CN211531407U

CN211531407U - Circuit board structure

Info

Publication number: CN211531407U
Application number: CN201921643799.0U
Authority: CN
Inventors: 贾晓亮; 王周坤; 赵建军; 段志远
Original assignee: Guangdong Retop Led Display Co ltd
Current assignee: Zhuhai ruituo Display Technology Co.,Ltd.
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-09-18
Anticipated expiration: 2029-09-29

Abstract

The utility model provides a circuit board structure, include: a substrate; a plurality of circuit components disposed on a front side of the substrate; the first metal routing layer is arranged on the front face of the substrate, the plurality of circuit assemblies are electrically connected through the first metal routing layer, the first metal routing layer comprises a plurality of metal routing wires, and each metal routing wire is arranged in an arc line at an extended corner. The utility model provides a circuit board structure is walked the line through the metal that is used for transmission signal on it and is adopted pitch arc design in the corner of extension, can reduce adjacent metal and walk the electromagnetic interference between the line.

Description

Circuit board structure

Technical Field

The utility model relates to an electronic product field, concretely relates to circuit board structure.

Background

In an LED display screen system, a periodic high voltage change rate exists in an LED driving circuit, and the parasitic inductance and capacitance in the circuit make the electromagnetic interference noise of the LED driving circuit difficult to eliminate. It can be generally found in EMI test results that LED driving circuits are generally prone to exceed EMI limits at on/off times, while tend to have larger margins at other frequency points. As an energy conversion device working in an on/off state, the voltage change rate of an LED driving circuit is high, the generated interference intensity is high, and interference sources are mainly concentrated in the LED on/off period. The main interference forms of LED driving circuits are conduction interference and near-field interference due to their high operating frequency (from tens of khz to several mhz), and in addition, the LED display screen has many connecting lines, which are arranged with greater randomness, which also increases interference.

Therefore, the prior art has defects and needs to be improved urgently.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a circuit board structure has the beneficial effect that reduces the metal and walks electromagnetic interference between the line.

The utility model provides a circuit board structure, include:

a substrate;

a plurality of circuit components disposed on a front side of the substrate;

the first metal routing layer is arranged on the front face of the substrate, the plurality of circuit assemblies are electrically connected through the first metal routing layer, the first metal routing layer comprises a plurality of metal routing wires, and each metal routing wire is arranged in an arc line at an extended corner.

In the circuit board structure of the present invention, the plurality of circuit components include a high-speed signal interface component and a first functional chip; the high-speed signal interface assembly is electrically connected with the first functional chip through a plurality of metal wires.

The circuit board structure of the present invention further comprises a ground metal layer, wherein the ground metal layer is disposed on the back surface of the substrate;

the metal wires comprise a plurality of first signal wires and a plurality of first grounding wires, and each first grounding wire is electrically connected with the grounding metal layer through a metallization hole arranged on the substrate;

the plurality of first grounding wires and the plurality of first signal wires are sequentially and alternately arranged at intervals, one end of each first signal wire is electrically connected with the high-speed signal interface assembly, the other end of each first signal wire is electrically connected with the first functional chip, and each first grounding wire extends to a position away from the first functional chip by a preset distance due to the high-speed signal interface assembly.

In the circuit board structure of the present invention, each the first grounding trace is all plural in that the metalized holes are electrically connected to the grounding metal layer, each the first grounding trace is provided with a plurality of metalized holes distributed at equal intervals.

In the circuit board structure, the plurality of circuit components further include a plurality of filter circuits, each the first signal line is provided with a filter circuit, the high-speed signal that the high-speed signal interface component inserts passes through the filter cloth circuit back retransmission gives first function chip.

In the circuit board structure of the present invention, the filter circuit includes a resistor and a capacitor;

the resistors are arranged on the corresponding first signal wires, one end of the capacitor is electrically connected with the corresponding first signal wires, and the other end of the capacitor is electrically connected with one first grounding wire.

In the circuit board structure of the present invention, the plurality of circuit components further include a plurality of second functional chips, and the plurality of first grounding traces further include a plurality of second signal traces; the first functional chip is electrically connected with the second functional chip through a second signal routing.

Circuit board structure in, first signal walk the line and the line width that the line was walked to the second signal is 15 1.5mil, adjacent two line and adjacent two are walked to first signal line distance 6 0.6mil is walked to the second signal.

In the circuit board structure of the present invention, the high-speed signal interface module is a socket for inserting an external signal plug.

In the circuit board structure of the present invention, the circuit board structure is a lamp panel of a LED display screen.

The utility model provides a circuit board structure is walked the line through the metal that is used for transmission signal on it and is adopted pitch arc design in the corner of extension, can reduce adjacent metal and walk the electromagnetic interference between the line.

Drawings

Fig. 1 is a schematic top view of a circuit board structure according to some embodiments of the present invention.

Fig. 2 is a schematic diagram of a layered structure of a circuit board structure according to some embodiments of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present invention. The circuit board structure is mainly applied to the LED display screen, for example, the circuit board structure can be a lamp panel of the LED display screen. The circuit board structure includes: a substrate 10, a plurality of circuit elements 20, a first metal wiring layer 30 and a ground metal layer 40. Wherein, the circuit components 20 are disposed on the front surface of the substrate 10; the first metal routing layer 30 is disposed on the front surface of the substrate 10, the plurality of circuit components 20 are electrically connected through the first metal routing layer 30, the first metal routing layer 30 includes a plurality of metal routing lines, and each metal routing line is disposed in an arc line at an extended corner. For example, each area 100 identified in fig. 1 is an extended corner, the metal traces therein are arranged in an arc, for example, an arc, and the central angle of the arc may be set to 90 degrees or 60 degrees, etc., but is not limited thereto.

Specifically, the plurality of circuit elements 20 includes a high-speed signal interface element 21, a first functional chip 22 and a plurality of second functional chips 23. The high-speed signal interface module 21 is electrically connected to the first functional chip 22 through metal traces, the first functional chip 22 is electrically connected to the second functional chip 23 through metal traces, and the second functional chip 23 is also connected by metal traces.

The high-speed signal interface module 21 is a socket for an external signal plug to be plugged into, so as to access an external high-speed signal.

The metal traces include a plurality of first signal traces 31, a plurality of first ground traces 32, a plurality of second signal traces 33, and a plurality of second ground traces 34, and each of the first ground traces 32 is electrically connected to the ground metal layer 40 through a metal via 11 disposed on the substrate 10. The plurality of first grounding traces 32 and the plurality of first signal traces 31 are alternately arranged in sequence at intervals, one end of each first signal trace 31 is electrically connected with the high-speed signal interface component 21, the other end of each first signal trace 31 is electrically connected with the first functional chip 22, and each first grounding trace 32 extends from the high-speed signal interface component 21 to a position away from the first functional chip 22 by a preset distance. Each first ground trace 32 is electrically connected to the ground metal layer 40 through a plurality of metallized holes 11, and the metallized holes 11 on each first ground trace 32 are uniformly distributed at intervals.

The first functional chip 22 is electrically connected to the second functional chip 23 through the second signal trace 33, the plurality of second functional chips 23 are also electrically connected to each other through the second signal trace 33, and the second signal trace 33 and the second ground trace 34 are alternately arranged at intervals to avoid interference between two adjacent second signal traces 33. The second ground trace 34 is also electrically connected to the ground metal layer 40 through the metalized hole 11.

In some embodiments, the plurality of circuit components 20 further include a plurality of filter circuits, each of the first signal traces 32 is provided with a filter circuit, and the high-speed signal received by the high-speed signal interface component 21 passes through the filter cloth circuit and then is transmitted to the first functional chip 22. Specifically, the filter circuit includes a resistor 24 and a capacitor 25; the resistor 24 is disposed on the corresponding first signal trace 31, one end of the capacitor 25 is electrically connected to the corresponding first signal trace 31, and the other end of the capacitor 25 is electrically connected to one first grounding trace 32.

In some embodiments, the line width of the first signal trace 31 and the second signal trace 32 is 15 ± 1.5mil, and the line distance between two adjacent first signal traces 31 and two adjacent second signal traces 32 is 6 ± 0.6 mil.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be determined by the scope of the appended claims.

Claims

1. A circuit board structure, comprising:

a substrate;

a plurality of circuit components disposed on a front side of the substrate;

2. The circuit board structure of claim 1, wherein the plurality of circuit components includes a high-speed signal interface component and a first functional chip; the high-speed signal interface assembly is electrically connected with the first functional chip through a plurality of metal wires.

3. The circuit board structure of claim 2, further comprising a ground metal layer disposed on the back side of the substrate;

4. The circuit board structure according to claim 3, wherein each of the first ground traces is electrically connected to the ground metal layer through a plurality of the metalized holes, and the metalized holes on each of the first ground traces are uniformly spaced apart.

5. The circuit board structure according to claim 3 or 4, wherein the plurality of circuit components further include a plurality of filter circuits, each of the first signal traces is provided with a filter circuit, and a high-speed signal received by the high-speed signal interface component passes through the filter circuit and is then transmitted to the first functional chip.

6. The circuit board structure according to claim 5, wherein the filter circuit comprises a resistor and a capacitor;

7. The circuit board structure of claim 3, wherein the plurality of circuit components further comprises a plurality of second functional chips, the plurality of first ground traces further comprises a plurality of second signal traces; the first functional chip is electrically connected with the second functional chip through a second signal routing.

8. The circuit board structure according to claim 7, wherein the line width of the first signal trace and the second signal trace is 15 ± 1.5mil, and the line distance between two adjacent first signal traces and two adjacent second signal traces is 6 ± 0.6 mil.

9. The circuit board structure of claim 2, wherein the high-speed signal interface component is a socket for external signal plugs.

10. The circuit board structure of claim 1, wherein the circuit board structure is an LED display panel.