CN211465859U - Semiconductor wafer grinding device - Google Patents
Semiconductor wafer grinding device Download PDFInfo
- Publication number
- CN211465859U CN211465859U CN201922249628.6U CN201922249628U CN211465859U CN 211465859 U CN211465859 U CN 211465859U CN 201922249628 U CN201922249628 U CN 201922249628U CN 211465859 U CN211465859 U CN 211465859U
- Authority
- CN
- China
- Prior art keywords
- suction
- motor
- grinding
- semiconductor wafer
- push rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a semiconductor wafer grinder, including cylinder platform, abrasive band, first motor, U type case, loading board, U type piece, hydraulic push rod, second motor, cylinder, U template, circle recess, sprinkler bead, suction groove, silica gel ring piece, winding rod, clutch, roller pole, round mouth and circular pressing plate. The utility model relates to a rationally, can be located round mouth department with the corresponding regional face of grinding of abrasive band and stretch tightly and bulldoze through installing the circular pressing plate at extension state cylinder push-rod end and stretch out round mouth port outside, have the function of changing different roughness abrasive surface structures, and can change in a flexible way, save the time of changing different specification abrasive structures, can adopt to bleed the mode that forms strong adsorption affinity and will wait to grind semiconductor wafer and fix placing the contact surface, simultaneously through the corresponding liquid of sprinkler bead blowout with external water pump connection, can wash the grinding powder and grind the region through liquid lubrication.
Description
Technical Field
The utility model relates to a grinder specifically is a semiconductor wafer grinder, belongs to wafer processing application technical field.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, various circuit element structures can be manufactured on the silicon wafer to form IC products with specific electrical functions, the original material of the wafer is silicon, and the surface of the earth crust has inexhaustible silicon dioxide.
During the process of grinding wafer-shaped semiconductor wafers in different degrees, grinding structures with different specifications need to be disassembled and replaced, time-consuming separation is caused during replacement operation, the work efficiency is not favorably improved, meanwhile, the single dry friction grinding easily generates higher temperature, the subsequent grinding progress is influenced, and the mode of placing a fixed structure on the semiconductor wafer needs to be improved and optimized from the direction of reducing the damage degree. Therefore, a semiconductor wafer polishing apparatus is proposed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a semiconductor wafer polishing apparatus for solving the above problems.
The utility model realizes the purpose through the following technical scheme, a semiconductor wafer grinding device comprises a cylindrical table, a suction structure and a grinding structure, wherein a circular groove is arranged on the surface of the top of the cylindrical table, and one end of a U-shaped plate is arranged at the bottom of one side of the annular surface of the cylindrical table;
the suction and fixation structure comprises a plurality of suction and fixation grooves which are regularly arranged on the bottom surface of a circular groove of the circular groove, a silica gel ring sheet is bonded on the edge of the notch of each suction and fixation groove, the suction and fixation grooves are communicated and arranged on the same built-in suction mechanism, a plurality of water spray heads are annularly and equidistantly arranged on the top of the annular wall of the inner annular wall of the circular groove, and the water spray heads are mutually communicated through the same annular pipe;
the grinding structure comprises a grinding belt, two ends of the grinding belt respectively roll to pass through corresponding roller rods and are connected with a winding rod on the same side, the winding rods are rotatably installed between the inner walls of two sides of a U-shaped box, a round opening is formed in the middle position of the surface of the bottom of the U-shaped box, an air cylinder is installed in the middle position of the surface of the top of the U-shaped box, a push rod end of the air cylinder is installed in the middle position of a round pressing plate, and the round pressing plate is attached to and pressed on the corresponding position of the back of the grinding belt.
Preferably, hydraulic push rod is installed to the top plate body of U template, and hydraulic push rod's push rod end installs at U type piece top intermediate position, U type piece both ends are installed on same hanger plate, and hanger plate top intermediate position installs the second motor.
Preferably, the U-shaped box is arranged at the bottom of the bearing plate, and the middle position of the top of the bearing plate is arranged at one end of a shaft lever of the second motor.
Preferably, the rotating shaft ends at the two ends of the winding rod are respectively installed at the corresponding connection positions of the shaft rod end of the first motor and the clutch, and the first motor and the clutch are respectively installed on two side walls of the same side end of the U-shaped box.
Preferably, the circular pressure plate is pushed to the outer side of the circular opening outer port through an extended air cylinder.
Preferably, the built-in air suction mechanism is installed in a corresponding placement structure in the cylindrical table and consists of an air pump, a pneumatic controller, a connecting pipe and the like.
The utility model has the advantages that:
1. the semiconductor wafer grinding device is reasonable in design, can enable the corresponding grinding area surface of the grinding belt to be located at the round opening and tightened, and can be pushed and extended out of the round opening through the round pressing plate arranged at the push rod end of the cylinder in the stretching state, the function of replacing grinding surface structures with different roughness degrees is achieved, the grinding surface structures can be flexibly replaced, and time for replacing grinding structures with different specifications is saved.
2. This kind of semiconductor wafer grinder reasonable in design can adopt and to place the contact surface and bleed the mode that forms strong adsorption affinity and fix waiting to grind the semiconductor wafer, and corresponding liquid is spouted through the sprinkler bead of being connected with external water pump simultaneously, can wash the grinding powder and through the lubricated grinding zone of liquid.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a top view of the top structure of the cylindrical table of the present invention;
fig. 3 is a schematic diagram of the internal structure of the U-shaped box of the present invention.
In the figure: 1. the cylinder platform, 2, abrasive band, 3, first motor, 4, U type case, 5, loading board, 6, U type piece, 7, hydraulic push rod, 8, second motor, 9, cylinder, 10, U template, 11, circular recess, 12, sprinkler bead, 13, inhale solid groove, 14, silica gel ring piece, 15, winding rod, 16, clutch, 17, roller pole, 18, round mouth, 19, circular pressing board.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-3, a semiconductor wafer polishing apparatus includes a cylindrical table 1, a suction structure and a polishing structure, wherein a circular groove 11 is formed on the top surface of the cylindrical table 1, and one end of a U-shaped plate 10 is mounted at the bottom of one side of the annular surface of the cylindrical table 1;
the suction and fixation structure comprises a plurality of suction and fixation grooves 13, the suction and fixation grooves 13 are regularly arranged on the bottom surface of the circular groove 11, a silica gel ring sheet 14 is bonded on the edge of the notch of the suction and fixation groove 13, the suction and fixation grooves 13 are communicated and installed on the same built-in suction mechanism, a plurality of water spraying heads 12 are annularly and equidistantly installed on the top of the annular wall of the inner annular wall of the circular groove 11, and the water spraying heads 12 are mutually communicated through the same annular pipe;
grind structure includes abrasive band 2, 2 both ends in abrasive band roll respectively and pass corresponding roller bar 17 and be connected with the rolling rod 15 with one side, and two rolling rod 15 rotates and installs between the incasement wall of both sides in U type case 4, round mouth 18 has been seted up to U type case 4 bottom surface intermediate position, and U type case 4 top surface intermediate position installs cylinder 9, the push rod end of cylinder 9 is installed at 19 intermediate positions of circular pressing board, and circular pressing board 19 pastes and presses on 2 back relevant positions in abrasive band.
A hydraulic push rod 7 is installed on a plate body at the top of the U-shaped plate 10, the push rod end of the hydraulic push rod 7 is installed in the middle of the top of the U-shaped block 6, two ends of the U-shaped block 6 are installed on the same hanging plate, a second motor 8 is installed in the middle of the top of the hanging plate, and the connected grinding structure surface can be close to or far away from the surface of the fixed semiconductor wafer through the started hydraulic push rod 7; the U-shaped box 4 is arranged at the bottom of the bearing plate 5, and the middle position of the top of the bearing plate 5 is arranged at one end of a shaft lever of the second motor 8, so that the mutual connection effect among the structures is achieved; the rotating shaft ends at the two ends of the winding rod 15 are respectively arranged at the corresponding connection positions of the shaft rod end of the first motor 3 and the clutch 16, the first motor 3 and the clutch 16 are respectively arranged on the two side walls at the same side end of the U-shaped box 4, and the winding rod 15 can be controlled to rotate and be statically fixed through the first motor 3 and the clutch 16; the circular pressing plate 19 is pushed to the outer side of the outer port of the circular port 18 through the extending air cylinder 9, so that the part of the grinding belt 2 attached together through the extending circular pressing plate 19 extends out of the outer portion of the circular port; the built-in air suction mechanism is arranged in a corresponding placing structure in the cylindrical table 1, is composed of an air pump, a pneumatic controller, a connecting pipe and the like, and can suck air from the inside of the suction groove 13.
When the utility model is used, the front surface of the grinding belt 2 is four grinding area surfaces with different roughness degrees, and the grinding belt 2 is partially wound on one winding rod 15, so that two first motors 3 are coordinately started to drive the two corresponding winding rods 15 to rotate in the same direction and then rotate in the opposite direction, the corresponding grinding area surfaces of the grinding belt 2 can be positioned at the round opening 18 and tightened, and are pushed and pressed by the round pressing plate 19 arranged at the push rod end of the cylinder 9 in the stretching state to stretch out of the round opening 18, the function of changing the grinding surface structures with different roughness degrees is realized, the replacement can be flexibly realized, and the time for replacing the grinding structures with different specifications is saved;
the semiconductor wafer to be ground is placed on the bottom circular surface of the circular groove 11 formed by the suction grooves 13 distributed according to specifications, the space formed by the suction grooves 13 and the surface of the semiconductor wafer is pumped by the built-in suction mechanism, and the adsorption force on the semiconductor wafer is generated, so that the semiconductor wafer to be ground can be fixed by adopting a mode of pumping air on a contact surface to form strong adsorption force, and meanwhile, corresponding liquid is sprayed out through the water spray head 12 connected with an external water pump, so that grinding powder can be washed away and the grinding area can be lubricated by the liquid.
It is well within the skill of those in the art to implement and protect the present invention without undue experimentation and without undue experimentation that the present invention is directed to software and process improvements.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. A semiconductor wafer polishing apparatus, comprising: the grinding device comprises a cylindrical table (1), a suction structure and a grinding structure, wherein a round groove (11) is formed in the top surface of the cylindrical table (1), and one end of a U-shaped plate (10) is arranged at the bottom of one side of the annular surface of the cylindrical table (1);
the suction and fixation structure comprises a plurality of suction and fixation grooves (13), the suction and fixation grooves (13) are regularly arranged on the bottom surface of a circular groove (11), a silica gel ring sheet (14) is bonded on the edge of the notch of the suction and fixation groove (13), the suction and fixation grooves (13) are communicated and installed on the same built-in suction mechanism, a plurality of water spray heads (12) are installed on the top of the annular wall of the circular groove (11) at equal intervals in an annular shape, and the water spray heads (12) are communicated with each other through the same annular pipe;
grind structure includes abrasive band (2), abrasive band (2) both ends roll respectively and pass corresponding roller pole (17) and be connected with rolling rod (15) with one side, and two rolling rod (15) are rotated and are installed between the both sides incasement wall in U type case (4), round mouth (18) have been seted up to U type case (4) bottom surface intermediate position, and U type case (4) top surface intermediate position installs cylinder (9), the push rod end of cylinder (9) is installed in dome sheet (19) intermediate position, and dome sheet (19) paste and press on abrasive band (2) back relevant position.
2. The apparatus as claimed in claim 1, wherein: hydraulic push rod (7) are installed to the top plate body of U template (10), and the push rod end of hydraulic push rod (7) installs at U type piece (6) top intermediate position, install on same hanger plate at U type piece (6) both ends, and hanger plate top intermediate position installs second motor (8).
3. The apparatus as claimed in claim 1, wherein: the U-shaped box (4) is arranged at the bottom of the bearing plate (5), and the middle position of the top of the bearing plate (5) is arranged at one end of a shaft rod of the second motor (8).
4. The apparatus as claimed in claim 1, wherein: and the rotating shaft ends at the two ends of the winding rod (15) are respectively arranged at the corresponding connection part of the shaft rod end of the first motor (3) and the clutch (16), and the first motor (3) and the clutch (16) are respectively arranged on the two side walls of the same side end of the U-shaped box (4).
5. The apparatus as claimed in claim 1, wherein: the circular pressure plate (19) is pushed to the outer side of the outer port of the circular port (18) through the extended air cylinder (9).
6. The apparatus as claimed in claim 1, wherein: the built-in air suction mechanism is arranged in a corresponding placing structure in the cylindrical table (1) and consists of an air pump, a pneumatic controller, a connecting pipe and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922249628.6U CN211465859U (en) | 2019-12-16 | 2019-12-16 | Semiconductor wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922249628.6U CN211465859U (en) | 2019-12-16 | 2019-12-16 | Semiconductor wafer grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211465859U true CN211465859U (en) | 2020-09-11 |
Family
ID=72357914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922249628.6U Active CN211465859U (en) | 2019-12-16 | 2019-12-16 | Semiconductor wafer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211465859U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113182971A (en) * | 2021-05-12 | 2021-07-30 | 四川雅吉芯电子科技有限公司 | High-precision edge grinding device for monocrystalline silicon epitaxial wafer |
-
2019
- 2019-12-16 CN CN201922249628.6U patent/CN211465859U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113182971A (en) * | 2021-05-12 | 2021-07-30 | 四川雅吉芯电子科技有限公司 | High-precision edge grinding device for monocrystalline silicon epitaxial wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211465859U (en) | Semiconductor wafer grinding device | |
| CN110026857B (en) | A multi-angle grinding device for calculating key dish metal keyboard shell | |
| CN207736404U (en) | A kind of textile cloth perforating device | |
| KR20140071926A (en) | Wafer polishing apparatus | |
| CN114346794A (en) | Polishing device and polishing robot | |
| CN206981303U (en) | A kind of device of the automatic cleaning of electrodeless bulb and spray aluminum oxide and fluorescent material | |
| CN102103987A (en) | Film adhering method and device of wafer | |
| CN218463290U (en) | A high-efficient stoving mechanism for printing machine | |
| CN110640623A (en) | Splash guard and chemical mechanical polishing machine | |
| CN208584424U (en) | A kind of mill | |
| CN113829181A (en) | Polishing device for precision metal parts | |
| CN213470616U (en) | Grinding device is used in high strength glass preparation | |
| CN211639302U (en) | Button edge grinding device | |
| CN211388265U (en) | Portable self-adaptation pipe diameter inner chamber burnishing device of metal seamless pipe | |
| CN210550233U (en) | High-efficient grinding device that washs of bearing inner race | |
| CN208826327U (en) | A kind of discharging mechanism of butterfly double face abrading machine | |
| CN211163394U (en) | L OW-E hollow glass's membrane device that removes | |
| CN112621413A (en) | High-efficient novel environment-friendly internal grinding machine | |
| CN215942473U (en) | Etching magnesium board surface treatment device | |
| CN209741000U (en) | High-efficient glass bottle frosting machine | |
| CN220244779U (en) | Transfer device is used in production of absorption formula porcelain aluminum plate | |
| KR101748428B1 (en) | Glass polisher | |
| CN213439032U (en) | Polishing mechanism suitable for furniture design uses | |
| CN211940282U (en) | Template suction manipulator with polishing function | |
| CN217706620U (en) | Powder ton bag quantitative packaging machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |