CN217563835U

CN217563835U - PCBA module heat abstractor

Info

Publication number: CN217563835U
Application number: CN202123066811.6U
Authority: CN
Inventors: 张金连; 汪志强
Original assignee: Hefei Xinshengyuan Electronic Technology Co ltd
Current assignee: Hefei Xinshengyuan Electronic Technology Co ltd
Priority date: 2021-12-08
Filing date: 2021-12-08
Publication date: 2022-10-11
Anticipated expiration: 2031-12-08

Abstract

The utility model provides a PCBA module heat dissipation device, which relates to the field of PCBA modules, and comprises a shell and a baffle plate, wherein the top of the shell is provided with a clamping plate, the baffle plate is connected in the clamping plate in a clamping way, and the shell and the baffle plate are detachably connected through a screw rod; be provided with waterproof bottom plate on the inboard bottom plate of casing, and be provided with the cushion on the waterproof bottom plate, placed the PCBA module on the cushion, wherein just be located the both sides of cushion on the inboard bottom plate of casing and be equipped with locating component. The utility model discloses in, through at the inside radiator unit that sets up of casing, radiator unit can directly carry out the thermal treatment to PCBA module to the heat after will dispelling the heat is outside through the louvre discharge casing, thereby makes PCBA module heat dissipation more thorough, improves the radiating efficiency, sets up waterproof bottom plate and cushion in the casing inboard bottom simultaneously, can play waterproof and absorbing effect to PCBA module.

Description

PCBA module heat abstractor

Technical Field

The utility model relates to a PCBA module field especially relates to a PCBA module heat abstractor.

Background

The PCBA board, namely the printed circuit board assembly, comprises the PCB and the electrical components arranged on the PCB, and has convenient manufacture and low cost, so that the PCBA board is widely applied to various electrical appliances;

but the electrical components during operation on the PCBA board can produce the heat, make the inside temperature of equipment rise rapidly, if not in time give off this heat, equipment can last intensification, electrical components will be because of overheated inefficacy, electronic equipment's reliability will descend, the PCBA board is generally dispelled the heat to electrical components through connecting extra radiator, but external connection's radiator can only dispel the heat to electrical components's upper surface, is difficult directly to use the PCBA board, thereby can appear the relatively poor defect of radiating efficiency, for this reason the utility model provides a PCBA module heat abstractor solves above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a PCBA module heat abstractor to solve above-mentioned technical problem.

The utility model discloses a solve above-mentioned technical problem, adopt following technical scheme to realize: a PCBA module heat dissipation device comprises a shell and baffles, wherein a clamping plate is arranged at the top of the shell, the baffles are connected in the clamping plate in a clamping mode, and the shell is detachably connected with the baffles through screws; a waterproof bottom plate is arranged on the inner side bottom plate of the shell, an elastic pad is arranged on the waterproof bottom plate, a PCBA module is placed on the elastic pad, positioning components are arranged on the inner side bottom plate of the shell and positioned on two sides of the elastic pad, and the positioning components are connected with the PCBA module in a clamping mode; the two sides of the shell are also provided with heat dissipation assemblies, and the baffle is provided with heat dissipation holes.

Preferably, a plurality of connectors are arranged on the shell, wherein the connectors are electrically connected with the PCBA module.

Preferably, radiator unit includes outer frame, heating panel, fan and filter screen, and wherein the lateral wall at the casing is established to the outer frame, the inside of outer frame is equipped with the fan, and wherein one side of fan is equipped with the heating panel, the opposite side of fan is equipped with the filter screen.

Preferably, impeller setting towards the inside of casing on the fan, the heating panel sets up towards the outside of casing, the filter screen is established between fan and PCBA module. The heat dissipation plate can discharge heat out of the shell, and the filter screen is used for separating dust, impurities and the like

Preferably, locating component includes slide bar and slider, and wherein the slide bar is established on the inboard bottom plate of casing, slider sliding connection is on the slide bar, and the top of slider has spacing fixture block through spring coupling, spacing fixture block is connected with PCBA module block. When the limiting fixture block is used for fixing the PCBA module, the limiting fixture block can be lifted firstly, then the limiting fixture block is moved to the position of the PCBA module, and the PCBA module is loosened and clamped with the limiting fixture block, so that the PCBA module and the limiting fixture block can be connected; when the PCBA module is disassembled, the limiting clamping block is lifted up in the same way and then moved backwards, so that the PCBA module can be taken out.

Preferably, the sliding block is further in threaded connection with a bolt, and the sliding block and the sliding rod are limited by the bolt. After the sliding block moves to a required position, the sliding block is fixed by using a bolt, so that the position of the sliding block is ensured, and the limit of a limit clamping block on the sliding block is ensured.

Compared with the prior art, the utility model provides a PCBA module heat abstractor has following beneficial effect:

the utility model provides a PCBA module heat abstractor, at first, through set up the radiator unit in the casing, the radiator unit can directly carry out the heat dissipation to the PCBA module and handle, and discharge the heat after the heat dissipation outside the casing through the louvre, thereby make the PCBA module dispel the heat more thoroughly, improve the radiating efficiency, set up waterproof bottom plate and cushion in the inboard bottom of casing simultaneously, can play waterproof and absorbing effect to the PCBA module; secondly, through setting up locating component in casing inboard bottom, locating component is portable, consequently can carry out corresponding regulation according to the size of PCBA module for the PCBA module homoenergetic of equidimension not can carry on spacingly, and the drive of the last spacing fixture block accessible spring of locating component is fixed the PCBA module, and the installation is dismantled conveniently, labour saving and time saving.

Drawings

Fig. 1 is a schematic perspective view of a pcb module heat dissipation device of the present invention;

fig. 2 is a schematic view of the internal structure of a PCBA module heat dissipation device of the present invention;

fig. 3 is a top view of the bottom plate of the housing of the present invention;

fig. 4 is an enlarged view of a portion of fig. 3 according to the present invention.

Reference numerals: 1. a housing; 2. a connector; 3. a baffle plate; 4. heat dissipation holes; 5. a heat dissipating component; 501. An outer frame body; 502. a heat dissipation plate; 503. a fan; 504. filtering with a screen; 6. a screw; 7. clamping a plate; 8. a PCBA module; 9. a positioning assembly; 901. a slide bar; 902. a limiting clamping block; 903. a spring; 904. a slider; 905. a bolt; 10. a waterproof bottom plate; 11. an elastic pad.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

In a specific implementation process, as shown in fig. 1 and 2, the PCBA module heat dissipation device comprises a housing 1 and a baffle 3, wherein a clamping plate 7 is arranged at the top of the housing 1, the baffle 3 is connected in the clamping plate 7 in a clamping manner, and the housing 1 is detachably connected with the baffle 3 through a screw 6; a waterproof bottom plate 10 is arranged on the inner side bottom plate of the shell 1, an elastic pad 11 is arranged on the waterproof bottom plate 10, a PCBA module 8 is placed on the elastic pad 11, positioning components 9 are arranged on the inner side bottom plate of the shell 1 and located on two sides of the elastic pad 11, and the positioning components 9 are connected with the PCBA module 8 in a clamping mode; the two sides of the shell 1 are also provided with heat dissipation components 5, and the baffle 3 is provided with heat dissipation holes 4.

As shown in fig. 1, the housing 1 is provided with a plurality of connectors 2, wherein the connectors 2 are electrically connected to the PCBA module 8.

As shown in fig. 2, the heat dissipation assembly 5 includes an outer frame 501, a heat dissipation plate 502, a fan 503 and a filter 504, wherein the outer frame 501 is disposed on a side wall of the housing 1, the fan 503 is disposed inside the outer frame 501, one side of the fan 503 is disposed with the heat dissipation plate 502, and the other side of the fan 503 is disposed with the filter 504.

As shown in fig. 2, the impeller of the fan 503 is disposed toward the inside of the housing 1, the heat dissipating plate 502 is disposed toward the outside of the housing 1, the heat dissipating plate 502 is disposed to discharge heat to the outside of the housing 1, the filter 504 is disposed between the fan 503 and the PCBA module 8, and the filter 504 is disposed to block dust, impurities, and the like.

As shown in fig. 3 and 4, the positioning assembly 9 includes a sliding rod 901 and a sliding block 904, wherein the sliding rod 901 is disposed on the inner bottom plate of the housing 1, the sliding block 904 is slidably connected to the sliding rod 901, the top of the sliding block 904 is connected to a limiting fixture block 902 through a spring 903, the limiting fixture block 902 is connected to the PCBA module 8 in a clamping manner, when the PCBA module 8 is fixed by using the limiting fixture block 902, the limiting fixture block 902 can be lifted first, then moved to the position of the PCBA module 8, and released, and the limiting fixture block 902 is connected to the PCBA module 8 in a clamping manner, so that the connection therebetween can be realized; when the PCBA module 8 is disassembled, the limiting fixture block 902 is lifted up and then moved backwards, and the PCBA module 8 can be taken out.

As shown in fig. 4, a bolt 905 is further connected to the slider 904 in a threaded manner, the bolt 905 limits the slider 904 and the sliding rod 901, and after the slider 904 moves to a desired position, the bolt 905 is then used to fix the slider 904, so as to ensure the position of the slider 904 and limit the limit fixture 902 on the slider 904.

The utility model relates to a PCBA module heat abstractor's implementation principle does: firstly, the device needs to be installed, namely the baffle 3 is pulled out from the top of the shell 1, then the PCBA module 8 is placed on the elastic pad 11, then the sliding block 904 slides on the sliding rod 901 through the sliding block 904 until the sliding block is contacted with the PCBA module 8, at the moment, the limiting clamping block 902 is clamped and connected with the PCBA module 8, the limiting clamping block 902 can position the PCBA module 8 under the action of the spring 903, then the sliding block 904 is positioned through the bolt 905, the stability of the sliding block 904 is ensured, and the installation of the PCBA module 8 can be completed; after the installation of the PCBA module 8 is completed, the baffle 3 is slid into the clamping plate 7, and the clamping plate 7 and the shell 1 are fixed through the screw 6;

when in use, a user can be electrically connected with the PCBA module 8 through the plug connection 2; when using simultaneously, radiator unit 5 can carry out the heat dissipation to PCBA module 8, carries out work through drive fan 503 promptly, and the fan 503 that is located casing 1 both sides dispels the heat to PCBA module 8, and the heat can be followed louvre 4 effluvium or through heating panel 502 discharge casing 1 to realize the heat dissipation of this device.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a PCBA module heat abstractor, includes casing (1) and baffle (3), its characterized in that: the top of the shell (1) is provided with a clamping plate (7), the baffle (3) is connected in the clamping plate (7) in a clamping manner, and the shell (1) and the baffle (3) are detachably connected through a screw (6);

a waterproof bottom plate (10) is arranged on the inner side bottom plate of the shell (1), an elastic pad (11) is arranged on the waterproof bottom plate (10), a PCBA module (8) is placed on the elastic pad (11), positioning components (9) are arranged on the inner side bottom plate of the shell (1) and positioned on two sides of the elastic pad (11), and the positioning components (9) are connected with the PCBA module (8) in a clamping mode;

the heat dissipation device is characterized in that heat dissipation assemblies (5) are further arranged on two sides of the shell (1), and heat dissipation holes (4) are formed in the baffle (3).

2. The PCBA module heat dissipation device of claim 1, wherein: a plurality of connectors (2) are arranged on the shell (1), wherein the connectors (2) are electrically connected with the PCBA module (8).

3. The PCBA module heat dissipation device of claim 1, wherein: radiating component (5) include outer frame (501), heating panel (502), fan (503) and filter screen (504), and wherein the lateral wall at casing (1) is established in outer frame (501), the inside of outer frame (501) is equipped with fan (503), and wherein one side of fan (503) is equipped with heating panel (502), the opposite side of fan (503) is equipped with filter screen (504).

4. A PCBA module heat sink as claimed in claim 3, wherein: impeller sets up towards the inside of casing (1) on fan (503), heating panel (502) set up towards the outside of casing (1), establish between fan (503) and PCBA module (8) filter screen (504).

5. The PCBA module heat dissipation device as recited in claim 1, wherein: the positioning assembly (9) comprises a sliding rod (901) and a sliding block (904), wherein the sliding rod (901) is arranged on a bottom plate on the inner side of the shell (1), the sliding block (904) is connected to the sliding rod (901) in a sliding mode, the top of the sliding block (904) is connected with a limiting clamping block (902) through a spring (903), and the limiting clamping block (902) is connected with the PCBA module (8) in a clamping mode.

6. The PCBA module heat sink of claim 5, wherein: the sliding block (904) is further connected with a bolt (905) in a threaded mode, and the sliding block (904) and the sliding rod (901) are limited through the bolt (905).