CN211529100U

CN211529100U - Computer cooling device

Info

Publication number: CN211529100U
Application number: CN201922317431.1U
Authority: CN
Inventors: 孔毅
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-22
Filing date: 2019-12-22
Publication date: 2020-09-18
Anticipated expiration: 2029-12-22

Abstract

The utility model discloses a computer heat sink, including the computer body, the computer body bottom is equipped with the fixing base, the inside heat-conducting plate that is equipped with of computer body, the heat-conducting plate below becomes first heat dissipation chamber, the bottom of first heat dissipation chamber right flank is equipped with exhaust system, heat-conducting plate upper end left side with be equipped with the baffle between the computer body top. The beneficial effects are that: through the exhaust system who sets up, open the air exhauster, can spread into first heat dissipation intracavity with the heat that mainboard installation intracavity components and parts during operation produced through venthole or heat-conducting plate, and through exhaust structure, pass through the outside of tuber pipe discharge computer body with the hot gas flow, thereby reduce inside heat, through the heat radiation structure who sets up, open radiator fan, the hot gas flow of mainboard installation intracavity can also get into the cover internally through the louvre, and through the inside of fan exhaust computer body, the radiating effect is improved.

Description

Computer cooling device

Technical Field

The utility model relates to a computer equipment technical field especially relates to a computer heat sink.

Background

At present, computers are gradually popularized and utilized in various industries and become necessary office equipment, the daily use time is long, and after the computers are used for a period of time, components inside a case can dissipate heat, so that the temperature in the case is increased, and the operation speed of the computers is influenced.

The existing computer has larger calorific value, and particularly in summer, the whole computer host can be in a higher temperature environment, so that the aging of some electronic components in the computer is accelerated, the service life of the computer is seriously influenced, and the normal operation of the computer is influenced, for example, a patent with the patent number of 201520116449.4, including a main board, a cooling pipeline, a speed regulating pump, a cooling tank and a speed regulating pump control chip, although the cooling of cooling liquid is accelerated, the working efficiency is improved, and the effect is obvious; however, there are some problems, especially the water sealing problem, and once leakage occurs, the leakage may cause short circuit and burn out of the machine, which may affect people's use.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a computer heat sink through the exhaust system and the heat radiation structure who sets up, adopts the vertical radiating mode who combines together with transversely, and whole heat dissipation is better, prolongs the life of computer body.

The technical scheme of the utility model is realized like this:

the utility model provides a computer heat sink, includes the computer body, computer body bottom is equipped with the fixing base, the inside heat-conducting plate that is equipped with of computer body, first heat dissipation chamber is formed to the heat-conducting plate below, the bottom of first heat dissipation chamber right flank is equipped with exhaust system, heat-conducting plate upper end left side with be equipped with the baffle between the computer body top, be equipped with a plurality of louvres that run through its surface on the baffle, a plurality of louvres form the heat dissipation region, the baffle right side forms the computer motherboard installation cavity, the baffle left side forms second heat dissipation chamber, the second heat dissipation intracavity is equipped with heat radiation structure.

Further, exhaust system includes the air exhauster, the one end of air exhauster is connected with the exhaust column, the exhaust column is kept away from the one end and the air exhausting structure of air exhauster are connected, air exhausting structure installs the bottom in first heat dissipation chamber, the other end of air exhauster is connected with out the tuber pipe.

Furthermore, the exhaust structure includes a plurality of exhaust pipes and connecting pipes, be linked together through the connecting pipe between the exhaust pipe, the surface of exhaust pipe evenly distributed has a plurality of gas pockets along its length direction, the exhaust pipe with the exhaust column is connected.

Furthermore, the air outlet pipe is far away from one end of the exhaust fan and connected with the filtering structure.

Furthermore, the filtering structure is installed on the right side wall of the first heat dissipation cavity, penetrates through the right side wall of the first heat dissipation cavity and extends to the outer side of the first heat dissipation cavity.

Further, heat radiation structure is including the cover body, the both ends of the cover body are open structure, the one end of the cover body with the heat dissipation region cooperatees, the other end of the cover body runs through the left surface in second heat dissipation chamber.

Furthermore, the heat dissipation structure further comprises a heat dissipation fan which is positioned at the top end of the left side surface of the computer body and is installed through the shell, and the heat dissipation fan corresponds to the free end of the cover body.

Furthermore, a plurality of heat dissipation ports arranged along the height direction of the shell are arranged on two sides of the shell.

Furthermore, a plurality of air outlet holes are uniformly distributed at the bottom of the heat conducting plate.

The utility model has the advantages that:

(1) through the exhaust system who sets up, open the air exhauster, can spread into first heat dissipation intracavity with the heat that mainboard installation intracavity components and parts during operation produced through venthole or heat-conducting plate to through exhaust structure, pass through the outside of going out the tuber pipe discharge computer body with the hot gas flow, thereby reduce inside heat.

(2) Through the heat radiation structure who sets up, open radiator fan, the hot gas flow of mainboard installation intracavity can also get into the cover internally through the louvre to through the inside of fan heater fan discharge computer body, further improvement radiating effect.

(3) Through the exhaust system and the heat radiation structure that set up, adopt the heat radiation mode that vertically and transversely combine together, whole heat dissipation is better, prolongs the life of computer body.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a computer cooling device;

FIG. 2 is a left side view of a computer cooling device;

FIG. 3 is a top view of a venting structure;

fig. 4 is a schematic structural view of the separator.

In the figure:

1. a computer body; 2. a heat conducting plate; 3. a fixed seat; 4. an air exhaust structure; 41. an exhaust duct; 42. a connecting pipe; 43. air holes; 5. a first heat dissipation chamber; 6. an exhaust pipe; 7. an exhaust fan; 8. a filter structure; 9. an air draft system; 10. an air outlet pipe; 11. an air outlet; 12. a mainboard mounting cavity; 13. heat dissipation holes; 131. a heat dissipation area; 14. a second heat dissipation chamber; 15. a cover body; 16. a housing; 17. a partition plate; 18. a heat dissipation structure; 19. a heat radiation fan; 20. and a heat dissipation port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

According to the utility model discloses an embodiment provides a computer heat sink.

Referring to fig. 1-4, according to the utility model discloses a computer heat sink, including computer body 1, 1 bottom of computer body is equipped with fixing base 3, 1 inside heat-conducting plate 2 that is equipped with of computer body, 2 below of heat-conducting plate form first heat dissipation chamber 5, the bottom of 5 right flank in first heat dissipation chamber is equipped with exhaust system 9, 2 upper end left sides of heat-conducting plate with be equipped with baffle 17 between 1 top of computer body, be equipped with a plurality of louvres 13 that run through its surface on baffle 17, a plurality of louvres 13 form heat dissipation region 131, baffle 17 right side forms computer motherboard installation cavity 12, baffle 17 left side forms second heat dissipation chamber 14, be equipped with heat radiation structure 18 in the second heat dissipation chamber 14.

In one embodiment, the air draft system 9 includes an air draft fan 7, one end of the air draft fan 7 is connected with the air draft pipe 6, the air draft pipe 6 is kept away from one end of the air draft fan 7 is connected with the air exhaust structure 4, the air exhaust structure 4 is installed at the bottom of the first heat dissipation cavity 5, and the other end of the air draft fan 7 is connected with the air outlet pipe 10.

In one embodiment, the exhaust structure 4 includes a plurality of exhaust pipes 41 and a connecting pipe 42, the exhaust pipes 41 are communicated with each other through the connecting pipe 42, a plurality of air holes 43 are uniformly distributed on the surface of the exhaust pipe 41 along the length direction thereof, and the exhaust pipe 41 is connected with the exhaust pipe 6.

In one embodiment, the end of the outlet duct 10 remote from the suction fan 7 is connected to the filter structure 8.

In one embodiment, the filter structure 8 is mounted on the right side wall of the first heat dissipation chamber 5 and extends through the right side wall of the first heat dissipation chamber 5 to the outside thereof.

In one embodiment, the heat dissipation structure 18 includes a cover 15, two ends of the cover 15 are open, one end of the cover 15 is matched with the heat dissipation area 131, and the other end of the cover 15 penetrates through the left side surface of the second heat dissipation chamber 14.

