CN211557622U - High-frequency circuit board - Google Patents
High-frequency circuit board Download PDFInfo
- Publication number
- CN211557622U CN211557622U CN202020081322.4U CN202020081322U CN211557622U CN 211557622 U CN211557622 U CN 211557622U CN 202020081322 U CN202020081322 U CN 202020081322U CN 211557622 U CN211557622 U CN 211557622U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit
- circuit layer
- antenna
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a high-frequency circuit board, including the first antenna layer, first substrate layer, second circuit layer and the third circuit layer that stack up in proper order, be equipped with first bell mouth on first substrate layer and the second circuit layer, the tip of first bell mouth is close to the first antenna layer sets up, be equipped with first conductive medium in the first bell mouth, the first antenna layer through first conductive medium with the second circuit layer switches on; the second circuit layer is connected with the third circuit layer in a welding mode. The first antenna layer and the second circuit layer of the high-frequency circuit board are conducted in an electroless plating mode, so that the uniformity, the roughness and the flatness of the copper foil of the first antenna layer can keep the characteristics of the base material not damaged, the manufactured antenna is higher in size precision, and the quality of the antenna and the yield of the circuit board can be improved.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a high frequency circuit board.
Background
With the rapid development of applications such as automated driving, intelligent factories, smart homes and the like, the demand of high-frequency radar sensors is rapidly increased, and higher requirements are also put forward on high-frequency circuit boards serving as carriers. The conventional method for manufacturing the high-frequency circuit board needs to manufacture a coating on the outer layer, wherein the processing flows such as electroplating, resin filling, grinding and brushing and the like can cause the uniformity of the copper thickness of the outer layer to be poor and the roughness to be large. Further, the manufacturing accuracy of the outer-layer antenna size is affected, and finally the performance of the high-frequency antenna, such as resonant frequency, gain and impedance, is affected. In addition, the via holes on the bonding pads can cause the flatness of the copper surface to be poor, and the yield of the welded chip is affected, so that the conventional manufacturing method of the high-frequency circuit board cannot meet the requirement.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the high-frequency circuit board is provided, and the uniformity and the flatness of the copper foil of the antenna layer are good.
In order to solve the technical problem, the utility model discloses a technical scheme be:
a high-frequency circuit board comprises a first antenna layer, a first substrate layer, a second circuit layer and a third circuit layer which are sequentially stacked, wherein first conical holes are formed in the first substrate layer and the second circuit layer, small ends of the first conical holes are arranged close to the first antenna layer, first conductive media are arranged in the first conical holes, and the first antenna layer is conducted with the second circuit layer through the first conductive media; the second circuit layer is connected with the third circuit layer in a welding mode.
Further, a second substrate layer, a fourth circuit layer, a third substrate layer, a fifth circuit layer, a fourth substrate layer and a sixth circuit layer are sequentially arranged on a side face, far away from the second circuit layer, of the third circuit layer, a through hole is formed between the third circuit layer and the sixth circuit layer, an electroplated layer is arranged at the position of the through hole, and the third circuit layer, the fourth circuit layer, the fifth circuit layer and the sixth circuit layer are conducted through the electroplated layer.
Furthermore, an ink layer is arranged on one side surface of the sixth circuit layer, which is far away from the fifth circuit layer.
Further, a seventh line layer, a fifth substrate layer and an eighth antenna layer are sequentially arranged on a side face, away from the fifth line layer, of the sixth line layer, second conical holes are formed in the seventh line layer and the fifth substrate layer, small ends of the second conical holes are close to the eighth antenna layer, second conductive media are arranged in the second conical holes, the seventh line layer passes through the second conductive media and the eighth antenna layer are conducted, and the seventh line layer is connected with the sixth line layer in a welded mode.
Furthermore, the material of the first base material layer is FR4, PTFE or LCP.
Furthermore, the welding medium for welding connection of the second circuit layer and the third circuit layer is solder paste or conductive adhesive.
Furthermore, an electroplated layer and an ink layer are sequentially arranged on one side face, far away from the second base material layer, of the third circuit layer.
The beneficial effects of the utility model reside in that: the first antenna layer and the second circuit layer are conducted in an electroless plating mode, so that the uniformity, the roughness and the flatness of the copper foil of the first antenna layer can keep the characteristics of the base material not to be damaged, the manufactured antenna is higher in size precision, and the quality of the antenna and the yield of the circuit board can be improved.
