CN114501796A - Vehicle-mounted gateway printed circuit board - Google Patents
Vehicle-mounted gateway printed circuit board Download PDFInfo
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- CN114501796A CN114501796A CN202210030464.1A CN202210030464A CN114501796A CN 114501796 A CN114501796 A CN 114501796A CN 202210030464 A CN202210030464 A CN 202210030464A CN 114501796 A CN114501796 A CN 114501796A
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- 238000004891 communication Methods 0.000 claims abstract description 99
- 230000008054 signal transmission Effects 0.000 claims description 11
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- 238000010586 diagram Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- YMXREWKKROWOSO-VOTSOKGWSA-N methyl (e)-3-(2-hydroxyphenyl)prop-2-enoate Chemical compound COC(=O)\C=C\C1=CC=CC=C1O YMXREWKKROWOSO-VOTSOKGWSA-N 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/66—Arrangements for connecting between networks having differing types of switching systems, e.g. gateways
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/16—Gateway arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
Abstract
The embodiment of the invention discloses a vehicle-mounted gateway printed circuit board. The circuit board includes: the device comprises a component layer and a circuit layer, wherein the component layer is provided with components of a vehicle-mounted gateway printed circuit board; communication lines among all components of the vehicle-mounted gateway printed circuit board are laid on the line layer; each component in the component layer communicates based on a communication line in the line layer. The technical scheme of the embodiment of the invention solves the technical problems that the conventional vehicle-mounted gateway printed circuit board is unreasonable in layout and needs a larger area of the printed circuit board, and the design of the vehicle-mounted gateway printed circuit board has higher cost, realizes more reasonable layout of the vehicle-mounted gateway printed circuit board and has a smaller structure size, thereby achieving the technical effect of reducing the cost of the vehicle-mounted gateway printed circuit board.
Description
Technical Field
The embodiment of the invention relates to the technical field of printed circuit board design, in particular to a vehicle-mounted gateway printed circuit board.
Background
The printed circuit board, also known as printed circuit board, printed board for short, pcb (printed circuit board) for short, or pwb (printed wiring board), is cut into a certain size by using an insulating board as a base material, and at least one conductive pattern is attached to the insulating board and is provided with holes (such as element holes, fastening holes, metalized holes, and the like) for replacing a chassis of an electronic component in the prior art and realizing the mutual connection of the electronic component. Such boards are known as "printed" circuit boards because they are made using electronic printing.
The existing vehicle-mounted gateway printed circuit board has the technical problems that the layout is unreasonable, the area of the printed circuit board is large, and the cost is high when the vehicle-mounted gateway printed circuit board is designed.
Disclosure of Invention
The embodiment of the invention provides a vehicle-mounted gateway printed circuit board, which is used for realizing more reasonable layout of the vehicle-mounted gateway printed circuit board and has a smaller structure size, thereby achieving the technical effect of reducing the cost of the vehicle-mounted gateway printed circuit board.
In a first aspect, an embodiment of the present invention provides a vehicle-mounted gateway printed circuit board, where the circuit board includes: a component layer and a wiring layer, wherein,
the component layer is provided with components of the vehicle-mounted gateway printed circuit board; communication lines among all components of the vehicle-mounted gateway printed circuit board are laid on the line layer; each component in the component layer communicates based on a communication line in the line layer.
Optionally, the circuit layer includes an electric source layer and a signal layer; the power supply layer is used for laying a power supply transmission line so as to transmit the accessed power supply to each component; and the signal layer is used for laying signal transmission lines among the components.
Optionally, each component in the component layer includes: the module layer comprises at least two connectors arranged on the side edge of the module layer, a communication chip set arranged on the working surface of the module layer and adjacent to one side of the connectors, a system-level chip and a storage chip set arranged on the working surface of the module layer and far away from one side of the connectors.
Optionally, the communication chipset includes a low-speed communication chipset and at least one high-speed communication chipset, wherein the low-speed communication chipset and the high-speed communication chipset are arranged longitudinally or transversely.
Optionally, the low-speed communication chipset includes a LIN chip and a CAN chip, and the high-speed communication chipset includes a Switch chip and two PHY chips, where the Switch chip and the two PHY chips are arranged in a "pin" shape structure.
Optionally, the memory chip set includes an EMMC chip, wherein the EMMC chip and the LIN chip are arranged adjacent to each other.
Optionally, the system-on-chip is arranged adjacent to the EMMC chip.
Optionally, the memory chip set further includes an LPDD4 chip and a FLASH chip, wherein the LPDD4 chip and the FLASH chip are arranged around the system-on-chip.
Optionally, each component in the component layer further includes: the power supply comprises a power supply chip, a power supply circuit and a power supply management chip; the power supply chip is arranged adjacent to the FLASH chip and the CAN chip; the power circuit is arranged adjacent to the power chip, the CAN chip and the connector; the power management chip is arranged adjacent to the system-on-chip and the high-speed communication chipset.
Optionally, the component layer is a top layer and/or a bottom layer of the vehicle-mounted gateway printed circuit board.
The technical scheme of the embodiment of the invention provides a vehicle-mounted gateway printed circuit board, which comprises a component layer and a circuit layer, wherein each component of the vehicle-mounted gateway printed circuit board is arranged on the component layer; communication lines among all components of the vehicle-mounted gateway printed circuit board are laid on the line layer; each component in the component layer communicates based on a communication line in the line layer. The technical scheme of the embodiment of the invention solves the technical problems that the conventional vehicle-mounted gateway printed circuit board is unreasonable in layout and needs a larger area of the printed circuit board, and the design of the vehicle-mounted gateway printed circuit board has higher cost, realizes more reasonable layout of the vehicle-mounted gateway printed circuit board and has a smaller structure size, thereby achieving the technical effect of reducing the cost of the vehicle-mounted gateway printed circuit board.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, a brief description is given below of the drawings used in describing the embodiments. It should be clear that the described figures are only views of some of the embodiments of the invention to be described, not all, and that for a person skilled in the art, other figures can be derived from these figures without inventive effort.
Fig. 1 is a schematic diagram of the structure of each layer of a vehicle-mounted gateway printed circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a component layer of a vehicle gateway printed circuit board according to a second embodiment of the present invention;
fig. 3A is a diagram illustrating a structure of a connector and a communication chipset in a component layer of a vehicle gateway printed circuit board according to a second embodiment of the present invention;
fig. 3B is a diagram illustrating a structure of a connector and a communication chipset in a component layer of a vehicle gateway pcb according to another embodiment of the present invention;
fig. 3C is a diagram illustrating a structure of a connector and a communication chipset in a component layer of a vehicle gateway pcb according to another embodiment of the present invention;
fig. 3D is a diagram illustrating a structure of a connector and a communication chipset in a component layer of a vehicle gateway pcb according to another embodiment of the present invention;
fig. 4 is a schematic structural diagram of communication between each chip and a system-on-chip of a vehicle-mounted gateway printed circuit board according to a third embodiment of the present invention;
fig. 5 is a schematic structural diagram of inter-chip communication of a vehicle-mounted gateway printed circuit board Switch according to a third embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
The embodiment of the invention provides a vehicle-mounted gateway printed circuit board. The embodiment can be applied to the condition that the vehicle-mounted Ethernet is connected through the vehicle-mounted gateway printed circuit board. The vehicle-mounted gateway printed circuit board specifically comprises the following structures:
the device comprises a component layer and a circuit layer, wherein the component layer is provided with components of a vehicle-mounted gateway printed circuit board; communication lines among all components of the vehicle-mounted gateway printed circuit board are laid on the line layer; each component in the component layer communicates based on a communication line in the line layer.
Wherein, each component of the vehicle-mounted gateway printed circuit board can be arranged on the component layer. Wherein, each subassembly that sets up on the subassembly layer can be according to actual demand setting. The communication lines of each component may be laid on the line layer in advance, wherein the communication lines laid on the line layer may include high-speed signal lines, low-speed signal lines, and copper lines. The high-speed signal lines may include differential signal lines and single-ended signal lines, among others. It should be noted that the positional relationship between the component layer and the line layer may be a stacking relationship. The number of component layers may be one or two. The number of wiring layers may be two or more.
It should be noted that the communication lines between the components of the vehicle gateway printed circuit board laid on the line layer are not allowed to be divided across.
Specifically, each component is arranged on a component layer of the vehicle-mounted gateway printed circuit board in advance, and a communication line between each component of the vehicle-mounted gateway printed circuit board is laid on a line layer in advance. Various components in the component layer of the onboard gateway printed circuit board may communicate based on communication lines in the wiring layer.
Referring to fig. 1, the component layers may be a top layer and/or a bottom layer of the onboard gateway printed circuit board. If the number of components is small, the component layer of the onboard gateway printed circuit board may be the top layer 1 or the bottom layer 2 of the onboard gateway printed circuit board. Referring to fig. 1, if the number of components is large, the component layers may be a top layer 1 and a bottom layer 2 of the vehicle gateway printed circuit board. It should be noted that, when the component layers are the top layer 1 and the bottom layer 2 of the vehicle gateway printed circuit board, the component with smaller volume can be arranged on the bottom layer 2 of the component. It should also be noted that if the component layers include the top layer 1 and the bottom layer 2 of the vehicle gateway printed circuit board, the wiring layer is located in the middle layer 3 between the top layer 1 and the bottom layer 2.
Optionally, the circuit layer includes an electric source layer and a signal layer; the power supply layer is used for laying a power supply transmission line so as to transmit the accessed power supply to each component; and the signal layer is used for laying signal transmission lines among the components.
The circuit layer may include a power layer and a signal layer. The power supply layer may be pre-laid with a power transmission line, wherein the power transmission line may be understood as a line made of copper. Alternatively, the power plane may be a copper layer. The number of power planes may be one or more. The signal layer may lay signal transmission lines between the components in advance. The signal transmission lines may include high-speed signal lines and low-speed signal lines, among others. The number of signal layers may be one or more.
It should be noted that the circuit layer includes the power layer and has the following advantages: because the whole copper film is laid on the power supply layer, the power supply layer not only can be used as a plane layer for supporting, but also can supply power for each component in the component layer by an external power supply through the power supply layer. The advantage of the line layer comprising a signal layer is that: since the signal transmission lines between the components are laid on the signal layer, the signal layer can facilitate communication connection between the components. The circuit layer includes an electric source layer and a signal layer, and has the advantage of improving the transmission speed of signals, thereby improving the communication efficiency of each component in the component layer.
Optionally, the vehicle gateway printed circuit board may further include a ground layer, wherein the ground layer may be understood as a planar layer, and the layer may be formed by a whole copper film. The ground layer is arranged on the vehicle-mounted gateway printed circuit board, so that the ground layer not only can be used as an intermediate layer to provide stable characteristic impedance for signals, so that the characteristic impedance of an entire signal transmission line cannot change along with the extension of the line, but also can provide a complete reference plane for a component layer when the ground layer is adjacent to the component layer.
The technical scheme of the embodiment of the invention provides a vehicle-mounted gateway printed circuit board, which comprises a component layer and a circuit layer, wherein each component of the vehicle-mounted gateway printed circuit board is arranged on the component layer; communication lines among all components of the vehicle-mounted gateway printed circuit board are laid on the line layer; each component in the component layer communicates based on a communication line in the line layer. The technical scheme of the embodiment of the invention solves the technical problems that the conventional vehicle-mounted gateway printed circuit board is unreasonable in layout and needs a larger area of the printed circuit board, and the design of the vehicle-mounted gateway printed circuit board has higher cost, realizes more reasonable layout of the vehicle-mounted gateway printed circuit board and has a smaller structure size, thereby achieving the technical effect of reducing the cost of the vehicle-mounted gateway printed circuit board.
Example two
Fig. 2 is a schematic diagram of a component layer structure of a vehicle-mounted gateway printed circuit board according to a second embodiment of the present invention, where on the basis of the foregoing embodiment, each component of the component layer of the vehicle-mounted gateway printed circuit board includes:
at least two connectors 210 disposed at the side of the module layer, a communication chipset 220 disposed on the working surface of the module layer and adjacent to one side of the connectors, a system-on-chip 230 disposed on the working surface of the module layer and remote from one side of the connectors, and a storage chipset 240.
Each component in the component layer may include a connector 210, a communication chipset 220, a system-on-chip 230, and a memory chipset 240. The number of connectors 210 may be two or more. The position of each connector 210 may be set at the side of the module layer, and specifically, the position of each connector 210 may be set at the left side (see fig. 3A), the right side (see fig. 3B), the upper side (see fig. 3C), or the lower side (see fig. 3D) of the module layer. It should be noted that the type of connector may be a gigabit dedicated connector or a hundred megabyte dedicated connector.
The communication chipset 220 may be disposed on the working surface of the module layer and adjacent to one side of the connector. Communication chipset 220 may include one or more chips for communication. The system-on-chip 230 may be a central gateway system-on-chip. Alternatively, the system-on-chip 230 may be packaged by 361 method based on a Ball Grid Array (BGA) PCB. Memory chip set 240 may include one or more memory chips. The location of the system-on-chip 230 and the memory chip set 240 may be located on the working surface of the component layer and on the side remote from the connector.
It should be noted that in the embodiment of the present invention, the fan-out manner of the soc 230 may be to fan out all around. The outermost two circles of pads may be optionally perforated after the top layer has pulled the wire.
Each component on the working surface of the component layer may further include a plurality of power supply chips, a plurality of resistors, capacitors, and circuits. The circuit may include a power protection circuit, a filter circuit, and other circuits. The power supply chip may include one or more power management chips.
Optionally, the communication chipset 220 includes a low-speed communication chipset 221 and at least one high-speed communication chipset 222, wherein the low-speed communication chipset 221 and the high-speed communication chipset 222 are arranged longitudinally or transversely.
The communication chipset 220 may include a low-speed communication chipset 221 and a high-speed communication chipset 222, wherein the number of the high-speed communication chipsets 222 may be one or more than one. The arrangement of the low-speed communication chipset 221 and the high-speed communication chipset 222 may be vertical.
Referring to fig. 3A, when the connector 210 is disposed on the right side of the module layer, the low-speed communication chipset 221 and the high-speed communication chipset 222 may be arranged vertically, and the low-speed communication chipset 221 is located above the high-speed communication chipset 222. Referring to fig. 3B, when the connector 220 is disposed on the left side of the module, the low-speed communication chipset 221 and the high-speed communication chipset 222 may be arranged vertically, and the low-speed communication chipset 221 is located below the high-speed communication chipset 222.
Referring to fig. 3C, when the connector 210 is disposed on the upper side of the module layer, the low-speed communication chipset 221 and the high-speed communication chipset 222 may be arranged laterally, and the low-speed communication chipset 221 is located on the left of the high-speed communication chipset 222. When the connector 210 is disposed on the lower side of the module layer as shown in fig. 3D, the low-speed communication chipset 221 and the high-speed communication chipset 222 may be arranged laterally, and the low-speed communication chipset 221 is located on the right side of the high-speed communication chipset 222.
Optionally, the low-speed communication chipset 221 includes a LIN chip 10 and a CAN chip 11, and the high-speed communication chipset 222 includes a Switch chip 20 and two PHY chips 21, where the Switch chip and the two PHY chips are arranged in a "pin" shape.
The low-speed communication chipset 211 may include one or more LIN chips 10 and one or more CAN chips 11, where the number of LIN chips 10 may be one or more, and the number of CAN chips 11 may be more. Because the LIN chip 10 and the CAN chip 11 have small volumes, when the component layers include the top layer and the bottom layer of the vehicle-mounted gateway printed circuit board, the LIN chip 10 and the CAN chip 11 CAN be arranged on the top layer and the bottom layer according to actual requirements.
It should be noted that, in the embodiment of the present invention, the LIN chip 10 and the CAN chip 11 may be arranged according to actual requirements, and are not specifically limited herein.
The high-speed communication chipset 222 may include a Switch chip 20 and two PHY chips 21, wherein the Switch chip 20 and the two PHY chips 21 may be arranged in a "pin" shape. The arrangement in the shape of the Chinese character pin can be understood as an arrangement result obtained by rotating the Chinese character pin, for example, the arrangement in the shape of the Chinese character pin can be in the shape of an inverted Chinese character pin, and can also be in the shape of a regular Chinese character pin.
It should be noted that, since the output signals of the Switch chip 20 and the PHY chip 21 in the high-speed communication chipset 222 need to be connected to the connector, the high-speed communication chipset 222 is disposed on the working plane of the module layer and adjacent to one side of the connector.
Alternatively, the memory chip set 240 may include the EMMC chip 40, wherein the EMMC chip 40 is arranged adjacent to the LIN chip 11. Optionally, the system-on-chip 230 may be arranged adjacent to the EMMC chip 40. On this basis, the memory chip set 240 may further include the LPDD4 chip 41 and the FLASH chip 42, wherein the LPDD4 chip 41 and the FLASH chip 42 are arranged around the system-on-chip 230.
The EMMC chip 40 may be an EMMC chip packaged as FPGA-153. The LPDD4 chip 41 may be the LPDD4 chip packaged as the WFBGA 200. The LPDD4 chip 41 and the FLASH chip 42 are arranged around the SOC 230, wherein the LPDD4 chip 41 and the FLASH chip 42 are arranged on the left side or on the top of the SOC 230, or the LPDD4 chip 41 is arranged on the left side of the SOC 230 and the FLASH chip 42 is arranged on the top of the SOC 230, or the LPDD4 chip 41 is arranged on the top of the SOC 230 and the FLASH chip 42 is arranged on the left side of the SOC 230.
The EMMC chip 40, the LPDD4 chip 41, and the FLASH chip 42 may communicate based on high speed signal lines in the line layer.
Optionally, each component in the component layer further includes: a power supply chip 250, a power supply circuit 260, and a power management chip 270; wherein, the power chip 250 is arranged adjacent to the FLASH chip 42 and the CAN chip 221; the power circuit 260 is arranged adjacent to the power chip 250, the CAN chip 10 and the connector; the power management chip 270 is disposed adjacent to the system-on-chip 230 and the high-speed communication chipset 222.
The power circuit 260 may include a power protection circuit and a filter circuit, among others.
It should be noted that, since the power chip 250 needs to supply power to each chip in the system-on-chip 230 and the high-speed communication chipset 222, the power management chip 270 needs to be arranged adjacent to the system-on-chip 230 and the high-speed communication chipset 222.
It should be noted that the power supply chip 250 needs to supply power to the EMMC chip 40, the FLASH chip 42, the LPDD4 chip 41, the CAN chip 221, and the LIN chip 10, and therefore, the power supply chip 250 needs to be arranged adjacent to the FLASH chip 42 and the CAN chip 221.
According to the technical scheme of the embodiment of the invention, each component of the component layer of the vehicle-mounted gateway printed circuit board comprises at least two connectors arranged on the side edge of the component layer, a communication chip set arranged on the working surface of the component layer and adjacent to one side of the connectors, a system level chip arranged on the working surface of the component layer and far away from one side of the connectors and a storage chip set. Through setting up two at least connectors in subassembly layer side, set up the communication chipset in on the working face on subassembly layer and the one side of neighbouring connector and with system level chip and the one side that the connector was just kept away from to the storage chipset setting on the working face on subassembly layer, solved current vehicle gateway printed circuit board and had the technical problem that the overall arrangement is unreasonable and need great printed circuit board area, realized that vehicle gateway printed circuit board is more reasonable overall arrangement and this circuit board structure volume is less, thereby reach the technological effect that reduces vehicle gateway printed circuit board cost.
EXAMPLE III
The third embodiment of the present invention provides a preferred embodiment of a vehicle-mounted gateway printed circuit board, and specific implementation manners thereof may be found in the following embodiments. The technical terms that are the same as or corresponding to the above embodiments are not repeated herein.
The vehicle-mounted gateway printed circuit board in the embodiment of the invention adopts 10-layer laminated layers. Wherein the first layer and the tenth layer may both be component layers. The third layer, the fourth layer, the fifth layer, the sixth layer and the eighth layer are circuit layers, wherein the third layer, the sixth layer and the eighth layer are signal layers, and the fourth layer and the fifth layer are power supply layers. The second, seventh and ninth layers are earth layers. Wherein the first layer can be understood as the top layer and the tenth layer as the bottom layer.
In order to reduce the volume of the vehicle gateway printed circuit board, the design principle of the 10-layer laminated layer in the embodiment of the invention can be a symmetrical principle. In particular, the symmetry of a 10-ply stack can be embodied in particular by: the first layer and the tenth layer are symmetrical and are assembly layers. The second layer and the ninth layer are symmetrical and are stratums. The third layer and the eighth layer are symmetrical and are signal layers. The fourth layer is a power supply layer, the seventh layer is a stratum, and the whole copper film is paved on the power supply layer and the stratum, so that the power supply layer can be a plane layer, the stratum can also be a plane layer, and the fourth layer can be symmetrical to the seventh layer. In the embodiment of the invention, a small amount of communication lines and a large-area copper film are laid on the signal layer of the sixth layer, so that the signal layer of the sixth layer has high flatness, and the fifth layer can be symmetrical to the sixth layer.
Along with fig. 2, each component in the component layer of the vehicle gateway printed circuit board of the present embodiment may include:
at least two connectors 210 disposed on the right side of the module layer, a communication chipset 220 disposed on the working surface of the module layer and adjacent to one side of the connectors, a system-on-chip 230 disposed on the working surface of the module layer and remote from one side of the connectors, and a storage chipset 240.
The at least two connectors 210 disposed on the right side of the module layer may include a connector for connecting an external power source, that is, a connector for connecting an external power source is used as a main connector.
Further, the communication chipset 220 may include a low-speed communication chipset 221 and at least one high-speed communication chipset 222, wherein the low-speed communication chipset 221 and the high-speed communication chipset 222 are longitudinally arranged, and the low-speed communication chipset 221 is located above the high-speed communication chipset 222.
The high-speed communication chipset 222 may be understood as an ethernet load.
It should be noted that, since the ethernet load needs to communicate with the system-on-chip 230 (see fig. 4), the system-on-chip 230 can be disposed at the upper left of the ethernet load.
Further, the low-speed communication chipset 211 may include a LIN chip 10 and a CAN chip 11, wherein the LIN chip 10 and the CAN chip 11 are longitudinally arranged, and the position of the LIN chip 10 is located below the CAN chip 11.
Further, the high-speed communication chipset 222 may include a Switch chip 20 and two PHY chips 21, wherein the Switch chip 20 and the two PHY chips 21 may be arranged in an inverted "pin" shape.
It should be noted that, because the Switch chip 20 and the other Switch chips 20 need to communicate through the reduced gigabit media independent interface signal (RGMII) (see fig. 5), the arrangement of the plurality of Switch chips 20 may be longitudinally or transversely arranged, and in the embodiment of the present invention, the arrangement of the plurality of Switch chips 20 may be longitudinally arranged. Because the Switch chip 20 needs to communicate with the two PHY chips 21 corresponding to the Switch chip 20 through the reduced gigabit media independent interface signal and the serial gigabit media independent interface signal, the Switch chip 20 and the two PHY chips 21 may be arranged in an inverted "pin" shape.
It should be noted that the reason why the Switch chip 20 and the two PHY chips 21 may be arranged in an inverted "pin" shape in the embodiment of the present invention is that the Switch chip 20 and the two PHY chips 21 are connected by a connection line.
Further, memory chip set 240 may include an EMMC chip 40. The EMMC chip 40 is located on the left side of the LIN chip 10 and above the PHY chip. On this basis, the system-on-chip 230 may be located on the left side of the EMMC chip 40. On this basis, the memory chip set 240 may further include the LPDD4 chip 41 and the FLASH chip 42. The LPDD4 chip 41 may be located to the left of the system-on-chip 230. The FLASH chip 42 may be located above the system-on-chip 230.
Since the signal transmission lines corresponding to the LPDD4 chip 41 may include address lines and signal lines, the signal transmission lines corresponding to the LPDD4 chip 41 need to be laid on the third layer and the eighth layer of the vehicle gateway printed circuit board.
For the convenience of line management, the signal transmission line corresponding to the EMMC chip 40 may be laid on the sixth layer of the vehicle-mounted gateway printed circuit board, and the length error of the signal transmission line needs to be controlled within 25 mils.
It should be noted that the number of the filter capacitors of the system-on-chip 230 is large, and in order to reduce the size of the circuit board structure, the filter capacitors of the system-on-chip 230 may be disposed on the tenth layer of the vehicle-mounted gateway printed circuit board. Further, in order to facilitate the management of the filter capacitor, the filter capacitor of the soc 230 may be packaged based on a predetermined package size. It should be noted that the preset package size is not specifically limited herein, and the package size may be selected according to actual needs, and the preset package size may be 0402, 0603 or 0805.
It should be further noted that the filter capacitor may be disposed adjacent to the pins of each chip, and the capacitance values of the filter capacitors may be arranged around the pins of each chip in the order from small to large.
On this basis, each component in the component layer of the vehicle gateway printed circuit board may further include a power chip 250, a power circuit 260, and a power management chip 270. Wherein, the power chip 250 can be located above the FLASH chip 42. The power circuit 260 may be located above the CAN chip 11 and to the left of the connector. The power management chip 270 may be located to the left of the high speed communication chipset 222 and below the system-on-chip 230.
It should also be noted that each component in the component layer of the onboard gateway printed circuit board may further include a crystal oscillator, and the crystal oscillator may be understood as a crystal oscillator. The crystal oscillator is arranged in the component layer, and has the advantage that the crystal oscillator generates a highly stable signal, and can convert the voltage into a corresponding frequency signal and transmit the corresponding frequency signal to various signal processing chips of the vehicle-mounted gateway printed circuit board.
The technical scheme of the embodiment of the invention solves the technical problems that the conventional vehicle-mounted gateway printed circuit board is unreasonable in layout and needs a larger area of the printed circuit board, and the design of the vehicle-mounted gateway printed circuit board has higher cost, realizes more reasonable layout of the vehicle-mounted gateway printed circuit board and has a smaller structure size, thereby achieving the technical effect of reducing the cost of the vehicle-mounted gateway printed circuit board.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. An in-vehicle gateway printed circuit board, comprising: a component layer and a wiring layer, wherein,
the component layer is provided with components of the vehicle-mounted gateway printed circuit board; communication lines among all components of the vehicle-mounted gateway printed circuit board are laid on the line layer; each component in the component layer communicates based on a communication line in the line layer.
2. The vehicle gateway printed circuit board of claim 1, wherein the wiring layer comprises a power layer and a signal layer; wherein the content of the first and second substances,
the power supply layer is used for laying a power supply transmission line so as to transmit the accessed power supply to each component;
and the signal layer is used for laying signal transmission lines among the components.
3. The vehicular gateway printed circuit board of claim 1, wherein each component in the component layer comprises: the module layer comprises at least two connectors arranged on the side edge of the module layer, a communication chip set arranged on the working surface of the module layer and adjacent to one side of the connectors, a system-level chip and a storage chip set arranged on the working surface of the module layer and far away from one side of the connectors.
4. The vehicular gateway printed circuit board of claim 3, wherein the communication chipset comprises a low-speed communication chipset and at least one high-speed communication chipset, wherein the low-speed communication chipset and the high-speed communication chipset are arranged longitudinally or transversely.
5. The vehicle-mounted gateway printed circuit board of claim 4, wherein the low-speed communication chipset comprises a LIN chip and a CAN chip, the high-speed communication chipset comprises a Switch chip and two PHY chips, and the Switch chip and the two PHY chips are arranged in a structure of a Chinese character pin.
6. The vehicle gateway printed circuit board of claim 5, wherein the memory chipset comprises an EMMC chip, wherein the EMMC chip is arranged adjacent to the LIN chip.
7. The vehicle gateway printed circuit board of claim 6, wherein the system-on-chip is arranged adjacent to the EMMC chip.
8. The vehicle gateway printed circuit board of claim 7, wherein the memory chipset comprises a LPDD4 chip and a FLASH chip, wherein the LPDD4 chip and the FLASH chip are arranged around the system-on-chip.
9. The vehicular gateway printed circuit board of claim 8, wherein each component in the component layer further comprises: the power supply comprises a power supply chip, a power supply circuit and a power supply management chip; wherein, the first and the second end of the pipe are connected with each other,
the power supply chip is arranged adjacent to the FLASH chip and the CAN chip;
the power circuit is arranged adjacent to the power chip, the CAN chip and the connector;
the power management chip is arranged adjacent to the system-on-chip and the high-speed communication chipset.
10. The vehicular gateway printed circuit board of claim 1, wherein the component layer is a top layer and/or a bottom layer of the vehicular gateway printed circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210030464.1A CN114501796B (en) | 2022-01-12 | Vehicle-mounted gateway printed circuit board | |
| PCT/CN2022/140601 WO2023134415A1 (en) | 2022-01-12 | 2022-12-21 | Vehicle-mounted gateway printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210030464.1A CN114501796B (en) | 2022-01-12 | Vehicle-mounted gateway printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114501796A true CN114501796A (en) | 2022-05-13 |
| CN114501796B CN114501796B (en) | 2024-05-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023134415A1 (en) * | 2022-01-12 | 2023-07-20 | 中国第一汽车股份有限公司 | Vehicle-mounted gateway printed circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2023134415A1 (en) | 2023-07-20 |
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