CN211394680U - Electroplating bath with uniform electroplating - Google Patents
Electroplating bath with uniform electroplating Download PDFInfo
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- CN211394680U CN211394680U CN202020054036.9U CN202020054036U CN211394680U CN 211394680 U CN211394680 U CN 211394680U CN 202020054036 U CN202020054036 U CN 202020054036U CN 211394680 U CN211394680 U CN 211394680U
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Abstract
The utility model relates to the technical field of plating baths, in particular to a plating bath with uniform plating, which comprises a bath body, wherein a clapboard is horizontally arranged in the bath body, and the clapboard is fixed at two opposite sides of the inner side wall of the bath body and has a distance with two other opposite inner side walls in the bath body; this external one side of cell body is provided with the driving pump, the output of driving pump is linked together with cell body inner wall, and is located between the bottom of baffle and cell body, the input of driving pump is linked together with cell body inner wall, and is located the one side that the bottom of cell body was kept away from to the baffle. The utility model discloses can make the direction that the plating solution flows form a endless route, the plating solution that has reduced the driving pump output directly is carried by the driving pump once more through the work piece of electroplating the condition, has improved the utilization efficiency of plating solution.
Description
Technical Field
The utility model relates to a technical field of plating bath especially relates to an electroplate even plating bath.
Background
The electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the electrolysis effect so as to play roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and enhancing beauty and the like.
The patent document with the prior publication number of CN204589359U discloses a rapid and uniform zinc dissolving tank (equivalent to the plating bath of the present invention), referring to fig. 1, comprising a zinc dissolving tank 1 (equivalent to the bath body of the present invention), a catalytic device 2 and a stirring device 3, wherein the catalytic device 2 is located at the bottom of the zinc dissolving tank 1, and comprises a pump 21, a water outlet pipe 22 and a water pump 23, the head of the water pump 23 is a porous nozzle, the stirring device 3 is located at the middle of the zinc dissolving tank 1, and comprises a motor 31, a stirring rod 32 and stirring blades, the stirring blades are in the shape of gears, the stirring rod 32 and the stirring blades are under the liquid in the zinc dissolving tank 1, the prior art adds the catalytic device 2 at the bottom of the zinc dissolving tank 1 and sets the stirring device 3 in the middle of the zinc dissolving tank 1 to assist the reaction of caustic soda and the zinc particles, the catalytic device 2 accelerates the upper and lower fluidity of the liquid in the zinc dissolving tank 1 by continuously pumping the liquid from the zinc dissolving tank 1 and returning the liquid to the zinc dissolving tank 1 through the pump, the stirring gear 33 of the stirring device 3 continuously rotates, thereby increasing the liquidity of the liquid in the zinc dissolving tank 1, accelerating the chemical reaction, and simultaneously stirring the liquid uniformly for electroplating of the electroplating bath.
The above prior art solutions have the following drawbacks: the water suction pump 23 pumps the electroplating solution in the zinc dissolving tank 1 and outputs the electroplating solution from the water outlet pipeline 22; because the outlet pipe 22 and the water pump 23 are both arranged at the bottom of the zinc dissolving tank 1, and the outlet pipe 22 and the water pump 23 lack corresponding partition plates, the direction of water flow inside the zinc dissolving tank 1 is relatively disordered, and the electroplating solution output from the outlet pipe 22 easily and directly enters the water pump 23, so that the utilization efficiency of the electroplating solution output from the outlet pipe 22 is reduced.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects existing in the prior art, the utility model aims at providing an electroplating bath with uniform electroplating, which has the effect of improving the utilization efficiency of the output electroplating solution.
The utility model aims at realizing through the following technical scheme:
an electroplating bath with uniform electroplating comprises a bath body, wherein a partition board is horizontally arranged in the bath body and is fixed on two opposite sides of the inner side wall of the bath body, and a distance is reserved between the partition board and the other two opposite inner side walls in the bath body; a driving pump is arranged on one side outside the tank body, and the output end of the driving pump is communicated with the inner wall of the tank body and is positioned between the partition plate and the bottom of the tank body; the input end of the driving pump is communicated with the inner wall of the tank body and is positioned on one side of the partition board far away from the bottom of the tank body.
Through adopting above-mentioned technical scheme, the inside plating solution of drive pump cell body flows, because the inside baffle that is provided with of cell body, consequently, the plating solution is under the drive of drive pump, the plating solution flows in one side of baffle earlier, and when the border of drive pump was kept away from to the flowing plating solution flow direction baffle, the plating solution will continue to flow around the opposite side to the baffle, flow to the input along the opposite side of baffle again, the direction that the plating solution flows has formed a circulating route, the condition that the plating solution that has reduced the drive pump output directly is carried by the drive pump once more without the work piece of electroplating has improved the utilization efficiency of plating solution.
The present invention may be further configured in a preferred embodiment as: the driving pump is communicated with one side wall of the groove body and the partition plate at intervals.
Through adopting above-mentioned technical scheme, the interval setting between baffle and the cell body inner wall is in the output top of driving pump for driving pump electroplating liquid can be followed one side border of baffle and walked around the opposite side border of baffle and carry out the circulation flow, makes the flow path of electroplating liquid more orderly.
The present invention may be further configured in a preferred embodiment as: the opposite side of baffle is provided with the flow distribution plate, the flow distribution plate sets up the border of one side of keeping away from the driving pump at the baffle, and on flow distribution plate one side was fixed in the baffle, there was the interval between flow distribution plate and the cell body inner wall.
Through adopting above-mentioned technical scheme, the flow distribution plate plays the effect of reposition of redundant personnel to rivers, can make rivers more dispersed for the plating solution flows more evenly in this internal portion of cell body.
The present invention may be further configured in a preferred embodiment as: the flow distribution plate is bent in a V shape, and the bent end of the flow distribution plate faces to the edge of the partition plate.
Through adopting above-mentioned technical scheme, the end of buckling of flow distribution plate is towards the baffle, consequently follows the border of baffle below liquid process baffle, and the plating solution that flows to the baffle top again flows along the both sides of flow distribution plate under the blockking of flow distribution plate, and the flow distribution of the plating solution is convenient for to the flow distribution plate that "V" shape set up.
The present invention may be further configured in a preferred embodiment as: the flow distribution plate is provided with a plurality of flow distribution holes.
Through adopting above-mentioned technical scheme, division of flow hole set up the sectional area that increases the plating solution and flow in the cell body inside for the flow of the inside plating solution of cell body is more even.
The present invention may be further configured in a preferred embodiment as: the baffle still is provided with the stirring rake that is used for carrying out the stirring to the plating solution in the one side that is provided with the flow distribution plate.
Through adopting above-mentioned technical scheme, the stirring rake can stir the plating solution for metal ion in the plating solution is inside evenly distributed at the plating solution.
The present invention may be further configured in a preferred embodiment as: the stirring rake includes fixed axle, rotation sleeve and paddle, the fixed axle is fixed on the baffle, rotate the sleeve cover and establish on the fixed axle, and rotate for the fixed axle, the paddle is fixed in and rotates telescopic periphery side.
Through adopting above-mentioned technical scheme, when the plating solution flows through the stirring rake, because the paddle receives asymmetric velocity of flow and assaults, consequently the paddle receives the great one side of impact force and begins to deflect, drives the stirring rake and rotates, rotates the sleeve and can rotate for the fixed axle, simple structure, does not need external power drive simultaneously, the energy can be saved.
The present invention may be further configured in a preferred embodiment as: the paddle sets up multiunit along rotating sleeve length direction.
Through adopting above-mentioned technical scheme, the paddle is provided with the multiunit, consequently can increase the plating solution to the impact force of stirring rake, reduces the frictional resistance between rotation sleeve and the fixed axle for it rotates more easily to rotate the sleeve, and can stir the plating solution to a plurality of high positions of cell body inside, makes the distribution of metal ion in the plating solution more even.
The present invention may be further configured in a preferred embodiment as: the stirring rake is provided with a plurality ofly, just the stirring rake all has the setting in the both sides of flow distribution plate.
Through adopting above-mentioned technical scheme, a plurality of stirring rake can stir the plating solution in a plurality of positions of plating bath inside for metal ion's distribution in the plating solution is more even.
To sum up, the utility model discloses a following at least one useful technological effect:
when the electroplating device works, under the driving of the driving pump, the electroplating solution flows to one side of the partition plate, which faces the workpiece, from one side of the partition plate, which is far away from the workpiece, passes through the workpiece, reaches the edge of the partition plate, which is close to the driving pump, flows back to the output end of the driving pump, and is driven to flow by the driving pump again, and the partition plate enables the flowing path of the electroplating solution to be ordered, so that the electroplating solution can flow back to the output end of the driving part pump through the workpiece to be electroplated sufficiently, and the utilization efficiency of the electroplating;
the flow distribution plate has a flow distribution effect on water flow, so that the water flow can be more dispersed, and electroplating solution can flow more uniformly in the tank body due to the arrangement of the flow distribution holes;
one side of baffle towards the work piece is provided with a plurality of stirring rakes, and the stirring rake is regarded as the drive by the flow of plating solution, can play the effect of the energy saving, advances the sexual stirring to the plating solution simultaneously, and the plating solution of messenger can continuously stir, and metal ion in the plating solution distributes more evenly.
Drawings
FIG. 1 is a schematic structural diagram of a rapid and uniform zinc dissolving tank in the prior art;
FIG. 2 is a schematic view of an overall structure of a uniform electroplating bath according to an embodiment of the present invention;
fig. 3 is a top view of the present invention along fig. 2;
fig. 4 is a cross-sectional view of the present invention taken along line a-a of fig. 2.
Reference numerals: 1. the tank body, 2, baffle, 3, actuating pump, 31, input, 32, output, 4, flow distribution plate, 41, reposition of redundant personnel hole, 5, stirring rake, 51, fixed axle, 52, rotate the sleeve, 53, paddle.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 2 and 4, for the utility model discloses an electroplate even plating bath, including cell body 1, cell body 1 is inside to be provided with baffle 2, and one side intercommunication of cell body 1 has actuating pump 3.
The tank body 1 is provided with an opening, a cavity is formed inside the tank body 1 and is used for containing electroplating liquid, and a workpiece is electroplated by utilizing an electrolysis principle.
Two through holes are formed in one side wall of the tank body 1, one through hole is close to the bottom of the tank body 1, and the other through hole is far away from the bottom of the tank body 1. The driving pump 3 may be any one of a water pump, a magnetic pump and a fluororubber diaphragm pump, and in a specific application example, the driving pump 3 is a water pump. Further, the driving pump 3 comprises an input end 31 and an output end 32, the input end 31 is communicated with the through hole far away from the bottom of the tank body 1 through a water pipe, and the output end 32 is communicated with the through hole near the bottom of the tank body 1 through a water pipe.
The drive pump 3 is electrified to circulate the plating solution in the plating tank. The plating solution flows through the drive pump 3 from the input end 31 of the drive pump 3, is pressurized by the drive pump 3 and then is output from the output end 32, and the flow rate of the output plating solution is increased, so that the metal ions can be uniformly distributed in the plating solution under the condition of high flow rate.
The inside level of cell body 1 is provided with baffle 2, and the high position of baffle 2 is between two through-holes. The baffle 2 is connected with the two opposite sides of the inner side wall of the tank body 1 through welding or bolts, the space is reserved between the two opposite inner side walls of the other two opposite sides of the baffle 2 and the tank body 1, and the through holes are formed in the side faces of the tank body 1 spaced from the baffle 2. The partition plate 2 plays a role in blocking the flow of the plating solution, so that the plating solution inside the tank body 1 flows in layers.
Furthermore, a splitter plate 4 is fixed on one side of the clapboard 2 departing from the bottom of the tank body 1. The flow distribution plate 4 may be a straight plate or a bent or wavy plate. In a specific application example, the flow distribution plate 4 is a plate bent in a "V" shape (see fig. 3), the bent end of the flow distribution plate 4 faces the edge of the partition plate 2, and two adjacent sides of the flow distribution plate 4 and the partition plate 2 are spaced from the inner wall of the tank body 1. The splitter plate 4 may be fixed to the partition plate 2 by means of bolts or welding. When the plating solution flows upwards to the top of the partition plate 2 from the space between the partition plate 2 and the bottom of the tank body 1 through the gap between the partition plate 2 and the inner side wall of the tank body 1, the bent end of the flow distribution plate 4 is divided into two strands, the two strands of plating solution flow into the space above the partition plate 2 from the two side edges of the flow distribution plate 4 respectively, so that the flowing plating solution can stir the plating solution above the partition plate 2, metal ions are supplemented to the plating solution near the workpiece, and the metal ions in the plating solution are distributed more uniformly.
Furthermore, a plurality of shunt holes 41 are further formed in the shunt plate 4, the shunt holes 41 are not required to be regularly arranged, the shunt holes 41 are formed in a plurality, and the central axis of the shunt hole 41 is parallel to the flowing direction of the electroplating solution. The plating liquid flowing upward from the bottom of the tank can flow into the interior of the partition plate 2 through the branch holes 41, so that the flow of the plating liquid is more uniform.
In order to further increase the mobility of the plating solution above the partition plate 2, so that the distribution of metal ions in the plating solution is more uniform, and the plating effect is improved, the partition plate 2 is further provided with a stirring paddle 5 for stirring the plating solution on the side provided with the flow distribution plate 4. Wherein the stirring paddle 5 includes a fixed shaft 51, a rotating sleeve 52, and a blade 53.
One end of the fixed shaft 51 is fixed on the partition board 2 by welding or bolt connection, the rotating sleeve 52 is sleeved on the fixed shaft 51, and a bearing is arranged between the rotating sleeve 52 and the fixed shaft 51 and is used for rotating the rotating sleeve 52 relative to the fixed shaft 51. The blades 53 are welded or bolted to the outer peripheral side of the rotating sleeve 52. Further, the paddle 53 sets up the multiunit along rotating sleeve 52 length direction, is provided with three groups in this embodiment, and multiunit paddle 53 can stir the liquid of a plurality of height positions of cell body 1 inside.
Further, stirring rake 5 is provided with a plurality ofly on baffle 2 to stirring rake 5 all has the setting in the both sides of flow distribution plate 4, and a plurality of stirring rakes 5 can stir 1 inside a plurality of positions of cell body, make the metal ion in the plating solution distribute more evenly.
The implementation principle of the embodiment is as follows: the partition plate 2 is fixed inside the tank body 1, the driving pump 3 is located outside the tank body 1, the input end 31 and the output end 32 of the driving pump 3 are communicated with the tank body 1, the driving pump 3 is electrified, so that the electroplating solution inside the tank body 1 is output from the output end 32 of the driving pump 3, the flow velocity of the output electroplating solution is large, the electroplating solution inside the tank body 1 can be stirred, and metal ions in the electroplating solution are uniformly distributed; when the electroplating bath is in work, the electroplating solution firstly flows between the partition plate 2 and the bottom of the bath body 1, and under the limitation of the flow rate of the electroplating bath, the flowing electroplating solution flows to one side of the partition plate 2 away from the driving pump 3 and flows around to the upper part of the partition plate 2, the workpiece is placed above the partition plate 2, the electroplating solution flows through the workpiece, and metal ions in the electroplating solution are attached to the outer surface of the workpiece under the electrolytic action, so that the electroplating of the workpiece is realized; the metal ions of the electroplating electrolyte are reduced, so that the electroplating solution flows to the input end 31 along the other side of the partition plate 2, passes through the driving pump 3 and is pressurized by the driving pump 3 again, and the metal ions are dispersed and distributed again in the electroplating solution with the increased flow speed; the flowing direction of the plating solution forms a circulating path, so that the condition that the plating solution output by the driving pump 3 is directly conveyed by the driving pump 3 again without passing through a plated workpiece is reduced, and the utilization efficiency of the plating solution is improved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (10)
1. A plating bath for uniform plating is characterized in that: the tank body comprises a tank body (1), wherein a partition plate (2) is horizontally arranged in the tank body (1), the partition plate (2) is fixed on two opposite sides of the inner side wall of the tank body (1) and is spaced from the other two opposite inner side walls in the tank body (1); one side outside cell body (1) is provided with driving pump (3), output (32) and cell body (1) inner wall of driving pump (3) are linked together, and are located between the bottom of baffle (2) and cell body (1), input (31) and cell body (1) inner wall of driving pump (3) are linked together, and are located one side that the bottom of cell body (1) was kept away from in baffle (2).
2. The plating bath of claim 1, wherein: the driving pump (3) is communicated with one side wall of the groove body (1) and the partition plate (2) at intervals.
3. The plating bath of claim 1, wherein: the opposite side of baffle (2) is provided with flow distribution plate (4), flow distribution plate (4) set up and keep away from one side border of driving pump (3) in baffle (2), and on flow distribution plate (4) one side was fixed in baffle (2), there was the interval between flow distribution plate (4) and cell body (1) inner wall.
4. The plating cell of claim 3, wherein: the flow distribution plate (4) is bent in a V shape, and the bent end of the flow distribution plate (4) faces the edge of the partition plate (2).
5. The plating cell of claim 3, wherein: the flow distribution plate (4) is provided with a plurality of flow distribution holes (41).
6. The plating cell of claim 3, wherein: the baffle (2) is provided with a stirring paddle (5) used for stirring the electroplating solution on one side of the flow distribution plate (4).
7. The plating bath of claim 6, wherein: the stirring paddle (5) comprises a fixed shaft (51), a rotating sleeve (52) and a blade (53), the fixed shaft (51) is fixed on the partition plate (2), the rotating sleeve (52) is sleeved on the fixed shaft (51) and rotates relative to the fixed shaft (51), and the blade (53) is fixed on the outer peripheral side of the rotating sleeve (52).
8. The plating cell of claim 7, wherein: the blades (53) are arranged in multiple groups along the length direction of the rotating sleeve (52).
9. The plating bath of claim 6, wherein: stirring rake (5) are provided with a plurality ofly, just stirring rake (5) all have the setting in the both sides of flow distribution plate (4).
10. The plating bath of claim 1, wherein: the driving pump (3) can be any one of a water pump, a magnetic pump or a fluororubber diaphragm pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020054036.9U CN211394680U (en) | 2020-01-11 | 2020-01-11 | Electroplating bath with uniform electroplating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020054036.9U CN211394680U (en) | 2020-01-11 | 2020-01-11 | Electroplating bath with uniform electroplating |
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| CN211394680U true CN211394680U (en) | 2020-09-01 |
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| CN202020054036.9U Active CN211394680U (en) | 2020-01-11 | 2020-01-11 | Electroplating bath with uniform electroplating |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116847566A (en) * | 2023-07-07 | 2023-10-03 | 武汉新辉天科技有限公司 | High-integration circuit board processing method |
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2020
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116847566A (en) * | 2023-07-07 | 2023-10-03 | 武汉新辉天科技有限公司 | High-integration circuit board processing method |
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Address after: 516100 Shentian (earth name), group 2, Xialiao village, Longxi Town, BOLUO County, Huizhou City, Guangdong Province Patentee after: Huizhou Yingbang Hardware Surface Treatment Technology Co.,Ltd. Address before: 516100 Shentian (earth name), group 2, Xialiao village, Longxi Town, BOLUO County, Huizhou City, Guangdong Province Patentee before: Huizhou Ruiji Environmental Protection Technology Co.,Ltd. |