CN210406065U

CN210406065U - Shielding case and circuit board with same

Info

Publication number: CN210406065U
Application number: CN201920856347.4U
Authority: CN
Inventors: 苏陟
Original assignee: Guangzhou Fangbang Electronics Co Ltd
Current assignee: Guangzhou Fangbang Electronics Co Ltd
Priority date: 2019-06-05
Filing date: 2019-06-05
Publication date: 2020-04-24
Anticipated expiration: 2029-06-05

Abstract

The utility model discloses a shield cover and have circuit board of shield cover, wherein the shield cover include the bottom plate and with bottom plate integrated into one piece and enclose in bottom plate curb plate all around, the bottom plate with the curb plate all includes insulating rete and the conducting layer that outside-in stromatolite set up in proper order, just the conducting layer orientation set up in the cavity of shield cover. The material of shield cover adopts insulating film layer to add the conducting layer, and whole shield cover is frivolous to have certain compliance, and the user of being convenient for uses the matching to install on the circuit board, and shield cover easy to assemble is fixed, and the structure is frivolous, but shield cover scale production, through thermoplastic technology integrated into one piece, and preparation simple process is ripe, then can tailor the shaping wantonly according to the size of different circuit boards, and the matching corresponds the installation, effectively prevents the leaky wave phenomenon.

Description

Shielding case and circuit board with same

Technical Field

The utility model belongs to the technical field of the circuit, concretely relates to shield cover and have circuit board of shield cover.

Background

With the increasing operation speed of electronic devices, integrated circuits are becoming more dense, and the need for preventing electromagnetic interference is becoming higher and higher, and the intensity of electromagnetic noise radiated from electronic components in the electronic devices is increasing day by day, which not only interferes with other users in the frequency band, but also interferes with the radio frequency receiver of the electronic devices. The common solution employs a shielding mask to suppress the leakage of noise.

At present, a common shield cover is a two-piece shield cover made of all-metal, and is composed of a cover body and a frame body, wherein the cover body is tightly arranged on the frame body by mutually clamping a clamping protrusion on the peripheral wall of the cover body and a clamping hole on the peripheral wall of the frame body, and if the shield cover needs to be disassembled, the clamping protrusion only needs to be separated from the clamping hole. However, in use, the shield has been found to suffer from at least the following problems: the shielding cover is made of metal, is relatively thick and heavy, has hard shell without certain flexibility, and cannot completely cover large-size electronic elements; secondly, the cover body and the frame body need to be prepared separately, and the preparation process is complex, time-consuming, labor-consuming and high in cost; thirdly, due to the reason of the preparation process, when the shielding cover is used, the hard metal cover body and the frame body have poor clamping matching degree in a certain proportion, so that the shielding cover has nonuniform isolation degree and poor stability, and cannot play a good shielding role. Specifically, electromagnetic waves leak from the gap between the cover and the frame, and thus a satisfactory shielding effect cannot be achieved.

SUMMERY OF THE UTILITY MODEL

The utility model provides a new material shielding case and a circuit board with the shielding case, wherein the shielding case is convenient to install and fix, has a light and thin structure, and effectively prevents the wave leakage phenomenon and the electromagnetic interference; the circuit board with the shielding case can prevent the electronic elements on the circuit board from being interfered by electromagnetic radiation.

The utility model provides a shielding case, including the bottom plate and with bottom plate integrated into one piece and enclose close in bottom plate curb plate all around, the bottom plate with the curb plate all includes insulating rete and the conducting layer that outside-in stromatolite set up in proper order, just the conducting layer orientation set up in the cavity of shielding case.

The insulating film layer is made of thermoplastic resin, the conducting layer is made of one or more of metal, carbon nano tubes, ferrite, graphite and graphene, and the metal conducting layer is made of any one or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.

Preferably, an adhesive body is arranged on one side of the side plate facing the cavity.

Preferably, the side plate is provided with a convex part facing the cavity; or/and the side plate faces towards the cavity, a groove is arranged in the cavity, and the opening of the groove faces towards the interior of the cavity. The convex part is provided with an adhesive part; or an adhesive part is arranged in the groove.

Preferably, one end of the side plate, which is far away from the bottom plate, extends towards one side outside the cavity body to form a horizontal plate. And the horizontal plate is provided with an adhesive body, and the projection area of the adhesive body on the horizontal plate is smaller than or equal to the area of the horizontal plate.

