CN211457520U - Thick copper flexible line way board of fretwork - Google Patents
Thick copper flexible line way board of fretwork Download PDFInfo
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- CN211457520U CN211457520U CN202020322290.2U CN202020322290U CN211457520U CN 211457520 U CN211457520 U CN 211457520U CN 202020322290 U CN202020322290 U CN 202020322290U CN 211457520 U CN211457520 U CN 211457520U
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- copper
- thick copper
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- film
- circuit area
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Abstract
The utility model discloses a hollowed-out thick copper flexible circuit board, which comprises a circuit area and a hollowed-out area, wherein the circuit area comprises a thick copper circuit area and a thin copper circuit area; the thick copper circuit area and the regional connection terminal surface of thin copper circuit form copper layer ladder position, and copper layer ladder position upside is provided with first packing glue film, and first packing glue film parcel copper layer ladder position and one end extend to thick copper circuit area on, the utility model provides a thick copper flexible circuit board of fretwork, the utility model discloses a paste packing glue film to thick copper area to paste packing glue film to the cover film, and laminate the cover film again, and the structure and the preparation method of pressfitting the cover film, because thick copper area and cover film all have packing glue film, under the pressfitting condition of high temperature, high pressure, the glue film has played the effect of filling and gluing cover film and copper layer, therefore, the cover film can not be empty, fold after laminating; the problems of cavities, folds and the like generated by directly sticking the covering film can be effectively avoided, and the product quality is effectively improved.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a thick copper flexible line way board of fretwork.
Background
The copper layer with the thickness more than or equal to 2OZ (70 microns) is generally regarded as a thick copper circuit board. On special electronic devices such as certain large-current high-heat-dissipation connectors and the like, thick copper circuit boards are needed, particularly, the positions of golden finger plugs of the circuit boards are needed, and the requirement on the thickness of copper is high; however, for the flexible circuit board with the design of the step circuit, which has the advantages that the copper thickness of the golden finger plug is thick, and the copper thickness of the circuit position is thin, the common cover film structure is difficult to meet the glue filling requirement of the step position, so that when the cover film is pasted, the problems of cavities, folds and the like are easily generated at the step position, the product quality is influenced, and the use hidden danger is caused.
Based on the above problems, a hollow thick copper flexible circuit board needs to be designed, and the problems of a flexible circuit board with a step circuit, such as glue filling holes and wrinkles at the step position, are solved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thick copper flexible line way board of fretwork to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a hollowed-out thick copper flexible circuit board comprises a circuit area and a hollowed-out area, wherein the circuit area comprises a thick copper circuit area and a thin copper circuit area; a copper layer step position is formed on the connecting end face of the thick copper circuit region and the thin copper circuit region, a first filling adhesive layer is arranged on the upper side of the copper layer step position, wraps the copper layer step position, one end of the first filling adhesive layer extends to the thick copper circuit region, and the other end of the first filling adhesive layer extends to the thin copper circuit region; the first filling adhesive layer is provided with a front covering film layer.
As a further aspect of the present invention: and a second filling adhesive layer is arranged between the filling adhesive layer and the circuit entity area of the thick copper circuit area.
As a further aspect of the present invention: the hollow-out area and the circuit area are arranged at intervals.
As a further aspect of the present invention: and a reverse side covering film layer is arranged on the other side of the circuit area corresponding to the copper layer step position.
Compared with the prior art, the utility model discloses the beneficial effect of following several aspects has:
the utility model provides a thick copper flexible line way board of fretwork, the utility model discloses a paste the packing glue film to thick copper region to paste the packing glue film to the cover film, laminate the cover film again, and the structure and the preparation method of recompression cover film, because thick copper region and cover film all have the packing glue film, under high temperature, highly compressed pressfitting condition, the glue film has played the effect of filling and gluing cover film and copper layer, consequently, the cover film can not cavity, fold after laminating; the problems of cavities, folds and the like generated by directly sticking the covering film can be effectively avoided, and the product quality is effectively improved.
