CN211528615U - Fault chip positioning device in high-density circuit board - Google Patents
Fault chip positioning device in high-density circuit board Download PDFInfo
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- CN211528615U CN211528615U CN201922375376.1U CN201922375376U CN211528615U CN 211528615 U CN211528615 U CN 211528615U CN 201922375376 U CN201922375376 U CN 201922375376U CN 211528615 U CN211528615 U CN 211528615U
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Abstract
The utility model discloses a trouble chip positioner in high density circuit board, include: the detection table is used for placing a circuit board of a chip to be positioned; the direct current power supply supplies power to chips under the same power network on the circuit board; the thermal imager faces the detection table in the imaging direction and performs thermal imaging on the circuit board after power supply on the detection table; and the image analysis positioning module is connected with the thermal imager. Compare with current experience elimination method, the utility model discloses the rate of accuracy of looking for trouble chip on the circuit board increases substantially, avoids demolising repeatedly and welding the risk that chip leads to many times high temperature operation to arouse other peripheral components of chip to become invalid, if demolish behind a trouble chip power network resistance not resume normal, operation location next trouble chip position more than the repeatable adoption has reduced the maintenance cost of circuit board when improving work efficiency.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit, concretely relates to trouble chip positioner in high density circuit board.
Background
With the wide application of integrated circuits, a large number of integrated chips are designed on the existing circuit board, and due to the small size and multiple functions of the chips, the circuit board can use dozens of chips or hundreds of chips in large-scale application. In order to facilitate design and control cost, chips with the same working voltage are usually hung to the same power network as much as possible for centralized power supply under the condition that the power output load capacity allows during design.
In the debugging process of the circuit board, if the output voltage exceeds the allowable working voltage range of a chip under the power network due to improper power debugging, a chip power pin under the power network is inevitably punctured; or the chip power supply pins on the circuit board have quality problems when leaving the factory, and the resistance value between the power supply pins of the fault chip and the GND (analog ground or data ground) is obviously lower than that of other normal chips under the power supply network, so that the whole power supply network is in a state of short circuit to the GND, the power supply is in an overcurrent protection state due to overlarge current, the power supply network cannot establish normal voltage output, other chips under the power supply network cannot work, and the circuit board cannot be debugged and completed smoothly.
In the process of fault elimination, as the input ends of all chips in the power supply network are connected in the same line, if only one chip is in short circuit, the resistance value of any place in the line measured by an instrument is in a short circuit state, and the fault chip cannot be positioned in a short time. At present, an elimination method is generally adopted to locate fault chips, namely, all chips under the same power supply network are listed, the chip which is most likely to break down a power supply pin is found out through experience, then the fault chips are detached from the power supply network one by one, an instrument is used for measuring the line resistance value when one fault chip is detached, and when the line resistance value of the power supply network is recovered to be normal after a certain fault chip is detached, namely, the situation that a short circuit of a line is caused by the fault chip is judged. If a plurality of chip power supply pins under the same power supply network are punctured at the same time, the circuit resistance value of the power supply network can not be recovered to be normal even if one fault chip is removed, and the difficulty in re-positioning other fault chips is very high, just like a sea fishing needle. Moreover, the chip on the circuit board needs to be removed and welded at a certain high temperature for a proper time, if the fault chip is not accurately positioned, the chip is repeatedly removed and welded by using an elimination method, and the risk of failure of other elements around the chip is increased by multiple high-temperature operations.
SUMMERY OF THE UTILITY MODEL
In order to solve at least one of the above technical problems, the utility model provides a trouble chip positioner in high density circuit board.
The purpose of the utility model is realized through the following technical scheme:
the utility model provides a trouble chip positioner in high density circuit board, include: including examining test table, DC power supply, thermal imager and image analysis orientation module, specifically do: a circuit board of a fault chip to be positioned is placed on the detection table; the direct current power supply supplies power to a power supply network of a plurality of chips connected in parallel on the circuit board; the thermal imager is used for imaging the circuit board after power supply on the detection table in a direction towards the detection table; and the image analysis positioning module is connected with the thermal imager.
As a further improvement, a voltage detection module is further arranged between the direct current power supply and the power supply network.
As a further improvement, the voltage detection module is a voltmeter.
As a further improvement, the dc power supply is an adjustable dc power supply.
As a further improvement, an on-off switch is arranged between the direct current power supply and the power supply network.
As a further improvement, the power output end of the direct current power supply is provided with a probe for connecting with a power supply network.
As a further improvement, the positive pole of the direct current power supply is provided with a current limiting module.
As a further improvement, the detection table is provided with a circuit board limiting area for preventing the circuit board from shifting.
