CN211466133U

CN211466133U - Clamping device for fixing wafer

Info

Publication number: CN211466133U
Application number: CN201922013715.1U
Authority: CN
Inventors: 李志峰; 庄海云; 徐铭; 王雪松
Original assignee: PNC Process Systems Co Ltd
Current assignee: Zhiwei Semiconductor Shanghai Co Ltd; PNC Process Systems Co Ltd
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2020-09-11
Anticipated expiration: 2029-11-20

Abstract

The utility model discloses a clamping device for fixed wafer, include: the first clamping assembly comprises a mounting plate, at least two fixed seats are fixedly connected to the mounting plate, each fixed seat comprises a first fixed seat and a second fixed seat symmetrically arranged with the first fixed seat, and a plurality of racks are arranged on the first fixed seats; the second clamping assembly and the first clamping assembly are identical in structure and are symmetrically arranged; run through on the mounting panel and be fixed with the connecting rod, and mounting panel one end rigid coupling has the rotation connecting rod, the rotation connecting rod rotates and is connected with crank handle to make first centre gripping subassembly and second centre gripping subassembly round crank handle does circumferential direction. According to the utility model discloses, be applicable to and bear the weight of no matter carry on that the process flow is that conveying process, processing technology, wafer arrangement etc. need see through fixed wafer list go into, batch formula wafer, make the wafer remove, transmit the station in order to carry out different district sections and stably settle.

Description

Clamping device for fixing wafer

Technical Field

The utility model relates to a to clamping device technical field, in particular to clamping device for fixed wafer.

Background

Under the development of the global semiconductor related technology, manufacturing equipment and manufacturing methods in various fields have development paths, and in china, in order to improve the development targets of the semiconductor related manufacturing technology and related equipment and components, related manufacturers spread across the country like bamboo shoots after rain, and with the continuous support of national policies and capital, the continuous and high-intensity research and development investment of the domestic equipment and the autonomous control of core technology are increasingly promoted, wherein the application design and technical concept of applying related component module devices such as wafers required to be placed or batch-type wafers used in the related process flow by the load and movement of semiconductor wafers are required to be generated. The use of the wafer cassette for wafer cassette transmission is common in various situations that a single wafer or a batch of wafers are required to be placed on a movable module in a clamping or holding manner, and the corresponding mechanism motion or the corresponding module mechanism or device connected with the wafer cassette in the process flow generates physical interference action due to micro or excessive shaking offset and improper deflection, so that the wafer is damaged and the related module equipment is lost.

Accordingly, there is a need to develop a clamping device for fixing a wafer, which solves the above problems.

SUMMERY OF THE UTILITY MODEL

To the weak point that exists among the prior art, the utility model aims at providing a clamping device for fixed wafer is suitable for and installs no matter carry on various process flow equipment that conveying flow, processing technology, wafer settle etc. need singly go into, batch formula wafer through fixed wafer, makes the wafer remove, transmit so that can stably place on the station of different district section. In order to achieve the above objects and other advantages in accordance with the present invention, there is provided a clamping device for fixing a wafer, comprising:

the first clamping assembly comprises a mounting plate, at least two fixed seats are fixedly connected to the mounting plate, each fixed seat comprises a first fixed seat and a second fixed seat symmetrically arranged with the first fixed seat, and a plurality of racks are arranged on the first fixed seats; and

the second clamping assembly and the first clamping assembly are identical in structure and are symmetrically arranged;

wherein, run through on the mounting panel and be fixed with the connecting rod, and mounting panel one end rigid coupling has the rotation connecting rod, it is connected with the turncrank to rotate the connecting rod to make first centre gripping subassembly and second centre gripping subassembly round turncrank is circumferential direction.

Preferably, the crank handle includes the hub connection piece, the lower extreme rigid coupling of hub connection piece has the fixed plate, sliding connection has the switching piece on the fixed plate.

Preferably, the upper end of the shaft connecting block is provided with a first shaft connecting hole, the first shaft connecting hole is connected with a first rotating shaft in a rotating mode, the lower end of the transfer block is provided with a second shaft connecting hole, and a second rotating shaft is connected in the second shaft connecting hole in a transferring mode.

Preferably, the two sides of the rack are symmetrically arranged, the rack comprises a top, and a first guide surface and a second guide surface are sequentially arranged on one side surface of the top.

Preferably, the first guide surface makes an angle α with the vertical, said angle α being in the range 30 ° to 60 °.

Preferably, the second guide surface is angled from the vertical by an angle β, said angle β being in the range 15 ° to 30 °.

Preferably, the junction of every two racks is an arc-shaped groove, and the arc-shaped groove extends along the width direction of the first fixed seat.

Preferably, a fixed interval is formed between every two racks by the first guide surface, the second guide surface and the arc-shaped groove.

Compared with the prior art, the utility model, through being equipped with the connecting rod, the device is widely used in the demand that needs carry on the relevant process units, equipment or the process flow that the wafer was put perpendicularly, and special rack structure makes the wafer stabilize and puts the device on, can not cause the wafer skew because of the wafer in the relevant motion behaviors such as removal, transmission, rock the motion deviation such as to cause the damage or the bruise to the wafer in the technology goes on.

Drawings

Fig. 1 is a schematic three-dimensional structure for fixing a wafer according to the present invention;

fig. 2 is a schematic three-dimensional structure of a first clamping assembly for fixing a wafer according to the present invention;

fig. 3 is a partial schematic view of a three-dimensional structure of a first clamping assembly for fixing a wafer according to the present invention;

fig. 4 is a partial schematic view of a front view of a first clamping assembly for holding a wafer according to the present invention;

fig. 5 is a schematic diagram of a three-dimensional explosion of a rotating crank for fixing a wafer according to the present invention.

1. A wafer; 2. a first clamping assembly; 3. a second clamping assembly; 4. a connecting rod; 5. rotating the connecting rod; 7. rotating a crank; 21. mounting a plate; 22. a first fixed seat; 23. a second fixed seat; 221. a rack; 2211. a first guide surface; 2212. a second guide surface; 2213. a top portion; 2214. an arc-shaped slot; 71. a first rotating shaft; 72. a second rotating shaft; 73. a shaft connecting block; 74. a fixing plate; 75. a transfer block; 731. a first shaft connection hole; 751. the second shaft is connected to the hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, in a first clamping assembly 2, the first clamping assembly 2 includes an installation plate 21, at least two fixing seats are fixedly connected to the installation plate 21, each fixing seat includes a first fixing seat 22 and a second fixing seat 23 symmetrically arranged with respect to the first fixing seat 22, the first fixing seat 22 is provided with a plurality of racks 221, one fixing seat can hold a group of wafers 1, and a plurality of wafers 1 are placed according to the number of racks 221 on each fixing seat, and one wafer 1 is clamped and fixed between every two racks 221; the second clamping assembly 3 is the same in structure and symmetrically arranged with the first clamping assembly 2, and the wafer 1 is circular in cross section, so that one side edge of the wafer 1 can be clamped by the second clamping assembly 3 and the first clamping assembly 2 symmetrically arranged, and the wafer 1 can be clamped stably; wherein, run through on the mounting panel 21 and be fixed with connecting rod 4, and mounting panel 21 one end rigid coupling has rotation connecting rod 5, rotation connecting rod 5 rotates and is connected with crank 7 to make first centre gripping subassembly 2 and second centre gripping subassembly 3 round crank 7 does circumferential direction, and connecting rod 4 and second connecting rod 6 are used for rotatable joint on the equipment of required installation, make this clamping device can the wide use like this and carry out the relevant process units that the wafer was put perpendicularly, equipment or process flow's demand, and rotation connecting rod 5 can be used for connecting drive arrangement as required, can provide a power to clamping device and make clamping device can automatic centre gripping wafer 1, perhaps release wafer 1 automatically.

Referring to fig. 1 and 5, the rotating crank 7 includes a shaft connecting block 73, a fixing plate 74 is fixedly connected to the lower end of the shaft connecting block 73, a transfer block 75 is slidably connected to the fixing plate 74, a first shaft connecting hole 731 is formed in the upper end of the shaft connecting block 73, a first rotating shaft 71 is rotatably connected to the first shaft connecting hole 731, a second shaft connecting hole 751 is formed in the lower end of the transfer block 75, a second rotating shaft 72 is connected to the second shaft connecting hole 751, the first rotating shaft 71 is fixed to the rotating connecting rod 5, the rotating connecting rod 5 is fixedly connected to the mounting plate 21, and when the rotating crank 7 moves, the first clamping assembly 2 rotates circumferentially around the first rotating shaft 71.

Referring to fig. 3, the rack 221 is symmetrically disposed on both sides, the rack 221 includes a top portion 2213, one side of the top portion 2213 is sequentially provided with a first guide surface 2211 and a second guide surface 2212, the rack 221 is symmetrical about a middle line of the top portion 2213, the top portion 2213 is symmetrically provided with a first guide surface 2211 and a second guide surface 2212 on both sides, each rack 221 has the same structure, a fixed interval is formed by the first guide surface 2211, the second guide surface 2212 and the arc-shaped groove 2214 between each two racks 221, the wafer 1 is fixed in the fixed interval, the first guide surface 2211 plays a role of installation guide when the wafer 1 is installed and placed, the second guide surface 2212 defines the position of the wafer 1 so that the wafer 1 is in a state perpendicular to a horizontal plane when the wafer 1 is completely placed in the fixed interval, and the bottom end of the wafer 1 is matched with the arc-shaped groove 2214 in a circular arc shape during the movement of the apparatus, the second guide surface 2212 also functions to automatically reposition the wafer 1 in a small excursion without damaging the wafer 1.

Referring to fig. 4, the first guide surface 2211 forms an angle α with the vertical direction, the angle α is in the range of 30 ° to 60 °, and the angle α of the first guide surface 2211 is large, so that the upper forming region between the two opposite racks 221 forms a trumpet-shaped opening to facilitate the mounting of the wafer 1.

Referring to fig. 4, the angle β between the second guiding surface 2212 and the vertical direction is in the range of 15 ° -30 °, and the angle β between the second guiding surfaces 2212 is smaller, so that the mouth of the lower region formed between the two opposite racks 221 effectively fixes the wafer 1 and resets the wafer 1.

Further, an arc-shaped groove 2214 is formed at the junction of every two racks 221, the arc-shaped groove 2214 extends along the width direction of the first fixing seat 22, the length of the arc-shaped groove 2214 is the same as the width of the first fixing seat 22, and the arc-shaped groove 2214 is matched with the arc-shaped edge of the wafer 1 to fix the wafer 1.

The working principle is as follows: in the using process, the connecting rods 4 on the first clamping assembly 2 and the second clamping assembly 3 are respectively rotatably clamped on equipment to be installed, so that the first clamping assembly 2 and the second clamping assembly 3 are symmetrically arranged and rotatably clamped on the equipment, then a group of wafers 1 are sequentially placed on the fixed seats on the first clamping assembly 2 and the second clamping assembly 3, a plurality of racks 221 are arranged on the fixed seats, a fixed interval is formed by a first guide surface 2211, a second guide surface 2212 and an arc-shaped groove 2214 between every two racks 221, the wafers 1 are fixed in the fixed interval, two sides of each wafer 1 are respectively matched with the arc-shaped grooves 2214 on the fixed seats on the first clamping assembly 2 and the second clamping assembly 3, when the clamping device moves, the lower area formed between the second guide surfaces 2212 of the two opposite racks 221 is a closing-in type, and then, the wafer 1 is more effectively fixed by combining the wafer 1 and the arc-shaped groove 2214, and the wafer 1 is reset, a driving device is arranged at the lower end part of the rotating crank 7, the first clamping component 2 and the second clamping component 3 can be driven to rotate circumferentially around the rotating connecting rod 4, so that the first clamping component 2 and the second clamping component 3 are relatively opened, at the moment, the first clamping component 2 and the second clamping component 3 form a first abdicating opening in a loosening state, so that the wafer 1 can pass through the first abdicating opening, the wafer 1 falls down, or the first clamping component 2 and the second clamping component 3 are controlled to be relatively folded, at the moment, the first clamping component 2 and the second clamping component 3 provide a bearing surface for bearing the wafer 1 in a clamping state, and at the moment, the wafer 1 is clamped.

The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.

While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application suitable for this invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims

1. A clamping device for fixing a wafer, comprising:

the clamping device comprises a first clamping assembly (2), wherein the first clamping assembly (2) comprises an installation plate (21), at least two fixed seats are fixedly connected to the installation plate (21), each fixed seat comprises a first fixed seat (22) and a second fixed seat (23) symmetrically arranged with the first fixed seat (22), and a plurality of racks (221) are arranged on the first fixed seat (22); and

the second clamping assembly (3) and the first clamping assembly (2) are identical in structure and are symmetrically arranged;

wherein, run through on mounting panel (21) and be fixed with connecting rod (4), and mounting panel (21) one end rigid coupling has rotating connecting rod (5), rotating connecting rod (5) rotate and be connected with crank (7) to make first centre gripping subassembly (2) and second centre gripping subassembly (3) round crank (7) rotate and do circumferential direction.

2. The clamping device for fixing the wafer as claimed in claim 1, wherein the rotary crank (7) comprises a shaft connecting block (73), a fixing plate (74) is fixedly connected to the lower end of the shaft connecting block (73), and a transfer block (75) is slidably connected to the fixing plate (74).

3. The clamping apparatus for fixing a wafer as claimed in claim 1, wherein the upper end of the shaft connecting block (73) is formed with a first shaft connecting hole (731), the first shaft connecting hole (731) is rotatably connected with a first rotating shaft (71), the lower end of the adapting block (75) is formed with a second shaft connecting hole (751), and the second shaft connecting hole (751) is connected with a second rotating shaft (72).

4. The clamping device for fixing the wafer as claimed in claim 1, wherein the rack (221) is symmetrically arranged at two sides, the rack (221) comprises a top portion (2213), and a first guide surface (2211) and a second guide surface (2212) are sequentially arranged at one side surface of the top portion (2213).

5. The clamping device for fixing a wafer as claimed in claim 4, wherein the first guiding surface (2211) forms an angle α with the vertical direction, and the angle α is in the range of 30 ° to 60 °.

6. A holding device for holding a wafer according to claim 4, wherein the second guiding surface (2212) is angled with respect to the vertical by β, said β being in the range of 15 ° -30 °.

7. The clamping device for fixing the wafer as claimed in claim 1, wherein the intersection of every two racks (221) is an arc-shaped slot (2214), and the arc-shaped slot (2214) extends along the width direction of the first fixing base (22).

8. The clamping device for fixing the wafer according to any one of claims 1 to 7, wherein a fixed interval is formed between every two racks (221) by the first guide surface (2211), the second guide surface (2212) and the arc-shaped groove (2214).