CN211497763U - Substrate cooling device suitable for vacuum coating - Google Patents
Substrate cooling device suitable for vacuum coating Download PDFInfo
- Publication number
- CN211497763U CN211497763U CN201922399071.4U CN201922399071U CN211497763U CN 211497763 U CN211497763 U CN 211497763U CN 201922399071 U CN201922399071 U CN 201922399071U CN 211497763 U CN211497763 U CN 211497763U
- Authority
- CN
- China
- Prior art keywords
- cooling
- cooling pipe
- substrate
- pipe
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a substrate cooling device suitable for vacuum coating relates to vacuum evaporation device technical field. A substrate cooling device for vacuum coating, including base plate, material storehouse and cooling chamber, the material storehouse has been seted up to the inside of base plate, has seted up the cooling chamber around the material storehouse, the bottom of base plate is provided with first cooling tube, second cooling tube and third cooling tube, the hole with first cooling tube, second cooling tube and third cooling tube looks adaptation is seted up to the inside in cooling chamber. Substrate cooling device suitable for vacuum coating mainly through setting up the intraductal high temperature water that leads to of first cooling, carries out the cooling of small range to its material that needs the cooling, and secondly, second, three cooling tubes carry out slow cooling, have played good guard action to material and crucible, and the effectual harm of avoiding direct cooling to cause material and crucible itself.
Description
Technical Field
The utility model relates to a vacuum evaporation device, in particular to a substrate cooling device suitable for vacuum coating.
Background
Vacuum evaporation mainly adopts two modes of evaporation and sputtering, and common high-vacuum coating devices such as electron beam evaporation, magnetron sputtering, vacuum ion evaporation and the like are mainly used. The evaporation coating is generally carried out by heating a coating material to vaporize the material and condense the material on the surface of a substrate to form a film. For sputtering type coating, the target material is bombarded by electrons or high-energy laser in a vacuum cavity, surface components are sputtered out in the form of atomic groups or ions, and finally the surface components are deposited on the surface of the substrate to form a thin film.
For example, the electron beam evaporation and magnetron sputtering evaporation can generate large heat, and if the cooling is insufficient, the heat can rapidly raise the temperature in the vacuum cavity, thereby affecting the quality of the coating film. The existing vacuum evaporation device has no good cooling effect, and materials and a crucible are easily damaged at too high speed or too low speed, so that the substrate cooling device suitable for vacuum coating is designed for solving the problem.
Disclosure of Invention
The utility model provides a substrate cooling device suitable for vacuum coating, which solves the problem that the existing vacuum evaporation device does not have good cooling effect.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
the utility model provides a substrate cooling device suitable for vacuum coating, includes base plate (1), material storehouse (2) and cooling chamber, its characterized in that:
a material bin is arranged inside the substrate, a cooling cavity is arranged around the material bin inside the substrate, a first cooling pipe, a second cooling pipe and a third cooling pipe are arranged at the bottom of the substrate, and the three cooling pipes are identical in structure; the bottom of the cooling cavity is provided with three openings matched with the cooling pipe, and the cooling pipe can be inserted into the openings and is communicated with the inside of the cooling cavity;
the outer surfaces of the first cooling pipe, the second cooling pipe and the third cooling pipe are respectively provided with a layer of heat insulation pipe, two sides of each heat insulation pipe are respectively provided with a fixing groove, the inside of each fixing groove is fixedly connected with a fixing ring, the fixing rings are clamped into the fixing grooves, the inside of each fixing ring and the inside of the base plate are respectively provided with a screw hole, the inside of each screw hole is in threaded connection with a screw, the fixing rings are fixedly connected with the base plate through screws, the contact surfaces of the fixing rings and the base plate are provided with grooves, and sealing gaskets are arranged inside the grooves to ensure that the connection is tighter;
be provided with the water conservancy diversion piece directly over the three cooling pipe, and be fixed in cooling intracavity wall with the water conservancy diversion piece, the inside of first cooling pipe, second cooling pipe and third cooling pipe all is provided with the solenoid valve.
The number of the screw holes is a plurality of, and the type of the screw is one centimeter in diameter.
The high-temperature water communicated in the first cooling pipe carries out small-amplitude cooling on the material to be cooled.
The temperature of the normal-temperature water communicated with the second cooling pipe is the same as the outside temperature.
The temperature of the cooling water communicated with the third cooling pipe is greater than zero and less than the room temperature.
The utility model provides a substrate cooling device suitable for vacuum coating possesses following beneficial effect:
(1) this substrate cooling device suitable for vacuum coating, the temperature through setting up the intraductal high-temperature water that leads to of first cooling slightly is less than the temperature of vacuum evaporation cavity, make its material to need the cooling carry out the cooling of small range, material and crucible can not damaged in slow cooling, good guard action has been played to material and crucible, effectually avoided direct cooling to lower the temperature to the material, crucible itself causes the harm, on the other hand is the same with ambient temperature through the temperature that sets up the intraductal normal atmospheric temperature water that leads to of second cooling, the material that makes need the cooling can cool down once more after the cooling of small range, and the temperature falls to the same with ambient temperature, secondly through setting up the intraductal cooling water that leads to of third cooling, make it can cool off once more to required cooling refrigerated material.
(2) This substrate cooling device suitable for vacuum coating, on the one hand through setting up the water conservancy diversion piece, make its rivers to the intraductal input cooling chamber of three cooling disperse, the effectual diffusion effect that has strengthened rivers, accurate control cooling speed, on the other hand is through adopting the screw to carry out fixed connection between solid fixed ring and the base plate, makes its dismantlement and simple to operate, is convenient for maintain and changes three cooling pipe.
Drawings
Fig. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;
fig. 3 is a schematic structural view of a cooling tube of the present invention.
In the figure: 1-substrate, 2-material bin, 3-cooling cavity, 4-first cooling pipe, 5-second cooling pipe, 6-third cooling pipe, 7-fixing groove, 8-fixing ring, 9-screw, 10-sealing gasket, 11-flow guide block, 12-electromagnetic valve and 13-heat insulation pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides a technical solution:
the utility model provides a substrate cooling device suitable for vacuum coating, includes base plate 1, material storehouse 2 and cooling chamber 3, its characterized in that:
a material bin 2 is arranged inside the substrate 1, a cooling cavity 3 is arranged around the material bin inside the substrate 1, a first cooling pipe 4, a second cooling pipe 5 and a third cooling pipe 6 are arranged at the bottom of the substrate 1, and the three cooling pipes are identical in structure; the bottom of the cooling cavity 3 is provided with three openings matched with the cooling pipes, and the cooling pipes can be inserted into the openings and are communicated with the interior of the cooling cavity;
the outer surfaces of the first cooling pipe 4, the second cooling pipe 5 and the third cooling pipe 6 are respectively provided with a layer of heat insulation pipe 13, two sides of each heat insulation pipe are respectively provided with a fixing groove 7, the inside of each fixing groove 7 is fixedly connected with a fixing ring 8, each fixing ring 8 is clamped into the corresponding fixing groove, the inside of each fixing ring 8 and the inside of the corresponding substrate 1 are respectively provided with a screw hole, the inside of each screw hole is in threaded connection with a screw 9, each fixing ring 8 is fixedly connected with the corresponding substrate 1 through the screw 9, the contact surface of each fixing ring 8 and the corresponding substrate 1 is provided with a groove, and a sealing gasket 10 is arranged inside each groove to ensure that the;
be provided with water conservancy diversion piece 11 directly over cooling tube 4, 5 and 6, and be fixed in cooling chamber 3 inner walls with water conservancy diversion piece 11, the inside of first cooling tube 4, second cooling tube 5 and third cooling tube 6 all is provided with solenoid valve 12.
As an optional technical solution of the utility model:
the quantity of screw hole is a plurality of, and the model of screw 9 is a diameter centimetre, through adopting screw 9 to carry out fixed connection between solid fixed ring 8 and the base plate 1, makes its dismantlement and simple to operate, is convenient for maintain and change three cooling tube.
As an optional technical solution of the utility model:
the temperature of the high-temperature water that leads to in the first cooling tube 4 slightly is less than the temperature of vacuum evaporation cavity, through setting up the temperature of the high-temperature water that leads to in the first cooling tube 4, makes it carry out the cooling of small range to the material that needs the cooling, and material and crucible can not be damaged in slow cooling, has played good guard action to material and crucible, and the effectual direct cooling of having avoided leads to the fact the harm to material, crucible.
As an optional technical solution of the utility model:
the temperature of the normal temperature water that leads to in the second cooling pipe 5 is the same with ambient temperature, and the temperature of the normal temperature water that leads to in setting up the second cooling pipe 5 is the same with ambient temperature, makes the material that needs the cooling can cool down once more after the small-amplitude cooling to the temperature falls to and ambient temperature is the same.
As an optional technical solution of the utility model:
the temperature of the cooling water communicated in the third cooling pipe 6 is greater than zero and less than the room temperature, and the material to be cooled can be cooled by setting the temperature of the cooling water communicated in the third cooling pipe 6.
As an optional technical solution of the utility model:
the quantity of water conservancy diversion piece 11 is three, and three water conservancy diversion piece 11 fixed connection is located first cooling pipe 4, second cooling pipe 5 and third cooling pipe 6 directly over in cooling chamber 3 respectively, through setting up water conservancy diversion piece 11, makes its rivers to the intraductal input cooling chamber 3 of three cooling disperse, the effectual diffusion effect that has strengthened rivers, accurate control cooling rate.
When using, when needs cooling, open solenoid valve 12 of first cooling pipe 4, make the high-temperature water in the first cooling pipe 4 toward cooling chamber 3 interior transport, treat that the temperature in the material storehouse 2 falls to the solenoid valve 12 that closes first cooling pipe 4 simultaneously with the high temperature aqueous phase, open solenoid valve 12 of second cooling pipe 5 simultaneously, make second cooling pipe 5 toward cooling chamber 3 interior normal atmospheric temperature water of carrying, treat that the temperature in the material storehouse 2 falls to the solenoid valve 12 that closes second cooling pipe 5 simultaneously with the normal atmospheric temperature aqueous phase, open solenoid valve 12 of third cooling pipe 6 simultaneously, make third cooling pipe 6 toward cooling chamber 3 interior transport cooling water, thereby accomplish cooling work, three solenoid valve 12 is at the normally closed state at ordinary times.
To sum up, the substrate cooling device suitable for vacuum coating is used for cooling the material to be cooled down in a small range by setting the temperature of the high-temperature water communicated in the first cooling pipe 4 to be slightly lower than the temperature of the vacuum evaporation cavity, the material and the crucible are not damaged by slow cooling, the material and the crucible are well protected, the damage to the material and the crucible caused by direct cooling is effectively avoided, the temperature of the normal-temperature water communicated in the second cooling pipe 5 is the same as the external temperature, the material to be cooled down can be cooled down again after being cooled down in a small range, the temperature is reduced to be the same as the external water temperature, the temperature of the cooling water communicated in the third cooling pipe 6 is set to be higher than zero and lower than the room temperature, the material to be cooled down can be cooled down, and on the one hand, the diversion block 11 is arranged, make its rivers to input cooling chamber 3 in the three cooling tube disperse, the effectual diffusion effect that has strengthened rivers, accurate control cooling rate, on the other hand is through adopting screw 9 to carry out fixed connection between solid fixed ring 8 and the base plate 1, make it dismantle and simple to operate, be convenient for maintain and change three cooling tube, the device carries out the successive layer cooling through adopting first cooling tube 4, carry the water of different temperatures in second cooling tube 5 and the third cooling tube 6, to the material, the crucible has good guard action, certain practicality has.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides a substrate cooling device suitable for vacuum coating, includes base plate (1), material storehouse (2) and cooling chamber (3), its characterized in that:
a material bin (2) is arranged inside the substrate (1), a cooling cavity (3) is arranged around the material bin inside the substrate (1), a first cooling pipe (4), a second cooling pipe (5) and a third cooling pipe (6) are arranged at the bottom of the substrate (1), and the three cooling pipes are identical in structure; the bottom of the cooling cavity (3) is provided with three openings matched with the cooling pipe, and the cooling pipe can be inserted into the openings and is communicated with the inside of the cooling cavity;
the outer surfaces of the first cooling pipe (4), the second cooling pipe (5) and the third cooling pipe (6) are respectively provided with a layer of heat insulation pipe (13), two sides of each heat insulation pipe are respectively provided with a fixing groove (7), a fixing ring (8) is fixedly connected to the inside of each fixing groove (7), the fixing ring (8) is clamped into the fixing grooves, the fixing rings (8) and the base plate (1) are respectively provided with a screw hole, the screw holes are connected with screws (9) through internal threads, the fixing rings (8) are fixedly connected with the base plate (1) through the screws (9), a groove is formed in the contact surface of each fixing ring (8) and the base plate (1), and a sealing gasket (10) is arranged inside each groove to ensure that the connection is tighter;
be provided with water conservancy diversion piece (11) directly over the three cooling pipe, and be fixed in cooling chamber (3) inner wall with water conservancy diversion piece (11), the inside of first cooling pipe (4), second cooling pipe (5) and third cooling pipe (6) all is provided with solenoid valve (12).
2. The substrate cooling device suitable for vacuum deposition according to claim 1, wherein the number of screw holes is several and the size of the screw (9) is one centimeter in diameter.
3. The substrate cooling device suitable for vacuum coating according to claim 1, wherein the high temperature water introduced into the first cooling pipe (4) cools the material to be cooled to a small extent.
4. The substrate cooling apparatus suitable for vacuum deposition according to claim 1, wherein the temperature of the normal temperature water introduced into the second cooling pipe (5) is the same as the outside temperature.
5. The substrate cooling device suitable for vacuum coating according to claim 1, wherein the temperature of the cooling water introduced into the third cooling pipe (6) is greater than zero and less than room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922399071.4U CN211497763U (en) | 2019-12-27 | 2019-12-27 | Substrate cooling device suitable for vacuum coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922399071.4U CN211497763U (en) | 2019-12-27 | 2019-12-27 | Substrate cooling device suitable for vacuum coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211497763U true CN211497763U (en) | 2020-09-15 |
Family
ID=72420697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922399071.4U Active CN211497763U (en) | 2019-12-27 | 2019-12-27 | Substrate cooling device suitable for vacuum coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211497763U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113652666A (en) * | 2021-08-18 | 2021-11-16 | 杨智仁 | Vacuum coating system with cooling device |
-
2019
- 2019-12-27 CN CN201922399071.4U patent/CN211497763U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113652666A (en) * | 2021-08-18 | 2021-11-16 | 杨智仁 | Vacuum coating system with cooling device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4094764A (en) | Device for cathodic sputtering at a high deposition rate | |
| CA1169467A (en) | Cylindrical magnetron sputtering cathode, as well as sputtering apparatus provided with such cathode | |
| US6171461B1 (en) | Sputtering cathode | |
| JPH0213026B2 (en) | ||
| US8663431B2 (en) | Sputtering system for depositing thin film and method for depositing thin film | |
| US10822721B2 (en) | Method to improve MOCVD reaction process by forming protective film | |
| CN211497763U (en) | Substrate cooling device suitable for vacuum coating | |
| US10266962B2 (en) | Deposition systems including effusion sources, and related methods | |
| CN103132044B (en) | A kind of shielding case improving planar target plated film homogeneity | |
| US6623610B1 (en) | Magnetron sputtering target for magnetic materials | |
| KR20080106423A (en) | System and method for sputtering a tensile silicon nitride film | |
| US20030183518A1 (en) | Concave sputtering apparatus | |
| JPWO2008149635A1 (en) | Thin film sputtering equipment | |
| CN102760679A (en) | Substrate bracket and substrate processing apparatus employing the same | |
| JPS57158380A (en) | Counter target type sputtering device | |
| JP5718767B2 (en) | Sputtering equipment | |
| JP5014696B2 (en) | Thin film forming method, copper wiring film forming method | |
| CN104746028B (en) | Can monitor wafer temperature in real time pressure ring system and magnetron sputtering apparatus | |
| WO2010044235A1 (en) | Sputtering apparatus, thin film forming method and method for manufacturing field effect transistor | |
| TWI819294B (en) | Semiconductor processing equipment and magnetron mechanism | |
| TW201807233A (en) | Magnetron element and magnetron sputtering device enabling a sputtering deposition thin film to satisfy a set uniformity requirement under the full process pressure range | |
| KR101385590B1 (en) | Apparatus to sputter | |
| JP2975649B2 (en) | Sputtering equipment | |
| US20160099135A1 (en) | Rectangular Hollow Sputter Source and Method of use Thereof | |
| JPH01132765A (en) | Magnetron sputtering device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |