CN211378551U - Improved heat dissipation printed circuit board - Google Patents
Improved heat dissipation printed circuit board Download PDFInfo
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- CN211378551U CN211378551U CN201922446782.2U CN201922446782U CN211378551U CN 211378551 U CN211378551 U CN 211378551U CN 201922446782 U CN201922446782 U CN 201922446782U CN 211378551 U CN211378551 U CN 211378551U
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- circuit board
- printed circuit
- heat dissipation
- improved
- casing
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Abstract
The utility model relates to a printed circuit board technical field, concretely relates to improved generation heat dissipation printed circuit board, including circuit board body and electrical components, the top of circuit board body is equipped with electrical components, and the bottom of circuit board body is supported and has been met the heating panel, the utility model provides an improved generation heat dissipation printed circuit board, design and use through a series of structures, the utility model discloses in carrying out the use, can reach and carry out dustproof damp-proofing purpose to the circuit board when carrying out the heat dissipation, the radiating mode is various moreover, has improved the radiating effect, and when electrical components on printed circuit board goes wrong and need overhaul simultaneously, reached the purpose of convenient dismantlement and equipment, and then improved heat dissipation printed circuit board's availability factor, and then improved heat dissipation printed circuit board's practicality.
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to improved generation heat dissipation printed circuit board.
Background
The printed circuit board, also called printed circuit board, short for printed board, short for PCB, uses insulating board as base material, and is cut into a certain size, on which at least one conductive pattern is attached, and is distributed with holes (such as element hole, fastening hole and metallized hole, etc.), and can be used for replacing chassis of electronic component and implementing interconnection between electronic components. Such boards are known as "printed" circuit boards because they are made using electronic printing. It is not exact to custom refer to a "printed wiring board" as a "printed circuit" because there are no "printed components" on the printed board, but only wiring.
When the printed circuit board is involved in use, however, although the existing printed circuit board mostly has a heat dissipation function in the use process, because the circuit board often contacts with dust and moisture in the air, because the dust easily absorbs moisture, will cause the circuit board to short circuit, can not reach the purpose of dust prevention and moisture prevention to the circuit board when carrying out heat dissipation, and the radiating mode is single, lead to the radiating effect poor, when electrical components on the printed circuit board go wrong and need overhaul, there is the problem of inconvenient dismantlement and equipment, and then the availability factor of the heat dissipation printed circuit board has been reduced, and then the practicality of the heat dissipation printed circuit board has been reduced, therefore need to develop an improved generation heat dissipation printed circuit board to solve the above-mentioned problem urgently.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides an improved generation heat dissipation printed circuit board, through the design and the use of a series of structures, the utility model discloses in the use, solved current printed circuit board and in the use although mostly have the radiating function, because the dust in circuit board and the air and moisture often contact, because the dust easily absorbs moisture, will cause the circuit board to take place the short circuit phenomenon, can reach the purpose of carrying out dustproof dampproofing to the circuit board when carrying out the heat dissipation, and the radiating mode is various, the radiating effect is improved, when electrical components on the printed circuit board appear the problem and need overhaul simultaneously, the purpose of convenient dismantlement and equipment has been reached, and then the availability factor of heat dissipation printed circuit board has been improved, and then the practicality of heat dissipation printed circuit board has been improved; and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.
The utility model discloses a following technical scheme realizes:
the utility model provides an improved generation heat dissipation printed circuit board, includes circuit board body and electrical components, the top of circuit board body is equipped with electrical components, the bottom butt of circuit board body has the heating panel, the heating panel sets up in the inner chamber bottom middle part of casing, the inner chamber bottom four corners symmetry of casing is equipped with the reference column, the locating hole has been seted up to the four corners symmetry of circuit board body, the joint has on the reference column the locating hole, the top left side of casing articulates there is the cooling lid, logical groove has been seted up at the middle part of cooling lid, it is equipped with filter screen and heat dissipation fan to inlay in proper order from left to right side in logical inslot, the cooling lid pass through the cooperation of buckle and draw-.
Preferably, the heat dissipation plate is made of copper material.
Preferably, the positioning column is an elastic rubber column, and the caliber of the positioning column is slightly larger than that of the positioning hole.
Preferably, the filter screen is made of non-woven fabric filter cotton.
Preferably, the middle part of the right side of the heat dissipation cover is provided with the buckle, the middle part of the right side of the top of the shell is provided with the clamping groove, and the buckle and the clamping groove are in one-to-one correspondence.
Preferably, the shell is made of aluminum.
The utility model has the advantages that:
when the utility model is used by the mutual cooperation of the circuit board body, the electrical element, the heat radiation plate, the shell, the positioning column, the positioning hole, the heat radiation cover, the through groove, the filter screen, the heat radiation fan, the buckle, the clamping groove and other parts, solves the problems that the prior printed circuit board has the function of heat dissipation in the using process, since the circuit board is frequently contacted with dust and moisture in the air, the dust is easy to absorb moisture, and a short circuit phenomenon of the circuit board can be caused, the purposes of dust prevention and moisture prevention can be achieved while heat dissipation is carried out, the heat dissipation modes are various, the heat dissipation effect is improved, meanwhile, when the electric elements on the printed circuit board have problems and need to be overhauled, the purpose of convenient disassembly and assembly is achieved, the use efficiency of the heat dissipation printed circuit board is improved, and the practicability of the heat dissipation printed circuit board is improved;
and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic structural view of the heat dissipating plate of the present invention;
fig. 3 is a schematic structural diagram of the middle positioning hole of the present invention.
In the figure: 1-circuit board body, 2-electrical element, 3-heat dissipation plate, 4-shell, 5-positioning column, 6-positioning hole, 7-heat dissipation cover, 8-through groove, 9-filter screen, 10-heat dissipation fan, 11-buckle and 12-clamping groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides an improved generation heat dissipation printed circuit board, including circuit board body 1 and electrical components 2, the top of circuit board body 1 is equipped with electrical components 2, the bottom butt of circuit board body 1 has heating panel 3, heating panel 3 sets up in the inner chamber bottom middle part of casing 4, the inner chamber bottom four corners symmetry of casing 4 is equipped with reference column 5, locating hole 6 has been seted up to circuit board body 1's four corners symmetry, the joint has locating hole 6 on reference column 5, casing 4's top left side articulates there is cooling cover 7, logical groove 8 has been seted up at the middle part of cooling cover 7, it is equipped with filter screen 9 and heat dissipation fan 10 to inlay in proper order by left to right in logical groove 8, cooling cover 7 carries out the lock through buckle 11 and draw.
Specifically, the heat dissipation plate 3 is made of copper material.
Specifically, the positioning column 5 is an elastic rubber column, and the caliber of the positioning column 5 is slightly larger than that of the positioning hole 6.
Specifically, the filter screen 9 is made of a non-woven fabric filter cotton material.
Specifically, the middle part of the right side of the heat dissipation cover 7 is provided with a buckle 11, the middle part of the right side of the top of the shell 4 is provided with a clamping groove 12, and the buckle 11 and the clamping groove 12 are in one-to-one correspondence.
Specifically, the housing 4 is made of aluminum.
