CN211481842U - Electromagnetic wave protection assembly and electronic device - Google Patents
Electromagnetic wave protection assembly and electronic device Download PDFInfo
- Publication number
- CN211481842U CN211481842U CN201922364767.3U CN201922364767U CN211481842U CN 211481842 U CN211481842 U CN 211481842U CN 201922364767 U CN201922364767 U CN 201922364767U CN 211481842 U CN211481842 U CN 211481842U
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- electromagnetic wave
- wave shielding
- shielding assembly
- magnetic conductive
- polymer substrate
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Abstract
The utility model provides an electromagnetic wave protection subassembly and electron device, wherein the electromagnetic wave protection subassembly includes: the magnetic conductive disc comprises a polymer substrate and magnetic conductive metal particles mixed in the polymer substrate; the magnetic conductive metal particles account for 70-90% of the volume of the electromagnetic wave protection component, and the polymer base material accounts for 10-30% of the volume of the electromagnetic wave protection component. Wherein the polymer base material is elastic rubber or silica gel, and the magnetic conductive metal particles are permalloy. The electromagnetic wave protection component has high magnetic permeability and can effectively shield or eliminate electromagnetic wave interference.
Description
Technical Field
The utility model relates to the field of electronic technology, in particular to electromagnetic wave protection component and electron device thereof.
Background
One common problem in the operation of electronic devices is the generation of electromagnetic radiation within the electronic circuitry of the apparatus. Such radiation may cause electromagnetic interference (EMI) or Radio Frequency Interference (RFI), which may interfere with the operation of other electronic devices within a certain proximity. Without adequate shielding, EMI/RFI interference may cause degradation or complete disappearance of important signals, thus rendering the electronic device inefficient or inoperable. One solution to improve the emi is to use an emi shielding component capable of absorbing, reflecting or redirecting emi so as to prevent the electronic device from emi or from emi.
However, most of the conventional electromagnetic wave shielding assemblies are made of metal sheets or magnetic powder materials after sintering, and the materials lack elasticity, so that the electromagnetic wave shielding assemblies cannot deform according to the structure of the electronic product, and the arrangement positions of the electromagnetic wave shielding assemblies are limited. In addition, some electromagnetic wave protection patches made of conductive rubber or polymer materials have the disadvantage of poor magnetic conductivity, and cannot effectively protect against electromagnetic wave interference. Therefore, how to overcome the above-mentioned drawbacks by improving the structural design has become one of the important issues to be solved in the technical field.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved of the present invention is to provide a flexible elastic device, which has good magnetic permeability and can effectively achieve the electromagnetic wave protection assembly and electronic device with the electromagnetic wave protection purpose.
In order to solve the technical problem, an embodiment of the present invention provides the following technical solution:
an electromagnetic wave shielding assembly comprising:
the magnetic conductive disc comprises a polymer substrate and magnetic conductive metal particles mixed in the polymer substrate, is in a flat plate shape and is arranged on one side surface of an electronic component to shield or eliminate electromagnetic waves generated by the electronic component; wherein, the magnetic conductive metal particles account for 70 to 90 percent of the volume of the magnetic conductive disc, and the polymer substrate accounts for 10 to 30 percent of the volume of the electromagnetic wave protection component.
Optionally, the polymer substrate is a rubber substrate or a silica gel substrate having elasticity.
Optionally, the magnetically permeable metal particles are permalloy particles.
Optionally, the polymer substrate has a hardness in the range of 40 to 70 shore d.
Optionally, the electromagnetic wave shielding assembly is formed by overlapping multiple layers of the magnetic conductive discs.
Optionally, the magnetically permeable metal particles account for 75% to 85% of the volume of the electromagnetic wave shielding component, and the polymer substrate accounts for 15% to 25% of the volume of the electromagnetic wave shielding component.
An embodiment of the present invention further provides an electronic device, the electronic device has a display panel, the electromagnetic wave protection component set up in the back of the display panel.
An embodiment of the present invention further provides an electronic device, the electronic device has a circuit substrate, a plurality of chips are provided on the circuit substrate, the electromagnetic wave protection component set up in just cover on the circuit substrate the chip.
