CN211414058U - Wafer marking and positioning tool - Google Patents
Wafer marking and positioning tool Download PDFInfo
- Publication number
- CN211414058U CN211414058U CN201921927621.9U CN201921927621U CN211414058U CN 211414058 U CN211414058 U CN 211414058U CN 201921927621 U CN201921927621 U CN 201921927621U CN 211414058 U CN211414058 U CN 211414058U
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- wafer
- thick bamboo
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- workstation
- loading
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- 235000017166 Bambusa arundinacea Nutrition 0.000 claims abstract description 16
- 235000017491 Bambusa tulda Nutrition 0.000 claims abstract description 16
- 241001330002 Bambuseae Species 0.000 claims abstract description 16
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims abstract description 16
- 239000011425 bamboo Substances 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 230000005389 magnetism Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 49
- 238000010330 laser marking Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a mark location frock is beaten to wafer, include the workstation and be located the marking machine on the workstation, its characterized in that: the workstation is located the marking machine below and slides along workstation width direction and is provided with the base, be provided with a wafer section of thick bamboo along vertical direction on the base, the open area top-down of a wafer section of thick bamboo reduces gradually, the loading and unloading groove has been seted up to the length direction of the outer periphery wall wafer section of thick bamboo of a wafer section of thick bamboo, the area of loading and unloading groove is 1/5 ~ 1/3 of wafer section of thick bamboo outer peripheral area, and its technical scheme main points are, through putting into a wafer section of thick bamboo with the wafer level, the automatic whereabouts of wafer is fixed a position, has ensured the center and the coincidence of wafer center of wafer, has guaranteed the quick centering of equidimension wafer not, through the adjustable wafer front and back position of back-and-forth movement base, the loading and unloading.
Description
Technical Field
The utility model relates to a wafer processing technology field, more specifically say, it relates to a mark location frock is beaten to wafer.
Background
After the wafer is processed, the wafer needs to be marked before packaging and leaving the factory. At present, the marking mode of the wafer mainly adopts laser marking. The laser marking technology is a marking method which is characterized in that a high-energy-density laser beam is controlled by a computer to locally irradiate a product, so that the surface of the product is instantly melted or vaporized, and a permanent mark is left. The laser marking has the advantages of wide marking content, high efficiency, clear and clean marking and the like.
The prior art mainly adopts the mode of artifical pendulum piece, places the wafer at the corresponding position manual of laser marking machine, pastes through the scale and leans on the location, makes the front end of wafer be located under the laser marking machine, then marks. The mode can not ensure the precision of wafer positioning, and particularly, when the wafers with different sizes need to be positioned, the scale needs to be moved repeatedly to center the wafers, so that the marking efficiency is low.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a mark location frock is beaten to wafer, it has the advantage of fixing a position accurately, convenient operation.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a mark location frock is beaten to wafer, includes the workstation and is located the marking machine on the workstation, its characterized in that: the workstation is located the marking machine below and slides along workstation width direction and is provided with the base, be provided with a wafer section of thick bamboo along vertical direction on the base, the open area top-down of a wafer section of thick bamboo reduces gradually, the loading and unloading groove has been seted up to the length direction of the outer periphery wall wafer section of thick bamboo of a wafer section of thick bamboo, the area of loading and unloading groove is 1/5 ~ 1/3 of wafer section of thick bamboo outer peripheral area.
Preferably, a scale is arranged on the workbench along the width direction of the workbench, and a marking needle perpendicular to the scale is arranged on the side face of the base.
Preferably, the base is provided with a guide rod which is coaxial with the wafer cylinder in a sliding manner along the up-down direction, the upper end of the guide rod is provided with a horizontal support plate in a sliding manner coaxially, the base is provided with a guide sleeve for the guide rod to pass through, and a magnetic ring which is attracted to the guide rod through magnetism is coaxially arranged in the guide sleeve.
Preferably, the outer peripheral surface of the support plate is provided with a deflector rod penetrating out of the loading and unloading groove.
Preferably, the upper surface of the support plate is provided with a gasket for supporting the wafer.
Preferably, the width of the loading and unloading groove is gradually reduced from top to bottom.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the wafer is horizontally placed in the wafer barrel, the wafer automatically falls and is positioned, the center of the wafer is enabled to be superposed with the center of the wafer, the wafers with different sizes are enabled to be quickly centered, the front and rear positions of the wafer can be adjusted by moving the base back and forth, the wafer can be conveniently taken and placed by the loading and unloading groove, the wafer is positioned at the corresponding scale of the scale according to the specification of the wafer, and the wafer positioning is efficient and accurate;
2. through setting up the extension board, can provide the support after the wafer location, make the quick whereabouts of follow-up wafer make level, more do benefit to the raise the efficiency, the extension board utilizes the magnetic force location of magnetic ring, through driving lever pulling extension board, the height-adjusting of being convenient for has the gasket on the extension board, and the protection wafer does not receive wearing and tearing.
Drawings
FIG. 1 is a schematic structural diagram of the present embodiment;
fig. 2 is an enlarged view of a portion a in fig. 1.