The working principle is as follows: when the utility model is used, the heat dissipation plate 3 is made of copper material through the arranged heat dissipation plate 3, so that the purpose of conducting heat to the heat generated by the circuit board can be achieved, and the heat dissipation plate 3 is made of aluminum material through the shell 4 so as to conduct heat and radiate the heat from the outside;
the heat dissipation fan 10 arranged in the through groove 8 controls the air blowing work of the heat dissipation fan 10, so that the aim of quickly dissipating heat generated by the circuit board can be fulfilled;
moreover, the filter screen 9 is arranged in the through groove 8, and the filter screen 9 is made of non-woven filter cotton materials, so that the purpose of filtering and adsorbing dust and moisture in the air can be achieved, and the phenomenon that the dust or the moisture enters the shell 4 to cause short circuit to the circuit board is avoided;
the positioning column 5 and the positioning hole 6 are arranged, so that the purposes of quickly positioning, assembling and disassembling the circuit board body 1 can be achieved, the positioning column 5 is an elastic rubber column, and the caliber of the positioning column 5 is slightly larger than that of the positioning hole 6, so that the stability of positioning and fixing the circuit board body 1 can be further improved;
the heat dissipation cover 7 can be conveniently opened to overhaul the circuit board through the arranged buckle 11 and the clamping groove 12;
and then under the design and the use of above-mentioned structure, the utility model discloses in carrying out the use, it though mostly has radiating function to have solved current printed circuit board in carrying out the use, because dust and moisture in circuit board and the air often contact, because the dust is the moisture uptake easily, will cause the circuit board to take place short circuit phenomenon, can reach to carry out dustproof damp-proofing purpose to the circuit board when carrying out the heat dissipation, and the radiating mode is various, the radiating effect is improved, when electrical components 2 on printed circuit board goes wrong and need overhaul simultaneously, the purpose of convenient dismantlement and equipment has been reached, and then the availability factor of heat dissipation printed circuit board has been improved, and then the practicality of heat dissipation printed circuit board has been improved.
The control mode of above-mentioned electric elements such as heat dissipation fan 10 is controlled through rather than supporting control switch, and control circuit can realize through the simple programming of technical staff in this field, belongs to the common general knowledge in this field, only uses it, does not improve it, and the utility model discloses mainly be used for protecting mechanical device, so the utility model discloses no longer detail control mode and circuit connection are repeated.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. The utility model provides an improved generation heat dissipation printed circuit board, includes circuit board body (1) and electrical components (2), its characterized in that: the top of circuit board body (1) is equipped with electrical components (2), the bottom butt of circuit board body (1) has heating panel (3), heating panel (3) set up in the inner chamber bottom middle part of casing (4), the inner chamber bottom four corners symmetry of casing (4) is equipped with reference column (5), locating hole (6) have been seted up to the four corners symmetry of circuit board body (1), the joint has on reference column (5) locating hole (6), the top left side of casing (4) articulates there is cooling lid (7), logical groove (8) have been seted up at the middle part of cooling lid (7), it is equipped with filter screen (9) and heat dissipation fan (10) to inlay in proper order to lead to the inslot (8) from left to right, cooling lid (7) through the cooperation of buckle (11) and draw-in groove (12) with casing (4) carry out the lock.
2. An improved heat dissipating printed circuit board as claimed in claim 1, wherein: the heat dissipation plate (3) is made of copper materials.
3. An improved heat dissipating printed circuit board as claimed in claim 1, wherein: the positioning column (5) is an elastic rubber column, and the caliber of the positioning column (5) is slightly larger than that of the positioning hole (6).
4. An improved heat dissipating printed circuit board as claimed in claim 1, wherein: the filter screen (9) is made of non-woven fabric filter cotton.
5. An improved heat dissipating printed circuit board as claimed in claim 1, wherein: the right side middle part of heat dissipation lid (7) is equipped with buckle (11), the top right side middle part of casing (4) is equipped with draw-in groove (12), just buckle (11) with draw-in groove (12) are the one-to-one correspondence setting.
6. An improved heat dissipating printed circuit board as claimed in claim 1, wherein: the shell (4) is made of aluminum materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922446782.2U CN211378551U (en) | 2019-12-30 | 2019-12-30 | Improved heat dissipation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922446782.2U CN211378551U (en) | 2019-12-30 | 2019-12-30 | Improved heat dissipation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211378551U true CN211378551U (en) | 2020-08-28 |
Family
ID=72155575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922446782.2U Active CN211378551U (en) | 2019-12-30 | 2019-12-30 | Improved heat dissipation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211378551U (en) |
-
2019
- 2019-12-30 CN CN201922446782.2U patent/CN211378551U/en active Active
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