CN211402473U - LED test probe structure with temperature adjusting module - Google Patents

LED test probe structure with temperature adjusting module Download PDF

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Publication number
CN211402473U
CN211402473U CN201921998499.4U CN201921998499U CN211402473U CN 211402473 U CN211402473 U CN 211402473U CN 201921998499 U CN201921998499 U CN 201921998499U CN 211402473 U CN211402473 U CN 211402473U
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China
Prior art keywords
module
temperature regulation
probe
temperature
led test
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Active
Application number
CN201921998499.4U
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Chinese (zh)
Inventor
熊亚俊
幸雄
段雄斌
何选民
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Shenzhen Biaopu Semiconductor Co ltd
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Shenzhen Biaopu Semiconductor Technology Co ltd
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Priority to CN201921998499.4U priority Critical patent/CN211402473U/en
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Abstract

The utility model provides a take LED test probe structure of temperature regulation module, includes temperature regulation module and probe module, temperature regulation module locates probe module top carries out temperature regulation to the product of being surveyed. The utility model discloses structurally installing heating or refrigeration module at traditional test probe, the beneficial effect who brings is for LED can obtain different temperatures when the test, has realized the wideer test scene of LED.

Description

LED test probe structure with temperature adjusting module
Technical Field
The utility model relates to a probe structure for dividing the ray apparatus, especially a take temperature regulation module's LED test probe structure.
Background
At present, the LED test is generally carried out at room temperature, and the performance of the LED is required to be tested at a plurality of temperatures along with the application of LED products to occasions with high performance requirements such as automobiles and aquarium culture lamps, and the traditional test cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the above-mentioned problem, provide one kind to the society and can carry out the LED test probe structure of taking temperature regulation module of test under the corresponding temperature according to the different temperature requirements of customer.
The technical scheme of the utility model realizes being: the utility model provides a take LED test probe structure of temperature regulation module, includes temperature regulation module and probe module, temperature regulation module locates probe module top carries out temperature regulation to the product of being surveyed.
As a right improvement of the utility model, the temperature adjusting module is provided with a notch for placing the tested product.
As right the utility model discloses an improve, temperature regulation module still is equipped with the temperature probe who is used for realizing temperature closed-loop control.
As an improvement to the present invention, the probe module further comprises a power element providing for the probe to move up and down.
As right the utility model discloses an it is right to be equipped with the stroke bolster that is used for the probe to cushion when reciprocating in the probe module.
As an improvement of the present invention, the probe module further comprises a guide for guiding the probe module.
As an improvement of the present invention, the temperature adjusting module is a semiconductor cooling plate, an electric heating cooler or a ceramic heating body.
As right the utility model discloses an improvement, temperature regulation module is external cold source or heat unit, external cold source or heat unit pass through fluid pipeline and carry the energy to the product carrier.
As an improvement, the temperature adjusting module is fixedly provided with a heat insulation plate.
The utility model discloses structurally installing heating or refrigeration module at traditional test probe, the beneficial effect who brings is for LED can obtain different temperatures when the test, has realized the wideer test scene of LED.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases for those skilled in the art. In addition, in the description of the present invention, "a plurality" or "a plurality" means two or more unless otherwise specified.
Please refer to fig. 1, the utility model provides a take LED test probe structure of temperature regulation module, including temperature regulation module 1 and probe module 2, temperature regulation module 1 locates probe module 2 top carries out temperature regulation to the product of being surveyed. The temperature adjusting module comprises a product carrier 11, a semiconductor refrigerating piece 12 (of course, the semiconductor refrigerating piece 12 can also be used for heating or refrigerating, or can be replaced by a device capable of heating and refrigerating) and a heat insulating plate 3; the probe module 2 includes a spring 21, a cylinder 22 and a slide rail 23, and since the probe module 2 is a prior art, it will not be described herein.
During the use, the product tool 11 is conducted to temperature regulation module 2's energy, and the product of being surveyed is placed in product carrier 11, and probe module 2 passes through cylinder 22 drive, and the product lead angle is put through in the direction of linear slide rail 23, through the control to heating or refrigeration time, can make product carrier 11 obtain different temperatures, realizes the test of different temperature conditions to the product (LED) of being surveyed.
Preferably, a notch 111 for placing the product to be tested is arranged on the temperature adjusting module 1.
Preferably, the temperature regulation module 1 is further provided with a temperature probe (not shown) for realizing closed-loop control of temperature.
Preferably, the probe module 2 further includes a power element (in this embodiment, a cylinder) for providing upward and downward movement of the probe.
Preferably, a stroke buffer (not shown) for buffering when the probe moves up and down is further disposed in the probe module 2. The probe module 2 further includes a guide (not shown) for guiding the probe module 2.
Preferably, the temperature adjusting module 1 is a semiconductor refrigerating sheet, an electric heating cooler or a ceramic heating body.
Preferably, the temperature regulation module 1 is an external cold source or heat element, and the external cold source or heat element transmits energy to the product carrier through a fluid pipeline. A heat insulation plate 112 is fixedly arranged on the temperature adjusting module 1.