Preferably, the horizontal plate is provided with a convex part; or/and the horizontal plate is provided with a groove.

Preferably, a glue film layer is further arranged between the insulating film layer and the conducting layer.

Preferably, at least one isolation plate is further arranged in the shielding case, and the isolation plate separates the shielding cavity formed by enclosing the bottom plate and the side plates to form a plurality of cavities.

Preferably, the isolation plate is provided with an elastic component; or/and elastic parts are arranged on the bottom plate and the side plates.

This patent still protects a circuit board that has above-mentioned shield cover, the shield cover with the circuit board is connected, just whole or partial region of circuit board is located the cavity of shield cover.

Specifically, the circuit board is provided with electronic components, and the shielding cover covers the whole circuit board and the electronic components thereon, or only covers part of the electronic components on the circuit board, so as to prevent electromagnetic interference of the electronic components in the shielding cavity to external electronic components, or interference of external electromagnetic waves to the electronic components in the shielding cavity.

Preferably, an adhesive body is arranged on one side, facing the cavity, of the side plate of the shielding cover, and the shielding cover is connected with the circuit board through the adhesive body.

Preferably, a clamping groove is formed in the vertical side edge of the circuit board; or/and the vertical side edge of the circuit board is provided with a convex part.

Preferably, a clamping groove is formed in the horizontal upper surface of the circuit board; or/and the horizontal upper surface of the circuit board is provided with a convex part.

Compared with the prior art, this patent has following beneficial effect:

(1) the shielding cover is made of an insulating film layer and a conducting layer, the whole shielding cover is light, thin and flexible, a user can conveniently use the shielding cover to install the shielding cover on a circuit board in a matched mode, and the size of the shielding cover can be conveniently adjusted to completely cover the large-size electronic element. For electronic elements with strong electromagnetic radiation, the number of conducting layers can be selectively increased, and the shielding cavity is divided into a plurality of cavities by the isolating plates arranged in the shielding cover, so that the shielding effect is improved. The existing shielding cover is all made of metal, and is relatively thick and heavy, and the manufacturing cost is high.

(2) But the shield cover scale production, through mould suppression or thermoplastic technology integrated into one piece, preparation simple process is ripe, then can tailor the shaping wantonly according to the size of different circuit boards, and the matching corresponds the installation, effectively prevents the leaky wave phenomenon. Compared with the existing metal shielding cover, the metal shielding cover has better installation matching degree and better shielding stability.

(3) The connection mode of the shielding cover and the circuit board is flexible, the shielding cover can be bonded, or clamped or fixedly connected by screws, the connection is tight, no gap exists, the whole shielding performance is good, the maintenance is convenient, and the wave leakage phenomenon is effectively prevented. The common shielding cover in the prior art is a metal shielding cover, and the metal shielding cover has two forms, one is a mode that a cover body is connected with a frame body in a buckling manner, although the mode is convenient to maintain, the buckling matching degree of the cover body and the frame body is poor in a certain proportion, and the phenomenon of wave leakage is easy to occur; the other type is an integrally formed metal shielding cover, but the shielding cover is welded on a circuit board, so that the maintenance is not facilitated, and the welding mode operation technology difficulty is high.

(4) The circuit board with the shielding case is more scientific than the design of the existing circuit board, can flexibly protect electronic elements needing electromagnetic shielding, can cover the whole circuit board for protection, can also carry out customized electromagnetic shielding protection on the electronic elements with any shapes and sizes, and brings better effect on precise chip protection.

Drawings

Fig. 1 is a schematic view illustrating a connection between a shield case and a circuit board according to a first embodiment of the present invention;

fig. 2 is a schematic structural view of a shielding case provided in the second embodiment of the present invention;

fig. 3 is a schematic view illustrating a connection between a shield case and a circuit board according to a second embodiment of the present invention;

fig. 4 is a schematic structural view of a shield according to a third embodiment of the present invention;

fig. 5 is a schematic view illustrating a connection between a shield case and a circuit board according to a third embodiment of the present invention;

fig. 6 is a schematic view illustrating a connection between the shielding case and the circuit board according to the fourth embodiment of the present invention;

fig. 7 is a schematic structural view of a shield according to a fifth embodiment of the present invention;

fig. 8 is a schematic view illustrating a connection between the shielding case and the circuit board according to a fifth embodiment of the present invention;

fig. 9 is a schematic structural view of a shield according to a sixth embodiment of the present invention;

fig. 10 is a schematic view illustrating a connection between the shielding case and the circuit board according to a sixth embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, in a first embodiment, a shielding case includes a bottom plate 1 and a side plate 2 integrally formed with the bottom plate 1 and surrounding the bottom plate 1, where the bottom plate 1 and the side plate 2 both include an insulating film layer and a conductive layer sequentially stacked from outside to inside, and the conductive layer is disposed in a cavity facing the shielding case. An adhesive body 3 is arranged on one side of the side plate 2 facing the cavity.

The insulating film layer is made of thermoplastic resin, the conducting layer is made of one or more of metal, carbon nano tubes, ferrite, graphite and graphene, and when the conducting layer is made of metal, the metal conducting layer is made of any one or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. In addition, because the shield cover by bottom plate 1 and with 1 integrated into one piece of bottom plate and enclose in bottom plate 1 curb plate 2 all around is constituteed, and bottom plate 1 and curb plate 2 all include insulating rete and the conducting layer that outside-in stromatolite set up in proper order, consequently, the shield cover not only can tailor the shaping wantonly according to the size of different circuit boards, matches and corresponds the installation, effectively prevents the leaky wave phenomenon. And the shielding cover can be pressed and formed in advance or integrally formed through a thermoplastic process according to the size of the electronic component to be protected.

The adhesive 3 may be a thermoplastic adhesive, a thermosetting adhesive, a pressure-sensitive adhesive, or the like, and preferably, the adhesive 3 is a pressure-sensitive adhesive, so as to facilitate repeated assembly and disassembly of the shielding case.

Specifically, when the electromagnetic shielding cover is used, the shielding cover is connected with the circuit board 10 through the adhesive body 3 arranged on the side plate 2, and all or part of the area of the circuit board 10 is located in the cavity of the shielding cover, that is, the shielding cover can cover the whole circuit board and the electronic components 11 arranged thereon as required, or the shielding cover only covers part of the electronic components 11 on the circuit board, so that the electromagnetic interference of the electronic components located in the shielding cavity to the external electronic components is effectively prevented, or the electromagnetic interference of the external electromagnetic waves to the electronic components in the shielding cavity is prevented.

Preferably, the projection area of the adhesive body 3 on the side plate 2 is smaller than or equal to the area of the side plate 2 itself, and when the projection area of the adhesive body 3 on the side plate 2 is smaller than the area of the side plate 2 itself, the adhesive body 3 is arranged near the end of the side plate 2 far away from the bottom plate 1, so as to ensure the effective connection of the shielding case and the circuit board 10.

Referring to fig. 2 and 3, in a second embodiment, the shield cover includes a bottom plate 1 and a side plate 2 integrally formed with the bottom plate 1 and surrounding the bottom plate 1, where the bottom plate 1 and the side plate 2 both include an insulating film layer and a conductive layer sequentially stacked from outside to inside, the conductive layer is disposed toward a cavity of the shield cover, and a protrusion 4 is disposed on the side plate 2 toward the cavity.

Specifically, when using, the side of circuit board 10 is equipped with draw-in groove 5, works as shield cover fits when on the circuit board 10, the shield cover passes through convex part 4 and the 5 joints of draw-in groove of circuit board 10 and realize that the shield cover is connected with the circuit board driving fit to effectively prevent to be located the electromagnetic interference of shielding intracavity electronic component to outside electronic component, perhaps prevent the electromagnetic interference of outside electromagnetic wave to shielding intracavity electronic component.

Preferably, the convex portion 4 is disposed adjacent to an end of the side plate 2 away from the bottom plate 1, so as to ensure effective connection of the shield case with the circuit board 10.

Wherein, the convex part 4 arranged on the side plate 2 can be formed by the following two ways:

1. the convex part 4 and the shielding cover are integrally hot-pressed, namely, the shielding cover with the convex part 4 is formed at one time by adopting a hot-pressing forming process, the process is simple, the realization is easy, and the consistency of the sizes of the convex parts is effectively ensured.

2. The convex part 4 is formed by adding material to the side of the side plate 2 facing the cavity, namely, after the shielding case is formed through the hot press molding process, the convex part 4 is formed by adding material to the side of the side plate 2 facing the cavity of the shielding case. The material of the convex portion 4 may be the same as or different from that of the side plate 2, and is not limited herein as long as the convex portion can be formed.