The utility model has the advantages that:
in the above scheme, the electromagnetic wave shielding assembly includes at least one layer of magnetic conductive disk, where the magnetic conductive disk includes a polymer substrate and magnetic conductive metal particles mixed in the polymer substrate, and the magnetic conductive disk is in a flat plate shape and is disposed on one side surface of an electronic assembly to shield or eliminate electromagnetic waves generated by the electronic assembly; wherein, the magnetic conductive metal particles account for 70 to 90 percent of the volume of the magnetic conductive disc, and the polymer substrate accounts for 10 to 30 percent of the volume of the electromagnetic wave protection component. The utility model discloses a scheme electromagnetic wave protection subassembly has high magnetic permeability, can effectively shield or eliminate electromagnetic interference to have flexible deformation elasticity, can set up in electron device's various different positions according to the demand.
Drawings
Fig. 1 is a schematic perspective view of the electromagnetic wave shielding assembly of the present invention;
FIG. 2 is an enlarged cross-sectional view of the electromagnetic wave shielding assembly of the present invention;
FIG. 3 is a schematic view of another embodiment of the electromagnetic wave shielding assembly of the present invention;
fig. 4 is a schematic diagram of an embodiment of an electronic device according to the present invention;
fig. 5 is a schematic cross-sectional view of an embodiment of an electronic device according to the present invention;
fig. 6 is a schematic diagram of another embodiment of an electronic device according to the present invention.
Description of reference numerals:
1-an electromagnetic wave shielding component; 10-a magnetically conductive disc; 11-a polymeric substrate; 12-magnetically permeable metal particles; 2-an electronic device; 20-a housing; 21-a circuit substrate; 22-electronic components; 30-a display panel; 40-a circuit substrate; 41-chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
The utility model discloses lack elasticity and the not good problem of magnetic conductivity to electromagnetic wave protection component's material among the prior art, provide an electromagnetic wave protection component 1 and electron device 2, have flexible elasticity and good magnetic permeability.
As shown in fig. 1 and 2, an embodiment of the present invention provides an electromagnetic wave shielding assembly 1, including:
the magnetic conductive disk 10 is made of a polymer substrate 11 and magnetic conductive metal particles 12 mixed in the polymer substrate 11, and can be disposed outside or inside the electronic device to eliminate or shield electromagnetic interference.
Wherein, if calculated by volume ratio, the volume of the magnetic conductive metal particles 12 accounts for 70% to 90% of the whole volume of the electromagnetic wave shielding component 1, and the polymer substrate 11 accounts for 10% to 30% of the volume of the electromagnetic wave shielding component 1. In the preferred embodiment, the volume of the magnetic conductive metal particles 12 accounts for 75% to 85% of the total volume of the electromagnetic wave shielding assembly 1, and the polymer substrate 11 accounts for 15% to 25% of the volume of the electromagnetic wave shielding assembly 1.
The utility model discloses a magnetic conduction metal particle 12 adopts permalloy's metal particle, and permalloy is the alloy material who comprises nickel and iron, and it has high magnetic conductivity, must the utility model discloses an electromagnetic wave protection subassembly 1's magnetic permeability is in 250 mu to 300 mu's within range. The polymer substrate 11 of the present invention can be made of one or a combination of elastic rubber, plastic or silica gel, and in a preferred embodiment, the hardness of the polymer substrate 11 is in the range of 40 to 70 degrees shore d hardness, so that the electromagnetic wave shielding assembly 1 of the present invention has suitable elasticity and ductility. Can combine powder or graininess magnetic conduction metal particle 12 through polymer substrate 11, have elasticity and ductility moreover, make the utility model discloses an electromagnetic wave protection subassembly 1 has flexible elasticity, also can elastic deformation, can laminate in the object surface of different shapes, also can cooperate the configuration of 2 inner spaces of electron device and warp.
As shown in fig. 3, which shows another embodiment of the electromagnetic wave shielding assembly 1 of the present invention, the electromagnetic wave shielding assembly 1 of the present embodiment includes a plurality of layers of magnetic conductive plates 10 stacked on each other, so as to have a better electromagnetic wave shielding effect.
As shown in fig. 4 and fig. 5, which illustrate one embodiment of the electromagnetic wave shielding assembly 1 of the present invention, in this embodiment, the electronic device 2 is a mobile phone or a tablet computer, the electronic device 2 has a housing 20, a display panel 30 is disposed on the housing 20, and an accommodating space is formed inside the housing 20 and located below the display panel 30, a circuit substrate 21 is disposed inside the housing, and the circuit substrate 21 is provided with electronic components 22 of processor chip, memory, baseband component, rf component, and other types. In this embodiment, the electromagnetic wave shielding component 1 is attached to the backlight surface of the display panel 30, so that the electromagnetic wave shielding component 1 is located between the back surface of the display panel 30 and the circuit substrate 21. The electromagnetic wave shielding assembly 1 can shield or eliminate the electromagnetic wave generated by the electronic component 22 on the display panel 30 or the circuit substrate 21, so that the display panel 30 or the electronic component 22 is not interfered by the electromagnetic wave.
As shown in fig. 6, another embodiment of the electromagnetic wave shielding assembly 1 of the present invention is shown, in this embodiment, the magnetic conductive plate 10 can be disposed on a circuit substrate 40 and cover a plurality of chips 41 disposed on the circuit substrate 40. The magnetic conductive disk 10 can shield or eliminate the electromagnetic wave generated by the chip 41 on the circuit substrate 40, or isolate the external electromagnetic wave, so as to prevent the chip 41 from being interfered by the electromagnetic wave.
The beneficial effects of the utility model reside in that the utility model discloses an electromagnetic wave protection subassembly 1 combines to form lamellar magnetic conduction dish 10 through magnetic conduction metal particles 12 and have elastic polymer substrate 11, and it has good magnetic permeability, and has elastic deformation or flexible characteristic, consequently makes the utility model discloses an electromagnetic wave protection subassembly 1 can set up on electron device 2's various different positions according to actual demand to reach good electromagnetic wave protection efficiency.
The foregoing is directed to the preferred embodiments of the present invention, and it will be understood by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Claims (8)
1. An electromagnetic wave shield assembly, comprising:
the magnetic conductive disc comprises a polymer substrate and magnetic conductive metal particles mixed in the polymer substrate, is in a flat plate shape and is arranged on one side surface of an electronic component to shield or eliminate electromagnetic waves generated by the electronic component;
wherein, the magnetic conductive metal particles account for 70 to 90 percent of the volume of the magnetic conductive disc, and the polymer substrate accounts for 10 to 30 percent of the volume of the electromagnetic wave protection component.
2. The electromagnetic wave shielding assembly of claim 1, wherein the polymer substrate is an elastic rubber substrate or a silicone substrate.
3. The electromagnetic wave shielding assembly of claim 2 wherein the magnetically permeable metal particles are permalloy particles.
4. The electromagnetic wave shielding device of claim 2, wherein the polymer substrate has a hardness ranging from 40 to 70 Shore hardness.
5. The electromagnetic wave shielding assembly of any one of claims 1 to 4, wherein the electromagnetic wave shielding assembly is formed by overlapping a plurality of layers of the magnetic conductive discs.
6. The electromagnetic wave shielding assembly of claim 5, wherein the magnetically permeable metal particles account for 75% to 85% of the volume of the electromagnetic wave shielding assembly, and the polymer substrate accounts for 15% to 25% of the volume of the electromagnetic wave shielding assembly.
7. An electronic device having the electromagnetic wave shielding assembly of any one of claims 1 to 6, wherein the electronic device has a display panel, and the electromagnetic wave shielding assembly is disposed on a back surface of the display panel.
8. An electronic device having the electromagnetic wave shielding assembly as claimed in any one of claims 1 to 6, wherein the electronic device has a circuit substrate having a plurality of chips thereon, and the electromagnetic wave shielding assembly is disposed on the circuit substrate and covers the chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922364767.3U CN211481842U (en) | 2019-12-25 | 2019-12-25 | Electromagnetic wave protection assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922364767.3U CN211481842U (en) | 2019-12-25 | 2019-12-25 | Electromagnetic wave protection assembly and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211481842U true CN211481842U (en) | 2020-09-11 |
Family
ID=72379632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922364767.3U Expired - Fee Related CN211481842U (en) | 2019-12-25 | 2019-12-25 | Electromagnetic wave protection assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211481842U (en) |
-
2019
- 2019-12-25 CN CN201922364767.3U patent/CN211481842U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200911 Termination date: 20211225 |