In one embodiment, the heat dissipating structure 18 further includes a heat dissipating fan 19 disposed at the top end of the left side of the computer body 1 through the housing 16, and the heat dissipating fan 19 corresponds to the free end of the cover 15.

In one embodiment, the housing 16 is provided with a plurality of heat dissipating ports 20 at both sides thereof in a height direction.

In one embodiment, a plurality of air outlet holes 11 are uniformly distributed on the bottom of the heat conducting plate 2.

In the specific implementation process, the components and parts in the mainboard installation cavity 12 can pass through at the in-process of work venthole 11 with heat-conducting plate 2 arrives heat transfer in the first heat dissipation chamber 5, open air exhauster 7, air exhauster 7 passes through exhaust column 6 with exhaust structure 4 is linked together, passes through the hot gas flow it discharges to go out tuber pipe 10 the outside of computer body 1 reduces inside heat.

In addition, by turning on the heat dissipation fan 19, the hot air flow in the motherboard installation cavity 12 can also enter the cover body 15 through the heat dissipation hole 13 and be exhausted from the interior of the computer body 1 through the heat dissipation fan 19.

Through setting up exhaust system 9 with heat radiation structure 18 adopts the vertical and horizontal heat radiation mode that combines together, and the whole heat dissipation is better, prolongs computer body's life.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A computer cooling device is characterized by comprising a computer body (1), the bottom end of the computer body (1) is provided with a fixed seat (3), a heat conducting plate (2) is arranged in the computer body (1), a first heat dissipation cavity (5) is formed below the heat conduction plate (2), an air draft system (9) is arranged at the bottom of the right side surface of the first heat dissipation cavity (5), a clapboard (17) is arranged between the left side of the upper end of the heat conducting plate (2) and the top of the computer body (1), a plurality of heat dissipation holes (13) penetrating through the surface of the partition plate (17) are arranged on the partition plate (17), a heat dissipation area (131) is formed by the plurality of heat dissipation holes (13), computer mainboard installation cavity (12) is formed on baffle (17) right side, baffle (17) left side forms second heat dissipation chamber (14), be equipped with heat radiation structure (18) in second heat dissipation chamber (14).

2. The computer cooling device according to claim 1, wherein the air draft system (9) comprises an air draft fan (7), one end of the air draft fan (7) is connected with an air draft tube (6), one end of the air draft tube (6) far away from the air draft fan (7) is connected with an air exhaust structure (4), the air exhaust structure (4) is installed at the bottom of the first heat dissipation cavity (5), and the other end of the air draft fan (7) is connected with an air outlet pipe (10).

3. The computer cooling device according to claim 2, wherein the exhaust structure (4) comprises a plurality of exhaust pipes (41) and connecting pipes (42), the exhaust pipes (41) are connected with each other through the connecting pipes (42), a plurality of air holes (43) are uniformly distributed on the surface of each exhaust pipe (41) along the length direction of the exhaust pipe, and the exhaust pipes (41) are connected with the exhaust pipes (6).

4. A computer cooling device according to claim 2, characterized in that the end of the outlet duct (10) remote from the suction fan (7) is connected to a filter structure (8).

5. A computer cooling device according to claim 4, wherein the filter structure (8) is mounted on the right side wall of the first heat dissipation chamber (5) and extends through the right side wall of the first heat dissipation chamber (5) to the outside thereof.

6. The computer cooling device according to claim 1, wherein the heat dissipation structure (18) comprises a cover body (15), two ends of the cover body (15) are open, one end of the cover body (15) is matched with the heat dissipation area (131), and the other end of the cover body (15) penetrates through the left side surface of the second heat dissipation cavity (14).

7. The computer cooling device according to claim 6, wherein the heat dissipating structure (18) further comprises a heat dissipating fan (19) disposed at the top end of the left side surface of the computer body (1) and mounted through the housing (16), and the heat dissipating fan (19) corresponds to the free end of the cover (15).

8. A computer cooling device according to claim 7, wherein the housing (16) is provided with a plurality of heat dissipating ports (20) at both sides along the height direction thereof.

9. A computer cooling device according to claim 7, characterized in that a plurality of air outlet holes (11) are uniformly distributed on the bottom of the heat conducting plate (2).