Referring to fig. 4 and 5, a shield cover according to a third embodiment includes a bottom plate 1 and a side plate 2 integrally formed with the bottom plate 1 and surrounding the bottom plate 1, where the bottom plate 1 and the side plate 2 both include an insulating film layer and a conductive layer sequentially stacked from outside to inside, the conductive layer is disposed toward a cavity of the shield cover, and a groove 6 is disposed in the side plate 2 toward the cavity.

Specifically, when using, the side of circuit board 10 is equipped with raised part 7, works as shield cover fits when on the circuit board 10, the shield cover passes through recess 6 and the 7 joints of raised part of circuit board 10 and realize that shield cover and circuit board driving fit are connected to effectively prevent to be located the electromagnetic interference of shielding intracavity electronic component to outside electronic component, perhaps prevent the electromagnetic interference of outside electromagnetic wave to shielding intracavity electronic component.

Preferably, the groove 6 is disposed adjacent to an end of the side plate 2 away from the bottom plate 1, so as to ensure effective connection of the shield with the circuit board 10.

Wherein, the groove 6 arranged on the side plate 2 can be formed by the following modes:

1. the groove 6 and the shielding cover are integrally hot-pressed, namely, the shielding cover with the groove 6 is formed at one time by adopting a hot-pressing forming process, the process is simple, the realization is easy, and the consistency of the size of the groove is effectively ensured.

2. The groove 6 is formed by removing part of the material on the side of the side plate 2 facing the cavity, that is, after the shielding case is formed by the hot press molding process, the groove 6 is formed by removing part of the material on the side of the side plate 2 facing the cavity.

Alternatively, the recess 6 may be a recess 6 with a bottom surface, and the recess 6 may also be a recess 6 with a through hole on the bottom surface of the slot, so that the bump on the circuit board can be connected more firmly through the through hole on the bottom of the slot.

As an improvement of the third embodiment, a convex portion and a concave portion are arranged in the cavity of the side plate of the shielding case, and are respectively used for matching and connecting a corresponding slot and a corresponding convex part on the side of the circuit board, and the convex portion and the concave portion can be respectively arranged on different side plates or on the same side plate. For example, if the shape of shield cover is the cuboid shape, and the curb plate encloses on the bottom plate, consequently have four curb plates, can set up a plurality of convex parts on two long curb plates among them when setting up, set up a plurality of recesses on two short curb plates in addition. Or, the convex parts and the concave grooves on the same side plate are alternately arranged, correspondingly, the clamping grooves and the convex parts on the side edge of the circuit board are also alternately arranged, so that the shielding cover and the circuit board can be tightly connected.

The number of the convex portions or the concave grooves in the second and third embodiments may be at least one, and when the number is plural, the convex portions or the concave grooves may be arranged in an orderly manner or in an unordered manner along the horizontal direction of the side plate. The shape of the convex part and the concave groove can be regular shape or irregular shape, such as square, rectangle, rhombus, polygon and the like, and the shape of each convex part and each concave groove can be the same or different.

Furthermore, the convex part of the side plate of the shielding cover can be also provided with an adhesive part which is arranged at the top of the convex part; or the bonding part is arranged in the groove of the side plate of the shielding cover and is arranged on the bottom surface of the groove, so that when the shielding cover is connected with the circuit board, the shielding cover can be clamped and bonded at the same time, and the connection stability of the shielding cover and the circuit board is effectively improved. Of course, the bonding member may be provided on the entire protrusion or the bonding member may be provided in the entire groove.

Referring to fig. 6, in the fourth embodiment, the shield case includes a bottom plate 1 and a side plate 2 integrally formed with the bottom plate 1 and surrounding the bottom plate 1, the bottom plate 1 and the side plate 2 both include an insulating film layer and a conductive layer sequentially stacked from outside to inside, and the conductive layer is disposed in a cavity facing the shield case. One end of the side plate 2, which is far away from the bottom plate 1, extends towards one side outside the cavity to form a horizontal plate 8, and an adhesive body 3 is arranged on the horizontal plate.

Specifically, when in use, the shielding cover is adhered to the circuit board through the adhesive body 3 disposed on the horizontal plate 8, so as to effectively prevent the electromagnetic interference of the electronic component located in the shielding cavity to the external electronic component, or prevent the electromagnetic interference of the external electromagnetic wave to the electronic component in the shielding cavity.

Referring to fig. 7 and 8, in a fifth embodiment, the shield cover includes a bottom plate 1 and a side plate 2 integrally formed with the bottom plate 1 and surrounding the bottom plate 1, where the bottom plate 1 and the side plate 2 both include an insulating film layer and a conductive layer sequentially stacked from outside to inside, and the conductive layer faces a cavity of the shield cover and is disposed therein. One end of the side plate 2, which is far away from the bottom plate 1, extends towards one side outside the cavity to form a horizontal plate 8, and a convex part 4 is arranged on the horizontal plate 8.

Specifically, when using, the upper surface of circuit board 10 is equipped with draw-in groove 5, works as shield cover fits when on the circuit board 10, the shield cover passes through convex part 4 and the 5 joints of draw-in groove of circuit board 10 and realize that the shield cover is connected with the circuit board driving fit to effectively prevent to be located the electromagnetic interference of shielding intracavity electronic component to outside electronic component, perhaps prevent the electromagnetic interference of outside electromagnetic wave to shielding intracavity electronic component.

Preferably, the convex portion 4 of the horizontal plate 8 is disposed adjacent to an end of the side plate 2 away from the bottom plate 1, so as to ensure effective connection of the shielding case with the circuit board 10.

Wherein, the convex part 4 arranged on the horizontal plate 8 can be formed by the following two ways:

2. The convex portion 4 is formed by adding material to one side of the horizontal plate 8, that is, after the shield case is formed by the hot press molding process, the convex portion 4 is formed by adding material to one side of the horizontal plate 8 of the shield case. The material of the convex portion 4 may be the same as or different from that of the horizontal plate 8, and is not limited herein as long as the convex portion can be formed.

Referring to fig. 9 and 10, in a sixth embodiment, the shield cover includes a bottom plate 1 and a side plate 2 integrally formed with the bottom plate 1 and surrounding the bottom plate 1, where the bottom plate 1 and the side plate 2 both include an insulating film layer and a conductive layer sequentially stacked from outside to inside, and the conductive layer faces a cavity of the shield cover and is disposed therein. One end of the side plate 2, which is far away from the bottom plate 1, extends towards one side outside the cavity to form a horizontal plate 8, and a groove 6 is formed in the horizontal plate 8.

Specifically, when using, circuit board 10 is equipped with raised part 7, works as shield cover fits when on the circuit board 10, the horizontal plate 8 of shield cover passes through recess 6 and the 7 joints of raised part of circuit board 10 and realize that shield cover and circuit board driving fit are connected to effectively prevent to be located the electromagnetic interference of shielding intracavity electronic component to outside electronic component, perhaps prevent the electromagnetic interference of outside electromagnetic wave to shielding intracavity electronic component.

Preferably, the recess 6 of the horizontal plate 8 opens towards the circuit board, so as to ensure an effective connection of the shield to the circuit board 10.

Wherein, the groove 6 arranged on the horizontal plate 8 can be formed by the following modes:

2. The recess 6 is formed by removing a part of the material on the side of the horizontal plate 8 facing the circuit board, i.e. after the shield case is formed by the hot press molding process, the recess 6 is formed by removing a part of the material on the side of the horizontal plate 8 facing the circuit board.

The first embodiment is improved on the basis of the sixth embodiment, a glue film layer can be further arranged between the insulating film layer and the conductive layer, and the glue film layer can be thermoplastic resin or thermosetting resin. As an optional embodiment, the glue film layer may also be disposed on a surface of the conductive layer away from the insulating film layer.

The number of the conductive layers can be at least one for improving the electromagnetic shielding effect, and when the conductive layers are multiple, each conductive layer can be made of the same material or different materials. For example, when the conductive layer is two layers, the shield case is composed of an insulating film layer, a first conductive layer and a second conductive layer in sequence from outside to inside, for example, the first conductive layer is carbon nanotubes, and the second conductive layer is aluminum.

As an alternative embodiment, the number of the insulating film layers may be at least one, and when the insulating film layers are multiple, each insulating film layer may be made of the same material or different materials.

Furthermore, at least one isolation plate is arranged in the shielding cover, and the isolation plate separates the shielding cavity formed by enclosing the bottom plate and the side plates to form a plurality of cavities, so that the influence of electromagnetic interference generated by electronic elements in different areas on the circuit board is effectively prevented.