In the figure: 1. a work table; 11. a scale; 2. marking machine; 3. a base; 31. a wafer cartridge; 311. loading and unloading the groove; 32. marking pins; 33. a guide bar; 331. a support plate; 3311. a deflector rod; 3312. a gasket; 34. a guide sleeve; 341. a magnetic ring.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
A wafer marking positioning tool, refer to fig. 1 and 2, which comprises a workbench 1 and a marking machine 2 positioned on the workbench 1, wherein the workbench 1 is positioned below the marking machine 2, a base 3 is arranged below the workbench 1 in a sliding manner along the width direction of the workbench 1, the base 3 is connected with the workbench 1 through a sliding groove, a wafer cylinder 31 is arranged on the base 3 along the vertical direction, the opening area of the wafer cylinder 31 is gradually reduced from top to bottom, a loading and unloading groove 311 is formed in the length direction of the wafer cylinder 31 on the outer circumferential wall of the wafer cylinder 31, the area of the loading and unloading groove 311 is 1/5-1/3 of the outer circumferential area of the wafer cylinder 31, the width of the loading and unloading groove 311 is gradually reduced from top to bottom, the size of a corresponding wafer is gradually reduced from top to bottom, wafers with different sizes can be conveniently taken and placed, the left and right positions of the wafer can be.
Be provided with scale 11 along its width direction on the workstation 1, the side of base 3 is provided with perpendicular scale 11's mark needle 32, and scale 11 is convenient for fix a position the front and back position of base 3, and scale 11 can be divided according to the size of wafer to only need observe that mark needle 32 corresponds the reading and can fix a position the wafer in required position.
A guide rod 33 which is coaxial with the wafer cylinder 31 is arranged on the base 3 in a sliding manner along the up-down direction, a horizontal support plate 331 is arranged at the upper end of the guide rod 33 in a sliding manner along the axis, a guide sleeve 34 through which the guide rod 33 passes is arranged on the base 3, a magnetic ring 341 which is attracted with the guide rod 33 through magnetism is coaxially arranged in the guide sleeve 34, the guide rod 33 slides up and down along the base 3, the lower end of the guide rod 33 can pass through the base 3 and the workbench 1 for lifting travel, the support plate 331 can provide support after positioning the wafer, so that the subsequent wafer can fall and level quickly, the efficiency is improved, the support plate 331 is positioned by utilizing the magnetic force of the magnetic ring 341, the support plate 331 is pulled by the shift rod 3311, the shift rod 3311 which penetrates out of the loading and unloading groove 311 is arranged on the peripheral surface of the support plate 331, the height is convenient to adjust, a.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications without inventive contribution to the present embodiment as required after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (6)
1. The utility model provides a mark location frock is beaten to wafer, includes the workstation and is located the marking machine on the workstation, its characterized in that: the workstation is located the marking machine below and slides along workstation width direction and is provided with the base, be provided with a wafer section of thick bamboo along vertical direction on the base, the open area top-down of a wafer section of thick bamboo reduces gradually, the loading and unloading groove has been seted up to the length direction of the outer periphery wall wafer section of thick bamboo of a wafer section of thick bamboo, the area of loading and unloading groove is 1/5 ~ 1/3 of wafer section of thick bamboo outer peripheral area.
2. The wafer marking positioning tool according to claim 1, characterized in that: the worktable is provided with a scale along the width direction thereof, and the side surface of the base is provided with a marking needle vertical to the scale.
3. The wafer marking positioning tool according to claim 1, characterized in that: the wafer barrel is characterized in that a guide rod coaxial with the wafer barrel is arranged on the base in a sliding mode in the up-down direction, a horizontal support plate is arranged at the upper end of the guide rod in a sliding mode, a guide sleeve for the guide rod to penetrate through is arranged on the base, and a magnetic ring attracted with the guide rod through magnetism is coaxially arranged in the guide sleeve.
4. The wafer marking positioning tool according to claim 3, characterized in that: and a deflector rod penetrating out of the loading and unloading groove is arranged on the peripheral surface of the support plate.
5. The wafer marking positioning tool according to claim 3, characterized in that: the upper surface of the support plate is provided with a gasket for supporting a wafer.
6. The wafer marking positioning tool according to claim 1, characterized in that: the width of the loading and unloading groove is gradually reduced from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921927621.9U CN211414058U (en) | 2019-11-08 | 2019-11-08 | Wafer marking and positioning tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921927621.9U CN211414058U (en) | 2019-11-08 | 2019-11-08 | Wafer marking and positioning tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211414058U true CN211414058U (en) | 2020-09-04 |
Family
ID=72274452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921927621.9U Active CN211414058U (en) | 2019-11-08 | 2019-11-08 | Wafer marking and positioning tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211414058U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397570A (en) * | 2022-01-24 | 2022-04-26 | 郑州赛奥电子股份有限公司 | Gas relay calibration device |
-
2019
- 2019-11-08 CN CN201921927621.9U patent/CN211414058U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397570A (en) * | 2022-01-24 | 2022-04-26 | 郑州赛奥电子股份有限公司 | Gas relay calibration device |
| CN114397570B (en) * | 2022-01-24 | 2022-10-25 | 郑州赛奥电子股份有限公司 | Gas relay calibration device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231130 Address after: No. 1 Yanyue Bridge North, Meiyan Lianhe Village, Pingwang Town, Wujiang District, Suzhou City, Jiangsu Province, 215221 Patentee after: Yangfan Semiconductor (Jiangsu) Co.,Ltd. Address before: 215000 558 FENHU Road, Wujiang District, Suzhou, Jiangsu Patentee before: SUZHOU EPI PHOTOELECTRIC MATERIAL CO.,LTD. |
|
| TR01 | Transfer of patent right |