 13, a sliding seat 14, a controller 15, a support 16, a sliding rail 17, a track 18, an air pressure box 19, an air pipe 20 and a spray head 21.

Detailed Description

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-3, a silicon chip is buffer memory device for automation line, including base 1, base 1 top is provided with ejector pad 2, and the outer wall of 2 upsides of ejector pad has four spliced poles 3 through bolted connection, spliced pole 3 has an axletree 4 through bolted connection, and 4 upsides of axletree outer walls have vertical scroll 5 through bolted connection, 5 one ends of vertical scroll have movable block 6 through bolted connection, and movable block 6 swing joint has lead screw 7, lead screw 7 both ends all have mount 8 through bolted connection, and mount 8 has roof 9 through bolted connection.

Wherein, base 1 top swing joint has conveying board 10, and base 1 both sides all are provided with silicon chip case 11, and silicon chip case 11 is inside to be provided with silicon chip hole 12, and there is support frame 13 silicon chip case 11's outer wall through bolted connection, and support frame 13 has slide 14 through bolted connection, and there is controller 15 slide 14 outer wall through bolted connection, and slide 14 inner wall sliding connection has support 16, and support 16 has slide rail 17 through bolted connection, and slide rail 17 sliding connection has track 18.

The working principle is as follows: during the use, the silicon chip after the cutting is conveyed to the top of the base 1 by the conveying plate 10, the inductor of the top of the base 1 can send a signal to the numerical control panel, the numerical control panel can suspend the conveying of the conveying plate 10, the moving block 6 receives the signal sent by the numerical control panel, the lead screw 7 rotates to enable the moving block 6 to move, the moving block 6 drives the push piece 2, the push piece 2 is enabled to push the silicon chip to enter the silicon chip hole 12, when the push piece 2 reaches the edge of one side of the base 1, the inductor of the base 1 can send a signal to the numerical control panel again, the numerical control panel can start the conveying of the conveying plate 10, the controller 15 can receive a feedback signal of the numerical control panel, the sliding seat 14 is controlled to move upwards, the silicon chip hole 12 is enabled to be flush with the upper side plate. When the silicon wafer holes 12 of the silicon wafer boxes 11 are filled with silicon wafers, the controller 15 controls the slide rails 17 to move forward, and meanwhile, the slide rails 17 of the other group of silicon wafer boxes 11 are driven by the controller 15 to move forward to reach the position of the base 1 for caching the silicon wafers.

Example 2

Referring to fig. 4, in the present embodiment, compared with embodiment 1, the outer wall of the upper side of the top plate 9 is connected to an air pressure tank 19 through a bolt, the outer walls of both sides of the air pressure tank 19 are connected to air pipes 20 through bolts, and one end of each air pipe 20 is connected to a nozzle 21 through a bolt.

The working principle is as follows: when the silicon chip dust remover is used, when a silicon chip reaches the upper part of the base 1, the sensor above the base 1 can send a signal to the numerical control panel, the numerical control panel can send a signal to the air pressure box 19, the air pressure box 19 conveys high-pressure gas, and the silicon chip is subjected to air injection and dust removal through the spray head 21.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a silicon chip is buffer memory device for automation line, includes base (1), its characterized in that, base (1) top is provided with push jack (2), and four spliced poles (3) of push jack (2) upside outer wall fixedly connected with, spliced pole (3) fixedly connected with axletree board (4), and axletree board (4) upside outer wall fixedly connected with vertical scroll (5), vertical scroll (5) one end fixedly connected with movable block (6), and movable block (6) swing joint has lead screw (7), the equal fixedly connected with mount (8) in lead screw (7) both ends, and mount (8) fixedly connected with roof (9).

2. The caching device for the silicon wafer automatic production line according to claim 1, wherein a transfer plate (10) is movably connected above the base (1).

3. The caching device for the automatic silicon wafer production line according to claim 1 or 2, wherein the base (1) is provided with silicon wafer boxes (11) on both sides, and the silicon wafer boxes (11) are internally provided with silicon wafer holes (12).

4. The buffer device for the silicon wafer automatic production line according to claim 3, wherein the outer wall of the silicon wafer box (11) is fixedly connected with a support frame (13), and the support frame (13) is fixedly connected with a slide seat (14).

5. The buffer device for the silicon wafer automatic production line according to claim 4, wherein the outer wall of the slide carriage (14) is fixedly connected with the controller (15), and the inner wall of the slide carriage (14) is slidably connected with the support (16).

6. The caching device for the silicon wafer automatic production line according to claim 5, wherein the support (16) is fixedly connected with a slide rail (17), and the slide rail (17) is slidably connected with a rail (18).

7. The caching device for the silicon wafer automatic production line according to claim 1, wherein an air pressure box (19) is fixedly connected to the outer wall of the upper side of the top plate (9), air pipes (20) are fixedly connected to the outer walls of two sides of the air pressure box (19), and a nozzle (21) is fixedly connected to one end of each air pipe (20).