As a further improvement, the detection table is provided with a thermal imager mounting bracket, and the thermal imager is arranged on the thermal imager mounting bracket
The utility model provides a pair of trouble chip positioner in high density circuit board, include: a circuit board of a fault chip to be positioned is placed on the detection table; the direct current power supply supplies power to a power network of a plurality of chips connected in parallel on the circuit board; the thermal imager faces the detection table in the imaging direction and performs thermal imaging on the circuit board after power supply on the detection table; and the image analysis positioning module is connected with the thermal imager, receives the thermal image generated by the thermal imager, and determines the position of the fault chip on the circuit board according to the hot spot of the thermal image. When the utility model is used, the circuit board of the fault chip to be positioned is placed on the detection platform, the cathode of the direct current power supply is connected with the GND of the circuit board power network, the anode of the direct current power supply is connected with the anode of the circuit board power network, the direct current power supply supplies power to the circuit board and controls the voltage value of the power supply to ensure enough potential difference to support the current of the power network when the circuit board chip does not work, the resistance between the pin and the GND of the chip in the circuit board is obviously lower than the resistance between the pin and the GND of other chips in the power network, the characteristic that the current magnitude is inversely proportional to the impedance of the same power network is utilized, and the principle of current work is utilized, a large amount of current raises the temperature of the pin of the fault chip, then the thermal imaging instrument facing the detection platform is adopted to carry out thermal imaging on the circuit board, the image analysis positioning module receives, and according to the combination of the hot spot of the thermal image and the position of the circuit board, according to the relation between the spectral wavelength and the color temperature, the color of the thermal image at the position with higher temperature on the circuit board is closer to red to determine the position of the fault chip on the circuit board, and the fault chip is accurately positioned. Compare with current experience elimination method, the utility model relates to a trouble chip positioner in high density circuit board, the rate of accuracy of seeking trouble chip increases substantially, avoids demolising repeatedly and welding the risk that chip leads to many times high temperature operation to arouse other components of chip periphery to become invalid, if remove a trouble chip after the power network resistance not resume normal, operation accurate positioning next trouble chip position more than the repeatedly usable has reduced the maintenance cost of circuit board when improving work efficiency.
Drawings
The present invention is further explained by using the drawings, but the embodiments in the drawings do not constitute any limitation to the present invention, and for those skilled in the art, other drawings can be obtained according to the following drawings without any inventive work.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a control block diagram of the present invention.
In the figure: 1, a detection table; 2, a direct current power supply; 3, a thermal imager; 4, an image analysis positioning module; 5, a current limiting module; 6, a voltage detection module; 7, a probe; 8, mounting a bracket for the thermal imaging camera; 9, switching on and off the switch; 11, a circuit board; and 12, switching a power supply chip.
Detailed Description
In order to make the technical solutions of the present invention better understood, the following detailed description of the present invention is provided with reference to the accompanying drawings and specific embodiments, and it should be noted that the embodiments and features of the embodiments of the present invention can be combined with each other without conflict.
With reference to fig. 1 and 2, an embodiment of the present invention provides a device for locating a fault chip in a high-density circuit board, including:
the detection table 1 is used for placing a circuit board 11 of a chip to be positioned, a plurality of chips are connected in parallel on the same power network of the circuit board 11, a circuit board limiting area for preventing the circuit board 11 from shifting is arranged on the detection table 1, and the thermal image generated after thermal imaging is carried out by a thermal imager 3 subsequently is guaranteed to correspond to the position of the circuit board 11. A power chip switch 12 is arranged between the power output end of the power network on the circuit board 11 and the rear-stage chip, and before fault chip positioning operation is carried out in the embodiment, the power output end of the power network on the circuit board 11 is disconnected with the power chip switch 12 of the rear-stage chip, so that damage caused by overlarge current of the rear-stage chip on the circuit board 11 in operation is avoided.
The direct current power supply 2 is used for supplying power to a power supply network which is connected with a plurality of chips in parallel on the circuit board 11, a voltage detection module 6 which is used for detecting the output voltage of the direct current power supply 2 is connected in parallel between the direct current power supply 2 and the power supply network, the voltage detection module 6 of the embodiment adopts a voltmeter, an on-off switch 9 is arranged between the anode of the direct current power supply 2 and the anode of the power supply network of the circuit board 11, and the on-off switch 9 is operated to realize the on-off of the current between the direct current power supply 2 and the power supply. The power output end of the direct current power supply 2 is provided with a probe 7 used for being connected with a power network, the probe 7 of the embodiment is arranged close to the output end of a power chip on a circuit board 11, so that the power network of the circuit board 11 has enough overcurrent capacity, the adopted direct current power supply 2 is an adjustable direct current power supply, when the positioning detection of a fault chip in the circuit board is carried out, an on-off switch 9 is closed to enable the adjustable direct current power supply to supply power to the power network of the fault chip on the circuit board 11, meanwhile, a voltage detection module 6 monitors the output voltage of the adjustable direct current power supply to enable the output voltage not to exceed 50% of the rated working voltage of the chip in the circuit board 11, so that the voltage regulated by the adjustable direct current power supply can ensure that the chip in the power network cannot work and has enough potential difference to support the current of the power network, the power supply pin of the chip in the circuit board 11 is in a breakdown state, by utilizing the characteristic that the current is inversely proportional to the impedance of the same power supply network, the temperature of a fault chip pin is increased by a large amount of current.
The image analyzing and positioning module 4 of this embodiment is configured to receive a thermal image generated by the thermal imager 3, determine, according to a relationship between a spectral wavelength and a color temperature, a hot spot of the thermal image as the color of the thermal image at a position on the circuit board 11 at which the temperature is higher is closer to red, and combine the hot spot of the thermal image and a photographed real image of the circuit board 11 at the same ratio to determine the position of a faulty chip on the circuit board 11.
If the resistance value of the power supply network is not recovered to normal after a fault chip is removed, the operation can be repeatedly adopted to position the position of the next fault chip on the circuit board 11.
In a further preferred embodiment, a current limiting module 5 is connected in series with the positive electrode of the dc power supply 2, the positive electrode of the dc power supply 2 is connected to other modules through the current limiting module 5, and the current limiting module 5 in this embodiment is a current limiter. In the embodiment, the maximum safe current value of the current limiting module 5 is set to be not more than 10% of the maximum working current of the power chip on the circuit board 11, and when the current of the direct current power supply 2 reaches the maximum current set by the current limiting module 5, the current limiting module 5 keeps constant safe current output.
The embodiment further comprises a voltage control module, the voltage control module is connected with the voltage detection module 6 and the direct current power supply 2, the voltage control module monitors and receives a voltage signal detected by the voltage detection module 6, the output voltage of the direct current power supply 2 is controlled according to the voltage signal, it is ensured that a chip in the power supply network cannot work due to the voltage regulated by the direct current power supply 2, and sufficient potential difference can be provided to support the current of the power supply network.
In the description above, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore should not be construed as limiting the scope of the invention.
In conclusion, although the present invention has been described with reference to the preferred embodiments, it should be noted that, although various changes and modifications can be made by those skilled in the art, unless such changes and modifications depart from the scope of the present invention, they should be construed as being included therein.
Claims (9)
1. The utility model provides a trouble chip positioner in high density circuit board which characterized in that, is including examining test table (1), DC power supply (2), thermal imaging system (3) and image analysis orientation module (4), specifically is: a circuit board (11) of a fault chip to be positioned is placed on the detection table (1); the direct current power supply (2) supplies power to a power supply network of a plurality of chips connected in parallel on the circuit board (11); the imaging direction of the thermal imager (3) faces the detection table (1), and thermal imaging is performed on the circuit board (11) after power supply on the detection table (1); and the image analysis positioning module (4) is connected with the thermal imager (3).
2. The device for locating the faulty chip in the high-density circuit board according to claim 1, wherein a voltage detection module (6) is further provided between the dc power supply (2) and the power supply network.
3. The device for locating faulty chips on high-density circuit board according to claim 2, wherein said voltage detection module (6) is a voltmeter.
4. A device for locating faulty chips on a high-density circuit board according to claim 3, characterized in that said dc power supply (2) is an adjustable dc power supply.
5. The device for locating faulty chips on high-density circuit board according to claim 4, wherein an on-off switch (9) is provided between the DC power supply (2) and the power supply network.
6. The device for locating faulty chips on high-density circuit board according to claim 5, wherein the power output of said DC power supply (2) is provided with a probe (7) for connection to a power network.
7. The device for locating faulty chips on high-density circuit board according to any one of claims 1 to 6, wherein the positive pole of the DC power supply (2) is provided with a current limiting module (5).
8. The device for locating faulty chips on high-density circuit board according to any one of claims 1 to 6, wherein the inspection table (1) is provided with a circuit board spacing region for preventing the circuit board (11) from shifting.
9. The high-density circuit board internal fault chip positioning device according to any one of claims 1 to 6, wherein the inspection table (1) is provided with a thermal imaging camera mounting bracket (8), and the thermal imaging camera (3) is provided on the thermal imaging camera mounting bracket (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922375376.1U CN211528615U (en) | 2019-12-26 | 2019-12-26 | Fault chip positioning device in high-density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922375376.1U CN211528615U (en) | 2019-12-26 | 2019-12-26 | Fault chip positioning device in high-density circuit board |
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| CN211528615U true CN211528615U (en) | 2020-09-18 |
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| CN201922375376.1U Active CN211528615U (en) | 2019-12-26 | 2019-12-26 | Fault chip positioning device in high-density circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110888044A (en) * | 2019-12-26 | 2020-03-17 | 北京航星中云科技有限公司 | Device and method for positioning fault chip in high-density circuit board |
| CN113466740A (en) * | 2021-07-07 | 2021-10-01 | 深圳市美信咨询有限公司 | Fault positioning method and fault positioning device |
-
2019
- 2019-12-26 CN CN201922375376.1U patent/CN211528615U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110888044A (en) * | 2019-12-26 | 2020-03-17 | 北京航星中云科技有限公司 | Device and method for positioning fault chip in high-density circuit board |
| CN113466740A (en) * | 2021-07-07 | 2021-10-01 | 深圳市美信咨询有限公司 | Fault positioning method and fault positioning device |
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