CN211452025U

CN211452025U - Laminated through heat conducting tube type radiating fin structure

Info

Publication number: CN211452025U
Application number: CN201922266419.2U
Authority: CN
Inventors: 陈传生
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-09-08
Anticipated expiration: 2029-12-17

Abstract

A laminated through heat conducting tube type heat radiating fin structure is a rectangular plate, the narrow two side plate edges are respectively bent to the plate back to form side walls, a plurality of tube penetrating holes for the heat conducting tubes to penetrate and be embedded are arranged on the plate surface, a plurality of ventilation through holes are arranged on the plate surface in a staggered mode, the corresponding sections of the heat conducting tubes are vertically abutted to the stack one by one to help the heat conducting tubes to discharge residual heat absorbed from a temperature difference generating element to the surrounding environment, particularly, the hole edges at the other ends of the ventilation through holes, which are led in airflow towards the plate edges, extend to the plate back to form thin lip walls, the bending depth of the thin lip walls is not half as high as that of the side walls, the airflow led in the plate edges is not obviously blocked, the thin lip walls press the airflow flowing into the stacked heat radiating fins in a layered mode to the lower layer, the airflow surface is increased, the convection heat absorption rate is enhanced, and the residual heat discharging effect is improved.

Description

Laminated through heat conducting tube type radiating fin structure

Technical Field

The utility model relates to a new structure of laminated heat conduction pipe type radiating fin, in particular to a special shape structure which is provided with a ventilation hole by a plate surface, and can increase the air flow to be tightly attached to the plate surface to enhance the convection heat absorption rate, thereby achieving the novel radiating fin structure technology of improving the residual heat dissipation effect.

Background

The heat sink plays an important role in the industry for solving the problems of working temperature control, cold storage or hot cooking temperature in people's life and air conditioning in riding or living, and the use of the heat sink enables residual temperature generated by thermoelectric cooling chips, heating pipes of ovens or thermal engine isothermal difference generating elements to be discharged to the ambient air environment in a mode of increasing heat exchange speed so as to keep the required working temperature and prevent overheating or supercooling fault in the working of the temperature difference generating elements and reduce the service life of the elements, so that the heat sink is named as a heat sink, which only shows the resistance of emitting high temperature and high heat, but in fact, the heat exchange work can be carried out under the condition of opposite temperature difference, so the heat sink can also transmit the residual temperature generated by the temperature difference generating elements to be lower temperature of cooler temperature to help cool the ambient air as air conditioning, therefore, the fact that the heat dissipation can be converted into the cold dissipation is not eliminated at the same time of the so-called heat dissipation, and with the increasing pursuit of the society for controlling the ambient temperature rate, the intensity and the temperature and source control efficiency, the industry has no serious research and development on the heat transfer capability of producing a new generation of radiating fins.

The heat sink has a plurality of through holes for the heat pipe to pass through and be embedded, and a plurality of ventilation holes are arranged on the plate surface in a staggered way at the through hole positions, and the plurality of through holes are used for clamping the corresponding sections of the heat pipe one by one to vertically lean against the stack to help the heat pipe to discharge the residual heat absorbed from the temperature difference generating element to the surrounding air environment.

SUMMERY OF THE UTILITY MODEL

In view of the thermal efficiency of the existing heat pipe type heat sink, the utility model provides a new laminated heat pipe type heat sink structure, which can improve the residual heat dissipation efficiency compared with the prior art.

The technical scheme of the utility model is that:

a laminated through heat-conducting tube type radiating fin structure is a rectangular plate body, the narrow two side plate edges of the plate body are respectively bent to the plate back to form a side wall, a plurality of through hole holes for the heat-conducting tubes to penetrate through and be embedded are arranged on the plate surface, a plurality of ventilation through holes are arranged on the plate surface in a staggered mode, corresponding sections of the heat-conducting tubes are penetrated one by one and vertically attached to the stack to help the heat-conducting tubes to discharge residual heat absorbed from a temperature difference generating element to the ambient air environment, the ventilation through holes introduce the hole edges at the other end of airflow towards the plate edges, the hole edges extend to the plate back to form a thin lip wall in a protruding and bending mode, and the bending depth of the thin lip wall is not as high as half of the height of the side wall.

Furthermore, the rectangular plate body is vertically attached to and stacked by a plurality of corresponding sections of the heat conduction pipes which are penetrated one by one and divided into a front heat dissipation stacking block and a rear heat dissipation stacking block.

Furthermore, the space between the front heat dissipation stacking block and the rear heat dissipation stacking block can contain and clamp the electronic circuit fan.

Furthermore, the space between the front heat dissipation stack block and the rear heat dissipation stack block can contain, clamp and fix the electronic circuit fan, the space of the electronic circuit fan which can be contained and stacked is arranged at the other end of the front heat dissipation stack block close to the rear heat dissipation stack block, and the space of the electronic circuit fan which can be contained and stacked is arranged at the other end of the rear heat dissipation stack block close to the front heat dissipation stack block.

