CN211497835U

CN211497835U - Ceramic substrate electroplating hanger after sputtering

Info

Publication number: CN211497835U
Application number: CN201922287084.2U
Authority: CN
Inventors: 王殿; 魏红军; 郝鹏飞; 魏宇翔
Original assignee: Northwest Electronic Equipment Institute of Technology
Current assignee: Northwest Electronic Equipment Institute of Technology
Priority date: 2019-12-19
Filing date: 2019-12-19
Publication date: 2020-09-15
Anticipated expiration: 2029-12-19

Abstract

The utility model discloses a hoist is electroplated to ceramic substrate after sputtering has solved current hoist and has taken place easily in electroplating and rock and the bad problem of electrode holder and conductive point contact. Be provided with ceramic substrate embedding through-hole (2) on hoist board (1), be provided with electrically conductive titanium axle jib (3) on the top of hoist board, pre-buried cross conductive band (5) in the hoist board, the upper end and the electrically conductive titanium axle jib (3) electricity of cross conductive band (5) are connected, polypropylene (PP) cap titanium screw hole (6) are connected with cross conductive band, spiro union has PP cap titanium screw (7) in PP cap titanium screw hole, cross-under has elasticity conductive probe (8) between the face of PP cap titanium screw and hoist board, ceramic substrate (12) after the embedding has the sputtering in ceramic substrate embedding through-hole, the conductive point of the needle point butt of elasticity conductive probe is on the conductive point on the ceramic substrate after the sputtering. Simple structure, low cost and uniform plating.

Description

Ceramic substrate electroplating hanger after sputtering

Technical Field

The invention relates to a ceramic substrate electroplating hanger, in particular to a sputtered ceramic substrate electroplating hanger and a clamping method thereof.

Background

The microwave device is often used in the field of microwave communication equipment, the microwave device is composed of an electroplating ceramic wafer and an electronic device, the electroplating ceramic wafer is subjected to pretreatment such as etching and the like, then electroplating of a printed circuit is carried out, and the ceramic substrate is electroplated in an electroplating bath; the existing hanger for electroplating the ceramic substrate has two types, namely a common hanger and an integral sealing hanger, the integral sealing hanger has the characteristics of higher cost, complex clamping mode and unsuitability for manual batch production, and meanwhile, because locking screws need to be fixed in the hanger sealing process, the hanger is easy to deform, and the problems of deformation and bending of the ceramic substrate, uneven electroplating and tearing at a clamping point position are caused; the common hanger is clamped on a ceramic plate, a conductive copper plate is arranged on a clamp, the ceramic substrate is hung in electroplating solution of an electroplating bath through the conductive copper hanging plate, the ceramic substrate is easy to shake around the conductive copper hanging plate in the electroplating process, so that the distance between a substrate electrode and a fixed anode in the electroplating bath is changed, and the substrate plating is directly uneven, in addition, a conductive point and a conductive belt are formed on the ceramic substrate before electroplating through a sputtering process, when the ceramic substrate is electroplated, the conductive point is required to be reliably connected with a clamp chuck, so that the normal operation of the electroplating process can be ensured, the conventional clamp chuck often has the phenomenon of poor contact between the chuck and the conductive point in the clamping process, particularly, a spring in the chuck fails in the electroplating process, the separation of the chuck and the conductive point is more easily caused, and the electroplating is directly interrupted, affecting the formation of the plated layer.

Disclosure of Invention

The invention provides a sputtered ceramic substrate electroplating lifting appliance and a clamping method thereof, and solves the technical problems that the existing lifting appliance is easy to shake and the contact between an electrode chuck and a conductive point is poor in electroplating.

The invention solves the technical problems by the following technical scheme:

a sputtered ceramic substrate electroplating hanger comprises a hanger plate and a sputtered ceramic substrate, wherein conductive points are arranged on the sputtered ceramic substrate, the ceramic substrate embedding through hole is arranged on the lifting appliance plate, the top end of the lifting appliance plate is provided with a conductive titanium shaft suspender, a rectangular conductive connecting sheet is fixedly arranged at the top end of the conductive titanium shaft suspender, a cross-shaped conductive belt is pre-embedded in the suspender plate, the upper end of the cross-shaped conductive belt is electrically connected with the conductive titanium shaft suspender, the surface of the lifting appliance plate is provided with a polypropylene cap titanium screw hole which is connected with the cross-shaped conductive belt, a polypropylene cap titanium screw is screwed in the polypropylene cap titanium screw hole, an elastic conductive probe is penetrated between the polypropylene cap titanium screw and the plate surface of the hanger plate, the ceramic substrate after sputtering is embedded into the ceramic substrate embedding through hole, and the needle tip of the elastic conductive probe is abutted against the conductive point on the ceramic substrate after sputtering.

Substrate embedding steps are arranged in the ceramic substrate embedding through holes, and the ceramic substrate embedding through holes are symmetrically arranged by taking the cross-shaped conductive belt as a symmetry axis; the hanger plate is hung and connected on the electroplating pole rod in the electric aqueduct through the conductive titanium shaft hanger rod, and the rectangular conductive connecting piece fixedly arranged at the top end of the conductive titanium shaft hanger rod is connected with the electroplating pole rod in an abutting mode.

A clamping method of a sputtered ceramic substrate electroplating hanger comprises the following steps:

firstly, embedding the sputtered ceramic substrate into the ceramic substrate embedding through hole to enable the ceramic substrate to be abutted to the substrate embedding step;

secondly, connecting a polypropylene cap titanium screw into the polypropylene cap titanium screw hole after penetrating through a tail through hole of the elastic conductive probe, adjusting and rotating the elastic conductive probe to connect a needle point of the elastic conductive probe with a conductive point on the sputtered ceramic substrate, and then screwing the polypropylene cap titanium screw to enable the elastic conductive probe to tightly prop the sputtered ceramic substrate;

and thirdly, placing the lifting appliance plate which is clamped with the sputtered ceramic substrate into the electroplating tank, and enabling a rectangular conductive connecting sheet fixedly arranged at the top end of the conductive titanium shaft suspender to be abutted with the electroplating pole rod.

The invention can realize the simultaneous electroplating of four ceramic substrates, and has simple structure, low cost and uniform plating layer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the present invention in a front view;

FIG. 3 is a schematic view of the present invention taken along a transverse axis;

FIG. 4 is a schematic diagram of the structure of the elastic conductive probe 8 of the present invention;

FIG. 5 is a schematic view of the present invention placed in a plating bath.

Detailed Description

The invention is described in detail below with reference to the accompanying drawings:

a sputtered ceramic substrate electroplating lifting appliance comprises a lifting appliance plate 1 and a sputtered ceramic substrate 12, wherein a conductive point is arranged on the sputtered ceramic substrate 12, a ceramic substrate embedding through hole 2 is arranged on the lifting appliance plate 1, a conductive titanium shaft suspender 3 is arranged at the top end of the lifting appliance plate 1, a rectangular conductive connecting sheet 4 is fixedly arranged at the top end of the conductive titanium shaft suspender 3, a cross-shaped conductive belt 5 is pre-embedded in the lifting appliance plate 1, the upper end of the cross-shaped conductive belt 5 is electrically connected with the conductive titanium shaft suspender 3, a polypropylene cap titanium screw hole 6 is arranged on the surface of the lifting appliance plate 1, the polypropylene cap titanium screw hole 6 is connected with the cross-shaped conductive belt 5, a polypropylene cap titanium screw 7 is screwed in the polypropylene cap titanium screw hole 6, an elastic conductive probe 8 is penetrated and connected between the polypropylene cap titanium screw 7 and the surface of the lifting appliance plate 1, the sputtered ceramic substrate 12 is embedded in the ceramic substrate embedding through hole 2, the needle tip of the elastic conductive probe 8 is abutted against a conductive point on the sputtered ceramic substrate 12; the hanger plate 1 is made of PP, PVDF, PVC and other materials, the frame material can be selected according to the process temperature, and the thickness is 12 mm.

A substrate embedding step 9 is arranged in the ceramic substrate embedding through hole 2, and the ceramic substrate embedding through hole 2 is symmetrically arranged by taking the cross-shaped conductive belt 5 as a symmetry axis; the hanger plate 1 is hung on an electroplating pole 10 in an electric flume 11 through a conductive titanium shaft hanger rod 3, and a rectangular conductive connecting sheet 4 fixedly arranged at the top end of the conductive titanium shaft hanger rod 3 is abutted with the electroplating pole 10.

firstly, embedding the sputtered ceramic substrate 12 into the ceramic substrate embedding through hole 2, and enabling the ceramic substrate 12 to be abutted against the substrate embedding step 9;

secondly, connecting the polypropylene cap titanium screw 7 to the polypropylene cap titanium screw hole 6 after penetrating through a tail through hole 13 of the elastic conductive probe 8, adjusting and rotating the elastic conductive probe 8 to enable the needle point of the elastic conductive probe 8 to be connected with a conductive point on the sputtered ceramic substrate 12, and then screwing the polypropylene cap titanium screw 7 to enable the elastic conductive probe 8 to tightly prop up the sputtered ceramic substrate 12;

thirdly, placing the lifting appliance plate 1 on which the sputtered ceramic substrate 12 is clamped into the electroplating bath 11, and enabling a rectangular conductive connecting sheet 4 fixedly arranged at the top end of the conductive titanium shaft suspender 3 to be abutted with the electroplating pole rod 10; the electroplating current passes through the electroplating pole rod 10, the conductive titanium shaft hanger rod 3, the cross-shaped conductive band 5, the polypropylene cap titanium screw 7, the elastic conductive probe 8 and the conductive point arranged on the sputtered ceramic substrate 12 in sequence, and then the ceramic substrate 12 is electroplated.

Claims

1. A sputtered ceramic substrate electroplating lifting appliance comprises a lifting appliance plate (1) and a sputtered ceramic substrate (12), wherein conductive points are arranged on the sputtered ceramic substrate (12), a ceramic substrate embedding through hole (2) is formed in the lifting appliance plate (1), and a conductive titanium shaft hanging rod (3) is arranged at the top end of the lifting appliance plate (1), and is characterized in that a rectangular conductive connecting piece (4) is fixedly arranged at the top end of the conductive titanium shaft hanging rod (3), a cross-shaped conductive belt (5) is pre-embedded in the lifting appliance plate (1), the upper end of the cross-shaped conductive belt (5) is electrically connected with the conductive titanium shaft hanging rod (3), a polypropylene cap titanium screw hole (6) is formed in the surface of the lifting appliance plate (1), the polypropylene cap titanium screw hole (6) is connected with the cross-shaped conductive belt (5), a polypropylene cap titanium screw (7) is screwed in the polypropylene titanium screw hole (6), an elastic conductive probe (8) is connected between the polypropylene cap titanium screw (7) and the plate surface of the hanger plate (1) in a penetrating way, a sputtered ceramic substrate (12) is embedded in the ceramic substrate embedding through hole (2), and the needle point of the elastic conductive probe (8) is abutted against a conductive point on the sputtered ceramic substrate (12).

2. The electroplated hanger of the sputtered ceramic substrate as claimed in claim 1, wherein the ceramic substrate embedding through holes (2) are internally provided with substrate embedding steps (9), and the ceramic substrate embedding through holes (2) are symmetrically arranged by taking the cross-shaped conductive belt (5) as a symmetry axis; the hanger plate (1) is hung on an electroplating pole rod (10) in an electric aqueduct (11) through a conductive titanium shaft hanger rod (3), and a rectangular conductive connecting sheet (4) fixedly arranged at the top end of the conductive titanium shaft hanger rod (3) is abutted with the electroplating pole rod (10).