Drawings
Fig. 1 is a schematic structural diagram of a hollow thick copper flexible circuit board.
Fig. 2 is a cross-sectional view of a hollowed-out thick copper flexible circuit board.
In the figure: 1. a line area; 2. a hollowed-out area; 3. a thick copper line region; 4. copper layer step positions; 5. a thin copper line region; 6. the front side is covered with a film layer; 7. a first adhesive filling layer; 8. a second adhesive filling layer; 9. the reverse side is covered with a film layer.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Referring to fig. 1-2, a hollowed-out thick copper flexible circuit board includes a circuit area 1 and a hollowed-out area 2, where the circuit area 1 includes a thick copper circuit area 3 and a thin copper circuit area 5; the copper layer step 4 is formed on the connecting end face of the thick copper circuit region 3 and the thin copper circuit region 5, a first filling adhesive layer 7 is arranged on the upper side of the copper layer step 4, the first filling adhesive layer 7 wraps the copper layer step 4, one end of the first filling adhesive layer extends to the thick copper circuit region 3, the other end of the first filling adhesive layer extends to the thin copper circuit region 5, and a front covering film layer 6 is arranged on the first filling adhesive layer 7; a second filling adhesive layer 8 is arranged between the filling adhesive layer and the circuit entity area of the thick copper circuit area 3; the hollow area 2 and the line area 1 are arranged at intervals; and a reverse covering film layer 9 is arranged on the other side of the circuit area 1 corresponding to the copper layer step position 4.
The utility model discloses a theory of operation is: the utility model provides a thick copper flexible line way board of fretwork, the utility model discloses a paste the packing glue film to thick copper region to paste the packing glue film to the cover film, laminate the cover film again, and the structure and the preparation method of recompression cover film, because thick copper region and cover film all have the packing glue film, under high temperature, highly compressed pressfitting condition, the glue film has played the effect of filling and gluing cover film and copper layer, consequently, the cover film can not cavity, fold after laminating; the problems of cavities, folds and the like generated by directly sticking the covering film can be effectively avoided, and the product quality is effectively improved.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (4)
1. A hollowed-out thick copper flexible circuit board comprises a circuit area (1) and a hollowed-out area (2), and is characterized in that the circuit area (1) comprises a thick copper circuit area (3) and a thin copper circuit area (5); thick copper line region (3) and thin copper line region (5) connection terminal surface form copper layer ladder position (4), and copper layer ladder position (4) upside is provided with first filling glue film (7), and on first filling glue film (7) parcel copper layer ladder position (4) and one end extended to thick copper line region (3), the other end extended to on thin copper line region (5), be provided with on first filling glue film (7) and openly cover rete (6).
2. The hollowed-out thick copper flexible circuit board according to claim 1, wherein a second filling adhesive layer (8) is arranged between the filling adhesive layer and the circuit entity area of the thick copper circuit area (3).
3. The hollowed thick copper flexible circuit board according to claim 1 or 2, wherein the hollowed area (2) is spaced from the circuit area (1).
4. The hollowed-out thick copper flexible circuit board according to claim 3, wherein a reverse cover film layer (9) is arranged on the other side of the circuit region (1) corresponding to the copper layer step (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020322290.2U CN211457520U (en) | 2020-03-16 | 2020-03-16 | Thick copper flexible line way board of fretwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020322290.2U CN211457520U (en) | 2020-03-16 | 2020-03-16 | Thick copper flexible line way board of fretwork |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211457520U true CN211457520U (en) | 2020-09-08 |
Family
ID=72317127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020322290.2U Active CN211457520U (en) | 2020-03-16 | 2020-03-16 | Thick copper flexible line way board of fretwork |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211457520U (en) |
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2020
- 2020-03-16 CN CN202020322290.2U patent/CN211457520U/en active Active
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