Further, the temperature difference generating element is a thermoelectric cooling chip.

Further, the temperature difference generating element is a computer central microprocessor.

Further, the temperature difference generating element is an air inlet end of the heat dissipation fan.

Adopt above-mentioned technical scheme the utility model discloses can bring following beneficial effect:

Drawings

FIG. 1 is a front view of the new structure of the laminated heat conducting tube type heat sink of the present invention viewed from the top of the heat sink;

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1;

FIG. 3 is a cross-sectional view taken along the line III-III of FIG. 1;

FIG. 4 is a cross-sectional view taken along section line IV-IV of FIG. 1;

FIG. 5 is a perspective view of the new structure of the laminated heat pipe type heat sink of the present invention;

FIG. 6 is a plan view of the stack structure of the laminated heat pipe type heat sink of the present invention;

FIG. 7 is an airflow diagram of the stack structure of the stacked heat pipe fins of the present invention;

FIG. 8 is an enlarged view of a portion of FIG. 7 indicated by circle A;

FIG. 9 is a first perspective view of a stack structure of the laminated heat pipe type heat sink of the present invention;

FIG. 10 is a second perspective view of the new structure of the stacked heat pipe type heat sink according to the present invention;

FIG. 11 is a third perspective view of the new structure of the stacked heat pipe type heat sink according to the present invention;

fig. 12 is a fourth perspective view of the new structure of the stacked heat pipe type heat sink according to the present invention.

In the figure, 1,1A, 1B-rectangular sheet plate body, 2, 3-side wall, 4A,4B, 4C-perforated hole, 50,51, 52-ventilation perforated hole, 50A,50B, 50C-thin lip wall, 6-heat conduction pipe, 7A, 7B-temperature difference generating element, 8-heat dissipation water tank, 10-front heat dissipation stack block, 11-rear heat dissipation stack block, 20, 21-air flow channel, 30,31, 32-electronic circuit fan, 40, 41-hook clamp and 40, 41-hook clamp.

Detailed Description

Please refer to the front view shown in fig. 1, the sectional views shown in fig. 2, fig. 3, and fig. 4, and the perspective view shown in fig. 5, the novel structure of the laminated heat conducting tube type heat sink is a rectangular plate body 1, wherein the two narrow side plate edges of the plate body are respectively bent perpendicularly to the plate back to form the

side walls

2 and 3, and a plurality of through

holes

4A,4B, and 4C for the heat conducting tubes to penetrate and be embedded are arranged on the plate surface, the rear view of the heat conducting tubes is shown, a plurality of through

holes

50,51, and 52 are arranged on the plate surface in a staggered manner of staggering the through

holes

4A,4B, and 4C, and the through

holes

50,51, and 52 introduce the hole edges of the other end of the airflow toward the plate edge, and extend and are bent convexly to form the

thin lip walls

50A,50B, and 50C, and the vertical bending depth of the

thin lip walls

50A,50B, and 50C is not as high as half of the

side walls

2 and 3.

In the combination and utilization, as shown in fig. 6, a plurality of

rectangular plate bodies

1,1A,1B penetrate through the corresponding sections of the heat conducting pipe 6 one by one, are vertically and closely stacked and divided into a front heat dissipation stacking block 10 and a rear heat dissipation stacking block 11 to help the heat conducting pipe 6 to discharge the residual heat absorbed from the temperature

difference generating elements

7A,7B to the ambient air environment, the two ends of the penetrating temperature guide pipe 6 are separately connected with a pipe pump to flow to the corresponding water inlet end or the water outlet end of the heat dissipation water tank 8, so that the temperature guide pipe 6 is always filled with water to form a water circulation loop of heat absorption liquid, and the temperature of the heat conducting pipe 6 is transmitted outside the pipe wall of the winding pipe section between the temperature

difference generating elements

7A and 7B and the heat radiation water tank 8, and large-area air contact heat radiation is carried out between the front heat radiation stacking block 10 and the rear heat radiation stacking block 11 and the surrounding air environment, the temperature

difference generating elements

7A and 7B can be heat sources such as thermoelectric cooling chips or computer Central Processing Units (CPU) or air inlet ends of heat dissipation fans.

Thus, as shown in the enlarged partial views of fig. 7 and 8, the front heat dissipation stack block 10 and the rear heat dissipation stack block 11 are overlapped with each layer of

air flow channel

20,21 between the

rectangular plate bodies

1,1A, because at least one temperature

difference generating element

7A,7B can control to generate micro temperature difference, the temperature of the rear temperature difference generating element 7B is slightly higher than that of the front temperature difference generating element 7A, so that the hot air mass can naturally rise and disperse, and the natural principle of the cold air mass flowing to the hot air mass can be applied to generate the induced air flow from the front edge of the

rectangular plate bodies

1,1A to the plate backward direction, and in the induced air flow, although slightly obstructed by the

thin lip walls

50A,50B,50C, the air flow is not obviously obstructed, and a plurality of the overlapped thin lip walls 50A are convexly bent, 50B and 50C, the air flows which flow into the front heat dissipation stacking block 10 and the rear heat dissipation stacking block 11 in a layered mode are pressed and attached to the lower layer, the air flow is attached to the plate surface in a tight mode, the convection heat absorption rate is enhanced, and the residual heat emission effect is improved.

In the overall implementation, as shown in the stack structure implementation perspective view of fig. 9, the heat dissipation function between the front heat dissipation stack block 10 and the rear heat dissipation stack block 11 can be achieved by a natural temperature difference air intake method without adding air blowing force, and certainly, the use can also not exclude air draft power, as shown in fig. 10, a single electronic circuit fan 30 is used to be clamped and fixed in the space between the front heat dissipation stack block 10 and the rear heat dissipation stack block 11 to enhance the heat dissipation flow rate, or as shown in fig. 11, an electronic circuit fan 31 is arranged in the space between the front heat dissipation stack block 10 and the rear heat dissipation stack block 11, except for the electronic circuit fan 30 clamped and fixed in the space between the front heat dissipation stack block 10 and the rear heat dissipation stack block 11, an electronic circuit fan 32 is arranged in another end space near the rear heat dissipation stack block 11 in the front heat dissipation stack block 10, an appropriate hook 40 is arranged in a stack manner, and another end space near the front heat dissipation stack block 10 in the rear heat dissipation stack block 11 is arranged in a stack in the appropriate hook 41, creating more multi-stage effect of enhancing the heat dissipation flow velocity.

The utility model discloses also can be as shown in fig. 12 implementation, wear to press from both sides the heat dissipation pile piece 11 and the preceding heat dissipation pile piece 10 of back heat dissipation pile piece 6 also can be for several two pipe ends seal slightly be the crooked heat dissipation pipe 6A of the style of calligraphy of falling U, 6B,6C,6D, heat dissipation pile piece 11 and the one end middle section pipe shaft of preceding heat dissipation pile piece 10 after the protrusion is parallel to each other and is laid, and inlay jointly and establish heat dissipation piece 50, can be by heat dissipation piece 50 outer ends level and smooth connection face overlap joint difference in temperature generating element 7A, from this also can reach earlier the efficiency.

Claims

1. The utility model provides a new structure of heat conduction tubular fin is worn to stromatolite which characterized in that: the plate body is a rectangular plate body, the narrow two side plate edges of the plate body are respectively bent out of side walls towards the plate back, a plurality of through pipe holes for the heat conduction pipes to penetrate and be embedded are arranged on the plate surface, a plurality of ventilation through holes are arranged on the plate surface in a staggered mode, corresponding sections of the heat conduction pipes are clamped by the through pipe holes one by one in a penetrating mode and are vertically attached to and stacked, the heat conduction pipes are helped to discharge residual heat absorbed from the temperature difference generation element to the ambient air environment, the ventilation through holes lead in the hole edges at the other end of air flow towards the plate edges, thin lip walls are particularly extended and bent out of the plate back in a protruding mode, and the bending depth of the thin lip walls is not half of the height of the side walls.

2. The new structure of laminated heat conducting tube type heat sink in accordance with claim 1, wherein: the rectangular plate body is vertically attached to and stacked by a plurality of corresponding sections of the heat conducting tubes which are penetrated one by one and divided into a front heat dissipation stacking block and a rear heat dissipation stacking block.

3. The new structure of laminated through-temperature conduction tube type heat sink as claimed in claim 2, wherein: the space between the front heat dissipation stacking block and the rear heat dissipation stacking block can contain and clamp the fan for fixing the electronic circuit.

4. The new structure of laminated through-temperature conduction tube type heat sink as claimed in claim 2, wherein: the space between the front heat dissipation stack block and the rear heat dissipation stack block can contain and clamp the electronic circuit fan, the front heat dissipation stack block is close to the other end of the rear heat dissipation stack block and is provided with a space capable of containing and stacking the electronic circuit fan, and the rear heat dissipation stack block is close to the other end of the front heat dissipation stack block and is provided with a space capable of containing and stacking the electronic circuit fan.

5. The new structure of laminated heat conducting tube type heat sink in accordance with claim 1, wherein: the temperature difference generating element is a thermoelectric cooling chip.

6. The new structure of laminated heat conducting tube type heat sink in accordance with claim 1, wherein: the temperature difference generating element is a computer central microprocessor.

7. The new structure of laminated heat conducting tube type heat sink in accordance with claim 1, wherein: the temperature difference generating element is an air inlet end of the heat dissipation fan.