Further, in order to prevent the frictional damage, elastic members may be provided on the bottom plate and the side plates of the shield case, or on the partition plate. This elastic component can be sponge, silica gel, sheet rubber, not only can protect the conducting layer like this, prevents its friction damage, but also can prevent to appear because of the conducting layer with the electronic components on the circuit board condition of short circuit that contacts.

In this embodiment, the shield cover and the circuit board can adopt a plurality of connection modes, and when the side plate of the shield cover is connected with the circuit board, besides the clamping and bonding modes, the shield cover can be fixedly connected through screws.

As an implementation manner, one end of the side plate, which is far away from the bottom plate, is provided with a screw hole for fixedly connecting the circuit board with a screw, so that the shielding cover can be screwed with the side of the circuit board through the screw hole arranged on the side plate 2.

As another embodiment, the horizontal plate 8 is provided with screw holes for screw fixing and connecting the circuit board, so that the shielding case can be screwed with the surface of the circuit board through the screw holes provided on the horizontal plate 8.

Furthermore, in order to make the connection between the shielding case and the circuit board more compact, three connection modes of clamping, bonding and screw fixing connection can be simultaneously adopted in the same shielding case.

Compared with the prior art, the shielding case of this patent, the advantage as follows: the shielding cover is made of an insulating film layer and a conducting layer, the whole shielding cover is light, thin and flexible, a user can conveniently use the shielding cover to install the shielding cover on a circuit board in a matched mode, and the size of the shielding cover can be conveniently adjusted to completely cover the large-size electronic element. The shielding cover can be produced in a large scale, is integrally formed through a thermoplastic process, is simple and mature in preparation process, can be cut and formed randomly according to the sizes of different circuit boards, and is matched with corresponding installation. The connection mode of shield cover and circuit board is nimble, can bond, joint, screw fixation, connects closely moreover, does not have the gap, and holistic shielding performance is good, and the maintenance of being convenient for moreover can cover the electronic component of an area on the circuit board, also can cover whole circuit board, effectively prevents the leaky wave phenomenon.

This patent still protects a circuit board that has above-mentioned shield cover, the shield cover with the circuit board is connected, just whole or partial region of circuit board is located the cavity of shield cover. The circuit board can be a single-sided board, a double-sided board or a multi-layer board, electronic components such as chips, capacitors, inductors, sensors and the like are arranged on the circuit board, and the whole circuit board and the electronic components thereon are covered by the shielding cover, or only a part of the electronic components on the circuit board are covered by the shielding cover, so that electromagnetic interference of the electronic components in the shielding cavity to external electronic components is prevented, or interference of external electromagnetic waves to the electronic components in the shielding cavity is prevented. By adopting the shielding case for connection, the whole circuit board has light weight and thin thickness, and the phenomenon of wave leakage is effectively prevented.

The seventh embodiment provides a circuit board, wherein a side edge of the circuit board is connected to a side plate of the shielding case through the adhesive body to form a sealed shielding case cavity, so as to protect electronic components in the shielding case from electromagnetic interference, and meanwhile, to effectively prevent the electronic components in the shielding case from electromagnetic interference with external electronic components.

The eighth embodiment provides another circuit board, the perpendicular side of circuit board is equipped with the draw-in groove, the curb plate orientation of shield cover is provided with the convex part in the cavity, the convex part is close to the curb plate is kept away from the one end setting of bottom plate. When the shielding cover covers the circuit board, the shielding cover is clamped in the clamping groove at the side edge of the circuit board through the convex part, so that the electronic element in the shielding cavity is protected from electromagnetic interference, and meanwhile, the electromagnetic interference of the electronic element in the shielding cavity to an external electronic element is effectively prevented. Or as an improvement mode, the perpendicular side of circuit board is provided with protruding parts, the curb plate orientation of shield cover be provided with the recess in the cavity, the recess closes on the curb plate is kept away from the one end setting of bottom plate for when the shield cover lid fits on the circuit board, the shield cover passes through the recess and is in the same place with circuit board side protruding parts joint, and the electronic component of protection shielding intracavity does not receive electromagnetic interference, simultaneously, also effectively prevents to be located the electronic component of shielding intracavity to outside electronic component's electromagnetic interference. Certainly, as another improvement mode, the vertical side of the circuit board may be provided with a clamping groove and a protruding part at the same time, so as to match with the protruding part and the groove on the side plate of the clamping shielding case respectively.