Claims (9)

1. The utility model provides a take temperature regulation module's LED test probe structure, its characterized in that, includes temperature regulation module (1) and probe module (2), temperature regulation module (1) is located probe module (2) top carries out temperature regulation to the product of being surveyed.
2. The LED test probe structure with the temperature regulation module as claimed in claim 1, wherein a notch for placing a product to be tested is arranged on the temperature regulation module (1).
3. The LED test probe structure with the temperature regulation module according to claim 1 or 2, characterized in that the temperature regulation module (1) is further provided with a temperature probe for realizing closed-loop control of temperature.
4. The LED test probe structure with temperature adjustment module according to claim 1 or 2, characterized in that the probe module (2) further comprises a power element providing up and down movement of the probe.
5. The LED test probe structure with the temperature adjusting module according to claim 1 or 2, wherein a stroke buffer member for buffering when the probe moves up and down is further arranged in the probe module (2).
6. The LED test probe structure with temperature regulation module according to claim 1 or 2, characterized in that the probe module (2) further comprises a guide for guiding the probe module (2).
7. The LED test probe structure with the temperature regulation module according to claim 1 or 2, wherein the temperature regulation module (1) is a semiconductor chilling plate, an electrothermal cooler or a ceramic heating body.
8. The LED test probe structure with temperature regulation module of claim 1 or 2, characterized in that the temperature regulation module (1) is an external cold source or heat element, which delivers energy to the product carrier through a fluid conduit.
9. The LED test probe structure with the temperature adjusting module according to claim 1 or 2, characterized in that a thermal insulation board is fixedly arranged on the temperature adjusting module (1).
CN201921998499.4U 2019-11-16 2019-11-16 LED test probe structure with temperature adjusting module Active CN211402473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921998499.4U CN211402473U (en) 2019-11-16 2019-11-16 LED test probe structure with temperature adjusting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921998499.4U CN211402473U (en) 2019-11-16 2019-11-16 LED test probe structure with temperature adjusting module

Publications (1)

Publication Number Publication Date
CN211402473U true CN211402473U (en) 2020-09-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921998499.4U Active CN211402473U (en) 2019-11-16 2019-11-16 LED test probe structure with temperature adjusting module

Country Status (1)

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CN (1) CN211402473U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114859213A (en) * 2022-07-05 2022-08-05 深圳市标谱半导体科技有限公司 Test needle adjusting part and chip test equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114859213A (en) * 2022-07-05 2022-08-05 深圳市标谱半导体科技有限公司 Test needle adjusting part and chip test equipment

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Address after: 1st-3rd, 5th-8th Floor, Building A, Tea Tree, Tongfuyu Industrial Park, Inner Ring Road, Sanwei Community, Hangcheng Street, Baoan District, Shenzhen, Guangdong, China

Patentee after: Shenzhen Biaopu Semiconductor Co.,Ltd.

Address before: Floor 9 and 10, Zone B, Chaxi Sanwei Second Industrial Zone, Xixiang Street, Bao'an District, Shenzhen, Guangdong 518000

Patentee before: SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY Co.,Ltd.

CP03 Change of name, title or address