CN201319695Y - Electrical connection structure of circuit board - Google Patents
Electrical connection structure of circuit board Download PDFInfo
- Publication number
- CN201319695Y CN201319695Y CNU2008201766855U CN200820176685U CN201319695Y CN 201319695 Y CN201319695 Y CN 201319695Y CN U2008201766855 U CNU2008201766855 U CN U2008201766855U CN 200820176685 U CN200820176685 U CN 200820176685U CN 201319695 Y CN201319695 Y CN 201319695Y
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- CN
- China
- Prior art keywords
- dielectric layer
- electric connection
- circuit board
- conductive pads
- connection structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Disclosed is an electrical connection structure of a circuit board, which at least comprises a dielectric layer, two conductive pads, two fine circuits and a tapered electrical connection element; wherein the dielectric layer is provided with a top surface and a bottom surface; one of the two conductive pads is embedded in the top surface of the dielectric layer and the other thereof is embedded in the bottom surface of the dielectric layer; the two fine circuits are embedded in the dielectric layer and isolated from each other by the dielectric layer; the electrical connection element punctures through the dielectric layer, which leads the electrical connection element to be embedded in the inner part of the dielectric layer; and the electrical connection element is electrically connected with the two conductive pads. The utility model has the advantages that by utilizing the electrical connection structure of the circuit board formed by the tapered electrical connection element which punctures through the dielectric layer, the purposes of simplified processing, lowered cost and improved processing yield are achieved.
Description
Technical field
The utility model relates to a kind of electric connection structure, relates in particular to a kind of electric connection structure of circuit board, and it utilizes the electric connection element of taper to replace known electroplating hole, in order to electrically connect the conductive pad of different layers.
Background technology
Flourish along with electronic industry, electronic product gradually towards light, thin, short, little, multi-functional, and direction such as high-performance develop, the density of its electronic component (Density, the quantity of electronic component in the so-called unit are) is also more and more higher.For the high integration (Integration) that satisfies semiconductor packages, the requirement that reaches microminiaturization (Miniaturization), printed circuit board (PCB) (the Printing Circuit Board that can provide most active and passive components and circuit to electrically connect, PCB) be multi-layer sheet (Multilayer Board) structure by doubling plate (DoublelayerBoard) structural evolution gradually also, with the active and passive component that under the same units area, holds greater number, and circuit.
In addition also simultaneously according to high-effect chip computing demands such as microprocessor, chipset, drawing chips, the circuit of printed circuit board (PCB) distributes also needs further to promote its transmission chip signal, improve functions such as frequency range, matched impedance, improve the development of I/O number packaging part, yet, for meet semiconductor package part compact, multi-functional, reach the exploitation direction of high frequencyization at a high speed, printed circuit board (PCB) is also towards the fine rule road and the small-bore development.Existing printed circuit board technology is contracted to 30 microns from the wire sizes of 100 microns of tradition, and continues to research and develop towards littler circuit precision.
For further improving the circuit distribution density of printed circuit board (PCB), a kind of layer (BuildingUp) technology that increase of industry development, it has played the part of important role, utilize circuit to increase mutual crossover multilayer dielectric layer of layer technology and line layer on core circuit plate (Core Circuit Board) surface exactly, and in the middle of this dielectric layer, offer conductive blind hole (Conductive Blind Via) for the electric connection between the levels circuit.
It is shown to please refer to Figure 1A to Fig. 1 C, the known circuits plate structure comprises a dielectric sandwich layer 100 (Dielectric Core Layer), a plurality of conduction fine rule roads 102 that are embedded in this dielectric sandwich layer 100, one is embedded in first conductive pad 104 of this dielectric sandwich layer 100, and second conductive pad 106 that is embedded in this dielectric sandwich layer 100, utilize machine drilling, or laser drill is dug in first conductive pad, 104 places and is established a hole 108, then hole 108 is electroplated, in order to form a conductive blind hole 110, conductive blind hole 110 is electrically connected at second conductive pad 106, in order to the electrical connection of vertical direction that dielectric sandwich layer 100 is provided.
Conductive blind hole 110 in the known circuits plate structure is to utilize plating mode to form, and causes complex process, cost to improve, and produces conduction fine rule road 102, first conductive pad 104, and second conductive pad, 106 concave surfaces simultaneously, causes process yield to descend.
Summary of the invention
Therefore the above-mentioned defective of inventor's thoughts can be improved, and proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned defective.
Main purpose of the present utility model is to provide a kind of electric connection structure of circuit board, reaches to simplify that technology, cost reduce, and the purpose that improves of process yield.
For reaching above-mentioned purpose, the utility model proposes a kind of electric connection structure of circuit board, it comprises at least: a dielectric layer, this dielectric layer have an end face, reach a bottom surface; Two conductive pads, one of them is embedded in the end face of this dielectric layer described two conductive pads, and wherein another is embedded in the bottom surface of this dielectric layer to described two conductive pads; Two fine rule roads, described two fine rule roads are embedded in this dielectric layer, and described two fine rule roads are isolated each other by this dielectric layer; And the electric connection element of a taper, this electrically connects the element puncture through this dielectric layer, make this electric connection element be embedded in this dielectric layer inside, this electric connection element is electrically connected at described two conductive pads, and this electric connection element bottom surface electrically connects one of them contact area of two conductive pads greater than most advanced and sophisticated wherein another the contact area of two conductive pads that electrically connects of this electric connection element.
The utlity model has following beneficial effect: utilize the electric connection element of taper to pierce through through dielectric layer, the electric connection structure of formed circuit board reaches the purpose of simplifying technology, cost reduction, reaching the process yield raising.
For enabling further to understand feature of the present utility model and technology contents, see also following relevant detailed description of the present utility model and accompanying drawing, yet accompanying drawing is only for reference and explanation usefulness, is not to be used for the utility model is limited.
Description of drawings
Figure 1A to Fig. 1 C is the technology generalized section of known circuits plate structure.
Fig. 2 A to Fig. 2 C is the technology generalized section of the electric connection structure of the utility model circuit board.
Description of reference numerals in the above-mentioned accompanying drawing is as follows:
[known]
100 dielectric sandwich layers
102 conduction fine rule roads
104 first conductive pads
106 second conductive pads
108 holes
110 conductive blind holes
[the utility model]
210 dielectric layers
212 end faces
214 bottom surfaces
220 support plates
230 conductive pads
240 fine rule roads
250 electrically connect element
252 tips
Embodiment
For further understanding feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing.
It is shown to please refer to Fig. 2 A to Fig. 2 C, and the utility model provides a kind of electric connection structure of circuit board to comprise: a dielectric layer 210, two conductive pads 230, a plurality of fine rules road 240, and the electric connection element 250 of a taper.
Described two conductive pads 230 respectively are arranged on two support plates 220, and fine rule road 240 is arranged on the support plate 220, in the present embodiment, conductive pad 230, and fine rule road 240 materials for example be copper.
Electrically connect element 250 bottom surfaces with wire mark, or the spray printing mode be connected in two conductive pads 230 one of them, electrically connect element 250 by silver paste (Silver Paste), copper cream (Copper Paste), carbon paste (CarbonPaste) and tin cream (Solder Paste) or other are suitably for the conductivity material that electrically connects element 250 and form, these tip 252 punctures that electrically connect element 250 are through dielectric layer 210, make electric connection element 250 be embedded in dielectric layer 210 inside, electrically connect element 250 be electrically connected at two conductive pads 230 wherein another, and this electric connection element bottom surface electrically connects one of them contact area of two conductive pads greater than most advanced and sophisticated wherein another the contact area of two conductive pads that electrically connects of this electric connection element, wherein said two conductive pads 230 end face 212 that is embedded in dielectric layer 210 wherein, wherein another is embedded in the bottom surface 214 of dielectric layer 210 to described two conductive pads 230, fine rule road 240 is embedded in the end face 212 of dielectric layer 210, and fine rule road 240 is isolated each other by dielectric layer 210.Then, remove support plate 220, two conductive pads, 230 one of them exposed surface trim in end face 212, two conductive pads 230 of dielectric layer 210 wherein another exposed surface trim bottom surface 214 in dielectric layer 210, the exposed surface on fine rule road 240 trims the end face 212 in dielectric layer 210.
The utility model and known technology are relatively, can reach following effect: utilize the electric connection element 250 of taper to pierce through through dielectric layer 210, the electric connection structure of formed circuit board can reach the purpose of simplifying technology, cost reduction, reaching the process yield raising.
The above only is a preferred embodiment of the present utility model; non-ly be intended to limit to scope of patent protection of the present utility model; so the equivalence of using the utility model specification and accompanying drawing content to be done such as changes, and all in like manner all is contained in the claim protection range of the present utility model.
Claims (9)
1, a kind of electric connection structure of circuit board is characterized in that, comprises at least:
One dielectric layer, this dielectric layer have an end face, reach a bottom surface;
Two conductive pads, described two a conductive pads end face that is embedded in this dielectric layer wherein, wherein another is embedded in the bottom surface of this dielectric layer to described two conductive pads;
Two fine rule roads, described two fine rule roads are embedded in this dielectric layer, and described two fine rule roads are isolated each other by this dielectric layer; And
The electric connection element of one taper, this electrically connects the element puncture through this dielectric layer, make this electric connection element be embedded in this dielectric layer inside, this electric connection element is electrically connected at described two conductive pads, and this electric connection element bottom surface electrically connects one of them contact area of two conductive pads greater than most advanced and sophisticated wherein another the contact area of two conductive pads that electrically connects of this electric connection element.
2, the electric connection structure of circuit board as claimed in claim 1, it is characterized in that this dielectric layer is selected from the group that is made up of bismaleimide three nitrogen resins, polyimides, FR-5 resin and FR-4 resin, ABF, poly-phenol resin and epoxy resin.
3, the electric connection structure of circuit board as claimed in claim 1 is characterized in that, described two conductive pad materials are copper.
4, the electric connection structure of circuit board as claimed in claim 1 is characterized in that, described two fine rule road materials are copper.
5, the electric connection structure of circuit board as claimed in claim 1 is characterized in that, the material of this electric connection element is selected from the group that is made up of silver paste, copper cream, carbon paste and tin cream.
6, the electric connection structure of circuit board as claimed in claim 1, it is characterized in that, this electrically connect element bottom surface wire mark in described two conductive pads one of them, the tip of this electrics connection element puncture be electrically connected at through this dielectric layer described two conductive pads wherein another.
7, the electric connection structure of circuit board as claimed in claim 1, it is characterized in that, this electrically connect element bottom surface spray printing in described two conductive pads one of them, the tip of this electrics connection element puncture be electrically connected at through this dielectric layer described two conductive pads wherein another.
8, the electric connection structure of circuit board as claimed in claim 1 is characterized in that, described at least one conductive pad is embedded in this dielectric layer, and its exposed surface and dielectric layer surface trim.
9, the electric connection structure of circuit board as claimed in claim 1 is characterized in that, described two fine rule roads are embedded in this dielectric layer, and its exposed surface and this dielectric layer surface trim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201766855U CN201319695Y (en) | 2008-11-10 | 2008-11-10 | Electrical connection structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201766855U CN201319695Y (en) | 2008-11-10 | 2008-11-10 | Electrical connection structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201319695Y true CN201319695Y (en) | 2009-09-30 |
Family
ID=41198452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201766855U Expired - Lifetime CN201319695Y (en) | 2008-11-10 | 2008-11-10 | Electrical connection structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201319695Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179794A (en) * | 2011-12-21 | 2013-06-26 | 欣兴电子股份有限公司 | Circuit board and production method thereof |
| TWI720898B (en) * | 2020-05-28 | 2021-03-01 | 欣興電子股份有限公司 | Carrier board structure with increased core layer wiring area and manufacturing method thereof |
-
2008
- 2008-11-10 CN CNU2008201766855U patent/CN201319695Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179794A (en) * | 2011-12-21 | 2013-06-26 | 欣兴电子股份有限公司 | Circuit board and production method thereof |
| CN103179794B (en) * | 2011-12-21 | 2015-12-02 | 欣兴电子股份有限公司 | Wiring board and preparation method thereof |
| TWI720898B (en) * | 2020-05-28 | 2021-03-01 | 欣興電子股份有限公司 | Carrier board structure with increased core layer wiring area and manufacturing method thereof |
| CN113745187A (en) * | 2020-05-28 | 2021-12-03 | 欣兴电子股份有限公司 | Carrier plate structure capable of increasing wiring area of core layer and manufacturing method thereof |
| CN113745187B (en) * | 2020-05-28 | 2024-03-22 | 欣兴电子股份有限公司 | Carrier plate structure with increased core layer wiring area and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: XINXING ELECTRONICS CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111013 Address after: 215123 No. 160 Feng Feng street, Suzhou Industrial Park, Jiangsu Patentee after: Unimicron Technology (SuZhou) Corp. Address before: 215123 No. 160 windy street, Suzhou Industrial Park, Jiangsu, Suzhou, China Co-patentee before: Xinxing Electronics Co., Ltd. Patentee before: Unimicron Technology (SuZhou) Corp. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090930 |