CN211406422U - Heat dissipation type PCB circuit board - Google Patents

Heat dissipation type PCB circuit board Download PDF

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Publication number
CN211406422U
CN211406422U CN201921622730.XU CN201921622730U CN211406422U CN 211406422 U CN211406422 U CN 211406422U CN 201921622730 U CN201921622730 U CN 201921622730U CN 211406422 U CN211406422 U CN 211406422U
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China
Prior art keywords
circuit board
aluminum plate
board main
air
heat dissipation
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CN201921622730.XU
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Chinese (zh)
Inventor
叶志军
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Jiangmen Jianghai Kenuo Microelectronic Co ltd
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Jiangmen Jianghai Kenuo Microelectronic Co ltd
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Priority to CN201921622730.XU priority Critical patent/CN211406422U/en
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Abstract

The utility model discloses a heat dissipation type PCB circuit board relates to circuit board heat dissipation technical field. The utility model discloses a circuit board main part and air pipe, a circuit board main part surface mounting has first aluminum plate, a first aluminum plate surface mounting has the air-blower, air pipe week side fixing has a plurality of second aluminum plates. The utility model discloses a heat conduction silica gel bonds circuit board main part and first aluminum plate together, make the heat that the circuit board main part produced can in time transmit first aluminum plate, on air pipe and a plurality of second aluminum plate, thereby carry out the heat dissipation treatment to the circuit board main part, and circuit board main part during operation can be to the air-blower circular telegram, make the air-blower can in time be with the heat suction in the air pipe, thereby to first aluminum plate, air pipe and a plurality of second aluminum plate cool down, make the circuit board main part further by the cooling, thereby make the radiating effect of circuit board main part better, and the radiating efficiency is higher.

Description

Heat dissipation type PCB circuit board
Technical Field
The utility model belongs to the technical field of the circuit board heat dissipation, especially, relate to a heat dissipation type PCB circuit board.
Background
The PCB is an important electronic component, is a support body of the electronic component, is a carrier for electrical connection of the electronic component, and the operation of the equipment is simpler and more convenient due to the use of the PCB, the volume of the equipment is reduced, and the loss of wires is saved.
The existing PCB circuit board is high in operation efficiency in the using process, so that the heat generation amount is large, the PCB circuit board is only subjected to heat dissipation treatment by the heat dissipation fan of the case, the heat dissipation efficiency of the PCB circuit board is low, the heat cannot be timely and effectively transported away from the PCB circuit board, the normal use of the PCB circuit board is affected, and the working efficiency of the PCB circuit board cannot meet the actual production requirement.
Disclosure of Invention
An object of the utility model is to provide a heat dissipation type PCB circuit board, bond circuit board main part and first aluminum plate through heat conduction silica gel, make the heat in the circuit board main part can in time transmit first aluminum plate, on air pipe and a plurality of second aluminum plate, thereby carry out the heat dissipation processing to the circuit board main part, and the air-blower can in time be with the heat suction in the air pipe, thereby to first aluminum plate, air pipe and a plurality of second aluminum plate cool down, make the circuit board main part further dispel the heat, it is comparatively single to have solved current PCB circuit board heat dissipation source, make PCB circuit board radiating efficiency lower, and can not in time effectually lose away from the heat, make the problem that PCB circuit board work efficiency reduces.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a heat dissipation type PCB circuit board, including circuit board main part and air pipe, a surface of circuit board main part is fixed with first aluminum plate, a surface of first aluminum plate is fixed with the air-blower, air pipe week side is fixed with a plurality of second aluminum plates, a plurality of second aluminum plate surface all with a first aluminum plate fixed connection, air pipe week side is opened has a plurality of ventilation slotted holes, a plurality of ventilation slotted holes and a plurality of second aluminum plate clearance distribution;
air pipe one end is fixed with the fixed plate, air-blower air intake one end is fixed with first trachea, the fixed intercommunication of first trachea other end has the inflator, inflator week side is run through and is fixed with a plurality of second trachea, and is a plurality of the second trachea other end all runs through a fixed plate surface and extends to inside the air pipe.
Furthermore, a plurality of heat dissipation slotted holes are formed in one surface of the circuit board main body.
Further, a protective layer is arranged at the joint of the first aluminum plate and the air blower.
Further, the ventilation pipeline is of a rectangular pipe body structure.
The utility model discloses following beneficial effect has:
the utility model bonds the circuit board main body and the first aluminum plate together through the heat-conducting silica gel, so that the heat generated when the circuit board main body works can be timely transmitted to the first aluminum plate, the air conduit and the plurality of second aluminum plates, thereby carrying out heat dissipation treatment on the circuit board main body, and the circuit board main body can be electrified when working, so that the air blower can timely suck out the heat in the air conduit along the plurality of second air pipes, thereby cooling the first aluminum plate, the air conduit and the plurality of second aluminum plates, so that the first aluminum plate, the air conduit and the plurality of second aluminum plates can continuously cool the circuit board main body, the heat dissipation effect of the circuit board main body is better, the heat dissipation efficiency is higher, thereby the circuit board main body can continuously and effectively work, the problem that the heat dissipation source of the existing PCB circuit board is single is solved, and the heat dissipation efficiency, and the heat can not be timely and effectively transported away, so that the working efficiency of the PCB circuit board is reduced.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a heat dissipation type PCB circuit board of the present invention;
FIG. 2 is a front view of the structure of FIG. 1;
FIG. 3 is a schematic view showing the structure of the blower, the inflator, the ventilation duct and the ventilation slot.
In the drawings, the components represented by the respective reference numerals are listed below:
1-circuit board main body, 2-heat dissipation slot hole, 3-first aluminum plate, 4-air blower, 5-first air pipe, 6-air cylinder, 7-second air pipe, 8-ventilation pipe, 9-fixing plate, 10-second aluminum plate and 11-ventilation slot hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 1-3, the utility model relates to a heat dissipation type PCB circuit board, including circuit board main part 1 and air pipe 8, 1 surface of circuit board main part has first aluminum plate 3 through heat conduction silica gel adhesive bonding, one surface of first aluminum plate 3 has air-blower 4 through screw fixation, 8 side welding of air pipe has eighty second aluminum plate 10, eighty second aluminum plate 10 one surface all with 3 one surface of first aluminum plate through welded fixation, 8 side opening of air pipe has seventy-nine ventilation slotted hole 11, seventy-nine ventilation slotted hole 11 and eighty second aluminum plate 10 gap distribution, seventy-nine ventilation slotted hole 11 is used for absorbing the heat between first aluminum plate 3 and air pipe 8 in air pipe 8, and finally be discharged by air-blower 4, thereby cool down the processing to first aluminum plate 3 and air pipe 8;
8 one ends of air pipe are fixed with fixed plate 9, 4 air intake one ends of air-blower are fixed with first trachea 5, the fixed intercommunication of first trachea 5 other end has inflator 6, 6 week side of inflator runs through and is fixed with five second trachea 7, five second trachea 7 other ends all run through fixed plate 9 surfaces and extend to inside air pipe 8, air-blower 4 is through first trachea 5, 6 and the heat suction of second trachea 7 in with air pipe 8 of inflator 6, thereby make first aluminum plate 3, air pipe 8 and second aluminum plate 10 cooling efficiency are higher, make 1 radiating efficiency of circuit board main part faster, thereby make circuit board main part 1 work of normal efficient.
As shown in fig. 1, three heat dissipation slots 2 are formed in one surface of the circuit board main body 1, and the three heat dissipation slots 2 are used for assisting the circuit board main body 1 to dissipate heat into air.
As shown in fig. 1, a protective layer is disposed at a joint of the first aluminum plate 3 and the blower 4, and the protective layer is made of glass fiber material, so that heat on the first aluminum plate 3 does not affect normal operation of the blower 4.
Wherein as shown in fig. 3, ventilation pipe 8 is the rectangle body structure to increase ventilation pipe 8 and second aluminum plate 10's contact surface, and increase ventilation slotted hole 11's opening length, make the heat on the first aluminum plate 3 get into ventilation pipe 8 more easily, and finally discharged along ventilation pipe 8, thereby make circuit board main part 1's cooling effect better.
One specific application of this embodiment is: the circuit board main body 1 is arranged in the case, the heat dissipation fan is arranged on the case, more heat can be generated in the working process of the circuit board main body 1, part of the generated heat can be dissipated into the air, most of the heat can not be dissipated in time, and therefore the heat can be accumulated in the circuit board main body 1, the working efficiency of the circuit board main body 1 is reduced, the first aluminum plate 3 is connected to one surface of the circuit board main body 1 through the heat conduction silica gel, the heat on the circuit board main body 1 can be conducted to the first aluminum plate 3 in time, the contact surface between the first aluminum plate 3 and the air can be increased through the second aluminum plate 10 fixed on the first aluminum plate 3, the first aluminum plate 3 can dissipate heat rapidly, the heat on the circuit board main body 1 can be dissipated in time, the circuit board main body 1 can be cooled continuously, and efficient work is kept, in the process, the circuit board main body 1 is electrified into the air blower 4, so that the air blower 4 discharges air inside the ventilation pipeline 8 along the five second air pipes 7 in time, meanwhile, the ventilation pipeline 8 generates suction force to the outside air, so that outside cold air enters the ventilation pipeline 8 along the other end of the ventilation pipeline 8, the first aluminum plate 3, the ventilation pipeline 8 and the second aluminum plate 10 are cooled, and the ventilation slotted holes 11 formed in the ventilation pipeline 8 can synchronously suck hot air between the first aluminum plate 3 and the ventilation pipeline 8 into the ventilation pipeline 8 and finally is discharged by the air blower 4, so that the cooling effect of the circuit board main body 1 is further improved, the circuit board main body 1 can still operate efficiently when operating for a long time, the actual use and production of the circuit board cannot be influenced, and finally, the heat generated by the main body 1 can be discharged out of the case by the heat dissipation fan on the case, thereby completing the cooling process of the circuit board main body 1.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims (4)

1. The utility model provides a heat dissipation type PCB circuit board, includes circuit board main part (1), its characterized in that: the aluminum plate air-conditioner is characterized by further comprising a ventilating duct (8), wherein a first aluminum plate (3) is fixed on one surface of the circuit board main body (1), an air blower (4) is fixed on one surface of the first aluminum plate (3), a plurality of second aluminum plates (10) are fixed on the peripheral side of the ventilating duct (8), one surfaces of the second aluminum plates (10) are fixedly connected with one surface of the first aluminum plate (3), a plurality of ventilating slot holes (11) are formed in the peripheral side of the ventilating duct (8), and the plurality of ventilating slot holes (11) and the plurality of second aluminum plates (10) are distributed in a clearance mode;
air pipe (8) one end is fixed with fixed plate (9), air-blower (4) air intake one end is fixed with first trachea (5), first trachea (5) other end fixed intercommunication has inflator (6), inflator (6) week side is run through and is fixed with a plurality of second trachea (7), and is a plurality of second trachea (7) other end all runs through fixed plate (9) a surface and extends to inside air pipe (8).
2. The heat dissipation type PCB circuit board according to claim 1, wherein a surface of the circuit board main body (1) is provided with a plurality of heat dissipation slots (2).
3. The heat dissipation type PCB circuit board according to claim 1, wherein a protective layer is arranged at the joint of the first aluminum plate (3) and the blower (4).
4. The heat dissipation type PCB circuit board of claim 1, wherein the ventilation duct (8) is a rectangular tube structure.
CN201921622730.XU 2019-09-27 2019-09-27 Heat dissipation type PCB circuit board Active CN211406422U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921622730.XU CN211406422U (en) 2019-09-27 2019-09-27 Heat dissipation type PCB circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921622730.XU CN211406422U (en) 2019-09-27 2019-09-27 Heat dissipation type PCB circuit board

Publications (1)

Publication Number Publication Date
CN211406422U true CN211406422U (en) 2020-09-01

Family

ID=72230503

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921622730.XU Active CN211406422U (en) 2019-09-27 2019-09-27 Heat dissipation type PCB circuit board

Country Status (1)

Country Link
CN (1) CN211406422U (en)

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