Drawings
Fig. 1 is a cross-sectional view of a high-frequency circuit board according to a first embodiment of the present invention;
FIG. 2 is a broken view of a double-sided copper-clad plate according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of a high-frequency circuit board according to a first embodiment of the present invention during a manufacturing process;
fig. 4 is another cross-sectional view of the high-frequency circuit board according to the first embodiment of the present invention during the manufacturing process;
fig. 5 is another cross-sectional view of the high-frequency circuit board according to the first embodiment of the present invention during the manufacturing process;
fig. 6 is another cross-sectional view of the high-frequency circuit board according to the first embodiment of the present invention during the manufacturing process;
fig. 7 is another cross-sectional view of the high-frequency circuit board according to the first embodiment of the present invention during the manufacturing process;
fig. 8 is another cross-sectional view of the high-frequency circuit board according to the first embodiment of the present invention;
fig. 9 is a sectional view of a high-frequency circuit board according to a second embodiment of the present invention.
Description of reference numerals:
1. a first antenna layer; 2. a first base material layer; 3. a second circuit layer; 4. a third circuit layer; 5. a first conductive medium; 6. a second substrate layer; 7. a fourth line layer; 8. a third substrate layer; 9. a fifth circuit layer; 10. a fourth substrate layer; 11. a sixth wiring layer; 12. electroplating layer; 13. an ink layer; 14. a seventh wiring layer; 15. a fifth base material layer; 16. an eighth antenna layer; 17. a second conductive medium; 18. a double-sided copper-clad plate; 19. a first tapered bore.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The utility model discloses the most crucial design lies in: the first antenna layer and the second circuit layer are conducted in an electroless plating mode, so that the uniformity, the roughness and the flatness of the copper foil of the first antenna layer can keep the characteristics of the base material from being damaged.
Referring to fig. 1 to 9, a high-frequency circuit board includes a first antenna layer 1, a first substrate layer 2, a second circuit layer 3, and a third circuit layer 4, which are sequentially stacked, wherein first tapered holes 19 are formed in the first substrate layer 2 and the second circuit layer 3, small ends of the first tapered holes 19 are disposed near the first antenna layer 1, first conductive media 5 are disposed in the first tapered holes 19, and the first antenna layer 1 is conducted with the second circuit layer 3 through the first conductive media 5; the second circuit layer 3 is connected with the third circuit layer 4 by welding.
From the above description, the beneficial effects of the present invention are: the first antenna layer and the second circuit layer are conducted in an electroless plating mode, so that the uniformity, the roughness and the flatness of the copper foil of the first antenna layer can keep the characteristics of the base material not to be damaged, the manufactured antenna is higher in size precision, and the quality of the antenna and the yield of the circuit board can be improved.
Further, a second substrate layer 6, a fourth circuit layer 7, a third substrate layer 8, a fifth circuit layer 9, a fourth substrate layer 10 and a sixth circuit layer 11 are sequentially arranged on a side face, away from the second circuit layer 3, of the third circuit layer 4, a through hole is formed between the third circuit layer 4 and the sixth circuit layer 11, a plating layer 12 is arranged at the through hole, and the third circuit layer 4, the fourth circuit layer 7, the fifth circuit layer 9 and the sixth circuit layer 11 are communicated through the plating layer 12.
As can be seen from the above description, the third to sixth circuit layers are conventional four-layer boards, and the adjacent two circuit layers are electrically connected through the plating layer.
Further, an ink layer 13 is disposed on a side of the sixth circuit layer 11 away from the fifth circuit layer 9.
Further, a seventh line layer 14, a fifth substrate layer 15 and an eighth antenna layer 16 are sequentially arranged on a side face, away from the fifth line layer 9, of the sixth line layer 11, second taper holes are formed in the seventh line layer 14 and the fifth substrate layer 15, small ends of the second taper holes are close to the eighth antenna layer 16, a second conductive medium 17 is arranged in the second taper holes, the seventh line layer 14 is communicated with the eighth antenna layer 16 through the second conductive medium 17, and the seventh line layer 14 is connected with the sixth line layer 11 in a welded mode.
As is apparent from the above description, the antenna layers may be provided on both sides of the high-frequency circuit board.
Further, the material of the first base material layer 2 is FR4, PTFE or LCP.
As can be seen from the above description, the material of the substrate layer can be selected as required.
Further, a welding medium for welding connection of the second circuit layer 3 and the third circuit layer 4 is solder paste or conductive adhesive.
As can be seen from the above description, the welding medium can be selected as desired.
Furthermore, an electroplated layer 12 and an ink layer 13 are sequentially arranged on one side surface of the third circuit layer 4 away from the second substrate layer 6.
Example one
Referring to fig. 1 to 8, a first embodiment of the present invention is:
the utility model provides a high frequency circuit board, as shown in fig. 1, includes first antenna layer 1, first substrate layer 2, second circuit layer 3 and the third circuit layer 4 that stacks gradually the setting, be equipped with first bell mouth on first substrate layer 2 and the second circuit layer 3, the tip of first bell mouth is close to first antenna layer 1 sets up, be equipped with first conductive medium 5 in the first bell mouth, first antenna layer 1 passes through first conductive medium 5 with second circuit layer 3 switches on. The second circuit layer 3 is connected with the third circuit layer 4 in a welding mode, and a welding medium for welding the second circuit layer 3 with the third circuit layer 4 is solder paste or conductive adhesive. In this embodiment, a second substrate layer 6, a fourth circuit layer 7, a third substrate layer 8, a fifth circuit layer 9, a fourth substrate layer 10, and a sixth circuit layer 11 are sequentially disposed on a side of the third circuit layer 4 away from the second circuit layer 3, a through hole is disposed between the third circuit layer 4 and the sixth circuit layer 11, an electroplated layer 12 is disposed at the through hole, and the third circuit layer 4, the fourth circuit layer 7, the fifth circuit layer 9, and the sixth circuit layer 11 are conducted through the electroplated layer 12. In the present embodiment, the third wiring layer 4 to the sixth wiring layer 11 have a conventional four-layer board structure. And an ink layer 13 is arranged on one side surface of the sixth circuit layer 11 away from the fifth circuit layer 9. An electroplated layer 12 is further arranged on one side surface of the sixth circuit layer 11 away from the fifth circuit layer 9, and the electroplated layer 12 can be protected by the ink layer 13. And an electroplated layer 12 and an ink layer 13 are sequentially arranged on one side surface of the third circuit layer 4 away from the second base material layer 6. In this embodiment, the material of the first substrate layer 2, the second substrate layer 6, the third substrate layer 8, and the fourth substrate layer 10 is FR4, PTFE, or LCP.
The manufacturing method of the high-frequency circuit board comprises the following steps:
as shown in fig. 2, the double-sided copper-clad plate 18 is first cut into pieces and cut into required specifications.
As shown in fig. 3, the first antenna layer 1 and the second circuit layer 3 are respectively manufactured on two sides of the double-sided copper-clad plate 18, and the line directions of the first antenna layer 1 and the second circuit layer 3 can be set as required.
As shown in fig. 4, a hole is drilled from the second circuit layer 3 in the direction of the first antenna layer 1, resulting in a first tapered hole 19, the small end of the first tapered hole 19 being arranged close to the first antenna layer 1. The number of the holes can be set according to needs, in the embodiment, the number of the holes is two, and a laser drilling machine is adopted for drilling.
As shown in fig. 5, the first tapered hole 19 is filled with a first conductive medium 5 to make the first antenna layer 1 and the second circuit layer 3 electrically connected.
As shown in fig. 6, ink is sprayed on both sides of the double-sided copper-clad plate 18 to obtain an ink layer 13.
As shown in fig. 7, the third circuit layer 4 is fabricated, and in this embodiment, the third circuit layer 4 to the sixth circuit layer 11 can be fabricated together, which is a conventional four-layer board fabrication method. And then the second circuit layer 3 and the third circuit layer 4 are welded and conducted, so that the structure shown in fig. 1 is obtained.
In this embodiment, a high-frequency circuit board structure as shown in fig. 8 can be produced, and fig. 8 is an inverted state of fig. 1.
Example two
Referring to fig. 9, a second embodiment of the present invention is: a high-frequency circuit board is different from the first embodiment in that: sixth circuit layer 11 is equipped with seventh circuit layer 14, fifth substrate layer 15 and eighth antenna layer 16 on keeping away from the side of fifth circuit layer 9 in proper order, be equipped with the second taper hole on seventh circuit layer 14 and the fifth substrate layer 15, the little end in second taper hole is close to eighth antenna layer 16 sets up, be equipped with second conducting medium 17 in the second taper hole, seventh circuit layer 14 passes through second conducting medium 17 with eighth antenna layer 16 switches on, seventh circuit layer 14 with sixth circuit layer 11 welded connection. The high-frequency circuit board in this embodiment is a symmetric structure, that is, antenna layers are disposed on both sides of the circuit board.
To sum up, the utility model provides a pair of high frequency circuit board, the first antenna layer and the second circuit layer of high frequency circuit board adopt the mode of non-electroplating to switch on for the homogeneity, roughness and the roughness of first antenna layer copper foil can keep the characteristic of substrate not destroyed, make the antenna size precision that the preparation obtained higher, can improve the yield of antenna quality and circuit board.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (7)
1. A high-frequency circuit board is characterized by comprising a first antenna layer, a first substrate layer, a second circuit layer and a third circuit layer which are sequentially stacked, wherein first conical holes are formed in the first substrate layer and the second circuit layer, small ends of the first conical holes are arranged close to the first antenna layer, first conductive media are arranged in the first conical holes, and the first antenna layer is conducted with the second circuit layer through the first conductive media; the second circuit layer is connected with the third circuit layer in a welding mode.
2. The high-frequency circuit board according to claim 1, wherein a second substrate layer, a fourth circuit layer, a third substrate layer, a fifth circuit layer, a fourth substrate layer and a sixth circuit layer are sequentially arranged on a side surface of the third circuit layer away from the second circuit layer, a through hole is arranged between the third circuit layer and the sixth circuit layer, a plating layer is arranged at the through hole, and the third circuit layer, the fourth circuit layer, the fifth circuit layer and the sixth circuit layer are conducted through the plating layer.
3. The high-frequency circuit board according to claim 2, wherein an ink layer is disposed on a side of the sixth circuit layer away from the fifth circuit layer.
4. The high-frequency circuit board according to claim 2, wherein a seventh circuit layer, a fifth substrate layer and an eighth antenna layer are sequentially disposed on a side surface of the sixth circuit layer away from the fifth circuit layer, second tapered holes are disposed on the seventh circuit layer and the fifth substrate layer, small ends of the second tapered holes are disposed near the eighth antenna layer, a second conductive medium is disposed in the second tapered holes, the seventh circuit layer is conducted with the eighth antenna layer through the second conductive medium, and the seventh circuit layer is welded to the sixth circuit layer.
5. The high-frequency circuit board according to claim 1, wherein the material of the first substrate layer is FR4, PTFE or LCP.
6. The high-frequency wiring board according to claim 1, wherein a soldering medium for soldering connection of the second wiring layer and the third wiring layer is solder paste or conductive paste.
7. The high-frequency circuit board according to claim 2, wherein a plating layer and an ink layer are further provided on a side of the third circuit layer away from the second substrate layer in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020081322.4U CN211557622U (en) | 2020-01-15 | 2020-01-15 | High-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020081322.4U CN211557622U (en) | 2020-01-15 | 2020-01-15 | High-frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211557622U true CN211557622U (en) | 2020-09-22 |
Family
ID=72492070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020081322.4U Active CN211557622U (en) | 2020-01-15 | 2020-01-15 | High-frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211557622U (en) |
-
2020
- 2020-01-15 CN CN202020081322.4U patent/CN211557622U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6930256B1 (en) | Integrated circuit substrate having laser-embedded conductive patterns and method therefor | |
| US7485569B2 (en) | Printed circuit board including embedded chips and method of fabricating the same | |
| US20070111380A1 (en) | Fabricating method of printed circuit board having embedded component | |
| KR20080007874A (en) | Chip type solid electrolytic capacitor | |
| CN108882500B (en) | Flexible circuit board and manufacturing method thereof | |
| CN101207977A (en) | Method for making flexible circuit board with break difference structure | |
| US8826531B1 (en) | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers | |
| CN102348328A (en) | Chip embedding method and chip-embedded circuit board | |
| US11297722B2 (en) | Multi-layered circuit board | |
| CN101389190B (en) | Multilayer printed wiring board production method | |
| US11581652B2 (en) | Spiral antenna and related fabrication techniques | |
| CN107666770A (en) | Has circuit board of weld pad and preparation method thereof | |
| CN102254885B (en) | Passive device, passive device-embedded circuit board and manufacturing method | |
| CN211557622U (en) | High-frequency circuit board | |
| CN201717255U (en) | Passive device and circuit board embedded with same | |
| US7810232B2 (en) | Method of manufacturing a circuit board | |
| US10462902B1 (en) | Circuit board and manufacturing method | |
| CN111182713A (en) | High-frequency circuit board and manufacturing method thereof | |
| CN201717256U (en) | Passive device and circuit board embedded with same | |
| CN210579553U (en) | Printed circuit board | |
| CN201319695Y (en) | Electrical connection structure of circuit board | |
| CN101198212B (en) | Multilayer soft printed wiring board and production method thereof | |
| KR100649683B1 (en) | Printed circuit board and method for manufacturing the same | |
| US6555914B1 (en) | Integrated circuit package via | |
| CN116634662B (en) | High-speed printed circuit board and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |