CN220731515U - Heat abstractor of chip system - Google Patents
Heat abstractor of chip system Download PDFInfo
- Publication number
- CN220731515U CN220731515U CN202322141255.7U CN202322141255U CN220731515U CN 220731515 U CN220731515 U CN 220731515U CN 202322141255 U CN202322141255 U CN 202322141255U CN 220731515 U CN220731515 U CN 220731515U
- Authority
- CN
- China
- Prior art keywords
- plate
- chip system
- connecting plate
- substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000006978 adaptation Effects 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 abstract description 11
- 239000013589 supplement Substances 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of heat dissipation devices and discloses a chip system heat dissipation device, which comprises a chip system main body, wherein the chip system main body is fixedly arranged in a substrate, one side of the inside of the substrate is fixedly provided with a plurality of heat conducting plates, two sides of the substrate are fixedly connected with connecting plates, one of the connecting plates is arranged above the other connecting plate and is arranged below the other connecting plate, one side of the connecting plate is fixedly connected with a mounting plate, the mounting plate is embedded into the inner wall of the substrate, when the chip system heat dissipation device is used, fans at two sides of the substrate are started, the temperature of the inside of the substrate is increased, so that the inside air flows up and down, then the inside air is exhausted through the fan above one side of the substrate, meanwhile, the fan below one side of the substrate sucks the cold air into the inside of the substrate, supplements the inside air of the substrate, and the body surface of the chip system main body exchanges heat with the newly moved colder air, so that heat is taken away continuously, and the cooling efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device of a chip system.
Background
The chip is a packaging form of an integrated circuit, electronic components, circuits and systems are integrated on a tiny silicon chip and used for realizing functions of electronic equipment, the chip is an important component of modern technology and is ubiquitous, production and life of people are affected, the chip is easy to generate heat during operation, a heat radiating device is needed to avoid damage of the chip, the current heat radiating device faces a fan to the chip, and therefore the effect of cooling is relatively poor.
Disclosure of Invention
The utility model aims to provide a heat dissipation device of a chip system, which aims to solve the problem that the prior heat dissipation devices in the background art are relatively poor in cooling effect because fans are opposite to chips.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a chip system heat abstractor, includes the chip system main part, chip system main part fixed mounting is in the inside of base plate, the inside one side of base plate is fixed and is equipped with a plurality of heat-conducting plates, the equal fixedly connected with connecting plate in both sides of base plate, one of them the connecting plate sets up another setting in the below in the top, one side fixedly connected with mounting panel of connecting plate, in the inner wall of mounting panel embedding base plate, the inside of mounting panel is provided with the mount pad, the outer end of mount pad is fixed and is equipped with a plurality of dead levers, dead lever fixed mounting is in the inner wall of mounting panel, one side of mount pad is connected with the connecting rod through the bearing frame, the one end of connecting rod is connected with the fan, the inside of connecting plate is provided with filtering structure, when using, installs the chip system main part in the inside of base plate, when the chip system main part during long-time during the higher temperature of chip system main part, starts the fan of base plate both sides, because of the inside temperature rise to make inside air flow down, then get rid of it through the fan of base plate one side top, the inside of the fan below can inhale the inside the base plate, the inside of cooling air, the inside, the chip main part is carried out with cooling down the system and the cooling down the heat is carried out to the system more than the body.
As the preference, filtration includes the filter, the filter embedding is in the inside of connecting plate, one side of filter all is provided with a plurality of fixed blocks, one side of connecting plate is equipped with the limiting plate, one side both ends of limiting plate are all fixed and are equipped with the gag lever post, the gag lever post runs through connecting plate and fixed block, the inside threaded connection of limiting plate has the bolt, when using, detains the filter at the inner wall of connecting plate, then pegging graft the limiting plate in the inside of connecting plate, and the gag lever post of limiting plate one side can run through the fixed block of filter one side, then twist the bolt, makes the inside of one end embedding connecting plate of bolt to fix the filter, the filter can filter the air, avoids the dust to get into the inside of base plate.
Preferably, the mounting grooves are formed in two sides of the base plate, and the size of each mounting groove is matched with that of the mounting plate, so that the mounting plate is convenient to mount.
Preferably, the inside of fixed block has seted up the through-hole, and the through-hole size and gag lever post looks adaptation, carries out spacingly to the filter through the gag lever post.
Preferably, a groove is formed in one side of the connecting plate, the limiting plate is located in the groove, and the problem that the limiting plate protrudes to cause inconvenient installation is avoided.
Preferably, threaded holes are formed in the limiting plate and the connecting plate, the size of the threaded holes is matched with that of the bolts, and the limiting plate is fixed through the bolts.
Compared with the prior art, the technical scheme provided by the utility model has the following technical effects:
when the chip system is used, the chip system main body is arranged in the base plate, the mounting plates are respectively arranged on two sides of the base plate, one mounting plate is arranged above one side of the base plate, the other mounting plate is arranged below the other side of the base plate, when the chip system main body works for a long time, the fan in the mounting plate is started, the air flows upwards due to the rising of the temperature in the base plate, the fan above the base plate can pump out the air, and meanwhile, the fan below the base plate can pump cold air into the base plate to form convection heat dissipation, and the body surface of the chip system main body exchanges heat with the newly moved colder air, so that heat is taken away continuously, and the heat dissipation efficiency is improved.
According to the utility model, the filter plate, the fixed block, the limiting plate, the limiting rod and the bolt are arranged, when the filter plate is used, the filter plate is buckled in the connecting plate, then the limiting plate is arranged on one side of the connecting plate, the limiting rods at two ends of one side of the connecting plate are spliced in the connecting plate, meanwhile, the limiting rods penetrate through the fixed block on one side of the filter plate, then the bolt is screwed, one end of the bolt is connected with the connecting plate in a threaded manner, so that the filter plate is fixed, dust in air is filtered by the filter plate, and the dust is prevented from entering the inside of the base plate.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the main structure of the present utility model;
FIG. 2 is a schematic side view of the present utility model;
FIG. 3 is a schematic diagram of a filter structure according to the present utility model;
fig. 4 is an enlarged schematic view of the structure of fig. 1 a according to the present utility model.
Reference numerals illustrate: 1. a chip system main body; 2. a substrate; 3. a heat conductive plate; 4. a connecting plate; 5. a mounting plate; 6. a mounting base; 7. a fixed rod; 8. a connecting rod; 9. a fan; 10. a filter plate; 11. a fixed block; 12. a limiting plate; 13. a limit rod; 14. and (5) a bolt.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "first," "second," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of a plurality of "a number" is two or more, unless explicitly defined otherwise.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the scope of the present disclosure, since any structural modifications, proportional changes, or dimensional adjustments made by those skilled in the art should not be made in the present disclosure without affecting the efficacy or achievement of the present disclosure.
Examples
In the prior art, the existing heat dissipation device aims at the fan to cool the chip, so that the problem of poor cooling effect is solved.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a chip system heat abstractor, including chip system main part 1, chip system main part 1 fixed mounting is in the inside of base plate 2, the inside one side of base plate 2 is fixed to be equipped with a plurality of heat-conducting plates 3, the equal fixedly connected with connecting plate 4 in both sides of base plate 2, one of them connecting plate 4 sets up another in the below, one side fixedly connected with mounting panel 5 of connecting plate 4, in the inner wall of mounting panel 5 embedding base plate 2, the mounting groove has all been seted up to the both sides of base plate 2, and the size and the mounting panel 5 looks adaptation of mounting groove, the convenience is installed mounting panel 5, the inside of mounting panel 5 is provided with mount pad 6, the outer end of mount pad 6 is fixed and is equipped with a plurality of dead levers 7, dead lever 7 fixed mounting is at the inner wall of mounting panel 5, one side of mount pad 6 is connected with connecting rod 8 through the bearing frame, the one end of connecting rod 8 is connected with fan 9, the inside of connecting plate 4 is provided with filtering structure, when using, install chip system main part 1 in the inside of base plate 2, when chip system main part 1 during long-time during operation temperature is higher, the fan 9 of base plate 2 both sides is started, because of the inside temperature rise of base plate 2, and make inside air flow from top to bottom, then take away the fan 9 and take away its inside air exchange heat, cooling system 2 is carried out to the inside air, and cooling system 2 is more than the inside cooling down, and cooling air exchange is carried out, and the inside cooling air is more than inside cooling down.
The chip system main body 1 is arranged in the base plate 2 in use, the mounting plates 5 are respectively arranged on two sides of the base plate 2, one mounting plate 5 is arranged above one side of the base plate 2, the other mounting plate 5 is arranged below the other side of the base plate 2, when the chip system main body 1 works for a long time, the fan 9 in the mounting plate 5 is started, the air flows upwards due to the rising of the internal temperature of the base plate 2, the fan 9 above the base plate 2 can pump out the air, meanwhile, the fan 9 below the base plate 2 can pump cold air into the base plate 2 to form convection heat dissipation, and the body surface of the chip system main body 1 exchanges heat with the newly moved colder air, so that heat is taken away continuously, and the heat dissipation efficiency is improved.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a chip system heat abstractor, the filter structure includes filter 10, filter 10 embeds in the inside of connecting plate 4, one side of filter 10 all is provided with a plurality of fixed blocks 11, one side of connecting plate 4 is equipped with limiting plate 12, one side of connecting plate 4 is seted up flutedly, limiting plate 12 is in the inside of recess, avoid limiting plate 12 protrusion, cause the installation inconvenient, one side both ends of limiting plate 12 are all fixed and are equipped with gag lever post 13, gag lever post 13 runs through connecting plate 4 and fixed block 11, the through-hole has been seted up to the inside of fixed block 11, and the size and the gag lever post 13 looks adaptation of through-hole, carry out spacingly to filter 10 through gag lever post 13, the inside threaded connection of limiting plate 12 has bolt 14, the screw hole size is all seted up with the inside of connecting plate 4, fix limiting plate 12 through bolt 14, when using, detain filter 10 in the inner wall of connecting plate 4, then peg graft limiting plate 12 in the inside of connecting plate 4, the gag lever post 13 of limiting plate 12 one side can run through the fixed block 11 of filter 10, then twist bolt 14, make the inside of one end embedding connecting plate 4, thereby filter 10 can be prevented from entering into the inside of filter plate 10, dust can be avoided to the inside 2.
The filter plate 10 is buckled in the inside of the connecting plate 4, then the limiting plates 12 are arranged on one side of the connecting plate 4, the limiting rods 13 at two ends of one side of the connecting plate 4 are inserted in the inside of the connecting plate 4, meanwhile, the limiting rods 13 penetrate through the fixed blocks 11 on one side of the filter plate 10, then the bolts 14 are screwed, one ends of the bolts 14 are in threaded connection with the connecting plate 4, so that the filter plate 10 is fixed, dust in air is filtered by the filter plate 10, and the dust is prevented from entering the inside of the base plate 2.
Thus, embodiments of the present utility model have been described in detail with reference to the accompanying drawings. It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the components are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
Those skilled in the art will appreciate that the features recited in the various embodiments of the utility model and/or in the claims may be combined in various combinations and/or combinations, even if such combinations or combinations are not explicitly recited in the utility model. In particular, the features recited in the various embodiments of the utility model and/or in the claims can be combined in various combinations and/or combinations without departing from the spirit and teachings of the utility model. All such combinations and/or combinations fall within the scope of the utility model.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the utility model, and is not meant to limit the utility model thereto, but to limit the utility model thereto, and any modifications, equivalents, improvements and equivalents thereof may be made without departing from the spirit and principles of the utility model.
Claims (6)
1. A heat sink for a chip system, comprising a chip system body (1), characterized in that: the chip system main part (1) fixed mounting is in the inside of base plate (2), the inside one side of base plate (2) is fixed and is equipped with a plurality of heat-conducting plates (3), the equal fixedly connected with connecting plate (4) in both sides of base plate (2), one of them connecting plate (4) set up another below that sets up in the top, one side fixedly connected with mounting panel (5) of connecting plate (4), in the inner wall of mounting panel (5) embedding base plate (2), the inside of mounting panel (5) is provided with mount pad (6), the outer end of mount pad (6) is fixed and is equipped with a plurality of dead levers (7), dead lever (7) fixed mounting is in the inner wall of mounting panel (5), one side of mount pad (6) is connected with connecting rod (8) through the bearing frame, the one end of connecting rod (8) is connected with fan (9), the inside of connecting plate (4) is provided with filtration.
2. A heat sink for a chip system according to claim 1, wherein: the filter structure comprises a filter plate (10), the filter plate (10) is embedded into the connecting plate (4), a plurality of fixing blocks (11) are arranged on one side of the filter plate (10), a limiting plate (12) is arranged on one side of the connecting plate (4), limiting rods (13) are fixedly arranged at two ends of one side of the limiting plate (12), the limiting rods (13) penetrate through the connecting plate (4) and the fixing blocks (11), and bolts (14) are connected with the internal threads of the limiting plate (12).
3. A heat sink for a chip system according to claim 1, wherein: mounting grooves are formed in two sides of the base plate (2), and the size of each mounting groove is matched with that of the mounting plate (5).
4. A heat sink for a chip system according to claim 2, wherein: the inside of fixed block (11) has seted up the through-hole, and the through-hole size and gag lever post (13) looks adaptation.
5. A heat sink for a chip system according to claim 2, wherein: a groove is formed in one side of the connecting plate (4), and the limiting plate (12) is located in the groove.
6. A heat sink for a chip system according to claim 2, wherein: threaded holes are formed in the limiting plate (12) and the connecting plate (4), and the size of the threaded holes is matched with that of the bolts (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322141255.7U CN220731515U (en) | 2023-08-10 | 2023-08-10 | Heat abstractor of chip system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322141255.7U CN220731515U (en) | 2023-08-10 | 2023-08-10 | Heat abstractor of chip system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220731515U true CN220731515U (en) | 2024-04-05 |
Family
ID=90492440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322141255.7U Active CN220731515U (en) | 2023-08-10 | 2023-08-10 | Heat abstractor of chip system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220731515U (en) |
-
2023
- 2023-08-10 CN CN202322141255.7U patent/CN220731515U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |