CN211481785U

CN211481785U - High heat dissipating integrated circuit board convenient to installation

Info

Publication number: CN211481785U
Application number: CN201922187683.7U
Authority: CN
Inventors: 王飞翔
Original assignee: Nanan Jinxing Stone Industry Co Ltd
Current assignee: Liu Zhijun
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2020-09-11
Anticipated expiration: 2029-12-09

Abstract

The utility model relates to the technical field of integrated circuit boards, in particular to a high heat dissipation integrated circuit board convenient to install, which comprises a circuit board, a heat dissipation component A and a heat dissipation component B, wherein one side of the heat dissipation component A is arranged at one side of the circuit board, one side of the heat dissipation component B is arranged at the top of the heat dissipation component A, the circuit board is provided with a connecting hole, an electronic component and a plug wire joint, the connecting hole is arranged at two ends of the connecting hole, the plug wire joint is electrically connected with one end of the circuit board, the electronic component is welded at one side of the circuit board, the heat dissipation component A comprises a refrigeration component, a fan A and a fan B, the fan A is arranged at one side of the refrigeration component, the fan B is arranged at one side of the fan A and is in parallel separation with the fan A, not only simple to operate, the heat dissipation is high-efficient moreover, can clear away the dust simultaneously.

Description

High heat dissipating integrated circuit board convenient to installation

Technical Field

The utility model relates to an integrated circuit board technical field specifically says a high heat dissipating integrated circuit board convenient to installation.

Background

An integrated circuit board is a carrier on which an integrated circuit is mounted. But often the integrated circuit board is also brought on. The integrated circuit board is mainly made of silica gel, so the integrated circuit board is generally green, a semiconductor manufacturing process is adopted, a plurality of transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above insufficiency, the utility model provides a high heat dissipating integrated circuit board convenient to installation herein, not only simple to operate, it is high-efficient to dispel the heat moreover, can clear away the dust simultaneously.

The utility model discloses a realize like this, construct a high heat dissipating integrated circuit board convenient to installation, which comprises a circuit board, radiator unit A and radiator unit B, radiator unit A one side is installed in circuit board one side, radiator unit B one side is installed in radiator unit A top, the circuit board is equipped with the connecting hole, electronic component and plug wire connect, the connecting hole is seted up in the connecting hole both ends, plug wire joint electric connection is in circuit board one end, electronic component welds in circuit board one side, radiator unit A includes the refrigeration subassembly, fan A and fan B, fan A installs in refrigeration subassembly one side, fan B is located fan A one side, both parallels are separated by, radiator unit B includes aluminium base board, heat radiation fins and heat pipe, screw connection is passed through in aluminium base board one side to heat radiation fins one end, the heat pipe alternates between a plurality of heat radiation.

Furthermore, the electronic element generates heat greatly and is arranged at the lower end of the cold air, and the electronic element generates heat slightly and is arranged at the upper end of the cold air in a transverse arrangement, so that heat dissipation is facilitated.

Furthermore, the refrigeration component comprises a compressor, an air suction pipe, an evaporator, a capillary tube, a drying filter, a condenser and an air exhaust pipe, wherein one end of the air suction pipe is embedded into one end of the compressor, the air exhaust pipe is sequentially provided with the evaporator, the capillary tube and the drying filter, the other end of the air suction pipe is embedded into one end of the condenser, one end of the air exhaust pipe is embedded into one end of the condenser, the other end of the air exhaust pipe is embedded into one end of the compressor, refrigerant gas is compressed into high-temperature high-pressure superheated steam by the compressor and is led into the condenser through the air exhaust pipe on one side of the compressor, the superheated steam is condensed into high-temperature medium-pressure liquid in the condenser, the refrigerant liquid of the high-temperature medium-pressure liquid enters the capillary tube after being, and then changed into low-pressure steam in the suction pipe, and sucked by the compressor to maintain the circulation.

Further, fan A includes motor, support frame and flabellum, and screw installation in support frame one side is passed through to motor one side, and the flabellum nestification is in motor one end, and driving motor drives the flabellum and rotates, blows off cold wind.

Furthermore, the heat conduction pipe is a hollow copper pipe, a heat conducting agent is arranged in the heat conduction pipe, and the heat conducting agent is filled in two thirds of the heat conduction pipe.

Furthermore, the joints of the heat dissipation fins and the heat conduction pipes are coated with silicone grease, and the contact between the heat dissipation fins and the heat conduction pipes is enhanced by coating a small amount of silicone grease, so that the heat dissipation effect is improved.

The utility model discloses an improve and provide a high heat dissipating integrated circuit board convenient to installation here, compare with current integrated circuit board, have following advantage: not only simple to operate has, and the heat dissipation is high-efficient moreover, can clear away the dust simultaneously and reason, embodies:

the method has the advantages that: the circuit board can be conveniently installed in an electric appliance through the connecting hole, and the circuit board can be conveniently connected with other electronic hardware through the plug wire connector, so that the circuit board is convenient to install.

The method has the advantages that: the cooling component absorbs heat for cooling, the fan A blows cold air to the circuit board, heat is blown out of the electronic component, the fan B sends the heat to the outside, and meanwhile, the heat of the electronic component is conducted to the radiating fins through the heat conducting pipes, and the heat is further dissipated through the radiating fins.

The method has the advantages that: the fan A can blow out accumulated dust while blowing out heat from the electronic component, thereby achieving the effect of removing the dust.

Drawings

Fig. 1 is a schematic structural view of a high heat dissipation integrated circuit board convenient to mount according to the present invention;

fig. 2 is a schematic structural diagram of the refrigeration assembly of the present invention.

The figure illustrates the format: 1. a circuit board; 2. a heat dissipation assembly A; 3. a heat dissipation assembly B; 11. connecting holes; 12. An electronic component; 13. a plug wire joint; 21. a refrigeration assembly; 22. a fan A; 23. a fan B; 31. an aluminum substrate; 32. heat dissipation fins; 33. a heat conducting pipe; 211. a compressor; 212. an air intake duct; 213. an evaporator; 214. a capillary tube; 215. drying the filter; 216. a condenser; 217. an exhaust pipe; 221. a motor; 222. A support frame; 223. a fan blade.

Detailed Description

The present invention will be described in detail below with reference to the attached drawings, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention; furthermore, the terms "first," "second," "third," "upper, lower, left, right," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model provides a high heat dissipating integrated circuit board which is convenient to install through improvement, as shown in the attached drawings of the specification, the implementation can be carried out according to the following mode; the heat dissipation module A comprises a circuit board 1, a heat dissipation module A2 and a heat dissipation module B3, one side of the heat dissipation module A2 is installed on one side of the circuit board 1, one side of the heat dissipation module B3 is installed on the top of the heat dissipation module A2, the circuit board 1 is provided with a connecting hole 11, an electronic component 12 and a plug wire connector 13, the connecting hole 11 is opened at two ends of the connecting hole 11, the plug wire connector 13 is electrically connected to one end of the circuit board 1, the electronic component 12 is welded on one side of the circuit board 1, the heat dissipation module A2 comprises a refrigeration module 21, a fan A22 and a fan B23, the fan A22 is installed on one side of the refrigeration module 21, a fan B23 is located on one side of a fan A22 and is spaced in parallel, the heat dissipation module B3 comprises an aluminum substrate 31, heat dissipation fins.

As shown in fig. 1, the electronic component 12 generates heat largely at the lower end of the cooling air, and generates heat less at the upper end of the cooling air, and is arranged horizontally, which is beneficial to heat dissipation.

As shown in fig. 2, the refrigeration assembly 21 includes a compressor 211, a gas suction pipe 212, an evaporator 213, a capillary tube 214, a dry filter 215, a condenser 216, and a gas discharge pipe 217, one end of the gas suction pipe 212 is embedded in one end of the compressor 211, the gas discharge pipe 217 is sequentially provided with the evaporator 213, the capillary tube 214, and the dry filter 215, the other end of the gas suction pipe 212 is embedded in one end of the condenser 216, one end of the gas discharge pipe 217 is embedded in one end of the condenser 216, the other end of the gas discharge pipe 217 is embedded in one end of the compressor 211, refrigerant gas is compressed into high-temperature high-pressure superheated vapor by the compressor 211 and is guided into the condenser 216 through the gas discharge pipe 217 at one side of the compressor 211, the superheated vapor is condensed into high-temperature medium-pressure liquid in the, the low-temperature and low-pressure refrigerant liquid absorbs a large amount of external heat in the evaporator 213 to become saturated vapor to realize refrigeration, and then becomes low-pressure vapor in the suction pipe 212, and is sucked by the compressor 211 to maintain the cycle.

As shown in fig. 2, the fan a22 includes a motor 221, a support bracket 222, and fan blades 223, one side of the motor 221 is mounted on one side of the support bracket 222 through screws, the fan blades 223 are nested at one end of the motor 221, and the motor 221 is driven to drive the fan blades 223 to rotate so as to blow out cold air.

As shown in fig. 1, the heat transfer pipe 33 is a hollow copper pipe, and a heat conductive agent is filled in the heat transfer pipe 33, and two thirds of the heat conductive agent is filled in the heat transfer pipe.

As shown in fig. 1, the joint between the heat dissipation fin 32 and the heat conduction pipe 33 is coated with silicone grease, and the contact between the heat dissipation fin 32 and the heat conduction pipe 33 is enhanced by coating a small amount of silicone grease, so as to improve the heat dissipation effect.

The working principle of the high-heat-dissipation integrated circuit board convenient to install is as follows: when the circuit board 1 is operated to generate heat, the refrigerant gas in the refrigeration component 21 is compressed into high-temperature high-pressure superheated steam by the compressor 211, and is guided into the condenser 216 through the exhaust pipe 217 at one side of the compressor 211, the superheated steam is condensed into high-temperature medium-pressure liquid in the condenser 216, the refrigerant liquid of the high-temperature medium-pressure liquid enters the capillary tube 214 after being filtered by the drying filter 215, the capillary tube 214 is throttled and depressurized and is changed from high-temperature medium-pressure into low-temperature low-pressure, the low-temperature low-pressure refrigerant liquid absorbs a large amount of external heat in the evaporator 213 to be saturated steam to realize refrigeration, then cold air is blown to the circuit board 1 by the fan a22 to blow out heat from the electronic component 12, the heat is sent to the outside by the fan B23, meanwhile, the rest heat of the electronic component 12 is guided to the heat dissipation fins 32 by the heat conduction pipe 33 to, the circuit board 1 can be easily connected to other electronic hardware by means of the plug connectors 13.

In conclusion; high heat dissipating integrated circuit board convenient to installation compares with current integrated circuit board, not only simple to operate, and the heat dissipation is high-efficient moreover, can clear away the dust simultaneously.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a high heat dissipating integrated circuit board convenient to installation which characterized in that: the cooling structure comprises a circuit board (1), a heat dissipation assembly A (2) and a heat dissipation assembly B (3), wherein one side of the heat dissipation assembly A (2) is installed on one side of the circuit board (1), one side of the heat dissipation assembly B (3) is installed on the top of the heat dissipation assembly A (2), the circuit board (1) is provided with a connecting hole (11), an electronic element (12) and a plug wire connector (13), the connecting hole (11) is formed in two ends of the connecting hole (11), the plug wire connector (13) is electrically connected to one end of the circuit board (1), the electronic element (12) is welded on one side of the circuit board (1), the heat dissipation assembly A (2) comprises a refrigeration assembly (21), a fan A (22) and a fan B (23), the fan A (22) is installed on one side of the refrigeration assembly (21), the fan B (23) is located on one side of the fan A (22), the fan A (22) and the fan B, The radiating structure comprises radiating fins (32) and a heat conducting pipe (33), wherein one end of each radiating fin (32) is connected to one side of the aluminum substrate (31) through a screw, and the heat conducting pipe (33) is inserted between the plurality of radiating fins (32) and the electronic component (12).

2. A high heat dissipation integrated circuit board easy to mount according to claim 1, wherein: the electronic components (12) are arranged at the lower end of the cold air with large heat and at the upper end of the cold air with small heat in a transverse arrangement.

3. A high heat dissipation integrated circuit board easy to mount according to claim 1, wherein: refrigeration subassembly (21) includes compressor (211), breathing pipe (212), evaporimeter (213), capillary (214), drying filter (215), condenser (216) and blast pipe (217), breathing pipe (212) one end imbed in compressor (211) one end, blast pipe (217) are equipped with in proper order evaporimeter (213), capillary (214) and drying filter (215), breathing pipe (212) other end imbed in condenser (216) one end, blast pipe (217) one end imbeds in condenser (216) one end, and blast pipe (217) other end imbeds in compressor (211) one end.

4. A high heat dissipation integrated circuit board easy to mount according to claim 1, wherein: the fan A (22) comprises a motor (221), a support frame (222) and fan blades (223), wherein one side of the motor (221) is installed on one side of the support frame (222) through screws, and the fan blades (223) are nested at one end of the motor (221).

5. A high heat dissipation integrated circuit board easy to mount according to claim 1, wherein: the heat conduction pipe (33) is a hollow copper pipe, and a heat conduction agent is arranged inside the heat conduction pipe.

6. A high heat dissipation integrated circuit board easy to mount according to claim 1, wherein: the joint of the radiating fin (32) and the heat conducting pipe (33) is coated with silicone grease.