The ninth embodiment provides another circuit board, the horizontal upper surface of circuit board is equipped with the draw-in groove, the one end orientation of bottom plate is kept away from to the shield cover curb plate one side outside the cavity extends and forms the horizontal plate, is provided with the convex part on the horizontal plate of shield cover for when the shield cover fits on the circuit board, the shield cover passes through the convex part joint in the draw-in groove of circuit board, and the electronic component in the protection shielding intracavity does not receive electromagnetic interference, and simultaneously, also effectively prevents to be located the electronic component in shielding intracavity to outside electronic component's electromagnetic interference. Or as an improvement mode, the horizontal upper surface of circuit board is provided with protruding parts, and the shield cover curb plate is kept away from the one end orientation of bottom plate one side extension outside the cavity forms the horizontal plate, is provided with the recess on the horizontal plate of shield cover for when the shield cover fits on the circuit board, the shield cover passes through the recess and is in the same place with protruding parts joint on the circuit board, and the electronic component of protection shielding intracavity does not receive electromagnetic interference, simultaneously, also effectively prevents to be located the electronic component of shielding intracavity to outside electronic component's electromagnetic interference. Of course, as another improvement, the horizontal upper surface of the circuit board may be provided with a slot and a protrusion for respectively matching with the protrusion and the groove on the horizontal plate of the clamping shield.

The connection mode of the circuit board and the shielding cover is flexible, can be bonded, clamped and screwed, is tightly connected without gaps, has good overall shielding performance, is convenient to maintain, can cover an electronic element in an area on the circuit board, and can also cover the whole circuit board, thereby effectively preventing the wave leakage phenomenon.

The embodiments described in this specification are merely illustrative of implementations of the patent concept and the scope of protection of the patent should not be considered limited to the specific forms set forth in the embodiments but rather by equivalents thereof as may occur to those skilled in the art upon consideration of the patent concept.

Claims

1. The utility model provides a shield cover, its characterized in that, including the bottom plate and with bottom plate integrated into one piece and enclose in bottom plate curb plate all around, the bottom plate with the curb plate all includes insulating rete and the conducting layer that outside-in stromatolite set up in proper order, just the conducting layer orientation set up in the cavity of shield cover.

2. The shielding cage of claim 1, wherein an adhesive is disposed on a side of the side plate facing into the cavity.

3. The shielding cage of claim 1, wherein said side plates are provided with a ledge facing into said cavity; or/and the side plate faces towards the cavity, a groove is arranged in the cavity, and the opening of the groove faces towards the interior of the cavity.

4. A shield according to claim 3, wherein the projections are provided with adhesive members; or an adhesive part is arranged in the groove.

5. The shielding cage of claim 1, wherein an end of said side plate remote from said bottom plate extends toward an outer side of said chamber to form a horizontal plate.

6. The shielding cage of claim 5, wherein said horizontal plate has an adhesive disposed thereon.

7. The shielding cage of claim 5, wherein said horizontal plate has a protrusion; or/and the horizontal plate is provided with a groove.

8. The shielding cage of claim 1, wherein a glue film layer is further disposed between said insulating film layer and said conductive layer.

9. The shielding case of claim 1, wherein at least one partition board is further disposed in the shielding case, and the partition board partitions a shielding cavity formed by enclosing the bottom board and the side boards into a plurality of cavities.

10. The shielding cage of claim 9, wherein said spacer is provided with a resilient member; or/and elastic parts are arranged on the bottom plate and the side plates.

11. A circuit board having a shielding cage according to any of claims 1-10, wherein the shielding cage is connected to the circuit board and all or part of the area of the circuit board is located in the cavity of the shielding cage.

12. The circuit board of claim 11, wherein an adhesive is disposed on a side of the side plate of the shield case facing the cavity, and the shield case is connected to the circuit board through the adhesive.

13. The circuit board of claim 11, wherein the vertical side of the circuit board is provided with a card slot; or/and the vertical side edge of the circuit board is provided with a convex part.

14. The circuit board of claim 11, wherein the circuit board is provided with a card slot on a horizontal upper surface; or/and the horizontal upper surface of the circuit board is provided with a convex part.