CN110888044A - Device and method for positioning fault chip in high-density circuit board - Google Patents
Device and method for positioning fault chip in high-density circuit board Download PDFInfo
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- CN110888044A CN110888044A CN201911363374.9A CN201911363374A CN110888044A CN 110888044 A CN110888044 A CN 110888044A CN 201911363374 A CN201911363374 A CN 201911363374A CN 110888044 A CN110888044 A CN 110888044A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 43
- 238000001931 thermography Methods 0.000 claims abstract description 25
- 238000010191 image analysis Methods 0.000 claims abstract description 6
- 238000003384 imaging method Methods 0.000 claims abstract description 6
- 239000000523 sample Substances 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims 2
- 230000008030 elimination Effects 0.000 abstract description 5
- 238000003379 elimination reaction Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
Abstract
The invention discloses a device and a method for positioning a fault chip in a high-density circuit board, wherein the device comprises the following steps: the detection table is used for placing a circuit board of a chip to be positioned; the direct current power supply supplies power to chips under the same power network on the circuit board; the thermal imager faces the detection table in the imaging direction and performs thermal imaging on the circuit board after power supply on the detection table; and the image analysis positioning module is connected with the thermal imager, receives the thermal image generated by the thermal imager, and determines the position of the fault chip on the circuit board according to the hot spot of the thermal image. Compared with the existing empirical elimination method, the method has the advantages that the accuracy of finding the fault chip on the circuit board is greatly improved, the risk that other elements around the chip are invalid due to repeated high-temperature operation caused by repeated chip removal and welding is avoided, if the resistance value of the power supply network is not recovered to be normal after one fault chip is removed, the operation can be repeatedly adopted to position the next fault chip, the working efficiency is improved, and the maintenance cost of the circuit board is reduced.
Description
Technical Field
The invention belongs to the technical field of integrated circuits, and particularly relates to a device and a method for positioning a fault chip in a high-density circuit board.
Background
With the wide application of integrated circuits, a large number of integrated chips are designed on the existing circuit board, and due to the small size and multiple functions of the chips, the circuit board can use dozens of chips or hundreds of chips in large-scale application. In order to facilitate design and control cost, chips with the same working voltage are usually hung to the same power network as much as possible for centralized power supply under the condition that the power output load capacity allows during design.
In the debugging process of the circuit board, if the output voltage exceeds the allowable working voltage range of a chip under the power network due to improper power debugging, a chip power pin under the power network is inevitably punctured; or the chip power supply pins on the circuit board have quality problems when leaving the factory, and the resistance value between the power supply pins of the fault chip and the GND (analog ground or data ground) is obviously lower than that of other normal chips under the power supply network, so that the whole power supply network is in a state of short circuit to the GND, the power supply with overlarge current is in an overcurrent protection state, the power supply network cannot establish normal voltage output, other chips under the power supply network cannot work, and the circuit board cannot be debugged and finished smoothly.
In the process of fault elimination, as the input ends of all chips in the power supply network are connected in the same line, if only one chip is in short circuit, the resistance value of any place in the line measured by an instrument is in a short circuit state, and the fault chip cannot be positioned in a short time. At present, an elimination method is generally adopted to locate fault chips, namely, all chips under the same power supply network are listed, the chip which is most likely to break down a power supply pin is found out through experience, then the fault chips are detached from the power supply network one by one, an instrument is used for measuring the line resistance value when one fault chip is detached, and when the line resistance value of the power supply network is recovered to be normal after a certain fault chip is detached, namely, the situation that a short circuit of a line is caused by the fault chip is judged. If a plurality of chip power supply pins under the same power supply network are punctured at the same time, the circuit resistance value of the power supply network can not be recovered to be normal even if one fault chip is removed, and the difficulty in re-positioning other fault chips is very high, just like a sea fishing needle. Moreover, the chip on the circuit board needs to be removed and welded at a certain high temperature for a proper time, if the fault chip is not accurately positioned, the chip is repeatedly removed and welded by using an elimination method, and the risk of failure of other elements around the chip is increased by multiple high-temperature operations.
Disclosure of Invention
To solve at least one of the above technical problems, the present invention provides a device and a method for positioning a faulty chip in a high-density circuit board.
The purpose of the invention is realized by the following technical scheme:
in one aspect, the present invention provides a device for locating a faulty chip in a high-density circuit board, comprising:
the detection table is used for placing a circuit board of a chip to be positioned;
the direct current power supply is used for supplying power to a power supply network of a plurality of chips connected in parallel on the circuit board;
the thermal imager is used for carrying out thermal imaging on the circuit board after power supply on the detection table, and the imaging direction of the thermal imager faces to the detection table;
and the image analysis positioning module is connected with the thermal imager and used for receiving the thermal image generated by the thermal imager and determining the position of the fault chip on the circuit board according to the hot spot of the thermal image.
As a further improvement, a voltage detection module for detecting the output voltage of the direct-current power supply is further arranged between the direct-current power supply and the power supply network.
As a further improvement, the voltage detection module is a voltmeter.
As a further improvement, the dc power supply is an adjustable dc power supply.
As a further improvement, an on-off switch is arranged between the direct current power supply and the power supply network.
As a further improvement, the power output end of the direct current power supply is provided with a probe for connecting with a power supply network.
As a further improvement, the positive pole of the direct current power supply is provided with a current limiting module.
As a further improvement, the detection table is provided with a circuit board limiting area for preventing the circuit board from shifting.
As a further improvement, a thermal imager mounting bracket is arranged on the detection table, and the thermal imager is arranged on the thermal imager mounting bracket.
The invention provides a device for positioning a fault chip in a high-density circuit board, which comprises: a circuit board of a fault chip to be positioned is placed on the detection table; the direct current power supply is used for supplying power to a power supply network of a plurality of chips connected in parallel on the circuit board; the thermal imager is used for carrying out thermal imaging on the circuit board after power supply on the detection table, and the imaging direction of the thermal imager faces the detection table; and the image analysis positioning module is connected with the thermal imager and used for receiving the thermal image generated by the thermal imager and determining the position of the fault chip on the circuit board according to the hot spot of the thermal image. When the invention is used, a circuit board of a chip to be positioned is placed on a detection table, the cathode of a direct current power supply is connected with GND of a circuit board power supply network, the anode of the direct current power supply is connected with the anode of the circuit board power supply network, the direct current power supply supplies power to the circuit board and controls the voltage value of the power supply to ensure that enough potential difference can support the current of the power supply network when the circuit board chip does not work, the resistance value between a pin and GND of the chip in the circuit board in a breakdown state is obviously lower than the resistance value of the pins GND of other chips in the power supply network, a great amount of current raises the temperature of the pin of the fault chip by utilizing the characteristic that the current is in inverse proportion to the impedance of the same power supply network and the principle of current acting, then a thermal imager facing the detection table is adopted to carry out thermal imaging on the circuit board, an image, and according to the combination of the hot spot of the thermal image and the position of the circuit board, according to the relation between the spectral wavelength and the color temperature, the color of the thermal image at the position with higher temperature on the circuit board is closer to red to determine the position of the fault chip on the circuit board, and the fault chip is accurately positioned. Compared with the existing experience elimination method, the fault chip positioning device in the high-density circuit board has the advantages that the accuracy of finding a fault chip is greatly improved, the risk that other elements around the chip are invalid due to multiple high-temperature operations caused by repeated chip dismounting and welding is avoided, if the resistance value of a power supply network is not recovered to be normal after one fault chip is dismounted, the operation can be repeatedly adopted to accurately position the next fault chip, the working efficiency is improved, and meanwhile, the maintenance cost of the circuit board is reduced.
On the other hand, the invention also provides a method for positioning the fault chip in the high-density circuit board, which comprises the following steps: s1, placing the circuit board of the chip to be positioned on a detection table; s2, supplying power to a power network of a plurality of chips connected in parallel on a circuit board, connecting the negative pole of a power supply with GND of the power network of the circuit board, connecting the positive pole of the power supply with the positive pole of the power network of the circuit board, supplying power to the circuit board by the power supply and controlling the voltage value of the power supply when the chip of the circuit board does not work, and ensuring enough potential difference to support the current of the power network, wherein the resistance value between a pin and the GND of the chip in a breakdown state is obviously lower than that of the pins GND of other chips in the power network, and the temperature of the pin of a fault chip is raised by a large amount of current by utilizing the characteristic that the current is in inverse proportion to the impedance of the same; s3, performing thermal imaging on the circuit board after power supply on the detection table; s4, determining the position of the fault chip on the circuit board according to the hot spot on the generated thermal image, determining the position of the fault chip on the circuit board by using the relation between the spectral wavelength and the color temperature, wherein the higher the temperature on the circuit board, the closer the color of the thermal image to red, and accurately positioning the fault chip. According to the method for positioning the fault chip in the high-density circuit board, the accuracy of finding the fault chip is greatly improved, the risk that other elements around the chip are invalid due to multiple high-temperature operations caused by repeated chip dismounting and welding is avoided, if the resistance value of a power supply network is not recovered to be normal after one fault chip is dismounted, the operation steps can be repeatedly adopted to accurately position the next fault chip, the working efficiency is improved, and meanwhile the maintenance cost of the circuit board is reduced.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a control block diagram of the present invention.
In the figure: 1, a detection table; 2, a direct current power supply; 3, a thermal imager; 4, an image analysis positioning module; 5, a current limiting module; 6, a voltage detection module; 7, a probe; 8, mounting a bracket for the thermal imaging camera; 9, switching on and off the switch; 11, a circuit board; and 12, switching a power supply chip.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings and specific embodiments, and it is to be noted that the embodiments and features of the embodiments of the present application can be combined with each other without conflict.
Referring to fig. 1 and fig. 2, in one aspect, an embodiment of the present invention provides a device for locating a faulty chip in a high-density circuit board, including:
the detection table 1 is used for placing a circuit board 11 of a chip to be positioned, a plurality of chips are connected in parallel on the same power network of the circuit board 11, a circuit board limiting area for preventing the circuit board 11 from shifting is arranged on the detection table 1, and the thermal image generated after thermal imaging is carried out by a thermal imager 3 subsequently is guaranteed to correspond to the position of the circuit board 11. A power chip switch 12 is arranged between the power output end of the power network on the circuit board 11 and the rear-stage chip, and before fault chip positioning operation is carried out in the embodiment, the power output end of the power network on the circuit board 11 is disconnected with the power chip switch 12 of the rear-stage chip, so that damage caused by overlarge current of the rear-stage chip on the circuit board 11 in operation is avoided.
The direct current power supply 2 is used for supplying power to a power supply network which is connected with a plurality of chips in parallel on the circuit board 11, a voltage detection module 6 which is used for detecting the output voltage of the direct current power supply 2 is connected in parallel between the direct current power supply 2 and the power supply network, the voltage detection module 6 of the embodiment adopts a voltmeter, an on-off switch 9 is arranged between the anode of the direct current power supply 2 and the anode of the power supply network of the circuit board 11, and the on-off switch 9 is operated to realize the on-off of the current between the direct current power supply 2 and the power supply. The power output end of the direct current power supply 2 is provided with a probe 7 used for being connected with a power network, the probe 7 of the embodiment is well contacted with the position, close to the output end of a power chip, on a circuit board 11, so that the power network of the circuit board 11 has enough over-current capability, the adopted direct current power supply 2 is an adjustable direct current power supply, when the positioning detection of a fault chip in the circuit board is carried out, an on-off switch 9 is closed, so that the adjustable direct current power supply supplies power to the power network of the fault chip on the circuit board 11, meanwhile, a voltage detection module 6 monitors the output voltage of the adjustable direct current power supply, so that the output voltage of the adjustable direct current power supply does not exceed 50% of the rated working voltage of the chip in the circuit board 11, the voltage regulated by the adjustable direct current power supply is ensured not to work, and enough potential, the resistance value between the pin and the GND is obviously lower than that of the pins GND of other chips in the power network, and the temperature of the pin of the fault chip is increased by a large amount of current by utilizing the characteristic that the current is inversely proportional to the impedance of the same power network and the principle that the current does work.
The image analyzing and positioning module 4 of this embodiment is configured to receive a thermal image generated by the thermal imager 3, determine, according to a relationship between a spectral wavelength and a color temperature, a hot spot of the thermal image as the color of the thermal image at a position on the circuit board 11 at which the temperature is higher is closer to red, and combine the hot spot of the thermal image and a photographed real image of the circuit board 11 at the same ratio to determine the position of a faulty chip on the circuit board 11.
If the resistance value of the power supply network is not recovered to normal after a fault chip is removed, the operation can be repeatedly adopted to position the position of the next fault chip on the circuit board 11.
In a further preferred embodiment, a current limiting module 5 is connected in series with the positive electrode of the dc power supply 2, the positive electrode of the dc power supply 2 is connected to other modules through the current limiting module 5, and the current limiting module 5 in this embodiment is a current limiter. In the embodiment, the maximum safe current value of the current limiting module 5 is set to be not more than 10% of the maximum working current of the power chip on the circuit board 11, and when the current of the direct current power supply 2 reaches the maximum current set by the current limiting module 5, the current limiting module 5 keeps constant safe current output.
The embodiment further comprises a voltage control module, the voltage control module is connected with the voltage detection module 6 and the direct current power supply 2, the voltage control module monitors and receives a voltage signal detected by the voltage detection module 6, the output voltage of the direct current power supply 2 is controlled according to the voltage signal, it is ensured that a chip in the power supply network cannot work due to the voltage regulated by the direct current power supply 2, and sufficient potential difference can be provided to support the current of the power supply network.
On the other hand, an embodiment of the present invention further provides a method for positioning a faulty chip in a high-density circuit board, which includes the following main steps:
s1, placing the circuit board 11 of the fault chip to be positioned on the detection table 1, wherein the detection table 1 is used for placing the circuit board 11 of the fault chip to be positioned, a plurality of chips are connected in parallel on the same power network of the circuit board 11, a circuit board limiting area for preventing the circuit board 11 from shifting is arranged on the detection table 1, and it is guaranteed that a thermal image generated after thermal imaging is carried out by the thermal imager 3 in a follow-up mode corresponds to the position of the circuit board 11. A power chip switch 12 is arranged between the power output end of the power network on the circuit board 11 and the rear-stage chip, and before fault chip positioning operation is carried out in the embodiment, the power output end of the power network on the circuit board 11 is disconnected with the power chip switch 12 of the rear-stage chip, so that damage caused by overlarge current of the rear-stage chip on the circuit board 11 in operation is avoided.
S2, supplying power to a power supply network of a plurality of chips connected in parallel on the circuit board 11, and connecting in parallel a voltage detection module 6 for detecting an output voltage of the dc power supply 2 between the dc power supply 2 and the power supply network, where the voltage detection module 6 of this embodiment is a voltmeter, and an on-off switch 9 is provided between an anode of the dc power supply 2 and an anode of the power supply network of the circuit board 11, and the on-off switch 9 is operated to switch on and off a current between the dc power supply 2 and the power supply network. The power output end of the direct current power supply 2 is provided with a probe 7 used for being connected with a power network, the probe 7 of the embodiment is well contacted with the position, close to the output end of a power chip, on a circuit board 11, so that the power network of the circuit board 11 has enough over-current capability, the adopted direct current power supply 2 is an adjustable direct current power supply, when the positioning detection of a fault chip in the circuit board is carried out, an on-off switch 9 is closed, so that the adjustable direct current power supply supplies power to the power network of the fault chip on the circuit board 11, meanwhile, a voltage detection module 6 monitors the output voltage of the adjustable direct current power supply, so that the output voltage of the adjustable direct current power supply does not exceed 50% of the rated working voltage of the chip in the circuit board 11, the voltage regulated by the adjustable direct current power supply is ensured not to work, and enough potential, the resistance value between the pin and the GND is obviously lower than that of the pins GND of other chips in the power network, and the temperature of the pin of the fault chip is increased by a large amount of current by utilizing the characteristic that the current is inversely proportional to the impedance of the same power network and the principle that the current does work.
S3, circuit board after the power supply on examining test table 1 carries out thermal imaging, examine and be equipped with thermal imager installing support 8 on test table 1, thermal imager 3 locates on thermal imager installing support 8 and examines test table 1 with thermal imager 3' S imaging direction orientation, still can be equipped with displacement device on thermal imager installing support 8, thermal imager 3 is convenient for scan through displacement device and examines the chip of the different positions of circuit board 11 after the bench power supply and carry out thermal imaging, and do not receive the restriction of circuit board 11 size. When the thermal imaging camera 3 scans that the temperature of a certain chip position on the circuit board 11 after power supply is obviously higher than that of peripheral elements, it can be determined that a large current passes through the chip in the non-working state, and the generated heat is captured by the thermal imaging camera 3. If the temperature of the circuit board 11 scanned by the thermal imager 3 is not obviously increased, so that the thermal imager 3 cannot determine the position of the fault chip, the current value of the power supply network of the circuit board 11 can be increased by adjusting the direct-current power supply under the condition of ensuring that the rated working current of the power supply chip on the circuit board 11 is not exceeded, so that the temperature of the pin of the fault chip is further increased, and the generated heat is conveniently captured by the thermal imager 3.
S4, determining the position of the faulty chip on the circuit board 11 according to the hot spot on the generated thermal image, where the image analysis and positioning module 4 of this embodiment determines the position of the faulty chip on the circuit board 11 by using the received thermal image generated by the thermal imager 3, and according to the relationship between the spectral wavelength and the color temperature, the higher the temperature on the circuit board 11, the closer the color of the thermal image to red is the hot spot of the thermal image, and combining the hot spot of the thermal image and the photographed real image of the circuit board 11 in the same proportion to determine the position of the faulty chip on the circuit board 11.
If the resistance value of the power supply network is not recovered to normal after a fault chip is removed, the operation can be repeatedly adopted to position the position of the next fault chip on the circuit board 11.
In a further preferred embodiment, a current limiting module 5 is connected in series with the positive electrode of the dc power supply 2, the positive electrode of the dc power supply 2 is connected to other modules through the current limiting module 5, and the current limiting module 5 in this embodiment is a current limiter. In the embodiment, the maximum safe current value of the current limiting module 5 is set to be not more than 10% of the maximum working current of the power chip on the circuit board 11, and when the current of the direct current power supply 2 reaches the maximum current set by the current limiting module 5, the current limiting module 5 keeps constant safe current output.
The embodiment further comprises a voltage control module, the voltage control module is connected with the voltage detection module 6 and the direct current power supply 2, the voltage control module monitors and receives a voltage signal detected by the voltage detection module 6, the output voltage of the direct current power supply 2 is controlled according to the voltage signal, it is ensured that a chip in the power supply network cannot work due to the voltage regulated by the direct current power supply 2, and sufficient potential difference can be provided to support the current of the power supply network.
In the description above, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore should not be construed as limiting the scope of the present invention.
In conclusion, although the present invention has been described with reference to the preferred embodiments, it should be noted that various changes and modifications can be made by those skilled in the art, and they should be included in the scope of the present invention unless they depart from the scope of the present invention.
Claims (10)
1. A device for locating a faulty chip in a high-density circuit board, comprising:
the detection table (1) is used for placing a circuit board (11) of a chip to be positioned;
the direct current power supply (2) is used for supplying power to a power supply network of a plurality of chips connected in parallel on the circuit board (11);
the thermal imaging instrument (3) faces the detection table (1) in the imaging direction and is used for carrying out thermal imaging on the circuit board (11) after power supply on the detection table (1);
and the image analysis positioning module (4) is connected with the thermal imager (3) and is used for receiving the thermal image generated by the thermal imager (3) and determining the position of the fault chip on the circuit board (11) according to the hot spot of the thermal image.
2. The device for locating the faulty chip in the high-density circuit board according to claim 1, wherein a voltage detection module (6) for detecting the output voltage of the direct current power supply (2) is further provided between the direct current power supply (2) and the power supply network.
3. The device for locating faulty chips on high-density circuit board according to claim 2, wherein said voltage detection module (6) is a voltmeter.
4. A device for locating faulty chips on a high-density circuit board according to claim 3, characterized in that said dc power supply (2) is an adjustable dc power supply.
5. The device for locating faulty chips on high-density circuit board according to claim 4, wherein an on-off switch (9) is provided between the DC power supply (2) and the power supply network.
6. The device for locating faulty chips on high-density circuit board according to claim 5, wherein the power output of said DC power supply (2) is provided with a probe (7) for connection to a power network.
7. The device for locating faulty chips on high-density circuit board according to any one of claims 1 to 6, wherein the positive pole of the DC power supply (2) is provided with a current limiting module (5).
8. The device for locating faulty chips on high-density circuit board according to claim 1, wherein the inspection table (1) is provided with a circuit board spacing region for preventing the circuit board (11) from shifting.
9. The device for locating faulty chips on high-density circuit board according to claim 1, wherein the inspection table (1) is provided with a thermal imager mounting bracket (8), and the thermal imager (3) is provided on the thermal imager mounting bracket (8).
10. A method for locating a faulty chip within a high-density circuit board using any one of claims 1 to 9, comprising the steps of:
s1, placing the circuit board (11) of the fault chip to be positioned on the detection table (1);
s2, supplying power to a power network of a plurality of chips connected in parallel on the circuit board (11);
s3, performing thermal imaging on the circuit board after power supply on the detection table (1);
and S4, determining the position of the fault chip on the circuit board (11) according to the hot spot on the generated thermal image.
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| CN201911363374.9A CN110888044A (en) | 2019-12-26 | 2019-12-26 | Device and method for positioning fault chip in high-density circuit board |
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| CN201911363374.9A CN110888044A (en) | 2019-12-26 | 2019-12-26 | Device and method for positioning fault chip in high-density circuit board |
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Cited By (7)
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| CN111896888A (en) * | 2020-06-24 | 2020-11-06 | 江苏航天龙梦信息技术有限公司 | Mainboard short-circuit fault position positioning method based on thermal imager |
| CN111913022A (en) * | 2020-07-30 | 2020-11-10 | 青岛歌尔微电子研究院有限公司 | Current failure analysis method of system packaging product |
| CN111965215A (en) * | 2020-08-13 | 2020-11-20 | 长江存储科技有限责任公司 | Packaged chip defect detection device and method thereof |
| CN113466740A (en) * | 2021-07-07 | 2021-10-01 | 深圳市美信咨询有限公司 | Fault positioning method and fault positioning device |
| CN114264933A (en) * | 2021-12-21 | 2022-04-01 | 厦门宇昊软件有限公司 | Fault detection method and fault detection system of integrated circuit board |
| CN116297462A (en) * | 2023-05-16 | 2023-06-23 | 泓准达电子科技(常州)有限公司 | Chip state monitoring method and related equipment |
| CN117665546A (en) * | 2024-02-02 | 2024-03-08 | 深圳市鑫恒天电子有限公司 | Automatic test method and system for PCBA (printed circuit board assembly) |
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